CN107968861A

CN107968861A - Input and output module and electronic device

Info

Publication number: CN107968861A
Application number: CN201711435677.8A
Authority: CN
Inventors: 吴安平
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2017-12-26
Filing date: 2017-12-26
Publication date: 2018-04-27

Abstract

Electronic device disclosed by the invention and input and output module include encapsulating housing, infrared light compensating lamp, close to infrared lamp and proximity sensor.Encapsulating housing includes package substrate, and infrared light compensating lamp, be encapsulated in encapsulating housing close to infrared lamp and proximity sensor and be carried on package substrate.Infrared light compensating lamp can launch infrared light with different power from close to infrared lamp to outside encapsulating housing, and proximity sensor is used to receiving the infrared light that is reflected by the object to detect the distance of object.Input and output module is integrated into a single package body structure by infrared light compensating lamp, close to infrared lamp and proximity sensor, gather transmitting and receive infrared light with the function of infrared distance measurement and the function of infrared light filling, therefore, the integrated level of input and output module is higher, small volume, input and output module have saved the space for the function of realizing infrared light filling and infrared distance measurement.

Description

Input and output module and electronic device

Technical field

The present invention relates to consumer electronics technical field, more specifically, is related to a kind of input and output module and electronics dress Put.

Background technology

As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of the function element set It is more and more, in order to realize distance detection, ambient light detection with the function such as the facial 3D feature recognitions of user, it is necessary to be set in electronics The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth Numerous function elements is put, the excessive space of mobile phone can be taken.

The content of the invention

Embodiment of the present invention provides a kind of input and output module and electronic device.

The input and output module of embodiment of the present invention includes encapsulating housing, infrared light compensating lamp, close to infrared lamp and close Sensor, the encapsulating housing include package substrate, the infrared light compensating lamp, described close to infrared lamp and the proximity sensor Be encapsulated in the encapsulating housing and carry on the package substrate, the infrared light compensating lamp with it is described close to infrared lamp energy Enough to launch infrared light to outside the encapsulating housing with different power, the proximity sensor is used to receive what is be reflected by the object Infrared light is to detect the distance of object.

In some embodiments, the input and output module further includes chip, the infrared light compensating lamp, described close to red Outer lamp and the proximity sensor are both formed on a piece of chip.

In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly The package substrate extends and is connected at the top of the encapsulation between the package substrate, formed with light filling at the top of the encapsulation Window, close to luminescence window and close to receive light window, the light filling window is correspondings with the infrared light compensating lamp, it is described approach shine Window is described corresponding with the proximity sensor close to light window is received with described corresponding close to infrared lamp.

In some embodiments, the input and output module further includes light-supplementing lamp lens, and the light-supplementing lamp lens are set It is in the encapsulating housing and corresponding with the infrared light compensating lamp；And/or

The input and output module is further included close to lamp lens, described to be arranged on close to lamp lens in the encapsulating housing simultaneously With it is described corresponding close to infrared lamp；And/or

The input and output module is further included close to sensing lens, described to be arranged on the encapsulating housing close to sensing lens It is interior and corresponding with the proximity sensor.

In some embodiments, it is saturating to further include the light compensating lamp being arranged in the encapsulating housing for the input and output module Mirror, close to lamp lens and close to sensing lens, the light-supplementing lamp lens are corresponding with the infrared light compensating lamp, described close to lamp lens It is described corresponding with the proximity sensor close to sensing lens with described corresponding close to infrared lamp, it is the light-supplementing lamp lens, described It is located at close to lamp lens and the close sensing lens on same transparent base.

In some embodiments, the input and output module further includes multiple metal shutters, and multiple metals hide Baffle is respectively in the encapsulating housing and positioned at the infrared light compensating lamp, described close to infrared lamp and the proximity sensor In it is any between the two.

In some embodiments, the input and output module further includes the optics sealing cover made of light transmissive material, described Optics sealing cover is formed on the package substrate and in the encapsulating housing, and the optics sealing cover wraps the infrared benefit It is light lamp, described close to infrared lamp and the proximity sensor.

In some embodiments, the input and output module further include it is multiple go out light clapboard, it is multiple it is described go out light clapboard It is respectively formed in the optics sealing cover and is located at the infrared light compensating lamp, is described close in infrared lamp and the proximity sensor It is any between the two.

In some embodiments, draw on the input and output module formed with grounding pin, light compensating lamp pin, close to lamp Foot and close sensing pin, when the grounding pin and the light compensating lamp pin are enabled, the infrared light compensating lamp transmitting is infrared Light；The grounding pin and it is described close to lamp pin be enabled when, it is described close to infrared lamp launch infrared light；The ground connection Pin and it is described close to sensing pin be enabled when, the proximity sensor receives the infrared light that is reflected by the object to detect thing The distance of body.

The electronic device of embodiment of the present invention includes：

Casing；And

Input and output module described in above-mentioned any one embodiment, the input and output module are arranged on the casing It is interior.

In some embodiments, the electronic device further includes the cover board of printing opacity, and the casing offers casing and approaches Through hole, casing light filling through hole and casing shine close to receipts light through hole, it is described close to the close luminous through hole of infrared lamp and the casing Corresponding, the infrared light compensating lamp is corresponding with the casing light filling through hole, and the proximity sensor leads to the casing close to light is received Hole corresponds to, and the cover board is set on the housing.

In some embodiments, the electronic device further includes the cover board of printing opacity, and the casing offers casing and approaches Through hole, casing light filling through hole and casing shine close to receipts light through hole, it is described close to the close luminous through hole of infrared lamp and the casing Corresponding, the infrared light compensating lamp is corresponding with the casing light filling through hole, and the proximity sensor leads to the casing close to light is received Hole corresponds to, and the cover board is set on the housing, and the cover board is infrared formed with only transmitting with the surface that the casing is combined The infrared of light passes through ink, it is described it is infrared through ink block the casing close to luminous through hole, the casing light filling through hole and The casing is at least one in light through hole close to receiving.

In some embodiments, the electronic device further includes optical flame detector and imaging modules, and the imaging modules include Microscope base, the lens barrel on the microscope base and the imaging sensor being housed in the microscope base, the microscope base include being located at institute The mounting surface between lens barrel and described image sensor is stated, the optical flame detector is arranged on the mounting surface.

In some embodiments, the imaging modules include at least one in visible image capturing head and infrared pick-up head Kind.

