CN205845998U - LED support and LED luminescence unit - Google Patents
LED support and LED luminescence unit Download PDFInfo
- Publication number
- CN205845998U CN205845998U CN201490000319.8U CN201490000319U CN205845998U CN 205845998 U CN205845998 U CN 205845998U CN 201490000319 U CN201490000319 U CN 201490000319U CN 205845998 U CN205845998 U CN 205845998U
- Authority
- CN
- China
- Prior art keywords
- led
- wire welding
- welding area
- transition region
- radial dimension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004020 luminiscence type Methods 0.000 title claims abstract description 14
- 230000007704 transition Effects 0.000 claims abstract description 60
- 238000003466 welding Methods 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000013078 crystal Substances 0.000 claims abstract description 16
- 230000005855 radiation Effects 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 7
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
A kind of LED support (1) and LED luminescence unit.LED support (1) includes the pedestal (11) being provided with containing cavity (111), be arranged on pedestal (11) electrode slice (12) and die bond sheet metal (13).Electrode slice (12) includes wire welding area (121) that be connected, that be positioned at containing cavity (111) and pin (122), and by wire welding area (121) to the transition region (123) of pin (122) transition, die bond sheet metal (13) has the crystal bonding area (131) for fixing LED chip (2), using wire welding area (121) to the direction of pin (122) transition as axially, the radial dimension of transition region (123) is less than the radial dimension of transition region (123) two side areas.Die bond sheet metal (13) is connected with the wire welding area (121) of electrode slice (12).When carrying out the scolding tin of electrode slice pin (122), owing to transition region (123) radial dimension is less, making heat produced by pin (122) scolding tin will not rapidly diffuse into wire welding area (121) causes wire welding area (121) solder joint to come off and form rosin joint phenomenon, it is ensured that the reliability of LED.
Description
Technical field
The application relates to light emitting diode field, particularly relates to a kind of LED support and LED luminescence unit.
Background technology
Due to light emitting diode (Light Emitting Diode, LED) have high security, operate steadily, low energy consumption,
The multiple advantages such as specular removal, life-span length are applied to panel computer, notebook computer, liquid crystal display, big more and more widely
Sized liquid crystal TV and room lighting and outdoor lighting field.Existing LED support, including pedestal, is provided with appearance on pedestal
Putting chamber, also include positive plate and negative plate, positive plate includes positive pole pin and positive pole wire welding area, negative plate include negative pin,
Negative pole wire welding area and for fixing the crystal bonding area of LED chip, crystal bonding area is connected together with negative pole wire welding area.Crystal bonding area is near just
Wire welding area, pole is horizontally disposed with.
During welding, first LED chip is placed in crystal bonding area, then respectively weldering is drawn at the two poles of the earth of LED chip by lead-in wire
It is connected on positive pole wire welding area and negative pole wire welding area.Adopt and can there is problems in that in this way due to crystal bonding area and negative pole wire welding area
The boundlessness that is connected together is distinguished, and causes negative pole wire welding area too close to negative pin, and client is when welding the scolding tin pin of LED
The heat that (including negative pin) produces can be delivered to the solder joint in negative pole wire welding area rapidly, causes this solder joint to come off formation rosin joint
Phenomenon, thus affect the reliability of LED.
Summary of the invention
The application is intended to solve one of above-mentioned technical problem the most to a certain extent.
According to the first aspect of the application, the application provides a kind of LED support, including: it is provided with the pedestal of containing cavity, sets
Being placed in the electrode slice on described pedestal and die bond sheet metal, described electrode slice includes: that be connected, be positioned at described containing cavity
Wire welding area and pin, and by described wire welding area to the transition region of described pin transition, described die bond sheet metal have for
The crystal bonding area of fixing LED chip, using described wire welding area to the direction of described pin transition as axially, the radial direction of described transition region
It is smaller in size than the radial dimension of described transition region two side areas, the described wire welding area phase of described die bond sheet metal and described electrode slice
Even.
Further, the radial dimension of described transition region is less than radial dimension of the 1/2 of described transition region two side areas.
