CN107924851A - 测量仪器用晶片定心装置 - Google Patents

测量仪器用晶片定心装置 Download PDF

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CN107924851A
CN107924851A CN201680050084.7A CN201680050084A CN107924851A CN 107924851 A CN107924851 A CN 107924851A CN 201680050084 A CN201680050084 A CN 201680050084A CN 107924851 A CN107924851 A CN 107924851A
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measuring instrument
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instrument according
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李揆成
郑惠锡
权宁钟
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Comet Co Ltd
Ke Matt Co Ltd
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Ke Matt Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25Movable or adjustable work or tool supports
    • B23Q1/44Movable or adjustable work or tool supports using particular mechanisms
    • B23Q1/56Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories
    • B24B37/345Feeding, loading or unloading work specially adapted to lapping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)

Abstract

本发明提供一种测量仪器用晶片定心装置,其中,包括:本体单元;引导单元,具备安装在所述本体单元上并用于支撑晶片的支撑部与通孔;以及移位单元,具备推动器,推动器在所述通孔内移动使得将所述晶片在所述支撑部上移动。

Description

测量仪器用晶片定心装置
技术领域
本发明涉及一种在测量仪器为了测量晶片的厚度而用于定心晶片的装置。
背景技术
通常,CMP(化学机械抛光)是降低及平整晶片的布线段差的过程。
具体而言,CMP工艺是一种在台板上形成具有弯曲的焊盘,并且将经过CVD工艺的晶片粘附到头装置上,由此对晶片施加压力的同时旋转晶片的方式。
在CMP之后,通过放置在CMP装置相邻的厚度测量仪器对晶片进行抛光。然而,由于插入测量仪器的晶片的定心误差频繁,使得测量仪器的误差率很高。这问题导致了测量仪器前端的CMP设备的运转率降低的问题。
发明内容
要解决的技术问题
本发明是鉴于所述诸多问题而提出的,其目的在于,提供一种能够通过机械装置简单地解决对于晶片的测量仪器的定心误差的问题。
技术方案
为了实现所述目的,本发明的测量仪器用晶片定心装置,其中,包括:本体单元;引导单元,具备安装在所述本体单元上并用于支撑晶片的支撑部与通孔;以及移位单元,具备推动器,推动器在所述通孔内移动使得将所述晶片在所述支撑部上移动。
所述引导单元还包括安装部,所述安装部连接到所述支撑部并且具有高于所述支撑部的表面,所述通孔形成在所述安装部上。
所述通孔从所述安装部延伸至所述支撑部。
所述移位单元包括:致动器,连接到所述推动器用于移动所述推动器;以及返回构件,使所述致动器相对于所述本体单元弹性地支撑,使得所述致动器在动作后返回到初始位置。
所述本体单元包括:驱动空间,用于流入空气;从动空间,位于所述驱动空间的相反侧,并且位有所述推动器;以及连接空间,用于连接所述驱动空间和所述从动空间,并具有小于所述驱动空间及所述从动空间的截面积。
所述返回构件包括位于所述驱动空间中并且支撑在限定所述连接空间的壁上的弹簧。
所述致动器包括:从动块,连接到所述推动器并定位在所述从动空间中;以及轴承,用于支撑所述从动块。
所述本体单元还包括容纳槽,所述容纳槽形成在限定所述从动空间的内周面用于容纳所述轴承。
所述致动器包括:气缸,配置在所述驱动空间;活塞,配置在所述气缸内并通过所述空气在所述气缸内移动;以及杆,用于连接所述活塞及所述从动块。
所述本体单元包括:支撑部,用于支撑所述安装部;以及限制壁,从所述支撑部的周边突出用于限制所述安装部的移动路径。
所述限制壁包括沿着所述安装部的移动方向延伸的长孔形状的紧固孔,所述安装部包括紧固在所述紧固孔并用于插入紧固片的通孔。
所述本体单元包括:安装架,安装在对象物体上并具有滑动部;以及轨道,用于可移动地容纳所述滑动部。
有益效果
根据本发明的测量仪器用晶片定心装置能够通过机械装置简单地解决对于晶片的测量仪器的定心误差的问题。
并且,能够提高配置于测量仪器前端的CMP设备的运转率。
附图说明
