CN1078754C - 贴片天线及其制造方法 - Google Patents

贴片天线及其制造方法 Download PDF

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CN1078754C
CN1078754C CN97100630A CN97100630A CN1078754C CN 1078754 C CN1078754 C CN 1078754C CN 97100630 A CN97100630 A CN 97100630A CN 97100630 A CN97100630 A CN 97100630A CN 1078754 C CN1078754 C CN 1078754C
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CN1164134A (zh
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倉本晶夫
田邊浩介
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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Abstract

所公开的贴片天线有一个馈入高频信号并从其一面表面辐射高频电磁场的驱动贴片；一个在其一面表面接收来自驱动贴片的高频电磁场并从其另一面表面辐射高频电磁场的寄生贴片；以及一个容置驱动贴片和寄生贴片于其中予以保护并夹持寄生贴片的天线罩；其中由与寄生贴片另一面表面接触的天线罩的内表面和一个从天线罩内表面凸起并盖住寄生贴片一面部分表面的夹具夹持住寄生贴片。

Description

贴片天线及其制造方法
本发明涉及一种贴片天线，更具体地说，涉及一种具有一个微带结构的驱动贴片、一个将从驱动贴片接收到的电磁场再辐射出去的寄生贴片和一个容纳这些贴片使其受到保护的天线罩的贴片天线，以及它的制造方法。
大家都知道，由包含一块驱动贴片和一块寄生贴片作为两层电磁波辐射层组成的贴片天线具有优良的宽带特性。将这样的贴片天线容置在一个天线罩内，使得在移动通信装置方面具有轻便性优点的贴片天线能够提供可靠性和漂亮的外观。例如，在日本特许公开号No.141007(1990)和日本特许公开号No.3-74908(1991)中就曾公开过这样的结构，前者公开了一种微带天线，其中有一寄生贴片附着在天线罩的内表面上，后者公开了一种叠层的微带天线，其中有一寄生贴片埋设在天线罩的罩壁内。
然而，在所公开的传统贴片天线中，由于要求在天线罩上附着寄生贴片或在天线罩的罩壁内埋入一寄生贴片，存在着必需增加生产步骤的问题。还有就是存在着难于在天线罩的恰当位置上或在天线罩的罩壁内使寄生贴片定位的问题。
因此，本发明的一项目的在于提供一种在天线罩的内表面精确定位并稳定地固定住一块寄生贴片的贴片天线。
本发明还有一项目的在于提供一种方便于使寄生贴片定位和固定在天线罩的内表面上的制造贴片天线的方法。
本发明的一种贴片天线包括：
一块驱动贴片，它被馈入高频信号，并从其一面的表面辐射高频电磁场；
一块寄生贴片，它在其一面的表面处接收来自驱动贴片的高频电磁场，并从其另一表面再辐射高频电磁场；以及
一个天线罩，包括将驱动贴片和寄生贴片容纳在天线罩内使它们受到保护并使寄生贴片固定；
其中的寄生贴片被天线罩的内表面所固定，该天线罩内表面与寄生贴片的另一表面以及一个夹具接触，该夹具自天线罩的内表面凸起并盖住寄生贴片一面表面的一部分。
按照本发明的另一种方式，一种制造贴片天线的方法，该贴片天线包括一块被馈入高频信号并从其另一表面辐射高频电磁场的驱动贴片、一块在其一面表面接收来自驱动贴片的高频电磁场并从其另一面表面再辐射高频电磁场的寄生贴片，以及一个使驱动贴片和寄生贴片容纳在天线罩内使它们得到保护并固定寄生贴片的天线罩，所包含的制造步骤有：
在天线罩的内表面上形成一个突起的凸台，其高度超过寄生贴片的厚度；
沿着环状凸台紧压寄生贴片的另一表面使其接触天线罩的内表面；
使凸台凸出寄生贴片一面表面的部分热软化并为了构成夹具使其形成为盖住寄生贴片一面部分表面的形状；以及
将夹具冷却并硬化使寄生贴片夹持在天线罩和夹具之间。
下面将结合附图对本发明作更详细的说明，其中：
图1A为示明本发明第一优选实施例中贴片天线的剖面视图；
图2为示明第一实施例中贴片天线处于分开状态的透视图；
图3A至3D为示明在本发明最佳实施例中制造贴片天线的方法的剖面视图；
