CN112770440B - Novel LED driving power supply - Google Patents
Novel LED driving power supply Download PDFInfo
- Publication number
- CN112770440B CN112770440B CN202011631456.XA CN202011631456A CN112770440B CN 112770440 B CN112770440 B CN 112770440B CN 202011631456 A CN202011631456 A CN 202011631456A CN 112770440 B CN112770440 B CN 112770440B
- Authority
- CN
- China
- Prior art keywords
- spring
- connecting block
- power supply
- novel led
- led driving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 34
- 238000009434 installation Methods 0.000 claims abstract description 16
- 238000001514 detection method Methods 0.000 claims description 28
- 239000003990 capacitor Substances 0.000 claims description 17
- 238000004146 energy storage Methods 0.000 claims description 7
- 238000003466 welding Methods 0.000 abstract description 10
- 229910000679 solder Inorganic materials 0.000 description 13
- 238000005476 soldering Methods 0.000 description 11
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 3
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000007115 recruitment Effects 0.000 description 1
- 238000012549 training Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
- H05K7/1418—Card guides, e.g. grooves
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Fuses (AREA)
Abstract
The invention discloses a novel LED driving power supply, which comprises a positioning bracket, a tin block and a clamping structure, wherein the PCB is provided with a groove for installing a patch electronic element, the positioning bracket is fixedly connected with the PCB, the positioning bracket is enclosed in the groove, the clamping structure comprises a first spring and a connecting block, one end of the first spring is fixedly connected with the PCB, the other end of the first spring is fixedly connected with the connecting block, the first spring is positioned in the installation cavity, the connecting block is in sliding connection with the PCB, the connecting block is positioned in the installation cavity, the tin block is fixedly connected with the connecting block, the positioning bracket is used for positioning the patch electronic element, and the clamping structure clamps the patch electronic element in the groove so as to facilitate welding of the patch electronic element by workers, thereby facilitating welding of the patch electronic element on the PCB by workers.
Description
Technical Field
The invention relates to the technical field of electronic product processing, in particular to a novel LED driving power supply.
Background
With the development of electronic technology, it is seen that lead type electronic components are less and less in electronic products, and more products use components in a patch mounting mode. The patch element has many advantages over the lead element, such as small size, light weight, PCB space saving, easier installation and removal than the lead element, reduced stray electric and magnetic fields, improved stability and reliability of the circuit, etc.
However, the welding of the patch element requires a certain experience and skill; because most of the patch elements are small in size and light in weight, positioning is inconvenient during welding, miswelding or missing welding can be caused by slight distraction, and the situation of excessive tin coating can also occur; particularly, when a dense multi-pin chip is soldered, two or more adjacent pins of the chip are easily shorted by solder. For a beginner just entering the gate, the chip component soldering operation is often "daubed" and is not perceived as easy to solder as a conventional in-line component. In combination with the current state of industrial development in China, the phenomenon brings cost pressure in the aspects of recruitment, training of personnel and the like to electronic product manufacturers, and further improves the product qualification rate and the service life of the product.
Disclosure of Invention
The invention aims to solve the technical problem that aiming at the defects in the prior art, the invention provides a novel LED driving power supply so as to facilitate welding by workers.
In order to achieve the above purpose, the invention provides a novel LED driving power supply, which comprises a power input end, a power output end, a driving chip, an input electrolytic capacitor, an energy storage patch inductor, a fuse resistor and an output filter electrolytic capacitor which are positioned on a PCB board, wherein the fuse resistor is positioned at the front part of the power output end, the input electrolytic capacitor is positioned between the power input end and the driving chip, the energy storage patch inductor is positioned between the driving chip and the output filter electrolytic capacitor, the power output end is electrically connected with the output filter electrolytic capacitor, the novel LED driving power supply further comprises a positioning bracket, a tin block and a clamping structure, the PCB board is provided with a groove for installing patch electronic elements, the positioning bracket is fixedly connected with the PCB board, the positioning bracket is arranged in the groove in a surrounding manner, the clamping structure comprises a first spring and a connecting block, the PCB board is further provided with a mounting cavity, any one of the mounting cavity is internally provided with a clamping structure, the mounting cavity is positioned at the top of the positioning bracket, the first spring is fixedly connected with the tin block, the first spring is far away from the first end of the connecting block, and the first end of the connecting block is fixedly connected with the connecting block, and the first end of the connecting block is far away from the first end of the connecting block.
