CN204678084U - LED support and LED luminescence unit - Google Patents
LED support and LED luminescence unit Download PDFInfo
- Publication number
- CN204678084U CN204678084U CN201490000324.9U CN201490000324U CN204678084U CN 204678084 U CN204678084 U CN 204678084U CN 201490000324 U CN201490000324 U CN 201490000324U CN 204678084 U CN204678084 U CN 204678084U
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- China
- Prior art keywords
- transition region
- radial dimension
- led
- wire welding
- welding area
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- Expired - Fee Related
Links
- 238000004020 luminiscence type Methods 0.000 title claims abstract description 14
- 230000007704 transition Effects 0.000 claims abstract description 63
- 238000003466 welding Methods 0.000 claims abstract description 44
- 239000002184 metal Substances 0.000 claims abstract description 28
- 239000013078 crystal Substances 0.000 claims abstract description 16
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 16
- 230000005855 radiation Effects 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 7
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 4
- 230000003292 diminished effect Effects 0.000 description 5
- 238000012512 characterization method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
This application discloses a kind of LED support and LED luminescence unit, described LED support comprises: the pedestal being provided with accommodating cavity, be arranged at the electrode slice on described pedestal and die bond sheet metal, described electrode slice comprises: be connected, be positioned at wire welding area and the pin of described accommodating cavity, and by the transition region of described wire welding area to described pin transition, described die bond sheet metal has the crystal bonding area for fixing described LED chip, using described wire welding area to the direction of described pin transition as axis, the radial dimension of described transition region is less than the radial dimension of described transition region two side areas, die bond sheet metal and described electrode slice separate.Like this, when carrying out the scolding tin of electrode slice pin, because transition region radial dimension is less, the heat that pin scolding tin is produced can not be diffused into rapidly wire welding area and cause wire welding area solder joint come off and form rosin joint phenomenon, ensure that the reliability of LED.
Description
Technical field
The application relates to light emitting diode field, particularly relates to a kind of LED support and LED luminescence unit.
Background technology
Due to light emitting diode (Light Emitting Diode, LED) there is high security, operate steadily, low energy consumption, specular removal, life-span are long etc., and multiple advantage is applied to panel computer, notebook computer, liquid crystal display, large-size liquid crystal television and room lighting and outdoor lighting field more and more widely.Existing LED support, comprise pedestal, pedestal is provided with accommodating cavity, also comprise positive plate and negative plate, positive plate comprises positive pole pin and positive pole wire welding area, negative plate comprises negative pole pin, negative pole wire welding area and the crystal bonding area for fixed L ED chip, and crystal bonding area and negative pole wire welding area are connected together.Crystal bonding area is horizontally disposed with near positive pole wire welding area.
During welding, first LED chip is placed in crystal bonding area, then respectively the two poles of the earth of LED chip is drawn by lead-in wire and be welded on positive pole wire welding area and negative pole wire welding area.Adopt and can there is following problem in this way: due to crystal bonding area and negative pole wire welding area be connected together boundlessness distinguish, cause negative pole wire welding area too near negative pole pin, the heat that client's (comprising negative pole pin) when welding the scolding tin pin of LED produces can be delivered to the solder joint in negative pole wire welding area rapidly, cause this solder joint to come off and form the phenomenon of rosin joint, thus affect the reliability of LED.
Summary of the invention
The application is intended to one of solve the problems of the technologies described above at least to a certain extent.
According to the first aspect of the application, the application provides a kind of LED support, comprise: the pedestal being provided with accommodating cavity, be arranged at the electrode slice on described pedestal and die bond sheet metal, described electrode slice comprises: be connected, be positioned at wire welding area and the pin of described accommodating cavity, and by the transition region of described wire welding area to described pin transition, described die bond sheet metal has the crystal bonding area for fixed L ED chip, using described wire welding area to the direction of described pin transition as axis, the radial dimension of described transition region is less than the radial dimension of described transition region two side areas, die bond sheet metal and described electrode slice separate.
Further, the radial dimension of described transition region is less than 1/2 of the radial dimension of described transition region two side areas.
Further, the radial dimension of described transition region is 1/3 or 1/4 of the radial dimension of described transition region two side areas.
Further, described LED support comprises: electrode film and negative electrode plate.
Further, described die bond sheet metal is connected with the described wire welding area of described electrode film or described negative electrode plate.
Further, described die bond sheet metal has the heat radiation leg be connected with described crystal bonding area.
According to the second aspect of the application, the application provides a kind of LED luminescence unit, comprise: LED support and the LED chip be installed on described LED support, described LED support comprises: the pedestal being provided with accommodating cavity, be arranged at the electrode slice on described pedestal and die bond sheet metal, described electrode slice comprises: be connected, be positioned at wire welding area and the pin of described accommodating cavity, and by the transition region of described wire welding area to described pin transition, described die bond sheet metal has the crystal bonding area for fixing described LED chip, using described wire welding area to the direction of described pin transition as axis, the radial dimension of described transition region is less than the radial dimension of described transition region two side areas, die bond sheet metal and described electrode slice separate.
Further, the radial dimension of described transition region is less than 1/2 of the radial dimension of described transition region two side areas.
Further, the radial dimension of described transition region is 1/3 or 1/4 of the radial dimension of described transition region two side areas.
Further, described LED support comprises: electrode film and negative electrode plate.
Further, described die bond sheet metal is connected with the described wire welding area of described electrode film or described negative electrode plate.
Further, described die bond sheet metal has the heat radiation leg be connected with described crystal bonding area.
The beneficial effect of the application is:
By providing a kind of LED support and LED luminescence unit, described LED support comprises: the pedestal being provided with accommodating cavity, be arranged at the electrode slice on described pedestal and die bond sheet metal, described electrode slice comprises: be connected, be positioned at wire welding area and the pin of described accommodating cavity, and by the transition region of described wire welding area to described pin transition, described die bond sheet metal has the crystal bonding area for fixing described LED chip, using described wire welding area to the direction of described pin transition as axis, the radial dimension of described transition region is less than the radial dimension of described transition region two side areas, die bond sheet metal and described electrode slice separate.Like this, when carrying out the scolding tin of electrode slice pin, because transition region radial dimension is less, the heat that pin scolding tin is produced can not be diffused into rapidly wire welding area and cause wire welding area solder joint come off and form rosin joint phenomenon, ensure that the reliability of LED.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED luminescence unit of the embodiment of the present application.
Detailed description of the invention
Be described below in detail the embodiment of the application, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Be exemplary below by the embodiment be described with reference to the drawings, be intended to for explaining the application, and the restriction to the application can not be interpreted as.
In the description of the application, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of the instruction such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only the application and simplified characterization for convenience of description, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore the restriction to the application can not be interpreted as.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In the description of the application, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In this application, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, above-mentioned term concrete meaning in this application can be understood as the case may be.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can comprise the first and second features and directly contact, also can comprise the first and second features and not be directly contact but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is less than second feature.
By reference to the accompanying drawings the application is described in further detail below by detailed description of the invention.
Please refer to Fig. 1, present embodiments provide a kind of LED luminescence unit, it can be used for the fields such as various display, illumination, signal designation, and concrete accessible site is LED display, LED lamp bar or LED signal lamp etc.
Above-mentioned LED luminescence unit mainly comprises: LED support 1 and the LED chip 2 be installed on LED support 1.LED support 1 comprises: be provided with the pedestal 11 of accommodating cavity 111, be arranged at electrode slice 12 on pedestal 11 and die bond sheet metal 13, electrode slice is divided into electrode film and negative electrode plate, electrode slice mainly comprises: wire welding area 121 that be connected, that be positioned at accommodating cavity 111 and pin 122, and by the transition region 123 of wire welding area 121 to pin 122 transition.Die bond sheet metal 13 has the crystal bonding area 131 for fixed L ED chip 2.For realizing the present embodiment object, using wire welding area 121 to the direction of pin 122 transition as axis, the radial dimension of transition region 123 is less than the radial dimension of transition region 123 two side areas, and die bond sheet metal 13 is separate with electrode slice 12.
Particularly, can be diminished by the radial dimension of wire welding area to transition region gradually or suddenly diminish, or, can be diminished by the radial dimension of pin to transition region gradually or suddenly diminish, or, all by wire welding area and the pin radial dimension to transition region can be diminished gradually or suddenly diminish, or, while to the radial dimension of transition region by wire welding area can being diminished gradually or suddenly diminish, can suddenly be diminished by the radial dimension of pin to transition region or diminish gradually.
Like this, when carrying out the scolding tin of electrode slice pin, because transition region radial dimension is less, the heat that pin scolding tin is produced can not be diffused into rapidly wire welding area (hot buffer action) and cause wire welding area solder joint come off and form rosin joint phenomenon, ensure that the reliability of LED.
When embody rule, for improving hot buffer action, the radial dimension of transition region 123 is less than 1/2 of the radial dimension of transition region 123 two side areas.And as preferred embodiment, the radial dimension of transition region 123 is 1/3 or 1/4 of the radial dimension of transition region 123 two side areas.
As a kind of preferred embodiment, in order to strengthen the radiating effect of LED support and LED luminescence unit, die bond sheet metal has the heat radiation leg be connected with crystal bonding area.
In the description of this description, at least one embodiment that specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained in the application or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Above content is the further description done the application in conjunction with concrete embodiment, can not assert that the concrete enforcement of the application is confined to these explanations.For the application person of an ordinary skill in the technical field, under the prerequisite not departing from the application's design, some simple deduction or replace can also be made.
Claims (10)
1. a LED support, comprise: the pedestal being provided with accommodating cavity, be arranged at the electrode slice on described pedestal and die bond sheet metal, described electrode slice comprises: be connected, be positioned at wire welding area and the pin of described accommodating cavity, and by the transition region of described wire welding area to described pin transition, described die bond sheet metal has the crystal bonding area for fixed L ED chip, it is characterized in that, using described wire welding area to the direction of described pin transition as axis, the radial dimension of described transition region is less than the radial dimension of described transition region two side areas, die bond sheet metal and described electrode slice separate.
2. LED support as claimed in claim 1, it is characterized in that, the radial dimension of described transition region is less than 1/2 of the radial dimension of described transition region two side areas.
3. LED support as claimed in claim 2, it is characterized in that, the radial dimension of described transition region is 1/3 or 1/4 of the radial dimension of described transition region two side areas.
4. LED support as claimed in claim 1, it is characterized in that, described LED support comprises: electrode film and negative electrode plate.
5. LED support as claimed in claim 4, it is characterized in that, described die bond sheet metal is connected with the described wire welding area of described electrode film or described negative electrode plate.
6. LED support as claimed in claim 1, it is characterized in that, described die bond sheet metal has the heat radiation leg be connected with described crystal bonding area.
7. a LED luminescence unit, comprise: LED support and the LED chip be installed on described LED support, described LED support comprises: the pedestal being provided with accommodating cavity, be arranged at the electrode slice on described pedestal and die bond sheet metal, described electrode slice comprises: be connected, be positioned at wire welding area and the pin of described accommodating cavity, and by the transition region of described wire welding area to described pin transition, described die bond sheet metal has the crystal bonding area for fixing described LED chip, it is characterized in that, using described wire welding area to the direction of described pin transition as axis, the radial dimension of described transition region is less than the radial dimension of described transition region two side areas, die bond sheet metal and described electrode slice separate.
8. LED luminescence unit as claimed in claim 7, it is characterized in that, the radial dimension of described transition region is less than 1/2 of the radial dimension of described transition region two side areas.
9. LED luminescence unit as claimed in claim 8, it is characterized in that, the radial dimension of described transition region is 1/3 or 1/4 of the radial dimension of described transition region two side areas.
10. LED luminescence unit as claimed in claim 7, it is characterized in that, described LED support comprises: electrode film and negative electrode plate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2014/091725 WO2016078051A1 (en) | 2014-11-20 | 2014-11-20 | Led support and led light emitting unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204678084U true CN204678084U (en) | 2015-09-30 |
Family
ID=54177775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201490000324.9U Expired - Fee Related CN204678084U (en) | 2014-11-20 | 2014-11-20 | LED support and LED luminescence unit |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN204678084U (en) |
| WO (1) | WO2016078051A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770440B (en) * | 2020-12-31 | 2023-12-01 | 江苏生辉光电科技有限公司 | Novel LED driving power supply |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7119422B2 (en) * | 2004-11-15 | 2006-10-10 | Unity Opto Technology Co., Ltd. | Solid-state semiconductor light emitting device |
| CN201732814U (en) * | 2010-07-20 | 2011-02-02 | 深圳市聚飞光电股份有限公司 | LED support and LED comprising the same for improving reliability |
| CN201845810U (en) * | 2010-11-03 | 2011-05-25 | 深圳市聚飞光电股份有限公司 | Light emitting diode (LED) support frame and LED |
| CN202167539U (en) * | 2011-07-28 | 2012-03-14 | 深圳市聚飞光电股份有限公司 | LED support and LED |
| CN203071133U (en) * | 2013-02-05 | 2013-07-17 | 深圳市新月光电有限公司 | Four-edge bonding wire structure of high-power LED lamp |
| CN203165943U (en) * | 2013-04-16 | 2013-08-28 | 慈溪宝诚知识产权服务有限公司 | LED support |
-
2014
- 2014-11-20 CN CN201490000324.9U patent/CN204678084U/en not_active Expired - Fee Related
- 2014-11-20 WO PCT/CN2014/091725 patent/WO2016078051A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016078051A1 (en) | 2016-05-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150930 Termination date: 20161120 |
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| CF01 | Termination of patent right due to non-payment of annual fee |