In some embodiments, the electronic device further include infrared pick-up head, visible image capturing head, receiver, And structured light projector, the input and output module, the infrared pick-up head, the visible image capturing head, the receiver It is located at the center of the structured light projector on same line segment, is followed successively by from one end of the line segment to the other end：

The input and output module, the structured light projector, the receiver, the infrared pick-up head, it is described can See light video camera head；Or

The input and output module, the infrared pick-up head, the receiver, the visible image capturing head, the knot Structure light projector；Or

The infrared pick-up head, the input and output module, the receiver, the visible image capturing head, the knot Structure light projector；Or

The infrared pick-up head, the visible image capturing head, the receiver, the input and output module, the knot Structure light projector.

In some embodiments, the electronic device further include receiver, infrared pick-up head, visible image capturing head, Structured light projector, the electronic device further include the cover board of printing opacity, and the cover board is set on the housing, and the casing is opened Equipped with casing sound outlet hole, the cover board offers cover board sound outlet hole, the receiver and the cover board sound outlet hole and the casing The position correspondence of sound outlet hole, the input and output module, the infrared pick-up head, the visible image capturing head and the structure The center of light projector is located on same line segment, and the receiver is between the line segment and the top of the casing.

In some embodiments, the electronic device further includes imaging modules and optical flame detector, the imaging modules installation On the housing, the imaging modules include camera case and camera lens module, the top surface of the camera case for cascaded surface simultaneously Including connected the first sub- top surface and the second sub- top surface, the relatively described first sub- top surface inclination of the second sub- top surface and with it is described First sub- top surface forms notch, and the top surface offers light extraction through hole, and the camera lens module is housed in the camera case simultaneously Corresponding with the light extraction through hole, the optical flame detector is arranged at the described first sub- top surface.

In some embodiments, the electronic device further includes imaging modules and optical flame detector, and the imaging modules include Camera case and two camera lens modules, offer notch to form step-like top surface on the top surface of the camera case, described Top surface includes the first tread and the second tread less than first tread, and offering two light extractions on first tread leads to Hole, each light extraction through hole is corresponding with the camera lens module, and the optical flame detector is arranged at second tread.

In some embodiments, the electronic device further includes imaging modules and optical flame detector, and the imaging modules include Microscope base, the lens barrel on the microscope base and part are arranged on the substrate in the microscope base, and the optical flame detector is arranged on described On substrate.

The electronic device and input and output module of embodiment of the present invention are passed by infrared light compensating lamp, close to infrared lamp with close Sensor is integrated into a single package body structure, has gathered transmitting and has received infrared light with the function of infrared distance measurement and infrared light filling Function, therefore, the integrated level of input and output module is higher, small volume, and input and output module, which has been saved, realizes infrared light filling With the space of the function of infrared distance measurement.

The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following Description in become obvious, or recognized by the practice of embodiments of the present invention.

Brief description of the drawings

The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change Obtain substantially and be readily appreciated that, wherein：

Fig. 1 is the structure diagram of the electronic device of certain embodiments of the present invention；

Fig. 2 is the schematic perspective view of the input and output module of the electronic device of certain embodiments of the present invention；

Fig. 3 is the schematic cross-section of the input and output module of the electronic device of certain embodiments of the present invention；

Fig. 4 is the schematic perspective view of the input and output module of the electronic device of certain embodiments of the present invention；

Fig. 5 is the partial sectional schematic view of the electronic device of certain embodiments of the present invention；

Fig. 6 is the optical flame detector of the electronic device of certain embodiments of the present invention and the schematic perspective view of imaging modules；

Fig. 7 is the arrangement schematic diagram of the electronic component of the electronic device of certain embodiments of the present invention；

Fig. 8 is the schematic cross-section of the input and output module of certain embodiments of the present invention；

Fig. 9 is the structure diagram of the electronic device of certain embodiments of the present invention；

Figure 10 to Figure 12 is the partial sectional schematic view of the electronic device of certain embodiments of the present invention；With

Figure 13 to Figure 20 is optical flame detector and the three-dimensional signal of imaging modules of the electronic device of certain embodiments of the present invention Figure.

Embodiment

Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing To the same or similar element of expression eventually or there is same or like element.

In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's Embodiment, and be not considered as limiting the invention.

In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature It is that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists Second feature " on ", " top " and " above " but fisrt feature are directly over second feature or oblique upper, or be merely representative of Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height and is less than second feature.

Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity Sub- component includes input and output module 10, optical flame detector 50 (such as Fig. 6), imaging modules 60 (such as Fig. 6), receiver 70 and structure light The projector 80.Electronic device 100 can be mobile phone, tablet computer, laptop, intelligent watch, Intelligent bracelet, automatic teller machine Deng the embodiment of the present invention is illustrated so that electronic device 100 is mobile phone as an example, it will be understood that the concrete form of electronic device 100 Can be other, this is not restricted.

Refer to Fig. 2 and Fig. 3, input and output module 10 is single package body structure, including encapsulating housing 11, infrared light compensating lamp 12nd, close to infrared lamp 13 and proximity sensor 1d.

Encapsulating housing 11 is used to encapsulating infrared light compensating lamp 12 at the same time, close to infrared lamp 13 and proximity sensor 1d, in other words, Infrared light compensating lamp 12, be encapsulated in encapsulating housing 11 close to infrared lamp 13 and proximity sensor 1d at the same time.Encapsulating housing 11 includes Package substrate 111, package wall 112 and encapsulation top 113.Encapsulating housing 11 can be by electromagnetic interference (Electromagnetic Interference, EMI) shielding material is made, to avoid extraneous electromagnetic interference to input and output Module 10 has an impact.In present embodiment, infrared light compensating lamp 12, be located at close to the center of infrared lamp 13 and proximity sensor 1d On same line segment, such as：Along one end of line segment to the other end be followed successively by infrared light compensating lamp 12, close to infrared lamp 13 and close to sensing Device 1d；Alternatively, it is followed successively by along one end of line segment to the other end close to infrared lamp 13, infrared light compensating lamp 12 and proximity sensor 1d； Alternatively, it is followed successively by along one end of line segment to the other end close to infrared lamp 13, proximity sensor 1d and infrared light compensating lamp 12.At other In embodiment, infrared light compensating lamp 12, close to infrared lamp 13 and proximity sensor 1d the line of centres it is triangular in shape.