The connecting block is provided with a mounting opening, the mounting opening is positioned at one end of the connecting block away from the first spring, and the tin block is clamped in the mounting opening of the connecting block.
Wherein the groove is a circular groove or a rectangular groove.
The novel LED driving power supply further comprises a detection structure, the detection structure is located at the bottom of the groove, the detection structure comprises a second spring and a detection plate, one end of the second spring is fixedly connected with the PCB, the other end of the second spring is fixedly connected with the detection plate, and one end, away from the second spring, of the detection plate is attached to the patch electronic element.
Wherein the detection plate is made of rubber.
Wherein, the pick-up plate is the arcwall face away from the one end of spring.
The beneficial effects of the invention are as follows: the chip electronic component is placed in the groove, the size of the groove is determined according to the size of a specific chip electronic component when the PCB is designed, the positioning support is arranged in the groove in a surrounding mode so as to position the chip electronic component, the step surface of the positioning support is covered with one layer of soldering tin in advance, the pin part of the chip electronic component is directly placed on the soldering tin of the step surface, the connecting block can slide in the mounting cavity, so that the tin block is driven to move, when the chip electronic component is mounted, the tin block is far away from one end of the connecting block to be arc-shaped, when the chip electronic component touches the tin block, the tin block moves towards the inside of the mounting cavity under the guide of the arc-shaped surface, so that the chip electronic component can be attached to the positioning support, then the tin block resets under the action of the restoring force of the first spring and comes out of the inside of the mounting cavity, the chip electronic component is clamped, the chip electronic component is fixed, the chip electronic component is started to slowly reflow or a high-temperature welding gun is enabled to slowly produce the pin part, the chip electronic component is enabled to be covered by the solder, and the chip electronic component is enabled to be completely and the liquid solder can be completely melted, and the chip electronic component is enabled to be completely and completely welded by the solder after the chip electronic component is completely and the pin is covered by the solder plate.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of the novel LED driving power supply of the present invention.
Fig. 2 is a schematic structural diagram of the novel LED driving power supply of the present invention.
The device comprises a 1-PCB board, a 101-groove, a 102-mounting cavity, a 2-power input end, a 3-power output end, a 4-driving chip, a 5-input electrolytic capacitor, a 6-energy storage patch inductor, a 7-fuse resistor, an 8-output filter electrolytic capacitor, a 9-positioning bracket, a 10-tin block, a 11-clamping structure, a 111-first spring, a 112-connecting block, a 113-mounting port, a 12-detection structure, a 121-second spring, a 122-detection plate and 13-standby tin sheet.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, in the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Referring to fig. 1 and 2, the present invention provides a technical solution: the utility model provides a novel LED drive power supply, is including being located power input end 2, power output end 3, driving chip 4, input electrolytic capacitor 5, energy storage paster inductance 6, fuse resistance 7 and output filter electrolytic capacitor 8 on PCB board 1, fuse resistance 7 is located the front portion of power output end 3, input electrolytic capacitor 5 is located power input end 2 with between driving chip 4, energy storage paster inductance 6 is located driving chip 4 with between the output filter electrolytic capacitor 8, power output end 3 with output filter electrolytic capacitor 8 electricity is connected, still includes locating bracket 9, tin block 10 and block 11, PCB board 1 is equipped with the recess 101 that is used for installing paster electronic component, locating bracket 9 with PCB board 1 fixed connection, locating bracket 9 encloses to establish recess 101's inside, block 11 includes first spring 111 and connecting block 112, PCB board 1 still has installation cavity 102, installation cavity 102 with recess 101 is linked together, arbitrary installation cavity 102 is equipped with one inside block 11 in the connection of connecting block 10 is in first spring 111 the same end of connecting block 111 is kept away from to be fixed connection with first spring 111, the connecting block 10 is located in first spring 111 the connecting block 112, the one end is kept away from to be fixed to be connected with first spring 111.
