CN107936896A - 一种led光源薄板封装材料及其制备方法 - Google Patents
一种led光源薄板封装材料及其制备方法 Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title abstract description 13
- -1 polysiloxane Polymers 0.000 claims abstract description 52
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 26
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 26
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims abstract description 24
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 claims abstract description 22
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000002253 acid Substances 0.000 claims abstract description 21
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 21
- 239000011777 magnesium Substances 0.000 claims abstract description 21
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 claims abstract description 20
- KILURZWTCGSYRE-LNTINUHCSA-K (z)-4-bis[[(z)-4-oxopent-2-en-2-yl]oxy]alumanyloxypent-3-en-2-one Chemical compound CC(=O)\C=C(\C)O[Al](O\C(C)=C/C(C)=O)O\C(C)=C/C(C)=O KILURZWTCGSYRE-LNTINUHCSA-K 0.000 claims abstract description 18
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 18
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 18
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 13
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 claims abstract description 13
- 229910001863 barium hydroxide Inorganic materials 0.000 claims abstract description 13
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims abstract description 13
- 238000005538 encapsulation Methods 0.000 claims abstract description 13
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 13
- 239000004843 novolac epoxy resin Substances 0.000 claims abstract description 13
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 13
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000011787 zinc oxide Substances 0.000 claims abstract description 13
- 239000005995 Aluminium silicate Substances 0.000 claims abstract description 12
- 235000012211 aluminium silicate Nutrition 0.000 claims abstract description 12
- 229910000019 calcium carbonate Inorganic materials 0.000 claims abstract description 12