Package substrate 111 is used to carrying infrared light compensating lamp 12, close to infrared lamp 13 and proximity sensor 1d.Inputted in manufacture When exporting module 10, infrared light compensating lamp 12, can be formed on a piece of chip 14 close to infrared lamp 13 and proximity sensor 1d, then It is set along by infrared light compensating lamp 12, close to infrared lamp 13, proximity sensor 1d and chip 14 on package substrate 111, specifically Chip 14, can be bonded on package substrate 111 by ground.Meanwhile package substrate 111 can be used for and electronic device 100 Other parts (such as the casing 20 of electronic device 100, mainboard etc.) connect, and input and output module 10 is fixed on electronics dress Put in 100.

Package wall 112 can surround infrared light compensating lamp 12, be set close to infrared lamp 13 and proximity sensor 1d, package-side Wall 112 extends from package substrate 111, and package wall 112 can be combined with package substrate 111, it is preferred that package wall 112 and envelope Substrate 111 is filled to be detachably connected, in order to remove after package wall 112 to infrared light compensating lamp 12, close to 13 and of infrared lamp Proximity sensor 1d is overhauled.The making material of package wall 112 can be the material of impermeable infrared light, to avoid infrared benefit Light lamp 12 or the infrared light sent close to infrared lamp 13 pass through package wall 112.

Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connected with package wall 112.Encapsulation top 113 Formed with light filling window 1131, close to luminescence window 1132 and close to receiving light window 1133, light filling window 1131 and infrared light filling Lamp 12 corresponds to, and the infrared light that infrared light compensating lamp 12 is launched is pierced by from light filling window 1131；Close to luminescence window 1132 with close to red Outer lamp 13 corresponds to, and the infrared light launched close to infrared lamp 13 is pierced by from close to luminescence window 1132；Close to receive light window 1133 with Proximity sensor 1d is corresponded to, and the infrared light being reflected by the object can pass through close to receipts light window 1133 and incide proximity sensor On 1d.Encapsulation top 113 integrally formed can be obtained with package wall 112, can also split shape to obtain.In an example In, light filling window 1131, close to luminescence window 1132 and close to receive light window 1133 be through hole, encapsulation top 113 making Material is impermeable infrared light and the material of visible ray.In another example, encapsulation top 113 by impermeable infrared light material, thoroughly Infrared light and the material co-manufactured being opaque to visible light but form, specifically, light filling window 1131, close to 1132 and of luminescence window It is made close to light window 1133 is received of the material of saturating infrared light, remaining position is by impermeable infrared light and the material system being opaque to visible light but Into.Further, light filling window 1131 and lens arrangement is could be formed with close to luminescence window 1132, to improve from light filling window 1131 and the infrared light emission angle that is projected close to luminescence window 1132, such as light filling window 1131 is formed with concavees lens structure, So that the divergence of beam through light filling window 1131 outwards projects；Close to luminescence window 1132 formed with convex lens structures, so that Gather outside injection through the light close to luminescence window 1132；Close to receive light window 1133 can also formed with lens arrangement, There are convex lens structures to improve from close to the infrared light emission angle for receiving the incidence of light window 1133, such as close to light window 1133 is received So that by gathering close to the light for receiving the incidence of light window 1133 and projecting on proximity sensor 1d.

Infrared light compensating lamp 12, can be formed on a piece of chip 14 close to infrared lamp 13 and proximity sensor 1d, into one Step reduces infrared light compensating lamp 12, integrated close to infrared lamp 13 and proximity sensor 1d after volume, and preparation process is simpler.It is red Outer light compensating lamp 12 can launch infrared light, infrared light through light filling window 1131 to project body surface, electronic device 100 it is red Outer light video camera head 62 is (as shown in Figure 1) to receive the infrared light that is reflected by the object to obtain the image information of object (at this time, infrared benefit Light lamp 12 is used for infrared light filling).Infrared light can be launched close to infrared lamp 13, infrared light is passed through close to luminescence window 1132 and reached Body surface, proximity sensor 1d are received by the infrared light being reflected by the object close to 1133 incidence of receipts light window, to judge thing Distance (at this time, close to infrared lamp 13 be used for infrared distance measurement) of the body to electronic device 100.Optical flame detector 50 receive ambient light in can See light, and detect the intensity (as shown in Figure 6) of visible ray.

Infrared light compensating lamp 12 can launch infrared light with different power from close to infrared lamp 13 to outside encapsulating housing 11, Specifically, with that can launch infrared light at the same time close to infrared lamp 13, input and output module 10 is used for infrared light compensating lamp 12 at the same time Infrared light filling and infrared distance measurement；Can also infrared light compensating lamp 12 launch light and do not launch light close to infrared lamp 13, input is defeated Go out module 10 and be only used for infrared light filling；Can also infrared light compensating lamp 12 do not launch light and close to infrared lamp 13 launch light, it is defeated Enter to export module 10 and be only used for infrared distance measurement.

Incorporated by reference to Fig. 4, in embodiments of the present invention, draw on input and output module 10 formed with grounding pin 15, light compensating lamp Foot 16, close to lamp pin 17 and close to sensing pin 1f.Grounding pin 15, light compensating lamp pin 16, close to lamp pin 17 and close Sensing pin 1f can be formed on package substrate 111, (that is, be grounded when grounding pin 15 and light compensating lamp pin 16 are enabled When pin 15 and light compensating lamp pin 16 access circuit turn-on), infrared light compensating lamp 12 launches infrared light；When grounding pin 15 and connect When low beam pin 17 is enabled (that is, grounding pin 15 and close to lamp pin 17 access circuit turn-on when), sent out close to infrared lamp 13 Penetrate infrared light.(that is, grounding pin 15 and close sensing pin 1f when grounding pin 15 and close sensing pin 1f are enabled When accessing circuit turn-on), the infrared light being reflected by the object that proximity sensor 1d detections are sent out close to infrared lamp 13 is to make Foundation for judgment object to the distance of electronic device 100.

