CN107946432A - One kind is molded uniform LED support - Google Patents
One kind is molded uniform LED support Download PDFInfo
- Publication number
- CN107946432A CN107946432A CN201711331680.5A CN201711331680A CN107946432A CN 107946432 A CN107946432 A CN 107946432A CN 201711331680 A CN201711331680 A CN 201711331680A CN 107946432 A CN107946432 A CN 107946432A
- Authority
- CN
- China
- Prior art keywords
- pole piece
- led support
- lamp cup
- injection
- uniform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002347 injection Methods 0.000 claims abstract description 37
- 239000007924 injection Substances 0.000 claims abstract description 37
- 239000000243 solution Substances 0.000 abstract description 4
- 239000002994 raw material Substances 0.000 description 7
- 238000001746 injection moulding Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to LED support technical field, more particularly to a kind of uniform LED support of injection, including for the Lamp cup for installing LED chip and the pole piece being formed in the Lamp cup, the pole piece includes the first pole piece and the second pole piece for being layed in the Lamp cup bottom surface；First pole piece two sides opposite on the Lamp cup, make and two independent regions are formed in the Lamp cup；Second pole piece is arranged in two regions, and the injection area connected is formed between second pole piece and the first pole piece.The goal of the invention of the present invention is to provide a kind of uniform LED support of injection solve the existing LED support with partition-type pole piece in the presence of the non-uniform technical problem of injection using technical solution provided by the invention.
Description
Technical field
The present invention relates to LED support technical field, more particularly to a kind of uniform LED support of injection.
Background technology
Chip carrier of the lead frame as integrated circuit, is a kind of real by means of bonding material (spun gold, aluminium wire, copper wire)
The electrical connection of existing chip internal circuits exit and outer lead, forms the key structure part of electric loop, plays and exterior
The function served as bridge of conducting wire connection, is required for using lead frame in most semiconductor integrated blocks, is electronics and information industry
In important basic material.
In LED support field, the manufacture craft of LED support is：Punching press-plating-be molded-is cut.In punching course
In, it is the lead frame for being stamped and formed out having multiple patch supports on the copper sheet to full wafer；Injection moulding process is then in lead frame
On each patch support on complete plastic-injection, each patch support is formed complete LED support.Link is molded, is
The critically important ring of LED production technologies, Shooting Technique are by the metallic support of web-like, and injection is put into automatic discharging material collecting device
Among machine, raw material is then injected into.
There is the common cathode or common-anode pole piece for forming strip, common cathode in the LED support of existing more lamp beads, its patch support
Lamp cup bottom after injection is separated into several independent regions by pole or common-anode pole piece, as shown in Figure 1, two strips
The region of a H font is formed between pole piece.During LED support is molded, the plastic raw materials that injection hole 1 injects first are filled
To a areas, the bottom for being then passed through pole piece 2 is flowed into H areas, and the bottom for again passing through pole piece 3 is flowed into b areas, and plastic raw materials need to wear
After the bottom of pole piece twice, the region away from injection hole 1 is molded non-uniform technical problem, reduces the qualification rate of LED support.
The content of the invention
The goal of the invention of the present invention is to provide a kind of uniform LED support of injection, using technical side provided by the invention
Case solves the existing LED support with partition-type pole piece and there is the non-uniform technical problem of injection.
In order to solve the above technical problem, the present invention provides one kind to be molded uniform LED support, including for installing LED
The Lamp cup of chip and the pole piece being formed in the Lamp cup, the pole piece include the first pole piece for being layed in the Lamp cup bottom surface and
Second pole piece；First pole piece two sides opposite on the Lamp cup, make and two independent areas are formed in the Lamp cup
Domain；Second pole piece is arranged in two regions, and forms the injection connected between second pole piece and the first pole piece
Area.
Preferably, second pole piece is formed on the other two sides on the Lamp cup；In second pole piece and
Formed with the 3rd pole piece between one pole piece；3rd pole piece is disconnected parallel to first pole piece, and in centre position.
Preferably, it is in H fonts that injection area is formed between first pole piece and the 3rd pole piece；Second pole piece is arranged on institute
State on H fonts on the side at the Lamp cup edge.