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 claims abstract description 12
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims abstract description 10
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims abstract description 10
- 229910052943 magnesium sulfate Inorganic materials 0.000 claims abstract description 10
- 235000019341 magnesium sulphate Nutrition 0.000 claims abstract description 10
- 239000002994 raw material Substances 0.000 claims abstract description 5
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 24
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 229920003986 novolac Polymers 0.000 claims description 5
- 238000007711 solidification Methods 0.000 claims description 5
- 230000008023 solidification Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- MTVUDFBYBPMGMR-UHFFFAOYSA-N 1-ethyl-2-propylhydrazine Chemical compound CCCNNCC MTVUDFBYBPMGMR-UHFFFAOYSA-N 0.000 claims 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims 1
- 239000011575 calcium Substances 0.000 claims 1
- 229910052791 calcium Inorganic materials 0.000 claims 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims 1
- 229910052622 kaolinite Inorganic materials 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 238000007872 degassing Methods 0.000 abstract 1
- ZGBSOTLWHZQNLH-UHFFFAOYSA-N [Mg].S(O)(O)(=O)=O Chemical compound [Mg].S(O)(O)(=O)=O ZGBSOTLWHZQNLH-UHFFFAOYSA-N 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 3
- HPBJPFJVNDHMEG-UHFFFAOYSA-L magnesium;octanoate Chemical compound [Mg+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O HPBJPFJVNDHMEG-UHFFFAOYSA-L 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 239000005864 Sulphur Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- JZZIHCLFHIXETF-UHFFFAOYSA-N dimethylsilicon Chemical compound C[Si]C JZZIHCLFHIXETF-UHFFFAOYSA-N 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/04—Epoxynovolacs
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Abstract
本发明公开了一种LED光源薄板封装材料及其制备方法，按照质量份数计包括如下原料：酚醛环氧树脂18‑22份、苯基硅树脂8‑12份、乙酰丙酮铝3‑5份、异辛酸镁3‑5份、固化剂二乙氨基丙胺3‑6份、二甲基硅氧烷5‑6份、氮化硅0.2‑0.3份、硫酸镁0.5‑0.8份、纳米氧化镁0.2‑0.3份、三氧化二铬0.2‑0.3份、氢氧化钡0.5‑0.8份、氢氧化铝0.5‑0.8份、氯化铜0.1‑0.2份、高岭土15‑18份、氧化锌0.1‑0.2份、碳酸钙0.1‑0.2份、硼酸锌0.1‑0.2份。本发明LED封装材料的制备过程包括混合、溶解、脱气、固化，制备得到LED封装材料。制备的LED封装具有较高的折射率、硬度和粘结强度，可作为发光二级管封装材料应用于发光二极管中。
Description
技术领域
本发明涉及LED灯具材料领域，具体涉及一种LED光源薄板封装材料及其制备方法。
背景技术
LED即半导体发光二极管，LED节能灯是用高亮度白色发光二极管发光源，光效高、耗电少，寿命长、易控制、免维护、安全环保；是新一代固体冷光源，光色柔和、艳丽、丰富多彩、低损耗、低能耗、绿色环保。
LED由芯片、金属线、导电胶、封装材料等组成。其中封装材料起到对芯片的密封、保护作用，防止芯片受到外界环境的干扰。封装材料需要具备较高的密封性、透光性、粘接性和机械性能。
提高LED封装材料折射率可有效减少折射率物理屏障带来的光子损失，提高光量子效率，封装材料的折射率是一个重要指标，越高越好。现有技术提高折射率可采用向封装材料中引入硫元素，引入形式多为硫醚键、硫脂键等，以环硫形式将硫元素引入聚合物单体，并以环硫基团为反应基团进行聚合则是一种较新的方法。
发明内容
本发明创新的提供一种LED光源薄板封装材料及其制备方法。
本发明所采用的技术方案是：
一种LED光源薄板封装材料，按照质量份数计包括如下原料：酚醛环氧树脂18-22份、苯基硅树脂8-12份、乙酰丙酮铝3-5份、异辛酸镁3-5份、固化剂二乙氨基丙胺3-6份、二甲基硅氧烷5-6份、氮化硅0.2-0.3份、硫酸镁0.5-0.8份、纳米氧化镁0.2-0.3份、三氧化二铬0.2-0.3份、氢氧化钡0.5-0.8份、氢氧化铝0.5-0.8份、氯化铜0.1-0.2份、高岭土15-18份、氧化锌0.1-0.2份、碳酸钙0.1-0.2份、硼酸锌0.1-0.2份。
所述的一种LED光源薄板封装材料，按照质量份数计包括如下原料：酚醛环氧树脂20份、苯基硅树脂10份、乙酰丙酮铝4份、异辛酸镁4份、固化剂二乙氨基丙胺5份、二甲基硅氧烷5份、氮化硅0.3份、硫酸镁0.6份、纳米氧化镁0.3份、三氧化二铬0.3份、氢氧化钡0.6份、氢氧化铝0.6份、氯化铜0.2份、高岭土16份、氧化锌0.2份、碳酸钙0.2份、硼酸锌0.1份。
所述封装材料制备方法包括以下步骤：
(1)按重量比取酚醛环氧树脂、苯基硅树脂、乙酰丙酮铝、异辛酸镁，将酚醛环氧树脂、苯基硅树脂、乙酰丙酮铝、异辛酸镁四种成分加热后溶解，溶解后搅拌至混合均匀；
(2)再添加固化剂二乙氨基丙胺、二甲基硅氧烷，搅拌均匀得到有机溶解物A；
(3)分别将氮化硅、硫酸镁、纳米氧化镁、三氧化二铬、氢氧化钡、氢氧化钠、氢氧化钾、氢氧化铝、氯化铜、高岭土、氧化锌、碳酸钙、硼酸锌进行机械粉碎，粉碎成为无机粉末B；打开高温反应釜将无机粉末B和步骤2固化后的有机溶解物A混合，搅拌均匀；
(4)将步骤3混合物在真空脱泡机中进行脱泡，脱泡时间为3h；
(5)再将混合物加入模具中进行固化，固化温度为140℃～150℃，固化后冷却至室温，制备得到LED封装材料。
本发明的有益效果为：本发明LED封装材料的制备过程包括混合、溶解、脱气、固化，制备得到LED封装材料。制备的LED封装具有较高的折射率、硬度和粘结强度，可作为发光二级管封装材料应用于发光二极管中。
具体实施方式
为了便于本发明内容的理解，下面将结合实施例对本发明作进一步说明，以下实施例仅为本发明的一部分实施例。
实施例1
一种LED光源薄板封装材料，制备方法包括以下步骤：
(1)按照重量分别取：酚醛环氧树脂1800g、苯基硅树脂800g、乙酰丙酮铝300g、异辛酸镁300g、固化剂二乙氨基丙胺300g、二甲基硅氧烷500g、异辛酸镁30g、氮化硅20g、硫酸镁50g、纳米氧化镁20g、三氧化二铬20g、氢氧化钡50g、氢氧化钠50g、氢氧化钾20g、氢氧化铝50g、氯化铜10g、高岭土1500g、氧化锌10g、碳酸钙10g、硼酸锌10g。
(2)按重量取酚醛环氧树脂、苯基硅树脂、乙酰丙酮铝、异辛酸镁，将酚醛环氧树脂、苯基硅树脂、乙酰丙酮铝、异辛酸镁四种成分加热后溶解，溶解后搅拌至混合均匀；
(3)再添加固化剂二乙氨基丙胺、二甲基硅氧烷、异辛酸镁，搅拌均匀得到有机溶解物A；
(4)分别将氮化硅、硫酸镁、纳米氧化镁、三氧化二铬、氢氧化钡、氢氧化钠、氢氧化钾、氢氧化铝、氯化铜、高岭土、氧化锌、碳酸钙、硼酸锌进行机械粉碎，粉碎成为无机粉末B；打开高温反应釜将无机粉末B和步骤2固化后的有机溶解物A混合，搅拌均匀；
(5)将步骤3混合物在真空脱泡机中进行脱泡，脱泡时间为3h；