Please refer to Fig.1 and Fig. 5, casing 20 can be as the installation carriers of input and output module 10, in other words, input and output Module 10 can be arranged in casing 20.Casing 20 can be the shell of electronic device 100, in embodiments of the present invention, casing It can be additionally used in the display screen 90 that electronic device 100 is set in 20, since the input and output module 10 of embodiment of the present invention can be with Less volume is taken, therefore, in casing 20 is used to set the volume of display screen 90 to correspond to increase, to improve electronics dress Put 100 screen accounting.Specifically, casing 20 includes top 21 and bottom 22, and display screen 90 and input and output module 10 are arranged on Between top 21 and bottom 22, in the state of user's normal use electronic device 100, top 21 is located at the top of bottom 22, As shown in Figure 1, input and output module 10 can be arranged between display screen 90 and top 21.In other embodiments, show Screen 90 can be that screen open up jagged comprehensively, and display screen 90 surrounds input and output module 10, and input and output module 10 is from aobvious The notch of display screen 90 exposes.

Casing 20 is further opened with casing and receives light through hole 25 close to luminous through hole 23, casing light filling through hole 24 and casing are close. It is corresponding with the close luminous through hole 23 of casing close to infrared lamp 13 when input and output module 10 is arranged in casing 20, infrared light filling Lamp 12 is corresponding with casing light filling through hole 24, and proximity sensor 1d is corresponding close to light through hole 25 is received with casing.Wherein close to infrared lamp 13 light sent close to infrared lamp 13 that refer to corresponding with the close luminous through hole 23 of casing can be passed through from casing close to luminous through hole 23, Specifically, can approach luminous 23 face of through hole close to infrared lamp 13 and casing or launch close to infrared lamp 13 Light is after light-guide device acts on through the close luminous through hole 23 of casing.Infrared light compensating lamp 12 is corresponding with casing light filling through hole 24 same Reason, therefore not to repeat here.Proximity sensor 1d and casing close to receive light through hole 25 it is corresponding refer to the infrared light being reflected by the object can Pass through and incided on proximity sensor 1d from casing close to receipts light through hole 25, can be proximity sensor 1d and machine specifically Shell is close to the light of 25 face of light through hole or infrared light incidence is received through casing close to receipts light through hole 25 and through guide-lighting member Incided after part effect on proximity sensor 1d.In the embodiment as shown in fig.5, casing is mended close to luminous through hole 23, casing Light through hole 24 and the close light through hole 25 of receiving of casing can be apart from one another by certainly, in other embodiments, casing is close to shine Through hole 23, casing light filling through hole 24 and casing can also be interconnected close to light through hole 25 is received.

Cover board 30 can be printing opacity, and the material of cover board 30 can be glass, resin, plastics of printing opacity etc..Cover board 30 is set Put on casing 20, cover board 30 includes the inner surface 32 combined with casing 20, and the outer surface 31 opposite with inner surface 32, defeated Enter to export after the light that module 10 is sent sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In reality as shown in Figure 5 Apply in example, cover board 30 covers casing light filling through hole 24, casing receives light through hole 25, cover board 30 close to luminous through hole 23 and casing are close Inner surface 32 on coated with infrared pass through ink 40, it is infrared to have higher transmitance to infrared light through ink 40, such as can Reach 85% or more, and have higher attenuation rate to visible ray, such as can reach more than 70% so that user is in normal use In, visually it is difficult to see that on electronic device 100 by the infrared region covered through ink 40.Specifically, it is infrared to pass through ink 40 Can cover on inner surface 32 not with 90 corresponding region of display screen.

Infrared transmission ink 40 can also block casing and be approached close to luminous through hole 23, casing light filling through hole 24 and casing Receive at least one in light through hole 25, i.e. infrared to cover casing at the same time close to luminous through hole 23, casing benefit through ink 40 Light through hole 24 and casing are difficult to by the close luminous through hole 23 of casing, casing close to light through hole 25 (as shown in Figure 5), user is received Light filling through hole 24, casing see the internal structure of electronic device 100 close to receipts light through hole 25, and the shape of electronic device 100 is more beautiful See；It is infrared to cover casing at the same time close to luminous through hole 23 and casing light filling through hole 24 through ink 40, and machine is not covered Shell is close to receive light through hole 25；It is infrared to cover casing close to luminous through hole 23 through ink 40, and casing light filling is not covered Through hole 24 and the close receipts light through hole 25 of casing；It is infrared to cover casing light filling through hole 24 through ink 40, and machine is not covered Shell receives light through hole 25 close to luminous through hole 23 and casing are close；It is close luminous that infrared transmission ink 40 can also cover casing at the same time Through hole 23 and casing do not cover casing light filling through hole 24 close to receipts light through hole 25；Or infrared transmission ink 40 can also be same When cover casing light filling through hole 24 and casing close to receiving light through hole 25, and do not cover casing close to luminous through hole 23；It is or infrared Casing can also be covered close to receipts light through hole 25 through ink 40, and it is logical close to shining not cover casing light filling through hole 24 and casing Hole 23.

Referring to Fig. 6, optical flame detector 50 is single package body structure.Optical flame detector 50 receives the visible ray in ambient light, and detects The intensity of visible ray, using the foundation of the display brightness as control display screen 90.

Please refer to Fig.1 and Fig. 6, imaging modules 60 can be visible image capturing first 61 and one in infrared pick-up first 62 Or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is installed on microscope base 63, and image passes Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, mounting surface 631 be located at lens barrel 64 and imaging sensor 65 it Between.In the embodiment illustrated in fig. 6, optical flame detector 50 is arranged on mounting surface 631, and specifically, optical flame detector 50 is in mounting surface 631 The plane orthographic projection at place is at least partly dropped on mounting surface 631, in this way, optical flame detector 50 sets tighter with imaging modules 60 Gather, the horizontal space that the two takes jointly is smaller.

Referring to Fig. 1, receiver 70 is used to send out acoustic signals when being encouraged be subject to power supply, user can by by Words device 70 is conversed.Structured light projector 80 is used for outside emitting structural light, on project structured light to testee after it is anti- Penetrate, the structure light reflected can be received by infrared pick-up first 62, and the processor of electronic device 100 is further analyzed by infrared light The structure light that camera 62 receives, to obtain the depth information of testee.