图4A为示明本发明第二优选实例中贴片天线的局部平面视图；
图4B为沿图4A中A1-A2线切开的剖面视图；
图5A为示明本发明第三优选实施例中贴片天线的局部平面视图；以及
图5B为沿图5A中B1-B2线切开的剖面视图。
图1A至图2将对第一优选实施例的贴片天线进行说明，其中图1A为其剖面视图，图1B为示明图1A中一部分的放大视图，图2为示明图1A中天线罩1A和贴片天线其它分开部分的透视图。
如图1A和图2所示，在此贴片天线中，一条由馈入段3形成的微带结构，一个由印刷电路板加工的辐射元件4以及保持印刷电路板原始形状的一层介质衬底5、一层接地导体6。金属贴片2A和辐射元件4形成一个宽频带微带天线。经馈入段3馈入的高频电磁波由金属贴片2A和辐射元件4调谐。若辐射元件4的直径和谐振频率分别为D1、f1，金属贴片2A的直径和谐振频率分别为D2、f2，而且给出了D2＞D1，则得到f1＞f2。此外，倘若给出的中心频率f0为f0＝(f1＋f2)/2，则由(f1－f2)/f0给出的频带接近等于0.1。因此，经馈入段3馈入的辐射元件4在频带f1附近谐振并辐射电波。另一方面，金属贴片2A是和辐射元件4电磁耦合的，从而在频率f2附近谐振并辐射电波。结果是，一个圆偏振波电磁场的高频信号沿着低损耗塑料制成的天线罩1A外表面13的方向辐射出去。包括辐射元件4的微带结构和金属贴片2A都被天线罩1A的内表面和该微带结构固定在其上的天线板7覆盖住，借此与天线罩1A的外界环境隔开而得到保护。
对此贴片天线作更具体的说明，馈入段3和辐射元件4是通过导电板的腐蚀而形成在印刷电路板的同一表面上。一个象盘状的辐射元件4是以90°相位差由馈入电路3分开两处相互成夹角α＝90°馈入的。经此馈入，辐射元件4自其一面表面辐射出圆偏振波电磁场。由铝薄板制成并形成为盘状的金属贴片2A在其一面表面处接收圆偏振波电磁场然后从另一面表面再把它辐射出去。金属贴片2A的另一面表面与天线罩1A的内表面12相接触，且金属贴片2A被夹持在天线罩1A的内表面与一夹具11A之间，夹具11A自内表面12凸起并盖住金属贴片2A的部分下表面。如在后面所作说明，夹具11A是经过对凸台11a的端部进行加工形成的。天线罩1A沿着微带结构的周围压在天线板7之上，而后用螺钉8a、8b固定在天线板7上。将天线罩1A固定在天线板7上的方法不限于镙钉，其它能够精确确定天线罩1A与天线板7之间位置关系的固定方法均可采用。
接着，要详细说明怎样把金属贴片2A固定在天线罩1A上。金属贴片2A有一个凸台孔21，它处于表面中心即圆心P1的位置，是从其一面表面穿透至另一面表面的一个穿孔。考虑到圆偏振波电磁场辐射特性的退化以及金属贴片2A在天线罩1A上的夹持强度，凸台孔21的内径r最好为5R/100左右，其中R为金属贴片2A的外径。例如，贴片天线的工作频率若为1.5千兆赫至1.6千兆赫，它适合于外径R＝80毫米、厚度t＝0.5毫米以及凸台孔内径r＝4毫米的金属贴片2A。要使在天线罩1A内表面12上形成的夹具11A盖住金属贴片2A邻近凸台孔21的部分下表面。
夹具11A是通过对从天线罩1A内表面突起的凸台11a的端部进行加工得到的结构。凸台11a的高度h大于金属贴片2A的厚度t，而凸台11a的外径r1则略小于金属贴片2A的凸台孔21的内径r。凸台11a要定位成当天线罩1A固定在天线板7上时，金属贴片2A的圆心P1如图1A所示正好定位在辐射元件4的圆心P0之上。金属贴片2A由凸台11a定位并在金属贴片2A的上表面紧压住天线罩1A的内表面12之后，使凸台11a的端部加热软化并向内表面12的方向压缩，以此使其转换成盖住金属贴片2A部分下表面的式样，然后冷却和硬化使其构成如图所示的夹具11A。天线罩1A可以由聚碳酸酯之类材料制成。使聚碳酸酯加热软化的热软化温度(玻璃变化温度)Tg在150℃左右，使其流化的晶体熔化温度Tm在240℃左右，而用于固态的耐热温度则在125℃左右。
图3A至3D示出将图1A贴片天线中的金属贴片2A固定到天线罩1A上的过程，其中的图3A至3D分别对应于第一至第四步骤。
在第一步中，在天线罩1A的内表面上突起的是凸台11a，它被制成具有大于金属贴片2A厚度t的高度h以及具有略小于金属贴片2A的凸台孔21的内径r的外径r1。在第二步中，由凸台11a的周边定位将金属贴片2A紧压成与内表面12接触。