In this embodiment, put into paster electronic component the inside of recess 101, the size of recess 101 is in according to concrete paster electronic component's size determination when PCB board 1 designs, the inside of recess 101 encloses and is equipped with locating support 9 to carry out the location to paster electronic component, the step face of locating support 9 has covered one deck soldering tin in advance, and paster electronic component's pin part is direct to be placed on the soldering tin of step face, connecting block 112 can be in the inside of installation cavity 102 slides to drive the tin piece 10 removes, when installing paster electronic component, the tin piece 10 is kept away from the one end of connecting block 112 is arc form, when paster electronic component touches tin piece 10, tin piece 10 is in the guide of arc face down to the inside of installation cavity 102 removes, so that paster electronic component can laminate with locating support 9, then tin piece 10 resets under the effect of restoring force of first spring 111 and comes out from the inside of installation cavity 102, thereby carries out the block to electronic component, thereby carries out the electronic component and slides in the inside of installation cavity 102, and carries out the welding torch, thereby carries out the high temperature reflow soldering machine with the high temperature and the welding of paster electronic component or the very high-speed solder, and the solder reflow soldering gun that can be accomplished the high temperature and the welding machine is covered by the surface of surface mount 1, and the solder paste is very high-temperature reflow soldering machine is finished, and the solder paste is very slowly to the solder paste is cooled down to the solder paste is finished.
Further, the connection block 112 has a mounting opening 113, the mounting opening 113 is located at an end of the connection block 112 away from the first spring 111, and the tin block 10 is engaged with the inside of the mounting opening 113 of the connection block 112.
In the present embodiment, the block 10 is engaged with the inside of the mounting hole 113 of the connection block 112, thereby realizing the fixed connection between the block 10 and the connection block 112.
Further, the groove 101 is a circular groove or a rectangular groove.
In this embodiment, the recess 101 may be formed as a circular groove or a rectangular groove according to the shape of the chip electronic component, so as to mount the chip electronic component.
Further, the novel LED driving power supply further comprises a detection structure 12, the detection structure 12 is located at the bottom of the groove 101, the detection structure 12 comprises a second spring 121 and a detection plate 122, one end of the second spring 121 is fixedly connected with the PCB 1, the other end of the second spring 121 is fixedly connected with the detection plate 122, and one end of the detection plate 122, away from the second spring 121, is attached to the chip electronic component.
In this embodiment, after the patch electronic component is mounted, one end of the detection plate 122 away from the second spring 121 is abutted against the patch electronic component under the abutment of the second spring 121, so as to squeeze the patch electronic component, and after the patch electronic component is soldered, if the patch electronic component has a significant tilting phenomenon, it is indicated that a cold joint phenomenon occurs at the corresponding position, so as to detect the soldering condition of the patch electronic component.
Further, the detection plate 122 is made of rubber.
In this embodiment, the detecting plate 122 is made of rubber, which is soft and does not damage the patch electronic element when the patch electronic element is extruded.
Further, the end of the detecting plate 122 far away from the spring is arc-shaped.
In this embodiment, the end of the detection plate 122 away from the spring is in an arc surface, so as to reduce the contact area between the detection plate 122 and the patch electronic element, thereby reducing the influence of the detection plate 122 on the patch electronic element.
Further, the novel LED driving power supply further comprises a standby tin sheet 13, wherein the standby tin sheet 13 is fixedly connected with the PCB 1, and the standby tin sheet 13 is positioned at the top of the PCB 1.
In this embodiment, the top of the PCB board 1 is further provided with a spare tin sheet 13, and the spare tin sheet 13 can be broken to continue to solder the chip electronic component when the soldering of the tin block 10 is not good, so that the soldering effect of the chip electronic component is better.
The above disclosure is only a preferred embodiment of the present invention, and it should be understood that the scope of the invention is not limited thereto, and those skilled in the art will appreciate that all or part of the procedures described above can be performed according to the equivalent changes of the claims, and still fall within the scope of the present invention.
