CN112770440A - Novel LED driving power supply - Google Patents
Novel LED driving power supply Download PDFInfo
- Publication number
- CN112770440A CN112770440A CN202011631456.XA CN202011631456A CN112770440A CN 112770440 A CN112770440 A CN 112770440A CN 202011631456 A CN202011631456 A CN 202011631456A CN 112770440 A CN112770440 A CN 112770440A
- Authority
- CN
- China
- Prior art keywords
- spring
- connecting block
- pcb
- power supply
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 34
- 238000001514 detection method Methods 0.000 claims description 22
- 239000003990 capacitor Substances 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 238000004146 energy storage Methods 0.000 claims description 8
- 238000001914 filtration Methods 0.000 claims 3
- 238000009434 installation Methods 0.000 abstract description 10
- 238000005476 soldering Methods 0.000 description 14
- 238000003466 welding Methods 0.000 description 11
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 5
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 5
- 239000000155 melt Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000007115 recruitment Effects 0.000 description 1
- 235000013547 stew Nutrition 0.000 description 1
- 238000012549 training Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
- H05K7/1418—Card guides, e.g. grooves
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Fuses (AREA)
Abstract
The invention discloses a novel LED driving power supply, which comprises a positioning bracket, a tin block and a clamping structure, wherein the PCB is provided with a groove for mounting a patch electronic element, the positioning bracket is fixedly connected with the PCB, the positioning bracket is enclosed in the groove, the clamping structure comprises a first spring and a connecting block, one end of the first spring is fixedly connected with the PCB, the other end of the first spring is fixedly connected with the connecting block, the first spring is positioned in an installation cavity, the connecting block is slidably connected with the PCB, the connecting block is positioned in the installation cavity, the tin block is fixedly connected with the connecting block, the positioning bracket positions the patch electronic element, the clamping structure clamps the patch electronic element in the groove so as to facilitate a worker to weld the patch electronic element, therefore, the patch electronic element can be conveniently welded on the PCB by workers.
Description
Technical Field
The invention relates to the technical field of electronic product processing, in particular to a novel LED driving power supply.
Background
With the development of electronic technology, lead electronic components are increasingly used in electronic products, and more products use components mounted on a chip. The patch element has many advantages over the lead element, such as small size, light weight, PCB space saving, easier installation and removal than the lead element, reduced stray electric and magnetic fields, improved stability and reliability of the circuit, etc.
However, the soldering of the patch elements requires a certain experience and skill; because most patch elements are small in size and light in weight, the positioning is inconvenient during welding, wrong welding or missing welding can be caused without paying attention, and the condition of excessive tin can also occur; particularly, when a dense multi-pin chip is soldered, two adjacent pins or even multiple pins of the chip are easily short-circuited by soldering tin. The beginning beginners often feel "daunting" with respect to patch element welding operations, feeling that it is not as easy to weld hold as traditional in-line elements. In combination with the current state of industrial development in China, the phenomenon brings cost pressure on the aspects of recruitment, personnel training and the like to electronic product manufacturers, and further improvement of the product qualification rate and the service life of the product is hindered.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide a novel LED driving power supply for facilitating welding by a worker, aiming at the above-mentioned defects in the prior art.
In order to achieve the above purpose, the invention provides a novel LED driving power supply, which comprises a power input end, a power output end, a driving chip, an input electrolytic capacitor, an energy storage patch inductor, a fuse resistor and an output filter electrolytic capacitor, wherein the power input end, the power output end, the driving chip, the input electrolytic capacitor, the energy storage patch inductor, the positioning bracket, a tin block and a clamping structure are arranged on a PCB, the fuse resistor is arranged in front of the power output end, the input electrolytic capacitor is arranged between the power input end and the driving chip, the energy storage patch inductor is arranged between the driving chip and the output filter electrolytic capacitor, the power output end is electrically connected with the output filter electrolytic capacitor, the novel LED driving power supply further comprises a positioning bracket, a tin block and a clamping structure, the PCB is provided with a groove for mounting a patch electronic element, the positioning bracket is fixedly connected with the PCB, the PCB still has the installation cavity, the installation cavity with the recess is linked together, arbitrary the inside of installation cavity is equipped with one the block structure, the installation cavity is located the top of locating support, the one end of first spring with PCB board fixed connection, the other end of first spring with connecting block fixed connection, first spring is located the inside of installation cavity, the connecting block with PCB board sliding connection, the connecting block is located the inside of installation cavity, the tin billet with connecting block fixed connection, the tin billet is located the connecting block is kept away from the one end of first spring, the tin billet is kept away from the one end of connecting block is the arc form.
The connecting block is provided with a mounting port, the mounting port is located at one end, far away from the first spring, of the connecting block, and the tin block is clamped inside the mounting port of the connecting block.
Wherein, the groove is a circular groove or a rectangular groove.