In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, defeated Enter to export that module 10, infrared pick-up are first 62, visible image capturing is first 61, the center of receiver 70 and structured light projector 80 is located at On same line segment.Specifically, be followed successively by from one end of line segment to the other end input and output module 10, structured light projector 80, by Talk about that device 70, infrared pick-up be first 62, visible image capturing first 61 (as shown in Figure 7), at this time, it is seen that light video camera head 61 and infrared light are taken the photograph Double photography/videography heads (as shown in figure 17) can be formed as first 62；Or input and output mould is followed successively by from one end of line segment to the other end Group 10, infrared pick-up are first 62, receiver 70, visible image capturing are first 61, structured light projector 80 (as shown in Figure 1)；Or from One end of line segment is followed successively by infrared pick-up first 62, input and output module 10, receiver 70, visible image capturing head to the other end 61st, structured light projector 80；Or it is followed successively by that infrared pick-up is first 62, visible image capturing head from one end of line segment to the other end 61st, receiver 70, input and output module 10, structured light projector 80, at this time, it is seen that light video camera head 61 and infrared pick-up first 62 Double photography/videography heads (as shown in figure 17) can be formed.Certainly, input and output module 10, infrared pick-up be first 62, receiver 70, can See that light video camera head 61, the arrangement mode of structured light projector 80 are not limited to above-mentioned citing, there can also be other, such as each electronics The center of component arranges the shapes such as in the arc-shaped, center arrangement is rectangular.

Further, incorporated by reference to Fig. 6, optical flame detector 50 can be arranged on the mounting surface 631 of infrared pick-up first 62, also may be used To be arranged on the mounting surface 631 of visible image capturing first 61, certainly, optical flame detector 50 can not also be arranged on mounting surface 631, example Such as, optical flame detector 50 can be disposed adjacent with input and output module 10, or be disposed adjacent with receiver 70, and this is not restricted.

To sum up, in the electronic device 100 of embodiment of the present invention, input and output module 10 is by infrared light compensating lamp 12, close Infrared lamp 13 and proximity sensor 1d is integrated into a single package body structure, has gathered transmitting and has received infrared light with infrared distance measurement Function and infrared light filling function, therefore, the integrated level of input and output module 10 is higher, small volume, input and output module 10 have saved the space for the function of realizing infrared light filling and infrared distance measurement.Further, since infrared light compensating lamp 12, close to infrared lamp 13 It is carried on proximity sensor 1d on same package substrate 111, infrared light compensating lamp 12 compared to traditional handicraft, close to infrared Lamp 13 and proximity sensor 1d, which need different wafers are respectively adopted, to be manufactured recombinants and is encapsulated to PCB substrate, improves encapsulation effect Rate.

Referring to Fig. 3, in some embodiments, input and output module 10 further includes light-supplementing lamp lens 18, saturating close to lamp Mirror 19 and close sensing lens 1e.Light-supplementing lamp lens 18 are arranged in encapsulating housing 11 and corresponding with infrared light compensating lamp 12.It is close Lamp lens 19 are arranged in encapsulating housing 11 and corresponding with close to infrared lamp 13.Encapsulating housing 11 is arranged on close to sensing lens 1e It is interior and corresponding with proximity sensor 1d.The infrared light that infrared light compensating lamp 12 is launched converges to benefit under the action of light-supplementing lamp lens 18 Projected in light window 1131, reduce the light quantity in other regions for being transmitted to package wall 112 and encapsulation top 113.Similarly, approach The infrared light that infrared lamp 13 is launched is projected being converged to close under the action of lamp lens 19 close in luminescence window 1132, reduces hair It is mapped to the light quantity in other regions at package wall 112 and encapsulation top 113.Similarly, the quilt by entering close to receipts light window 1133 When the infrared light of object reflection is incided close on sensing lens 1e, infrared light is converged to close to sensing close to sensing lens 1e On device 1d, reduce infrared light and be transferred to proximity sensor 1d with the light quantity of exterior domain.Specifically, light-supplementing lamp lens 18, close to lamp Lens 19 close to sensing lens 1e with can be located on same transparent base, more specifically, light-supplementing lamp lens 18, saturating close to lamp Mirror 19 is obtained with can be integrally formed close to sensing lens 1e with the transparent base.Certainly, input and output module 10 can also It is provided only with light-supplementing lamp lens 18, close to lamp lens 19 and close to any one in sensing lens 1e or any two, also may be used To be not provided with light-supplementing lamp lens 18, close to lamp lens 19 and close to sensing lens 1e.

Referring to Fig. 3, in some embodiments, input and output module 10 further includes multiple metal shutter 1a, multiple Metal shutter 1a is respectively positioned in encapsulating housing 11, and multiple metal shutter 1a are respectively positioned at infrared light compensating lamp 12, close to red Outer lamp 13 and proximity sensor 1d are arbitrarily between the two.When infrared light compensating lamp 12, close to infrared lamp 13 and proximity sensor 1d When center is located on same line segment, the quantity of metal shutter 1a is two；If one end of line segment is followed successively by infrared to the other end Light compensating lamp 12, close to infrared lamp 13 and proximity sensor 1d, two metal shutter 1a respectively positioned at infrared light compensating lamp 12 with connecing Between near-infrared lamp 13 and close between infrared lamp 13 and proximity sensor 1d；Connect if one end of line segment is followed successively by the other end Near-infrared lamp 13, infrared light compensating lamp 12 and proximity sensor 1d, two metal shutter 1a respectively positioned at infrared light compensating lamp 12 with Close between infrared lamp 13 and between infrared light compensating lamp 12 and proximity sensor 1d；If one end of line segment is followed successively by the other end Close to infrared lamp 13, proximity sensor 1d and infrared light compensating lamp 12, two metal shutter 1a are respectively situated proximate to sensor 1d With close between infrared lamp 13 and between infrared light compensating lamp 12 and proximity sensor 1d.Metal shutter 1a is located at infrared light filling Lamp 12 and close between infrared lamp 13, metal shutter 1a on the one hand can shield infrared light compensating lamp 12 with close to 13 phase of infrared lamp Electromagnetic interference between mutually, infrared light compensating lamp 12 will not interact with the luminous intensity close to infrared lamp 13 and sequential, another Aspect metal shutter 1a can be used for completely cutting off 12 place cavity of infrared light compensating lamp and the cavity close to the place of infrared lamp 13, light Another cavity will not be entered from a cavity.Metal shutter 1a is between infrared light compensating lamp 12 and proximity sensor 1d Or it is located adjacent to sensor 1d and close to infrared light compensating lamp 12 between infrared lamp 13, can be avoided and close to infrared lamp 13 initial The infrared light of transmitting is incided on proximity sensor 1d, moreover it is possible to shields infrared light compensating lamp 12 and proximity sensor 1d is mutual Electromagnetic interference or shielding close to infrared lamp 13 and electromagnetic interference mutual proximity sensor 1d.