Preferably, the quantity of second pole piece is 8 pieces, is respectively arranged in two injection areas.
The present invention is provided through two sides opposite on the Lamp cup, makes two isolated areas of formation in the Lamp cup
First pole piece, first pole piece can be used as common cathode or common-anode to use, and the second pole piece in two isolated areas is then used as phase
Antipole piece uses, and in injection moulding process, injection raw material only passes through the bottom of the first pole piece, you can completes to the note in whole Lamp cup
Modeling so that LED support injection is more uniform, and it is non-uniform in the presence of being molded to solve the existing LED support with partition-type pole piece
Technical problem.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, the present invention will be implemented below
Attached drawing is briefly described needed in the description of example or the prior art.It should be evident that drawings in the following description
Only part of the embodiment of the invention, for those of ordinary skill in the art, in not making the creative labor property
Under the premise of, other attached drawings can also be obtained according to these attached drawings.
Fig. 1 is existing LED support structure diagram；
Fig. 2 binds foot LED support front view for the embodiment of the present invention；
Fig. 3 binds foot LED support rearview figure for the embodiment of the present invention；
Fig. 4 binds foot LED support side view for the embodiment of the present invention；
Fig. 5 binds foot LED support bottom view for the embodiment of the present invention.
Embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes.Obviously, described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without creative efforts
Embodiment, belongs to the scope of protection of the invention.
There is the common cathode or common-anode pole piece for forming strip, common cathode in the LED support of existing more lamp beads, its patch support
Lamp cup bottom after injection is separated into several independent regions by pole or common-anode pole piece, during LED support is molded,
The plastic raw materials of injection hole injection need to sequentially pass through the bottom of polylith pole piece, could complete the injection of whole Lamp cup, away from note
The region for moulding mouth is molded non-uniform technical problem, reduces the qualification rate of LED support.
In order to solve the above-mentioned technical problem, Fig. 2-5 are referred to, the present embodiment provides one kind to be molded uniform LED support, bag
Include for the Lamp cup 10 for installing LED chip and the pole piece being formed in Lamp cup 10.Fig. 3,5 are referred to, which can be pole
Piece cutting product, or pole piece are bound foot product.Its difference lies in, the pole piece of pole piece cutting product is concordant with the lateral wall of LED support,
The bottom surface of pole piece is in plane；Pole piece bind foot product pole piece then formed with flanging, pole piece extend out to LED support it is outer after be wrapped in
The bottom of LED support.The present embodiment elaborates by taking LED support of binding foot as an example.
Wherein pole piece includes the first pole piece 20 and the second pole piece 30 for being layed in 10 bottom surface of Lamp cup.First pole piece 20 runs through lamp
Opposite two sides on cup 10, make and two independent regions 11 are formed in Lamp cup 10；Second pole piece 30 is arranged in two regions 11,
And second forms the injection area connected between pole piece 30 and the first pole piece 20.First pole piece 20 can be used as common cathode or common-anode
Use, the second pole piece 30 in two isolated areas 11 is then used as opposite pole piece.
The injection point 12 of LED support can be arranged on the side wall of Lamp cup 10, can be also arranged in two injection areas.In injection moulding process
In, after injection raw material fills up one of region 11, only pass through the bottom of the first pole piece 20, you can to another region 11 into
Row filling, and then realize the injection in whole Lamp cup 10.LED support provided in this embodiment is in injection moulding process, injection raw material
The injection of whole Lamp cup 10 can be only completed by one piece of pole piece so that LED support injection is more uniform, and solving existing has
The LED support of partition-type pole piece, which exists, is molded non-uniform technical problem.
In order to improve the practicality of LED support, the second pole piece 30 is formed on the other two sides on Lamp cup 10, second
Formed with the 3rd pole piece 40 between 30 and first pole piece 20 of pole piece, the 3rd pole piece 40 is parallel to the first pole piece 20, and in interposition
Put disconnection.Specifically, it is in H fonts that injection area is formed between the first pole piece 20 and the 3rd pole piece 40；Second pole piece 30 is arranged on H fonts
On the side at upper close 10 edge of Lamp cup.The quantity of second pole piece 30 is 8 pieces, is respectively arranged in two injection areas.