(6)再将混合物加入模具中进行固化，固化温度为140℃～150℃，固化后冷却至室温，制备得到LED封装材料。
实施例2
一种LED光源薄板封装材料，制备方法包括以下步骤：
(1)按照重量分别取：酚醛环氧树脂2200g、苯基硅树脂1200g、乙酰丙酮铝500g、异辛酸镁500g、固化剂二乙氨基丙胺600g、二甲基硅氧烷600g、异辛酸镁50g、氮化硅30g、硫酸镁80g、纳米氧化镁30g、三氧化二铬30g、氢氧化钡80g、氢氧化钠80g、氢氧化钾30g、氢氧化铝80g、氯化铜20g、高岭土1800g、氧化锌20g、碳酸钙20g、硼酸锌20g。
(2)按重量取酚醛环氧树脂、苯基硅树脂、乙酰丙酮铝、异辛酸镁，将酚醛环氧树脂、苯基硅树脂、乙酰丙酮铝、异辛酸镁四种成分加热后溶解，溶解后搅拌至混合均匀；
(3)再添加固化剂二乙氨基丙胺、二甲基硅氧烷、异辛酸镁，搅拌均匀得到有机溶解物A；
(4)分别将氮化硅、硫酸镁、纳米氧化镁、三氧化二铬、氢氧化钡、氢氧化钠、氢氧化钾、氢氧化铝、氯化铜、高岭土、氧化锌、碳酸钙、硼酸锌进行机械粉碎，粉碎成为无机粉末B；打开高温反应釜将无机粉末B和步骤2固化后的有机溶解物A混合，搅拌均匀；
(5)将步骤3混合物在真空脱泡机中进行脱泡，脱泡时间为3h；
(6)再将混合物加入模具中进行固化，固化温度为140℃～150℃，固化后冷却至室温，制备得到LED封装材料。
实施例3
一种LED光源薄板封装材料，制备方法包括以下步骤：
(1)按照重量分别取：酚醛环氧树脂2000g、苯基硅树脂1000g、乙酰丙酮铝400g、异辛酸镁400g、固化剂二乙氨基丙胺400g、二甲基硅氧烷500g、异辛酸镁40g、氮化硅20g、硫酸镁70g、纳米氧化镁20g、三氧化二铬20g、氢氧化钡60g、氢氧化钠60g、氢氧化钾20g、氢氧化铝60g、氯化铜20g、高岭土1600g、氧化锌10g、碳酸钙10g、硼酸锌10g；
(2)按重量取酚醛环氧树脂、苯基硅树脂、乙酰丙酮铝、异辛酸镁，将酚醛环氧树脂、苯基硅树脂、乙酰丙酮铝、异辛酸镁四种成分加热后溶解，溶解后搅拌至混合均匀；
(3)再添加固化剂二乙氨基丙胺、二甲基硅氧烷、异辛酸镁，搅拌均匀得到有机溶解物A；
(4)分别将氮化硅、硫酸镁、纳米氧化镁、三氧化二铬、氢氧化钡、氢氧化钠、氢氧化钾、氢氧化铝、氯化铜、高岭土、氧化锌、碳酸钙、硼酸锌进行机械粉碎，粉碎成为无机粉末B；打开高温反应釜将无机粉末B和步骤2固化后的有机溶解物A混合，搅拌均匀；
(5)将步骤3混合物在真空脱泡机中进行脱泡，脱泡时间为3h；
(6)再将混合物加入模具中进行固化，固化温度为140℃～150℃，固化后冷却至室温，制备得到LED封装材料。
以上内容仅仅是对本发明所作的举例和说明，所属本技术领域的技术人员对所描述的具体实施例做各种各样的修改或补充或采用类似的方式替代，只要不偏离发明的构思或者超越本权利要求书所定义的范围，均应属于本发明的保护范围。
Claims (3)
1.一种LED光源薄板封装材料，其特征在于，按照质量份数计包括如下原料：酚醛环氧树脂18-22份、苯基硅树脂8-12份、乙酰丙酮铝3-5份、异辛酸镁3-5份、固化剂二乙氨基丙胺3-6份、二甲基硅氧烷5-6份、氮化硅0.2-0.3份、硫酸镁0.5-0.8份、纳米氧化镁0.2-0.3份、三氧化二铬0.2-0.3份、氢氧化钡0.5-0.8份、氢氧化铝0.5-0.8份、氯化铜0.1-0.2份、高岭土15-18份、氧化锌0.1-0.2份、碳酸钙0.1-0.2份、硼酸锌0.1-0.2份。
2.根据权利要求1所述的一种LED光源薄板封装材料，其特征在于，按照质量份数计包括如下原料：酚醛环氧树脂20份、苯基硅树脂10份、乙酰丙酮铝4份、异辛酸镁4份、固化剂二乙氨基丙胺5份、二甲基硅氧烷5份、氮化硅0.3份、硫酸镁0.6份、纳米氧化镁0.3份、三氧化二铬0.3份、氢氧化钡0.6份、氢氧化铝0.6份、氯化铜0.2份、高岭土16份、氧化锌0.2份、碳酸钙0.2份、硼酸锌0.1份。
3.根据权利要求1所述的一种LED光源薄板封装材料，其特征在于，所述封装材料制备方法包括以下步骤：
(1)按重量比取酚醛环氧树脂、苯基硅树脂、乙酰丙酮铝、异辛酸镁，将酚醛环氧树脂、苯基硅树脂、乙酰丙酮铝、异辛酸镁四种成分加热后溶解，溶解后搅拌至混合均匀；
(2)再添加固化剂二乙氨基丙胺、二甲基硅氧烷，搅拌均匀得到有机溶解物A；
(3)分别将氮化硅、硫酸镁、纳米氧化镁、三氧化二铬、氢氧化钡、氢氧化钠、氢氧化钾、氢氧化铝、氯化铜、高岭土、氧化锌、碳酸钙、硼酸锌进行机械粉碎，粉碎成为无机粉末B；打开高温反应釜将无机粉末B和步骤2固化后的有机溶解物A混合，搅拌均匀；
(4)将步骤3混合物在真空脱泡机中进行脱泡，脱泡时间为3h；
(5)再将混合物加入模具中进行固化，固化温度为140℃～150℃，固化后冷却至室温，制备得到LED封装材料。
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