图1是示出根据本发明的一实施例的测量仪器用晶片定心装置100支撑晶片W的状态的立体图。
图2是图1的测量仪器用晶片定心装置100的分解立体图。
图3是图1的测量仪器用晶片定心装置100的纵向截面图。
具体实施方式
参考附图详细描述根据本发明优选实施例的测量仪器用晶片定心装置。在本说明书中,对于相同及类似的结构标注相同及类似的参照符号。
图1是示出根据本发明的一实施例的测量仪器用晶片定心装置100支撑晶片W的状态的立体图。
参考附图,晶片定心装置100可以具有本体单元110、引导单元130及移位单元150。
本体单元110安装在CMP设备上。在本体单元110设置引导单元130和移位单元150。
引导单元130支撑晶片W,并引导移位单元150的操作。具体地,引导单元130可以具有支撑部131、安装部133以及通孔135。
支撑部131是用于支撑晶片W的部分。安装部133是从支撑部131延伸并安装在本体单元110上的部分。此时,安装部133具有高于支撑部131的表面。通孔135可以形成在安装部133上并延伸到支撑部131。
移位单元150是用于使由支撑部131支撑的晶片W朝固定位置的中心方向C上移位的结构。移位单元150可以具有设置在通孔135中并且沿着通孔135的延伸方向移动的推动器151。
根据该结构,本体单元110设置在CMP中放置晶片W的部分。此时,晶片定心装置100可以具备多个,以画出与晶片W的形状对应的圆。
从而,在晶片W被放置在引导单元130的支撑部131上后,多个晶片定心装置100可以一起动作。具体而言,启动分别的晶片定心装置100的推动器151来使晶片W向中心方向C移动。
晶片W可以定位在由多个晶片定心装置100移动的中心位置。
参照图2及图3说明晶片定心装置100的具体结构。
图2是图1的测量仪器用晶片定心装置100的分解立体图,图3是图1的测量仪器用晶片定心装置100的纵向截面图。
参照附图,本体单元110可以具有安装模块、操作空间、支撑模块及盖模块。
所述安装模块可以具有安装架111与轨道112。
安装架111是安装在CMP上的托架。滑动部111a在安装架111的上部朝侧方突出。
轨道112是用于可移动地容纳安装架111的滑动部111a。在本体单元110中轨道112所在的部分通过被滑动部111a压缩的固定件112a固定在安装架111上。
所述操作空间是贯通本体单元110形成的空间。所述操作空间可以具有驱动空间113、连接空间114及从动空间115。
驱动空间113位于本体单元110的图的左侧,并且是空气流入的空间。连接空间114用于连接驱动空间113和从动空间115,并且可以具有小于驱动空间113和从动空间115的截面积。从动空间115位于驱动空间113的相反侧。
所述支撑模块支撑引导单元130并限制其移动路径。所述支撑模块可以具有支撑部116和限制壁117。
支撑部116具有用于支撑引导单元130的表面。限制壁117是沿着支撑部116的周边形成的突出的壁。在限制壁117中可以形成长孔形态的紧固孔117a。
所述盖模块可以具有用于覆盖从动空间115侧的限制板118和用于覆盖驱动空间113侧的排出板119。
限制板118用于限制轴承153向外流出。排出板119使从外部输入的空气向驱动空间113内排出。为此,在排出板119可以形成排出口119a和连接到排出口119a的流路119b。
在引导单元130的安装部133可以具有通孔133a。通孔133a容纳紧固在紧固孔117a的紧固片133b。由此,引导单元130可以被支撑部116支撑的同时沿着紧固孔117a的延伸方向固定在调整后的位置处。
除了推动器151之外,移位单元150可以具有从动块152、动作模块及返回构件159。此时,从动块152和所述动作模块可以统称为致动器。
从动块152位于从动空间115中并连接至所述动作模块及推动器151。
从动块152具有供推动器151安置的底座部152a和使推动器151跨过底座部152a与从动块152结合的结合销152b。从动块152由容纳在容纳槽115a中的轴承153支撑,容纳槽115a形成在用于限定从动空间115的内周面中。
所述动作模块可以具有活塞154、气缸155及杆156。
活塞154位于气缸155内,随着从排出口119a供给空气而向图中右侧移动。活塞154可以与密封构件154a结合,用于密封与气缸155的间隙。
气缸155安装在驱动空间113中。杆156与活塞154连接,并经由连接空间114连接到从动块152。
返回构件159可以是杆156插入在中空部中的压缩线圈弹簧。返回构件159用于使杆156被弹性地支撑在限定连接空间114的壁上。然而,如在图3所示,返回构件159可以由从动块152支撑。
由此,从外部空气罐流向流路119b的空气通过排出口119a被排出到驱动空间113。通过排出的空气,活塞154朝图中向右侧移动。
当活塞154移动时,连接到活塞154的杆156及从动块152也向右移动。使得连接到从动块152的推动器151沿着中心方向C移动以移动晶片W。
在该过程中,作为返回构件159的弹簧通过杆156的向右移动而被弹性地压缩。然后,当向活塞154的空气供应被停止时,返回构件159返回到初始状态。活塞154、杆156、从动块152以及推动器151通过返回构件159的恢复力返回到初始位置。
所述测量仪器用晶片定心装置不限于上述实施例的结构与操作方式。上述实施例可以被配置为所有或者局部实施例可以被选择性地组合以进行各种修改。
产业上的利用可能性
本发明的测量仪器用晶片定心装置在制造领域具有产业上的利用可能性。