Further, the radial dimension of described transition region is radial dimension of the 1/3 or 1/ of described transition region two side areas
4。
Further, described LED support includes: electrode film and negative electrode plate.
Further, described die bond sheet metal is connected with the described wire welding area of described electrode film or described negative electrode plate.
Further, described die bond sheet metal has the heat radiation leg being connected with described crystal bonding area.
According to the second aspect of the application, the application provides a kind of LED luminescence unit, including: LED support and be installed on
LED chip on described LED support, described LED support includes: is provided with the pedestal of containing cavity, is arranged on described pedestal
Electrode slice and die bond sheet metal, described electrode slice includes: that be connected, be positioned at wire welding area and the pin of described containing cavity,
And had for fixing described LED chip to the transition region of described pin transition, described die bond sheet metal by described wire welding area
Crystal bonding area, using described wire welding area to the direction of described pin transition as axially, the radial dimension of described transition region is less than institute
Stating the radial dimension of transition region two side areas, described die bond sheet metal is connected with the described wire welding area of described electrode slice.
Further, the radial dimension of described transition region is less than radial dimension of the 1/2 of described transition region two side areas.
Further, the radial dimension of described transition region is radial dimension of the 1/3 or 1/ of described transition region two side areas
4。
Further, described LED support includes: electrode film and negative electrode plate.
Further, described die bond sheet metal is connected with the described wire welding area of described electrode film or described negative electrode plate.
Further, described die bond sheet metal has the heat radiation leg being connected with described crystal bonding area.
The application provides the benefit that:
By providing a kind of LED support and LED luminescence unit, described LED support includes: be provided with containing cavity pedestal,
Being arranged at the electrode slice on described pedestal and die bond sheet metal, described electrode slice includes: that be connected, be positioned at described containing cavity
Interior wire welding area and pin, and to the transition region of described pin transition, described die bond sheet metal, be there is use by described wire welding area
In the crystal bonding area of fixing described LED chip, using described wire welding area to the direction of described pin transition as axially, described transition region
Radial dimension less than the radial dimension of described transition region two side areas, the described weldering of described die bond sheet metal and described electrode slice
Line district is connected.So, when carrying out the scolding tin of electrode slice pin, owing to transition region radial dimension is less so that pin scolding tin institute
The heat produced will not rapidly diffuse into wire welding area and cause wire welding area solder joint to come off and form rosin joint phenomenon, it is ensured that LED's can
By property.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED luminescence unit of the embodiment of the present application.
Detailed description of the invention
Embodiments herein is described below in detail, and the example of described embodiment is shown in the drawings, the most from start to finish
Same or similar label represents same or similar element or has the element of same or like function.Below with reference to attached
The embodiment that figure describes is exemplary, it is intended to be used for explaining the application, and it is not intended that restriction to the application.
In the description of the present application, it is to be understood that term " " center ", " longitudinally ", " laterally ", " length ", " width ",
" thickness ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end " " interior ", " outward ", " up time
Pin ", the orientation of the instruction such as " counterclockwise " or position relationship be based on orientation shown in the drawings or position relationship, be for only for ease of
Describe the application and simplification description rather than instruction or the device of hint indication or element must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore it is not intended that restriction to the application.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include one or more this feature.In the description of the present application, " multiple " are meant that two or more,
Unless otherwise expressly limited specifically.
In this application, unless otherwise clearly defined and limited, term " install ", " being connected ", " connection ", " fixing " etc.
Term should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or be integrally connected；It can be machine
Tool connects, it is also possible to be electrical connection；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, can be two units
Connection within part.For the ordinary skill in the art, can understand that above-mentioned term is in this Shen as the case may be
Concrete meaning in please.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score
Can include that the first and second features directly contact, it is also possible to include that the first and second features are not directly contact but by it
Other characterisation contact between.And, fisrt feature second feature " on ", " top " and " above " include that first is special
Levy directly over second feature and oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " below " include that fisrt feature directly over second feature and oblique upper, or is merely representative of
Fisrt feature level height is less than second feature.
