CN107946194B - 双极晶体管的制作方法 - Google Patents
双极晶体管的制作方法 Download PDFInfo
- Publication number
- CN107946194B CN107946194B CN201711394775.1A CN201711394775A CN107946194B CN 107946194 B CN107946194 B CN 107946194B CN 201711394775 A CN201711394775 A CN 201711394775A CN 107946194 B CN107946194 B CN 107946194B
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- Prior art keywords
- layer
- polysilicon
- silicon
- forming
- manufacturing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims description 17
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 78
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 57
- 229920005591 polysilicon Polymers 0.000 claims abstract description 55
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 39
- 238000002955 isolation Methods 0.000 claims abstract description 33
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 30
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 30
- 238000005530 etching Methods 0.000 claims abstract description 19
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 9
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 9
- 230000001590 oxidative effect Effects 0.000 claims abstract description 3
- 230000000149 penetrating effect Effects 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 9
- 229920002120 photoresistant polymer Polymers 0.000 claims description 6
- 238000001259 photo etching Methods 0.000 claims description 5
- 238000000407 epitaxy Methods 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 238000009740 moulding (composite fabrication) Methods 0.000 claims description 2
- 230000003321 amplification Effects 0.000 description 5
- 238000003199 nucleic acid amplification method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000005669 field effect Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Bipolar Transistors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711394775.1A CN107946194B (zh) | 2017-12-21 | 2017-12-21 | 双极晶体管的制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201711394775.1A CN107946194B (zh) | 2017-12-21 | 2017-12-21 | 双极晶体管的制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107946194A CN107946194A (zh) | 2018-04-20 |
CN107946194B true CN107946194B (zh) | 2020-08-28 |
Family
ID=61942502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201711394775.1A Expired - Fee Related CN107946194B (zh) | 2017-12-21 | 2017-12-21 | 双极晶体管的制作方法 |
Country Status (1)
Country | Link |
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CN (1) | CN107946194B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109166800A (zh) * | 2018-09-04 | 2019-01-08 | 深圳市诚朗科技有限公司 | 一种晶体管及其制作方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07240423A (ja) * | 1994-02-28 | 1995-09-12 | Oki Electric Ind Co Ltd | バイポーラトランジスタの製法、BiMOSの製法 |
KR20030090058A (ko) * | 2002-05-21 | 2003-11-28 | 삼성전자주식회사 | 바이폴라 타입 반도체 트랜지스터 소자의 에미터 구조 및그에 따른 제조방법 |
CN101257044A (zh) * | 2007-02-28 | 2008-09-03 | 国际商业机器公司 | 使用选择性介质淀积的双极晶体管及其制造方法 |
CN107180757A (zh) * | 2017-07-14 | 2017-09-19 | 罗灿 | 高频三极管基极与发射极之间侧墙的制作方法 |
-
2017
- 2017-12-21 CN CN201711394775.1A patent/CN107946194B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07240423A (ja) * | 1994-02-28 | 1995-09-12 | Oki Electric Ind Co Ltd | バイポーラトランジスタの製法、BiMOSの製法 |
KR20030090058A (ko) * | 2002-05-21 | 2003-11-28 | 삼성전자주식회사 | 바이폴라 타입 반도체 트랜지스터 소자의 에미터 구조 및그에 따른 제조방법 |
CN101257044A (zh) * | 2007-02-28 | 2008-09-03 | 国际商业机器公司 | 使用选择性介质淀积的双极晶体管及其制造方法 |
CN107180757A (zh) * | 2017-07-14 | 2017-09-19 | 罗灿 | 高频三极管基极与发射极之间侧墙的制作方法 |
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Publication number | Publication date |
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CN107946194A (zh) | 2018-04-20 |
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Effective date of registration: 20200807 Address after: 210000 Kechuang building, Futian Road, Zhetang street, Lishui Economic Development Zone, Nanjing City, Jiangsu Province Applicant after: Nanjing Lishui hi tech Venture Capital Management Co.,Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Fuyong Street Peace community Junfeng Industrial Zone A3 building the first floor Applicant before: SHENZHEN JINGTE SMART MANUFACTURING TECHNOLOGY Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200828 Termination date: 20211221 |