Claims (6)
1. The novel LED driving power supply comprises a power input end, a power output end, a driving chip, an input electrolytic capacitor, an energy storage patch inductor, a fuse resistor and an output filter electrolytic capacitor which are positioned on a PCB board, wherein the fuse resistor is positioned at the front part of the power output end, the input electrolytic capacitor is positioned between the power input end and the driving chip, the energy storage patch inductor is positioned between the driving chip and the output filter electrolytic capacitor, the power output end is electrically connected with the output filter electrolytic capacitor,
still include locating support, tin piece and block structure, the PCB board is equipped with the recess that is used for installing paster electronic component, the locating support with PCB board fixed connection, the locating support encloses to be established the inside of recess, the block structure includes first spring and connecting block, the PCB board still has the installation cavity, the installation cavity with the recess is linked together, arbitrary the inside of installation cavity is equipped with one the block structure, the installation cavity is located the top of locating support, the one end of first spring with PCB board fixed connection, the other end of first spring with connecting block fixed connection, first spring is located the inside of installation cavity, the connecting block with PCB board sliding connection, the connecting block is located the inside of installation cavity, the tin piece with connecting block fixed connection, the tin piece is located the connecting block is kept away from the one end of first spring, the tin piece is kept away from the one end of connecting block is the arc form.
2. The novel LED driving power supply according to claim 1, wherein,
the connecting block is provided with a mounting opening, the mounting opening is positioned at one end of the connecting block away from the first spring, and the tin block is clamped in the mounting opening of the connecting block.
3. The novel LED driving power supply according to claim 2, wherein,
the grooves are round grooves or rectangular grooves.
4. The novel LED driving power supply according to claim 3,
the novel LED driving power supply further comprises a detection structure, the detection structure is located at the bottom of the groove, the detection structure comprises a second spring and a detection plate, one end of the second spring is fixedly connected with the PCB, the other end of the second spring is fixedly connected with the detection plate, and one end of the second spring, which is far away from the detection plate, is attached to the patch electronic element.
5. The novel LED driving power supply according to claim 4,
the detection plate is made of rubber.
6. The novel LED driving power supply according to claim 5,
and one end of the detection plate, which is far away from the spring, is an arc-shaped surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011631456.XA CN112770440B (en) | 2020-12-31 | 2020-12-31 | Novel LED driving power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011631456.XA CN112770440B (en) | 2020-12-31 | 2020-12-31 | Novel LED driving power supply |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112770440A CN112770440A (en) | 2021-05-07 |
| CN112770440B true CN112770440B (en) | 2023-12-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011631456.XA Active CN112770440B (en) | 2020-12-31 | 2020-12-31 | Novel LED driving power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112770440B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014154139A1 (en) * | 2013-03-27 | 2014-10-02 | 苏州远创达科技有限公司 | Electronic component mounting structure, manufacturing method and electronic component product |
| WO2016078051A1 (en) * | 2014-11-20 | 2016-05-26 | 史利利 | Led support and led light emitting unit |
| CN205491302U (en) * | 2016-01-19 | 2016-08-17 | 江苏生辉光电科技有限公司 | Novel LED (Light -Emitting diode) driving power supply |
| CN110864231A (en) * | 2018-08-08 | 2020-03-06 | 广东德豪润达照明电气有限公司 | LED support lamp |
| CN212013104U (en) * | 2020-05-09 | 2020-11-24 | 深圳市中孚光电科技有限公司 | LED power drive chip support structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208967492U (en) * | 2018-10-19 | 2019-06-11 | 东莞市明凌电子科技有限公司 | A kind of light emitting device on lamps and lanterns |
-
2020
- 2020-12-31 CN CN202011631456.XA patent/CN112770440B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014154139A1 (en) * | 2013-03-27 | 2014-10-02 | 苏州远创达科技有限公司 | Electronic component mounting structure, manufacturing method and electronic component product |
| WO2016078051A1 (en) * | 2014-11-20 | 2016-05-26 | 史利利 | Led support and led light emitting unit |
| CN205491302U (en) * | 2016-01-19 | 2016-08-17 | 江苏生辉光电科技有限公司 | Novel LED (Light -Emitting diode) driving power supply |
| CN110864231A (en) * | 2018-08-08 | 2020-03-06 | 广东德豪润达照明电气有限公司 | LED support lamp |
| CN212013104U (en) * | 2020-05-09 | 2020-11-24 | 深圳市中孚光电科技有限公司 | LED power drive chip support structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112770440A (en) | 2021-05-07 |
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