The novel LED driving power supply further comprises a detection structure, the detection structure is located at the bottom of the groove and comprises a second spring and a detection plate, one end of the second spring is fixedly connected with the PCB, the other end of the second spring is fixedly connected with the detection plate, and one end of the second spring is far away from the detection plate and is attached to a surface-mounted electronic element.
Wherein the detection plate is made of rubber.
Wherein, the one end of pick-up plate is kept away from the spring is the arcwall face.
The invention has the beneficial effects that: placing a patch electronic element into the groove, wherein the size of the groove is determined according to the size of the specific patch electronic element during the design of the PCB, the positioning support is arranged around the groove to position the patch electronic element, the step surface of the positioning support is covered with a layer of soldering tin in advance, the pin part of the patch electronic element is directly placed on the soldering tin on the step surface, the connecting block can slide in the mounting cavity to drive the tin block to move, when the patch electronic element is mounted, one end of the tin block, which is far away from the connecting block, is in an arc shape, when the patch electronic element touches the tin block, the tin block moves towards the inside of the mounting cavity under the guide of the arc surface so that the patch electronic element can be attached to the positioning support, and then the tin block resets under the restoring force of the first spring and comes out of the inside of the mounting cavity, thereby carry out the block to paster electronic component to fix paster electronic component, start reflow soldering machine or high temperature welder will the tin billet slowly melts to the liquid soldering tin that the messenger melts the production evenly drips gradually and covers paster electronic component's pin part, and remove reflow soldering machine or high temperature welder and stew, a period of back soldering tin solidification finishes, with the completion to paster electronic component's welding, thereby makes the staff with paster electronic component welding very convenient on the PCB board.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic diagram of the structure of the novel LED driving power supply of the present invention.
Fig. 2 is a schematic structural diagram of the novel LED driving power supply of the present invention.
The device comprises a PCB (printed circuit board) 1, a groove 101, a mounting cavity 102, a power input end 2, a power output end 3, a driving chip 4, an input electrolytic capacitor 5, an energy storage chip inductor 6, a fuse resistor 7, an output filter electrolytic capacitor 8, a positioning bracket 9, a tin block 10, a clamping structure 11, a first spring 111, a connecting block 112, a mounting opening 113, a detection structure 12, a second spring 121, a detection plate 122 and a spare tin sheet 13.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1 and fig. 2, the present invention provides a technical solution: a novel LED driving power supply comprises a power input end 2, a power output end 3, a driving chip 4, an input electrolytic capacitor 5, an energy storage patch inductor 6, a fuse resistor 7 and an output filter electrolytic capacitor 8 which are positioned on a PCB 1, wherein the fuse resistor 7 is positioned at the front part of the power output end 3, the input electrolytic capacitor 5 is positioned between the power input end 2 and the driving chip 4, the energy storage patch inductor 6 is positioned between the driving chip 4 and the output filter electrolytic capacitor 8, the power output end 3 is electrically connected with the output filter electrolytic capacitor 8, the novel LED driving power supply further comprises a positioning bracket 9, a tin block 10 and a clamping structure 11, the PCB 1 is provided with a groove 101 for mounting a patch electronic element, the positioning bracket 9 is fixedly connected with the PCB 1, the positioning bracket 9 is enclosed in the groove 101, the clamping structure 11 comprises a first spring 111 and a connecting block 112, the PCB board 1 further comprises a mounting cavity 102, the mounting cavity 102 is communicated with the groove 101, any one of the mounting cavity 102 is provided with the clamping structure 11, the mounting cavity 102 is located at the top of the positioning support 9, one end of the first spring 111 is fixedly connected with the PCB board 1, the other end of the first spring 111 is fixedly connected with the connecting block 112, the first spring 111 is located inside the mounting cavity 102, the connecting block 112 is slidably connected with the PCB board 1, the connecting block 112 is located inside the mounting cavity 102, the solder block 10 is fixedly connected with the connecting block 112, the solder block 10 is located far away from the connecting block 112 from one end of the first spring 111, and one end of the connecting block 112, which is far away from the solder block 10, is arc-shaped.
In this embodiment, a patch electronic component is placed inside the groove 101, the size of the groove 101 is determined according to the size of the specific patch electronic component when the PCB 1 is designed, the positioning bracket 9 is enclosed inside the groove 101 to position the patch electronic component, the step surface of the positioning bracket 9 is covered with a layer of soldering tin in advance, the pin portion of the patch electronic component is directly placed on the soldering tin of the step surface, the connecting block 112 can slide inside the mounting cavity 102 to drive the solder block 10 to move, when the patch electronic component is mounted, one end of the solder block 10 away from the connecting block 112 is arc-shaped, when the patch electronic component touches the solder block 10, the solder block 10 moves inside the mounting cavity 102 under the guidance of the arc-shaped surface, so that the patch electronic component can be attached to the positioning bracket 9, subsequently the tin bloom 10 is in restore to the throne under the effect of the restoring force of first spring 111 and follow the inside of installation cavity 102 comes out to carry out the block to paster electronic component, thereby fix paster electronic component, start backward flow welding machine or high temperature welder will tin bloom 10 slowly melts, and the liquid soldering tin that makes the production of melting evenly drips gradually and covers paster electronic component's pin part, and it stands to remove backward flow welding machine or high temperature welder, and soldering tin solidification finishes after a period of time, with the completion to paster electronic component's welding, thereby makes the staff with paster electronic component welding very convenient on PCB board 1.