在第三步中，用一块热板30在高于凸台11a的热软化温度Tg并低于凸台11a的熔化温度Tm的温度下按压凸台11a的端部，以此使自金属贴片2A上表面凸起的部分凸台11a被软化并形成为使夹具11A具有盖住金属贴片2A的部分上表面的式样。这里，在热板30和金属贴片2A之间插入了一块有热阻的盘状隔片31。隔片31具有t1的厚度和一个居于中心直径为2的孔。隔片31用来当在凸台11a上按压热板10时控制夹具11A的厚度。凸台11a的高度h和隔片31的厚度t1被设定成使所形成的夹具11A的厚度和直径具有足够夹持金属贴片2A的强度，而夹片31的直径r2则被设定成大于夹具11A沿金属贴片2A周边方向伸展的一段范围。热板30可以用低温焊烙铁代替。
在第四步中，移去热板30和隔片31并使夹具11冷却硬化，以此使金属贴片2A被夹持在天线罩的内表面12和夹具11A之间。
如上所述，在第一实施例中，可以利用图3A至3D所示的制造方法使金属贴片2A固定到天线罩1A上。具有图3A所示形状的天线罩1可以用注模的方法制成，而用热板30在天线罩1A上固定金属贴片2A的步骤非常简单。从而，第一实施例中的贴片天线能以低廉的成本制成。
此外，金属贴片2A是由能够精确形成的天线罩1A的凸台11a导引的，所以它能被精确地定位。因而，在第一实施例中的贴片天线无需考虑由金属贴片2A和辐射元件4之间的位置差所引起的电性能退化。
在图4A和4B中将对本发明第二优选实施例的贴片天线进行说明，其中的图4A是它的平面视图而图4B则为沿着图4A中的A1-A2线切开的剖面视图。
在第二实施例中，只有图1A中所示第一实施例的天线罩1A由天线罩1B所取代而第一实施例中的其它部件则照常使用。第一实施例中的制造方法仍能用于第二实施例中。天线罩1B还包括附加在图1A中天线罩1A的夹具11A之外的夹具11B、11C和11D。当金属贴片2A固定在天线罩1B上时，夹具11B、11C和11D各自具有部分地盖住靠近金属贴片2A周边的下表面的式样。夹具11B、11C和11D与夹具11A类似，是使分别形成在天线罩1B上的凸台11b、11c和11d(图未示出)经热软化成形构成的，然后使它们冷却硬化。凸台11b、11c和11d与金属贴片的周边近乎接触并在对称点处自天线罩1B的内表面12凸起。经过如上所述对凸台11b、11c和11d的加工，由对部位凸台11b、11c和11d分别进行加工制成的夹具11B、11C和11D形成为盖住靠近金属贴片2A周边的下表面。在第二实施例中，由于在夹具11A之外增加了夹具11B、11C和11D在天线罩1B的内表面12上夹持着金属贴片2A，能够增加在天线罩1B上夹持金属贴片2A的强度，因而提高了电气和机械的稳定性。
在图5A和5B中将对本发明第三优选实施例的贴片天线进行说明，其中图5A是它的平面视图，而图5B为图5A中沿B1-B2线切开的剖面视图。
在第三实施例中，示于图1A的第一实施例中的天线罩1A和金属贴片2A分别由一个天线罩1C和一块金属贴片2B所取代，而在第一实施例中的其它部件仍被使用。第一实施例中的制造方法同样能在第三实施例中使用。此贴片天线所具备的结构使盘状金属贴片2B在其周边处被夹持在天线罩1C的内表面上。也就是，在金属贴片2B的圆心P2处未形成穿孔。同样，天线罩1C不包含示于图1A中天线罩1A的夹具11A，而是设置夹具11E、11F、11G和11H代替夹具11A。当金属贴片2B被固定到天线罩1C上时，夹具11E、11F、11G和11H各有部分覆盖金属贴片2B周边附近下表面的形状。
夹具11E、11F、11G和11H的形成是经过对在天线罩1C上分别预形成的弧状凸起11e、11f(未示出)、11g和11h进行热软化成形，然后使它们冷却硬化。对称形成的弧状凸起11e、11f、11g和11h是从天线罩1C的内表面12凸起的，而弧状凸起的内壁则几乎与金属贴片2B的周边接触。通过分别加工弧状凸起部件11e、11f、11g和11h制成的夹具11E、11F、11G和11H被形成为盖住金属贴片2B周边附近的下表面。在第三实施例中，由于有夹具11E、11F、11G和11H在天线罩1C的内表面12上夹持着金属贴片2B，能够提高在天线罩1C上夹持金属贴片的强度，从而提高了电气和机械的稳定性。
尽管如此，在第三实施例中，夹具11E、11F、11G和11H是作为环的部分形成的，可以通过用环状凸起取代弧状凸起11e、11f、11g和11h形成整体的夹具取代它们。此外，天线罩1C还可以包含一个靠近金属贴片2B的圆心P2的夹具。
尽管为了完整清楚地公开起见，本发明已就特定的实施例进行了说明，然而附带的权利要求并不因此而受到限制，而是要解释为包括对于那些熟练的技术人员可能要发生的一切改装以及替换构造，那都完全落入在此讲授的基本范围。

Claims (7)

1.一种贴片天线，其特征在于，它包括：
一个馈入高频信号并从其一面表面辐射高频电磁场的驱动贴片；
一个在其一面表面接收来自所述驱动贴片的所述高频电磁场并从其另一面表面再辐射出所述高频电磁场的寄生贴片；以及
一个将所述驱动贴片和所述寄生贴片容置其中使它们受到保护并夹持所述寄生贴片的天线罩；
其中所述寄生贴片是由与所述寄生贴片的所述另一面表面相接触的所述天线罩的内表面夹持住并且有一夹具从所述天线罩的所述内表面上凸起并盖住所述寄生贴片的所述一面表面的一部分。
2.按照权利要求1所述的一种贴片天线，其特征在于：
所述寄生贴片在其表面中央有一个穿孔，以及
所述天线罩的所述夹具包括一个从所述天线罩的所述内表面穿透所述寄生贴片的所述穿孔并盖住所述穿孔附近所述寄生贴片的所述一面表面的第一夹持件。
3.按照权利要求2所述的一种贴片天线，其特征在于：
所述天线罩的所述夹具还包括一个或多个盖住所述寄生贴片的一部分周边的第二夹持件。
4.按照权利要求1所述的一种贴片天线，其特征在于：
所述天线罩的所述夹具盖住所述寄生贴片的部分或全部周边。
5.按照权利要求1所述的一种贴片天线，其特征在于：
所述夹具是在使所述寄生贴片的所述另一面表面定位在所述天线罩的所述内表面上之后经过对所述夹具的端部进行热软化、成形、冷却并硬化形成的。
6.按照权利要求5所述的一种贴片天线，其特征在于：
所述寄生贴片是在所述热软化之前由所述夹具导引定位的。
7.一种制造贴片天线的方法，所述贴片天线包括一个馈入高频信号并从其一面表面辐射高频电磁场的驱动贴片、一个在其一面表面接收来自所述驱动贴片的所述高频电磁场并从其另一面表面再辐射出所述高频电磁场的寄生贴片、以及一个将所述驱动贴片和所述寄生贴片容置其中使它们受到保护并夹持所述寄生贴片的天线罩，其特征在于，所述制造方法包括的步骤有：
制造所述的天线罩使得从其内表面凸起一个所具有高度超过所述寄生贴片厚度的凸台；
沿着所述凸台的周边轮廓按压所述寄生贴片的所述另一面表面使其与天线罩的所述内表面接触；
热软化从所述寄生贴片的所述一面表面凸起的所述凸台的一部分并为设置一个夹具使其形成为盖住所述寄生贴片的部分所述一面表面的形状；以及
冷却和硬化所述夹具使所述寄生贴片被夹持在所述天线罩和所述夹具之间。
CN97100630A 1996-03-11 1997-03-11 贴片天线及其制造方法 Expired - Fee Related CN1078754C (zh)

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US5977710A (en) 1999-11-02
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EP0795925A3 (en) 1998-01-14
AU726672B2 (en) 2000-11-16
JPH09246851A (ja) 1997-09-19
DE69708358D1 (de) 2002-01-03
JP2957463B2 (ja) 1999-10-04
EP0795925A2 (en) 1997-09-17
EP0795925B1 (en) 2001-11-21
CN1164134A (zh) 1997-11-05

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