Referring to Fig. 8, in some embodiments, input and output module 10 further includes optics sealing cover 1b.Optics sealing cover 1b It is made of light transmissive material, optics sealing cover 1b is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 1b is wrapped up Firmly infrared light compensating lamp 12, close to infrared lamp 13 and proximity sensor 1d.Specifically, optics sealing cover 1b can be injection molded as by encapsulating Type technique is formed, and optics sealing cover 1b can be made of transparent thermosetting epoxy resin, to be not easy to soften in use, optics Sealing cover 1b can fix infrared light compensating lamp 12, close to the relative position between infrared lamp 13 and proximity sensor 1d three, and make Obtain infrared light compensating lamp 12, be not easy to rock in encapsulating housing 11 close to infrared lamp 13 and proximity sensor 1d.

In addition, referring to Fig. 8, input and output module 10 further include it is multiple go out light clapboard 1c, it is multiple go out light clapboard 1c formed In optics sealing cover 1b and it is located at infrared light compensating lamp 12, close between infrared lamp 13 and proximity sensor 1d three.When infrared benefit Light lamp 12, close to the center of infrared lamp 13 and proximity sensor 1d be located on same line segment when, go out light clapboard 1c quantity be two It is a；If one end of line segment is followed successively by infrared light compensating lamp 12, close to infrared lamp 13 and proximity sensor 1d, two light extractions to the other end Partition plate 1c respectively positioned at infrared light compensating lamp 12 and close between infrared lamp 13 and close to infrared lamp 13 and proximity sensor 1d it Between；If one end of line segment is followed successively by close to infrared lamp 13, infrared light compensating lamp 12 and proximity sensor 1d, two light extractions to the other end Partition plate 1c respectively positioned at infrared light compensating lamp 12 and close between infrared lamp 13 and infrared light compensating lamp 12 and proximity sensor 1d it Between；If one end of line segment is followed successively by close to infrared lamp 13, proximity sensor 1d and infrared light compensating lamp 12, two light extractions to the other end Partition plate 1c be respectively situated proximate to sensor 1d and close between infrared lamp 13 and infrared light compensating lamp 12 and proximity sensor 1d it Between.Go out light clapboard 1c and can be used for interval infrared light compensating lamp 12 and close to infrared lamp 13, the light that infrared light compensating lamp 12 is sent will not It is pierced by from close to luminescence window 1132, the light sent close to infrared lamp 13 will not be pierced by from light filling window 1131.Light extraction Partition plate 1c can stop that infrared light compensating lamp 12 and the infrared light close to 13 initial transmissions of infrared lamp incide proximity sensor 1d On, at the same stop from close to receive light window 1133 enter and directive proximity sensor 1d infrared light influence infrared light compensating lamp 12 and Close to shining for infrared lamp 13.

Referring to Fig. 6, in some embodiments, the optical flame detector 50 of the above embodiment can be arranged on the peace of microscope base 63 On dress face 631.Microscope base 63 can be the microscope base 63 of infrared pick-up first 62 or the microscope base 63 of visible image capturing first 61.

Referring to Fig. 9, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also Offer cover board sound outlet hole 35, the position correspondence of receiver 70 and cover board sound outlet hole 35 and casing sound outlet hole.Input and output module 10th, infrared pick-up is first 62, the center of visible image capturing first 61 and structured light projector 80 is located on same line segment, receiver 70 Between the line segment and the top 21 of casing 20.

On the line segment, each electronic component (input and output module on cover board 30 has not been saved in the center of receiver 70 10th, infrared pick-up is first 62, visible image capturing is first 61, structured light projector 80 etc.) horizontal space that takes.As shown in Figure 9 Embodiment in, cover board sound outlet hole 35 is opened in the marginal position of cover board 30, and casing sound outlet hole is opened up close to top 21.

Referring again to Figure 10, cover board light filling through hole 34, cover board can also be offered in some embodiments, on cover board 30 Light filling through hole 34 is corresponding with casing light filling through hole 24, and the infrared light that infrared light compensating lamp 12 is launched can after passing through casing light filling through hole 24 To be pierced by electronic device 100 from cover board light filling through hole 34.At this time, luminous 23 corresponding position of through hole is approached on cover board 30 with casing Infrared transmission ink 40 can be set by putting, and user is difficult to the inside for seeing electronic device 100 close to luminous through hole 23 by casing It is more beautiful close to infrared lamp 13, the shape of electronic device 100.

1 is please referred to Fig.1, cover board can also be opened up in some embodiments, on cover board 30 close to luminous through hole 33, cover board It is corresponding with the close luminous through hole 23 of casing close to the through hole 33 that shines, sent out close to the infrared light that infrared lamp 13 is launched through casing is close After light through hole 23 electronic device 100 can be pierced by close in luminous through hole 33 from cover board.At this time, lead on cover board 30 with casing light filling 24 corresponding position of hole can set infrared transmission ink 40, and user is difficult to see electronic device by casing light filling through hole 24 The infrared light compensating lamp 12 of 100 inside, the shape of electronic device 100 are more beautiful.

2 are please referred to Fig.1, cover board can also be opened up in some embodiments, on cover board 30 close to receipts light through hole 36, cover board Corresponding close to receipts light through hole 25 and proximity sensor 1d with casing close to light through hole 36 is received, electronic device 100 is outer anti-by object The infrared light penetrated can incide proximity sensor 1d through cover board close to after receiving light through hole 36 and the close receipts light through hole 25 of casing On.

3 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on On substrate 66, optical flame detector 50 may be also secured on substrate 66.Specifically, FPC, a part for substrate 66 are provided with substrate 66 In microscope base 63, another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and for carrying imaging sensor 65, the other end can be connected with the mainboard of electronic device 100.When optical flame detector 50 is arranged on substrate 66, optical flame detector 50 is arranged on Outside microscope base 63, optical flame detector 50 can also be connected with FPC.

Imaging modules 60 can be visible image capturing first 61 and one or two in infrared pick-up first 62.Specifically, Optical flame detector 50 can be fixed on the substrate 66 of visible image capturing first 61；Optical flame detector 50 can be fixed on infrared pick-up first 62 On substrate 66.Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the side opposite with optical flame detector 50, with increase The integral strength of substrate 66 so that FPC is not susceptible to around folding, while when optical flame detector 50 is arranged on substrate 66 is not susceptible to shake It is dynamic.In one example, optical flame detector 50 may be also secured on the lateral wall of microscope base 63, such as is fixed on by cohesive mode On the lateral wall of microscope base 63.