Furthermore, the connecting block 112 has a mounting opening 113, the mounting opening 113 is located at an end of the connecting block 112 away from the first spring 111, and the solder bump 10 is clamped inside the mounting opening 113 of the connecting block 112.
In the present embodiment, the solder bump 10 is engaged with the inside of the mounting opening 113 of the connection block 112, thereby achieving the fixed connection between the solder bump 10 and the connection block 112.
Further, the groove 101 is a circular groove or a rectangular groove.
In the present embodiment, the groove 101 may be provided as a circular groove or a rectangular groove according to the shape of the patch electronic component, so as to facilitate mounting of the patch electronic component.
Further, novel LED drive power supply still includes detection structure 12, detection structure 12 is located the bottom of recess 101, detection structure 12 includes second spring 121 and pick-up plate 122, the one end of second spring 121 with PCB board 1 fixed connection, the other end of second spring 121 with pick-up plate 122 fixed connection, pick-up plate 122 is kept away from the one end and the paster electronic component of second spring 121 laminate mutually.
In this embodiment, after the chip electronic component is mounted, one end of the detection board 122, which is far away from the second spring 121, is abutted against the chip electronic component by the second spring 121 to be attached to the chip electronic component, so as to extrude the chip electronic component.
Further, the detection plate 122 is made of rubber.
In this embodiment, the detection board 122 is made of rubber, which is relatively soft and will not damage the chip electronic component when the chip electronic component is pressed.
Further, one end of the detecting plate 122 far away from the spring is an arc-shaped surface.
In this embodiment, an end of the detecting plate 122 away from the spring is an arc-shaped surface, so that a contact area between the detecting plate 122 and the chip electronic component is reduced, and an influence of the detecting plate 122 on the chip electronic component is reduced.
Further, novel LED drive power supply still includes reserve tin piece 13, reserve tin piece 13 with 1 fixed connection of PCB board, just reserve tin piece 13 is located the top of PCB board 1.
In this embodiment, a spare solder foil 13 is further disposed on the top of the PCB 1, and when the solder bumps 10 are not well soldered, the spare solder foil 13 can be broken to continue soldering the chip electronic component, so that the soldering effect of the chip electronic component is better.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. A novel LED driving power supply comprises a power input end, a power output end, a driving chip, an input electrolytic capacitor, an energy storage patch inductor, a fuse resistor and an output filtering electrolytic capacitor which are arranged on a PCB board, wherein the fuse resistor is arranged in front of the power output end, the input electrolytic capacitor is arranged between the power input end and the driving chip, the energy storage patch inductor is arranged between the driving chip and the output filtering electrolytic capacitor, the power output end is electrically connected with the output filtering electrolytic capacitor, and the novel LED driving power supply is characterized in that,
the PCB is provided with a groove for mounting a surface-mounted electronic element, the positioning support is fixedly connected with the PCB, the positioning support is arranged in the groove in an enclosing manner, the clamping structure comprises a first spring and a connecting block, the PCB is also provided with a mounting cavity, the mounting cavity is communicated with the groove, the clamping structure is arranged in any mounting cavity, the mounting cavity is arranged at the top of the positioning support, one end of the first spring is fixedly connected with the PCB, the other end of the first spring is fixedly connected with the connecting block, the first spring is arranged in the mounting cavity, the connecting block is slidably connected with the PCB, the connecting block is arranged in the mounting cavity, the solder block is fixedly connected with the connecting block, and the solder block is arranged at one end of the connecting block far away from the first spring, the end of the tin block far away from the connecting block is arc-shaped.
2. The novel LED driving power supply according to claim 1,
the connecting block is provided with a mounting hole, the mounting hole is located at one end, far away from the first spring, of the connecting block, and the tin block is clamped inside the mounting hole of the connecting block.
3. The novel LED driving power supply according to claim 2,
the groove is a circular groove or a rectangular groove.
4. The novel LED driving power supply according to claim 3,
the novel LED driving power supply further comprises a detection structure, the detection structure is located at the bottom of the groove, the detection structure comprises a second spring and a detection plate, one end of the second spring is fixedly connected with the PCB, the other end of the second spring is fixedly connected with the detection plate, and one end of the second spring is attached to the surface mounted electronic element through the detection plate.