Combine accompanying drawing below by detailed description of the invention the application is described in further detail.
Refer to Fig. 1, present embodiments provide a kind of LED luminescence unit, it can be used for various display, illumination, signal refer to
The field such as show, specifically can be integrated into LED display, LED lamp bar or LED signal lamp etc..
Above-mentioned LED luminescence unit specifically includes that LED support 1 and the LED chip 2 being installed on LED support 1.LED props up
Frame 1 includes: the pedestal 11 being provided with containing cavity 111, the electrode slice 12 being arranged on pedestal 11 and die bond sheet metal 13, electrode
Sheet is divided into electrode film and negative electrode plate, electrode slice specifically include that wire welding area 121 that be connected, that be positioned at containing cavity 111 and
Pin 122, and by wire welding area 121 to the transition region 123 of pin 122 transition.Die bond sheet metal 13 has for fixing LED
The crystal bonding area of chip 2.For realizing the present embodiment purpose, using wire welding area 121 to the direction of pin 122 transition as axially, transition
The radial dimension in district 123 is less than the radial dimension of transition region 123 two side areas, die bond sheet metal 13 and the wire welding area of electrode slice 12
121 are connected.
Specifically, can taper into or suddenly diminish to the radial dimension of transition region wire welding area, or, by pin to mistake
The radial dimension crossing district can taper into or suddenly diminish, or, by wire welding area and pin to the radial dimension of transition region
Taper into or suddenly diminish, or, can be tapered into the radial dimension of transition region by wire welding area or suddenly diminish same
Time, to the radial dimension of transition region by pin can suddenly be diminished or taper into.
So, when carrying out the scolding tin of electrode slice pin, owing to transition region radial dimension is less so that pin scolding tin is produced
Raw heat will not rapidly diffuse into wire welding area (effect is thermally isolated) and cause wire welding area solder joint to come off and form rosin joint phenomenon, it is ensured that
The reliability of LED.
When specifically applying, effect being thermally isolated for improving, the radial dimension of transition region 123 is less than 123 liang of lateral areas of transition region
Radial dimension of the 1/2 of territory.And as the presently preferred embodiments, the radial dimension of transition region 123 is the footpath of transition region 123 two side areas
To the 1/3 or 1/4 of size.
In the present embodiment, die bond sheet metal 13 is connected with the wire welding area of electrode film.In other embodiments, die bond gold
Belong to sheet 13 to be connected with the wire welding area of negative electrode plate.
As a kind of preferred embodiment, in order to strengthen LED support and the radiating effect of LED luminescence unit, die bond sheet metal
There is the heat radiation leg being connected with crystal bonding area.
In the description of this specification, reference term " embodiment ", " some embodiments ", " an enforcement
Example ", " some embodiments ", " example ", the description of " concrete example " or " some examples " etc. mean to combine this embodiment or example
The specific features, structure, material or the feature that describe are contained at least one embodiment or the example of the application.In this explanation
In book, the schematic representation of above-mentioned term is not necessarily referring to identical embodiment or example.And, the concrete spy of description
Levy, structure, material or feature can combine in any one or more embodiments or example in an appropriate manner.
Above content is to combine the further description that the application is made by specific embodiment, it is impossible to assert this Shen
Being embodied as please is confined to these explanations.For the application person of an ordinary skill in the technical field, do not taking off
On the premise of the application conceives, it is also possible to make some simple deduction or replace.
Claims (10)
1. a LED support, including: it is provided with the pedestal of containing cavity, the electrode slice being arranged on described pedestal and die bond gold
Belonging to sheet, described electrode slice includes: that be connected, be positioned at wire welding area and the pin of described containing cavity, and by described wire welding area
To the transition region of described pin transition, described die bond sheet metal has the crystal bonding area for fixing LED chip, it is characterised in that
Using described wire welding area to the direction of described pin transition as axially, the radial dimension of described transition region is less than described transition region two
The radial dimension of side region, described die bond sheet metal is connected with the described wire welding area of described electrode slice.
2. LED support as claimed in claim 1, it is characterised in that the radial dimension of described transition region is less than described transition region
Radial dimension of the 1/2 of two side areas.
3. LED support as claimed in claim 2, it is characterised in that the radial dimension of described transition region is described transition region two
Radial dimension of the 1/3 or 1/4 of side region.
4. LED support as claimed in claim 1, it is characterised in that described LED support includes: electrode film and negative electrode plate.
5. LED support as claimed in claim 4, it is characterised in that described die bond sheet metal and described electrode film or described
The described wire welding area of negative electrode plate is connected.
6. LED support as claimed in claim 5, it is characterised in that described die bond sheet metal has and is connected with described crystal bonding area
Logical heat radiation leg.
7. a LED luminescence unit, including: LED support and be installed on the LED chip on described LED support, described LED props up
Frame includes: be provided with the pedestal of containing cavity, the electrode slice being arranged on described pedestal and die bond sheet metal, described electrode slice bag
Include: that be connected, be positioned at wire welding area and the pin of described containing cavity, and by described wire welding area to the mistake of described pin transition
Crossing district, described die bond sheet metal has the crystal bonding area for fixing described LED chip, it is characterised in that with described wire welding area to
The direction of described pin transition is as axially, and the radial dimension of described transition region is less than the radial ruler of described transition region two side areas
Very little, described die bond sheet metal is connected with the described wire welding area of described electrode slice.
8. LED luminescence unit as claimed in claim 7, it is characterised in that the radial dimension of described transition region is less than described mistake
Cross radial dimension of the 1/2 of district's two side areas.
9. LED luminescence unit as claimed in claim 8, it is characterised in that the radial dimension of described transition region is described transition
Radial dimension of the 1/3 or 1/4 of district's two side areas.
10. LED luminescence unit as claimed in claim 7, it is characterised in that described LED support includes: electrode film and negative electricity
Pole piece.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2014/091726 WO2016078052A1 (en) | 2014-11-20 | 2014-11-20 | Led support and led light emitting unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205845998U true CN205845998U (en) | 2016-12-28 |
Family
ID=56013081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201490000319.8U Expired - Fee Related CN205845998U (en) | 2014-11-20 | 2014-11-20 | LED support and LED luminescence unit |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205845998U (en) |
| WO (1) | WO2016078052A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946432A (en) * | 2017-12-13 | 2018-04-20 | 博罗县正润光电有限公司 | One kind is molded uniform LED support |
| CN110529766A (en) * | 2019-09-29 | 2019-12-03 | 周莉莉 | A kind of deformable multipurpose way LED light |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201628185U (en) * | 2009-07-02 | 2010-11-10 | 弘凯光电(深圳)有限公司 | Light emitting diode support and packaging structure thereof |
| CN101834267B (en) * | 2010-04-30 | 2013-07-10 | 深圳市奥伦德元器件有限公司 | Planar bracket and encapsulating method |
| CN201732814U (en) * | 2010-07-20 | 2011-02-02 | 深圳市聚飞光电股份有限公司 | LED support and LED comprising the same for improving reliability |
| CN202167539U (en) * | 2011-07-28 | 2012-03-14 | 深圳市聚飞光电股份有限公司 | LED support and LED |
| CN203445146U (en) * | 2013-07-17 | 2014-02-19 | 邓青平 | Directly-surface mounted type LED support |
-
2014
- 2014-11-20 CN CN201490000319.8U patent/CN205845998U/en not_active Expired - Fee Related
- 2014-11-20 WO PCT/CN2014/091726 patent/WO2016078052A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946432A (en) * | 2017-12-13 | 2018-04-20 | 博罗县正润光电有限公司 | One kind is molded uniform LED support |
| CN110529766A (en) * | 2019-09-29 | 2019-12-03 | 周莉莉 | A kind of deformable multipurpose way LED light |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016078052A1 (en) | 2016-05-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161228 Termination date: 20171120 |
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| CF01 | Termination of patent right due to non-payment of annual fee |