CN108022910A - 用于在电子芯片与载体衬底之间形成电连接的方法以及电子器件 - Google Patents

用于在电子芯片与载体衬底之间形成电连接的方法以及电子器件 Download PDF

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CN108022910A
CN108022910A CN201710374185.6A CN201710374185A CN108022910A CN 108022910 A CN108022910 A CN 108022910A CN 201710374185 A CN201710374185 A CN 201710374185A CN 108022910 A CN108022910 A CN 108022910A
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additional
pad
electrical connection
carrier substrates
electric connection
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D·奥彻雷
A·哈吉
F·奎尔恰
J·洛佩
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Italy Semiconductor (grenoble 2) Co
STMicroelectronics Grenoble 2 SAS
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Italy Semiconductor (grenoble 2) Co
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Abstract

电连接线连接电子芯片的电连接焊盘与载体衬底的电连接焊盘，该电子芯片安装至该载体衬底。液体介电材料沉积在该电连接线上并且然后硬化以形成围绕该电连接线的局部介电涂层。液体导电材料沉积在该局部介电涂层上并且然后硬化以形成围绕该局部介电涂层的局部导电屏蔽。

Description

用于在电子芯片与载体衬底之间形成电连接的方法以及电子 器件
优先权要求
本申请要求于2016年11月3日提交的第1660624号法国专利申请的优先权权益，该申请的公开内容通过引用以其全文结合在此。
技术领域
实施例涉及电子器件领域并且更具体地涉及包括安装在载体衬底上的电子芯片以及将芯片连接至载体衬底的电连接线的那些电子器件，这些载体衬底包括电连接网络或引线框。
背景技术
在电连接线尤其是以高频率传送信号的情况下，这些信号可以通过围绕电磁场而被衰减或被破坏和/或发射可能破坏周围环境的电磁场。
目前，为了应对这种问题，提出了向电子器件添加潜在地连接至地的金属屏蔽板。尽管如此，定位这类金属屏蔽板并将其电连接至地，加上制造包封块或将包封盖放置就位造成了问题并且成本很高。此外，由于所获得的屏蔽是非特定的并且位于距电连接线一定距离，因此，所获得的电磁保护水平仍然是不够的。
发明内容
根据一个实施例，提出了一种用于在电子芯片与载体衬底之间形成电连接的方法，此芯片安装在该载体衬底上。
该方法包括以下步骤：将电连接线置于该电子芯片的暴露的电连接焊盘与该载体衬底的暴露的电连接焊盘之间并且在此线的两端与这些焊盘之间形成电结；制造局部介电涂层，该局部介电涂层由介电材料制成、至少部分地围绕该电连接线并且至少部分地覆盖这些电焊盘和这些结；以及制造局部导电屏蔽，该局部导电屏蔽由导电材料制成、至少部分地覆盖该局部介电涂层。
可以通过分配确定量的液体状态下的该介电材料以及使此介电材料硬化来获得该局部介电涂层。
可以通过分配确定量的液体状态下的导电材料以及使此导电材料硬化来获得该局部导电屏蔽。
可以借助于包括分注注射器的控制工具来实现该分配。
该局部介电涂层可以完全围绕该电连接线并完全覆盖这些焊盘和这些结，并且该局部导电屏蔽可以完全覆盖该局部介电涂层。
可以制造该局部介电涂层以完全围绕该电连接线并且完全覆盖这些焊盘和这些结，并且可以制造该局部导电屏蔽以完全覆盖该局部介电涂层。
该方法可以附加地包括以下步骤：将附加电连接线置于该电子芯片的暴露的电连接焊盘与该载体衬底的暴露的电连接焊盘之间并且在此附加电连接线的两端与这些焊盘之间形成电结；以及制造该局部导电屏蔽使得此局部导电屏蔽与此附加电连接线和/或与这些电连接焊盘中的至少一个电连接焊盘相接触。
还提出了一种电子器件，该电子器件包括：载体衬底；电子芯片，该电子芯片安装在该载体衬底上；至少一条电连接线，该至少一条电连接线连接该载体衬底的电连接焊盘和该电子芯片的电连接焊盘；局部介电涂层，该局部介电涂层由介电材料制成、至少部分地围绕该电连接线并且至少部分地覆盖这些电连接焊盘；以及局部导电屏蔽，该局部导电屏蔽由导电材料制成、至少部分地覆盖该局部介电涂层。
由介电材料制成的该局部介电涂层可以完全围绕该电连接线并且可以完全覆盖这些焊盘和这些结，并且该局部导电屏蔽可以完全覆盖该局部介电涂层。
该器件可以附加地包括至少一条附加电连接线，该至少一条附加电连接线连接该载体衬底的电连接焊盘和该电子芯片的电连接焊盘，该局部导电屏蔽与此附加电连接线和/或与这些电连接焊盘中的至少一个电连接焊盘相接触。
附图说明
现在将以附图所展示的非限制性示例的方式描述电子器件和制造模式，在附图中：
图1表示制造过程中的电子器件在一个制造步骤中的横截面视图；
图2表示图1的电子器件的俯视图；
图3表示制造过程中的电子器件在随后的制造步骤中的横截面视图；
图4表示图3的电子器件的俯视图；
图5表示制造过程中的电子器件在随后的制造步骤中的横截面视图，示出了所获得的电子器件；以及
图6表示图5的电子器件的俯视图。
具体实施方式
如在图1和图2中所展示的，电子器件1包括载体衬底2以及包括有集成电路的电子芯片3，该电子芯片的背面4借助于粘合层(未示出)固定至载体衬底2的正面5。
载体衬底2由介电材料制成并且包括用于连接至一个或多个金属层的集成电连接网络6，该集成电连接网络包括正面5的正面暴露的电连接焊盘7和8，这些正面暴露的电连接焊盘横向地位于与电子芯片3的侧面9相距一定距离处并且彼此靠近。
电子芯片3包括与其背面4相反的此电子芯片3的正面12的正面暴露的电连接焊盘10和11，这些正面暴露的电连接焊盘位于与电子芯片3的侧面9相距一定距离处，离载体衬底2的正面焊盘7和8不远。
现在将描述出于在载体衬底2和电子芯片3的焊盘7与10以及可选地焊盘8与11之间分别形成电连接的目的的步骤。
在图1和图2所展示的步骤中，一方面，裸露的电连接线(也称为键合接线)13被放置就位在暴露的电连接焊盘7与10之间，并且电结14和15借助于焊接分别形成在电连接线13的两端与焊盘7和10之间，并且另一方面，附加电连接线16被放置就位在附加的暴露的电连接焊盘8与11之间，并且电结借助于焊接分别形成在电连接线16的端部与焊盘8和11之间。电连接线13和16是邻近的但是彼此有一定距离。
可以使用专门的接线键合机来实施将电连接线13和16放置就位的这个操作。
在图3和图4所展示的随后的步骤中，将确定量的粘合液体介电材料局部分配在电连接线13的顶部上，使得此介电材料完全围绕电连接线13并且完全覆盖焊盘7和10以及结14和15。在硬化之后，此介电材料形成局部介电涂层17。
此操作可以例如使用专门的工具来实施，该专门的工具包括能够将液体介电材料的至少一滴校准的液体介电材料递送到电连接线13的顶部上的分注注射器18，此液体介电材料具体地借助于润湿效应或者毛细效应最终流动用于围绕电连接线12并且用于覆盖焊盘7和10以及结14和15。
接下来，液体介电材料凭借其在室温下固有的硬化品质或者通过在热源或光辐射源效应下硬化而硬化以形成介电涂层17。例如，介电材料可以是适合的环氧树脂。
在图5和图6所展示的随后步骤中，将确定量的导电粘合液体材料局部分配在介电涂层17的顶部上以及潜在地在电连接线16的顶部上，从而使得此导电材料完全围绕介电涂层17并且与电连接线16和/或焊盘8和11相接触，此导电材料潜在地溢流到载体衬底2的以及电子芯片3的正面5和12上。在硬化之后，此导电材料形成局部导电屏蔽19，该局部导电屏蔽尽可能地靠近电连接线13并且连接至电连接线16以及至焊盘8和11。
此操作可以例如使用专门的控制工具来实施，该专门的控制工具包括能够递送液体导电材料的至少一滴校准的液体导电材料的分注注射器20，此液体导电材料具体地借助于润湿效应或者毛细效应流动。
接下来，液体导电材料凭借其在室温下固有的硬化品质或者通过在热源或光辐射源效应下硬化而硬化以形成局部导电屏蔽19。例如，导电材料可以是填充有金属颗粒的环氧树脂。
因此，获得成品电子器件1。
电连接线13旨在传送载体衬底2和电子芯片3的焊盘7与10之间的电信号。导电屏蔽19为这些电信号提供电磁保护。
由电连接线16连接的焊盘8和11形成电子器件1的电气电路的接地焊盘。因此，连接至焊盘8和11以及至电连接线16的导电屏蔽19连接至电子器件1的电气电路的地。
根据一个变体实施例，局部介电涂层17将有可能覆盖焊盘7和10中的仅一个焊盘以及电连接线13的相邻部分，并且局部导电屏蔽19将有可能在此减少的局部导电屏蔽19不与电连接线13相接触的情况下部分地覆盖此减少的局部介电涂层17。
根据一个变体实施例，将有可能真的省略电连接线16。
当然，电子器件1可以包括连接载体衬底2的以及电子芯片3的其他焊盘7和10的其他电连接线13，以及连接载体衬底2的以及电子芯片3的其他焊盘8和11的其他电连接线16，该载体衬底和该电子芯片还配备有局部介电涂层17和局部导电屏蔽19，这些电连接线的对应制造步骤将会是相同的。
根据一个变体实施例，一个局部导电屏蔽19将有可能由多个邻近电连接线13共享并且局部地覆盖载体衬底的正面5和/或电子芯片3的正面12，使得此延伸的局部导电屏蔽19将会形成对电子器件1的电子电路中的一部分的电磁保护。这类延伸的局部导电屏蔽19可以例如借助于金属材料(例如，铜或铝)的物理气相淀积(PCV)来形成。在此情况下，将有可能提供单条接地电连接线16。仍在此情况下并且作为变体，延伸的局部导电屏蔽19可以通过提供载体衬底2的未被介电涂层17覆盖的至少一个电连接焊盘8而连接至地。
根据一个变体实施例，载体衬底2可以包括金属框，该金属框包括电子芯片3将会安装在其上的平台，电连接线13和16将电子芯片3连接至此框的外围引线。

Claims (17)

1.一种方法，包括以下步骤：
将电连接线置于电子芯片的暴露的电连接焊盘与载体衬底的暴露的电连接焊盘之间，所述电子芯片安装至所述载体衬底，并且在所述线的两端与所述暴露的电连接焊盘之间形成电结；
制造局部介电涂层，所述局部介电涂层由介电材料制成、至少部分地围绕所述电连接线并且至少部分地覆盖所述暴露的电连接焊盘和所述电结；以及
制造局部导电屏蔽，所述局部导电屏蔽由导电材料制成、至少部分地覆盖所述局部介电涂层。
2.根据权利要求1所述的方法，其中，制造所述局部介电涂层包括分配确定量的液体状态下的所述介电材料以及使所述介电材料硬化。
3.根据权利要求2所述的方法，其中，分配包括使用控制工具来分注液体状态下的所述介电材料。
4.如权利要求3所述的方法，其中，所述控制工具为分注注射器。
5.根据权利要求1所述的方法，其中，制造所述局部导电屏蔽包括分配确定量的液体状态下的导电材料以及使所述导电材料硬化。
6.根据权利要求5所述的方法，其中，分配包括使用控制工具来分注液体状态下的所述导电材料。
7.如权利要求6所述的方法，其中，所述控制工具为分注注射器。
8.根据权利要求1所述的方法，其中，制造所述局部介电涂层包括用所述局部介电涂层来完全围绕所述电连接线以及用所述局部介电涂层来完全覆盖所述暴露的电连接焊盘和所述电结。
9.根据权利要求8所述的方法，其中，制造所述局部导电屏蔽包括用所述局部导电屏蔽来完全覆盖所述局部介电涂层。
10.根据权利要求1所述的方法，进一步包括以下步骤：
将附加电连接线置于所述电子芯片的附加的暴露的电连接焊盘与所述载体衬底的附加的暴露的电连接焊盘之间并且在所述附加电连接线的两端与所述附加的暴露的电连接焊盘之间形成电结；以及
制造所述局部导电屏蔽使得所述局部导电屏蔽与所述附加电连接线中的至少一条附加电连接线以及所述附加的暴露的电连接焊盘中的至少一个附加的暴露的电连接焊盘相接触。
11.一种电子器件，包括：
载体衬底；
电子芯片，所述电子芯片安装在所述载体衬底上；
至少一条电连接线，所述至少一条电连接线连接所述载体衬底的电连接焊盘和所述电子芯片的电连接焊盘；
局部介电涂层，所述局部介电涂层由介电材料制成、至少部分地围绕所述电连接线并且至少部分地覆盖所述电连接焊盘；以及
局部导电屏蔽，所述局部导电屏蔽由导电材料制成、至少部分地覆盖所述局部介电涂层。
12.根据权利要求11所述的电子器件，其中，所述局部介电涂层完全围绕所述电连接线并且完全覆盖所述电连接焊盘，并且其中，所述局部导电屏蔽完全覆盖所述局部介电涂层。
13.根据权利要求11所述的器件，进一步包括至少一条附加电连接线，所述至少一条附加电连接线连接所述载体衬底的附加电连接焊盘和所述电子芯片的附加电连接焊盘，所述局部导电屏蔽与所述附加电连接线中的至少一条附加电连接线以及所述附加电连接焊盘中的至少一个附加电连接焊盘相接触。
14.一种方法，包括以下步骤：
将电子芯片安装至载体衬底；
将键合接线连接在所述电子芯片的电连接焊盘与所述载体衬底的电连接焊盘之间；
使液体介电材料流动以涂覆所述键合接线；
使所述液体介电材料硬化以形成围绕所述键合接线的介电涂层；
使液体导电材料流动以涂覆所述介电涂层；以及
使所述液体导电材料硬化以形成围绕所述介电涂层的导电屏蔽。
15.如权利要求14所述的方法，进一步包括：
将附加键合接线连接在所述电子芯片的附加电连接焊盘与所述载体衬底的附加电连接焊盘之间；
其中，使所述液体导电材料流动进一步包括使所述液体导电材料流动以涂覆所述附加键合接线；并且
其中，使所述液体导电材料硬化进一步包括使所述液体导电材料硬化以形成围绕所述附加键合接线的所述导电屏蔽。
16.一种电子器件，包括：
载体衬底；
电子芯片，所述电子芯片安装在所述载体衬底上；
键合接线，所述键合接线连接所述载体衬底的电连接焊盘和所述电子芯片的电连接焊盘；
硬化的液体介电材料，所述硬化的液体介电材料围绕所述键合接线以形成介电涂层；以及
硬化的液体导电材料，所述硬化的液体导电材料围绕所述介电涂层。
17.如权利要求16所述的电子器件，进一步包括：
附加键合接线，所述附加键合接线连接所述电子芯片的附加电连接焊盘和所述载体衬底的附加电连接焊盘；
其中，所述硬化的液体导电材料围绕所述附加键合接线。
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