4 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67 Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- 672 and the 3rd sub- top surface 673 of top surface, the second son top 672 and first sub- top surface 671 of face tilts connection and forms notch 675, the 3rd sub- top surface 673 and second with the first sub- top surface 671 Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- 671 and the 3rd sub- top surface 673 of top surface to connect first Sub- 671 and the 3rd sub- top surface 673 of top surface.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight Angle, the angle between the second sub- 672 and the 3rd sub- top surface 673 of top surface can be obtuse angle or right angle.Notch 675 is opened in camera shell On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.3rd sub- top surface 673 offers out Light through hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through hole 674.Imaging sensor 65 is housed in In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through hole 674 and camera lens mould Group 68 is simultaneously delivered on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Optical flame detector 50 is arranged on At one sub- top surface 671.In present embodiment, imaging modules 60 can be visible image capturing first 61, and optical flame detector 50 is single packaging body Structure.In other embodiments, imaging modules 60 can be infrared pick-up first 62.

The imaging modules 60 of present embodiment offer notch 675, and optical flame detector 50 is arranged on the first sub- top surface 671 On, optical flame detector 50 is set compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, has saved electronics dress Put the installation space in 100.

Please continue to refer to Figure 14, in some embodiments, the optical flame detector 50 of the above embodiment is arranged on the first son top On face 671 and positioned at the outside of camera case 67, specifically, whole optical flame detector 50 is along the projection perpendicular to the first sub- top surface 671 It can be located in the first sub- top surface 671 (as shown in figure 14)；Alternatively, part optical flame detector 50 is along perpendicular to the first sub- top surface 671 Projection be located in the first sub- top surface 671.That is, optical flame detector 50 is at least part of to be located at the first sub- top surface 671 just Top, in this way, optical flame detector 50 sets compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, further The installation space in electronic device 100 is saved.

5 are please referred to Fig.1, the first sub- top surface 671 of the above embodiment offers loophole 676, and optical flame detector 50 is located at phase It is in casing body 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and be delivered to light On sensor 50.The optical flame detector 50 of present embodiment is arranged in camera case 67, makes the structure of optical flame detector 50 and camera case 67 More stablize and easy to which optical flame detector 50 and imaging modules 60 are installed on casing 20.

6 are please referred to Fig.1, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole 676, optical flame detector 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image sensing Device 65 is arranged on substrate 66, and optical flame detector 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically, base It is provided with FPC on plate 66, one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can be with The mainboard connection of electronic device 100.In other embodiments, optical flame detector 50 can also be connected with FPC.

The optical flame detector 50 of present embodiment is arranged in camera case 67, makes the structure of optical flame detector 50 and camera case 67 more Add and stablize and easy to which optical flame detector 50 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60 set substrate 66 simultaneously Optical flame detector 50 is arranged on substrate 66, optical flame detector 50 is firmly mounted in camera case 67.

7 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 take the photograph module, including two imaging sensors 65, camera case 67 and two camera lens moulds to be double Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677 678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a positioned at the first tread 677 with With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677 Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle. Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two A light extraction through hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through holes 674 Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions Through hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68, Light outside electronic device 100 can pass through light extraction through hole 674 and camera lens module 68 and be delivered on imaging sensor 65.This reality Apply in mode, imaging modules 60 can be visible image capturing first 61, and two camera lens modules 68 are visible image capturing first 61 at this time Corresponding camera lens module.Optical flame detector 50 is arranged on the second tread 678 and outside camera case 67.Optical flame detector 50 encapsulates to be single Body structure.In other embodiments, imaging modules 60 can be infrared pick-up first 62, and two camera lens modules 68 are at this time First 62 corresponding camera lens module of infrared pick-up.In yet another embodiment, imaging modules 60 include visible image capturing first 61 and Infrared pick-up first 62, one of camera lens module 68 is first 62 corresponding camera lens module of infrared pick-up at this time, another mirror Head mould group 68 is first 61 corresponding camera lens module of visible image capturing.

The imaging modules 60 of present embodiment offer notch 675, and optical flame detector 50 is arranged on the second tread 678 On, optical flame detector 50 is set compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, has saved electronics dress Put the installation space in 100.

8 are please referred to Fig.1, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670 On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through holes 674 are opened in the first son respectively On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675 Both sides.At this time, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face 679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678, Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second Angle be right angle.Relative to the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating optical flame detector 50 is arranged on the second tread 678 On.

7 and Figure 18 is please referred to Fig.1, in some embodiments, the optical flame detector 50 of the above embodiment is arranged on the second ladder On face 678 and positioned at the outside of camera case 67.Specifically, when notch 675 is opened in the marginal position of top surface 670, entirely Optical flame detector 50 can be located in the second tread 678 along perpendicular to the projection of the second tread 678；Alternatively, 50 edge of part optical flame detector Projection perpendicular to the second tread 678 is located in the second tread 678 (as shown in figure 18).That is, optical flame detector 50 is at least A part is located at the surface of the second tread 678.When notch 675 is opened on the centre position of top surface 670, whole optical flame detector 50 can be located in the second tread 678 (as shown in figure 18) along perpendicular to the projection of the second tread 678.In this way, optical flame detector 50 Set compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, further saves in electronic device 100 Installation space.

9 are please referred to Fig.1, the second tread 678 of the above embodiment offers loophole 676, and optical flame detector 50 is located at camera It is in housing 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and be delivered to light sensation On device 50.The optical flame detector 50 of present embodiment is arranged in camera case 67, makes the structure of optical flame detector 50 and camera case 67 more Add and stablize and easy to which optical flame detector 50 and imaging modules 60 are installed on casing 20.

Figure 20 is referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676, Optical flame detector 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, imaging sensor 65 It is arranged on substrate 66, optical flame detector 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically, substrate 66 On be provided with FPC, one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can be with electronics The mainboard connection of device 100.In other embodiments, optical flame detector 50 can also be connected with FPC.

In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention. In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment or example.Moreover, description Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side Formula combines.

In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two, Three, unless otherwise specifically defined.

Although the embodiment of the present invention has been shown and described above, it is to be understood that above-described embodiment is example Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.

Claims

1. a kind of input and output module, it is characterised in that the input and output module includes encapsulating housing, infrared light compensating lamp, connects Near-infrared lamp and proximity sensor, the encapsulating housing include package substrate, the infrared light compensating lamp, described close to infrared lamp And the proximity sensor is encapsulated in the encapsulating housing and carries on the package substrate, the infrared light compensating lamp with Described to launch infrared light to outside the encapsulating housing close to infrared lamp with different power, the proximity sensor is used for The infrared light that is reflected by the object is received to detect the distance of object.

2. input and output module according to claim 1, it is characterised in that the input and output module further includes chip, The infrared light compensating lamp, described be both formed on a piece of chip close to infrared lamp and the proximity sensor.

3. input and output module according to claim 2, it is characterised in that the encapsulating housing further include package wall and Encapsulation top, the package wall extend from the package substrate and be connected at the top of the encapsulation and the package substrate it Between, formed with light filling window, close to luminescence window and close to receiving light window at the top of the encapsulation, the light filling window with it is described red Outer light compensating lamp corresponds to, it is described close to luminescence window with described correspondings close to infrared lamp, it is described close to receiving light window and described approach Sensor corresponds to.

4. input and output module according to claim 2, it is characterised in that the input and output module further includes light compensating lamp Lens, the light-supplementing lamp lens are arranged in the encapsulating housing and corresponding with the infrared light compensating lamp；And/or

The input and output module is further included close to lamp lens, it is described be arranged on close to lamp lens in the encapsulating housing and with institute State and corresponded to close to infrared lamp；And/or

The input and output module is further included close to sensing lens, described to be arranged on close to sensing lens in the encapsulating housing simultaneously It is corresponding with the proximity sensor.

5. input and output module according to claim 2, it is characterised in that the input and output module, which further includes, to be arranged on Light-supplementing lamp lens in the encapsulating housing, close to lamp lens and close to sensing lens, the light-supplementing lamp lens with it is described infrared Light compensating lamp corresponds to, it is described close to lamp lens with described correspondings close to infrared lamp, it is described close to be sensed with described close to sensing lens Device correspond to, the light-supplementing lamp lens, it is described close to lamp lens and it is described close to sensing lens be located on same transparent base.

6. input and output module according to claim 2, it is characterised in that the input and output module further includes multiple gold Belong to shutter, multiple metal shutters respectively in the encapsulating housing and positioned at the infrared light compensating lamp, described connect In near-infrared lamp and the proximity sensor it is any between the two.

7. input and output module according to claim 1, it is characterised in that the input and output module is further included by printing opacity Optics sealing cover made of material, the optics sealing cover is formed on the package substrate and in the encapsulating housing, described Optics sealing cover wraps the infrared light compensating lamp, is described close to infrared lamp and the proximity sensor.

8. input and output module according to claim 7, it is characterised in that the input and output module further include it is multiple go out Light clapboard, it is multiple it is described go out light clapboard be respectively formed in the optics sealing cover and positioned at the infrared light compensating lamp, described close In infrared lamp and the proximity sensor it is any between the two.

9. according to the input and output module described in claim 1-7 any one, it is characterised in that on the input and output module Formed with grounding pin, light compensating lamp pin, close to lamp pin and close to sensing pin, the grounding pin and the light compensating lamp draw When foot is enabled, the infrared light compensating lamp launches infrared light；The grounding pin and it is described close to lamp pin be enabled when, institute State close to infrared lamp and launch infrared light；It is described close to sensing when the grounding pin and the close sensing pin are enabled Device receives the infrared light that is reflected by the object to detect the distance of object.

10. a kind of electronic device, it is characterised in that the electronic device includes：

Casing；And

Input and output module described in claim 1-9 any one, the input and output module are arranged in the casing.

11. electronic device according to claim 10, it is characterised in that the electronic device further includes the cover board of printing opacity, The casing offers casing close to luminous through hole, casing light filling through hole and casing close to receipts light through hole, described close to infrared lamp Corresponding close to luminous through hole with the casing, the infrared light compensating lamp is corresponding with the casing light filling through hole, described close to sensing Device is corresponding close to light through hole is received with the casing, and the cover board is set on the housing.

12. electronic device according to claim 10, it is characterised in that the electronic device further includes the cover board of printing opacity, The casing offers casing close to luminous through hole, casing light filling through hole and casing close to receipts light through hole, described close to infrared lamp Corresponding close to luminous through hole with the casing, the infrared light compensating lamp is corresponding with the casing light filling through hole, described close to sensing Device is corresponding close to light through hole is received with the casing, and the cover board is set on the housing, and the cover board is combined with the casing Surface formed with only transmit infrared light it is infrared pass through ink, it is described that infrared through ink to block the casing logical close to shining Hole, the casing light filling through hole and the casing are at least one in light through hole close to receiving.

13. electronic device according to claim 10, it is characterised in that the electronic device further includes optical flame detector and imaging Module, the imaging modules include microscope base, the lens barrel on the microscope base and the image sensing being housed in the microscope base Device, the microscope base include the mounting surface between the lens barrel and described image sensor, and the optical flame detector is arranged on described Mounting surface.

14. electronic device according to claim 10, it is characterised in that the electronic device further includes imaging modules and light Sensor, on the housing, the imaging modules include camera case and camera lens module, the camera for the imaging modules installation The top surface of housing is for cascaded surface and the first sub- top surface and the second sub- top surface including being connected, the second sub- top surface relatively described the One sub- top surface inclination simultaneously forms notch with the described first sub- top surface, and the top surface offers light extraction through hole, and the camera lens module is received Appearance is in the camera case and corresponding with the light extraction through hole, and the optical flame detector is arranged at the described first sub- top surface.

15. electronic device according to claim 10, it is characterised in that the electronic device further includes imaging modules and light Sensor, the imaging modules include camera case and two camera lens modules, offered on the top surface of the camera case notch with Step-like top surface is formed, the top surface includes the first tread and the second tread less than first tread, first ladder Two light extraction through holes are offered on face, each light extraction through hole is corresponding with the camera lens module, and the optical flame detector is arranged on institute State at the second tread.

16. electronic device according to claim 10, it is characterised in that the electronic device further includes imaging modules and light Sensor, the imaging modules include the substrate that microscope base, the lens barrel on the microscope base and part are arranged in the microscope base, The optical flame detector is set on the substrate.