Claims (12)

1.一种测量仪器用晶片定心装置,其中,包括:
本体单元;
引导单元,具备安装在所述本体单元上并用于支撑晶片的支撑部与通孔;以及
移位单元,具备推动器,推动器在所述通孔内移动使得将所述晶片在所述支撑部上移动。
2.根据权利要求1所述的测量仪器用晶片定心装置,其中,所述引导单元还包括安装部,所述安装部连接到所述支撑部并且具有高于所述支撑部的表面,所述通孔形成在所述安装部上。
3.根据权利要求2所述的测量仪器用晶片定心装置,其中,所述通孔从所述安装部延伸至所述支撑部。
4.根据权利要求1所述的测量仪器用晶片定心装置,其中,所述移位单元包括:
致动器,连接到所述推动器用于移动所述推动器;以及
返回构件,使所述致动器相对于所述本体单元弹性地支撑,使得所述致动器动作后返回到初始位置。
5.根据权利要求4所述的测量仪器用晶片定心装置,其中,所述本体单元包括:
驱动空间,用于流入空气;
从动空间,位于所述驱动空间的相反侧,并且位有所述推动器;以及
连接空间,用于连通所述驱动空间和所述从动空间,并具有小于所述驱动空间及所述从动空间的截面积。
6.根据权利要求5所述的测量仪器用晶片定心装置,其中,所述返回构件包括弹簧,弹簧位于所述驱动空间中并且支撑在限定所述连接空间的壁上。
7.根据权利要求5所述的测量仪器用晶片定心装置,其中,所述致动器包括:
从动块,连接到所述推动器并定位在所述从动空间中;以及
轴承,用于支撑所述从动块。
8.根据权利要求7所述的测量仪器用晶片定心装置,其中,所述本体单元还包括容纳槽,所述容纳槽形成在限定所述从动空间的内周面用于容纳所述轴承。
9.根据权利要求7所述的测量仪器用晶片定心装置,其中,所述致动器包括:
气缸,配置在所述驱动空间;
活塞,配置在所述气缸内并通过所述空气在所述气缸内移动;以及
杆,用于连接所述活塞及所述从动块。
10.根据权利要求2所述的测量仪器用晶片定心装置,其中,所述本体单元包括:
支撑部,用于支撑所述安装部;以及
限制壁,从所述支撑部的周边突出用于限制所述安装部的移动路径。
11.根据权利要求10所述的测量仪器用晶片定心装置,其中,所述限制壁包括沿着所述安装部的移动方向延伸的长孔形状的紧固孔,所述安装部包括紧固在所述紧固孔并用于插入紧固片的通孔。
12.根据权利要求1所述的测量仪器用晶片定心装置,其中,所述本体单元包括:
安装架,安装在对象物体上并具有滑动部;以及
轨道,用于可移动地容纳所述滑动部。
CN201680050084.7A 2015-09-11 2016-09-01 测量仪器用晶片定心装置 Pending CN107924851A (zh)

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Application Number Priority Date Filing Date Title
KR1020150128832A KR101650398B1 (ko) 2015-09-11 2015-09-11 계측기용 웨이퍼 센터링 디바이스
KR10-2015-0128832 2015-09-11
PCT/KR2016/009799 WO2017043809A1 (ko) 2015-09-11 2016-09-01 계측기용 웨이퍼 센터링 디바이스

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KR101650398B1 (ko) 2016-08-24

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