LED support using the above structure, due to the 3rd pole piece 40 centre position disconnect, the first pole piece 20 separate shape
Into isolated area 11 in, the 3rd pole piece 40 does not influence the independence in the region 11, within the 3rd pole piece 40 do not influencing to be molded
On the basis of effect, the first pole piece 20 and the 3rd pole piece 40 can also interact the positive/negative plate as LED chip, add LED branch
The diversity of frame illumination effect.
Embodiments described above, does not form the restriction to the technical solution protection domain.It is any in above-mentioned implementation
Modifications, equivalent substitutions and improvements made within the spirit and principle of mode etc., should be included in the protection model of the technical solution
Within enclosing.
Claims (4)
1. one kind is molded uniform LED support, including for the Lamp cup for installing LED chip and the pole being formed in the Lamp cup
Piece, it is characterised in that：The pole piece includes the first pole piece and the second pole piece for being layed in the Lamp cup bottom surface；First pole piece
The opposite two sides on the Lamp cup, make and two independent regions are formed in the Lamp cup；Second pole piece is arranged on two
In a region, and the injection area connected is formed between second pole piece and the first pole piece.
A kind of 2. uniform LED support of injection according to claim 1, it is characterised in that：Second pole piece is formed at
On other two sides on the Lamp cup；Formed with the 3rd pole piece between second pole piece and the first pole piece；Described 3rd
Pole piece is disconnected parallel to first pole piece, and in centre position.
A kind of 3. uniform LED support of injection according to claim 2, it is characterised in that：First pole piece and the 3rd
It is in H fonts that injection area is formed between pole piece；Second pole piece is arranged on the H fonts close to the side at the Lamp cup edge
On.
A kind of 4. uniform LED support of injection according to claim 3, it is characterised in that：The quantity of second pole piece
For 8 pieces, it is respectively arranged in two injection areas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711331680.5A CN107946432A (en) | 2017-12-13 | 2017-12-13 | One kind is molded uniform LED support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711331680.5A CN107946432A (en) | 2017-12-13 | 2017-12-13 | One kind is molded uniform LED support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107946432A true CN107946432A (en) | 2018-04-20 |
Family
ID=61942942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711331680.5A Pending CN107946432A (en) | 2017-12-13 | 2017-12-13 | One kind is molded uniform LED support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107946432A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202167539U (en) * | 2011-07-28 | 2012-03-14 | 深圳市聚飞光电股份有限公司 | LED support and LED |
| CN203351656U (en) * | 2013-07-22 | 2013-12-18 | 博罗县正润光电有限公司 | LED light support |
| CN204289506U (en) * | 2014-09-02 | 2015-04-22 | 木林森股份有限公司 | Can the electrically-conductive backing plate of injection mo(u)lding LED support and high density LED support module |
| CN205752240U (en) * | 2016-06-30 | 2016-11-30 | 鸿利智汇集团股份有限公司 | A kind of gold silver plate LED support |
| CN205845998U (en) * | 2014-11-20 | 2016-12-28 | 史利利 | LED support and LED luminescence unit |
| CN207731947U (en) * | 2017-12-13 | 2018-08-14 | 博罗县正润光电有限公司 | A kind of uniform LED support of injection molding |
-
2017
- 2017-12-13 CN CN201711331680.5A patent/CN107946432A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202167539U (en) * | 2011-07-28 | 2012-03-14 | 深圳市聚飞光电股份有限公司 | LED support and LED |
| CN203351656U (en) * | 2013-07-22 | 2013-12-18 | 博罗县正润光电有限公司 | LED light support |
| CN204289506U (en) * | 2014-09-02 | 2015-04-22 | 木林森股份有限公司 | Can the electrically-conductive backing plate of injection mo(u)lding LED support and high density LED support module |
| CN205845998U (en) * | 2014-11-20 | 2016-12-28 | 史利利 | LED support and LED luminescence unit |
| CN205752240U (en) * | 2016-06-30 | 2016-11-30 | 鸿利智汇集团股份有限公司 | A kind of gold silver plate LED support |
| CN207731947U (en) * | 2017-12-13 | 2018-08-14 | 博罗县正润光电有限公司 | A kind of uniform LED support of injection molding |
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