5. The novel LED driving power supply according to claim 4,
the detection plate is made of rubber.
6. The novel LED driving power supply according to claim 5,
one end of the detection plate, which is far away from the spring, is an arc-shaped surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011631456.XA CN112770440B (en) | 2020-12-31 | 2020-12-31 | Novel LED driving power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011631456.XA CN112770440B (en) | 2020-12-31 | 2020-12-31 | Novel LED driving power supply |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112770440A true CN112770440A (en) | 2021-05-07 |
| CN112770440B CN112770440B (en) | 2023-12-01 |
Family
ID=75699614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011631456.XA Active CN112770440B (en) | 2020-12-31 | 2020-12-31 | Novel LED driving power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112770440B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014154139A1 (en) * | 2013-03-27 | 2014-10-02 | 苏州远创达科技有限公司 | Electronic component mounting structure, manufacturing method and electronic component product |
| WO2016078051A1 (en) * | 2014-11-20 | 2016-05-26 | 史利利 | Led support and led light emitting unit |
| CN205491302U (en) * | 2016-01-19 | 2016-08-17 | 江苏生辉光电科技有限公司 | Novel LED (Light -Emitting diode) driving power supply |
| CN110864231A (en) * | 2018-08-08 | 2020-03-06 | 广东德豪润达照明电气有限公司 | LED support lamp |
| US20200124261A1 (en) * | 2018-10-19 | 2020-04-23 | Dongguan City Minleon Electronics Co., Ltd. | Light-emitting device for lamp |
| CN212013104U (en) * | 2020-05-09 | 2020-11-24 | 深圳市中孚光电科技有限公司 | LED power drive chip support structure |
-
2020
- 2020-12-31 CN CN202011631456.XA patent/CN112770440B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014154139A1 (en) * | 2013-03-27 | 2014-10-02 | 苏州远创达科技有限公司 | Electronic component mounting structure, manufacturing method and electronic component product |
| WO2016078051A1 (en) * | 2014-11-20 | 2016-05-26 | 史利利 | Led support and led light emitting unit |
| CN205491302U (en) * | 2016-01-19 | 2016-08-17 | 江苏生辉光电科技有限公司 | Novel LED (Light -Emitting diode) driving power supply |
| CN110864231A (en) * | 2018-08-08 | 2020-03-06 | 广东德豪润达照明电气有限公司 | LED support lamp |
| US20200124261A1 (en) * | 2018-10-19 | 2020-04-23 | Dongguan City Minleon Electronics Co., Ltd. | Light-emitting device for lamp |
| CN212013104U (en) * | 2020-05-09 | 2020-11-24 | 深圳市中孚光电科技有限公司 | LED power drive chip support structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112770440B (en) | 2023-12-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208374426U (en) | Tool for stitching and reflow soldering tool component for circuit board solder reflow | |
| CN105899318A (en) | TIG welding device and TIG welding method | |
| CN104507271A (en) | Plug-in component technology and surface mount technology combination based PCBA (printed circuit board assembly) machining method and PCBA | |
| CN112770440A (en) | Novel LED driving power supply | |
| CN100371702C (en) | Backlight module detection arrangement | |
| CN105578789A (en) | Pick-and-place machine | |
| JP6197942B1 (en) | Jet solder height confirmation jig and its handling method | |
| CN214627533U (en) | SMT chip mounter for PCB board | |
| CN208374428U (en) | Tool for stitching and reflow soldering tool component for circuit board solder reflow | |
| CN202930184U (en) | Joint of ignition coil | |
| CN209424709U (en) | A kind of auxiliary tool that electronic component is fixed on to PCB circuit board welding | |
| CN205491302U (en) | Novel LED (Light -Emitting diode) driving power supply | |
| CN218388074U (en) | FPC component protection architecture and adhesive deposite device | |
| CN212761635U (en) | Wave-soldering tool of welding pencil | |
| CN113084293B (en) | Tin soldering pen and maintenance method of tin holes of printed circuit board | |
| CN219592691U (en) | Multilayer circuit board | |
| CN212734552U (en) | Welding device for dielectric filter | |
| JPH09134838A (en) | Discharge of capacitor part | |
| CN108907389A (en) | A kind of welder | |
| CN219534304U (en) | Electrolytic capacitor welding bracket and welding structure of electrolytic capacitor and aluminum substrate | |
| CN214381574U (en) | Structure for welding cylindrical device and cylindrical NTC resistor | |
| CN215698664U (en) | Full-automatic video alignment laser soldering machine | |
| CN216966559U (en) | Novel PCB board welding device | |
| CN218336569U (en) | Electronic component structure convenient for contact welding | |
| CN212876549U (en) | Anti-displacement chip mounting device of SMT chip mounter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |