EP0795925A2 - Patch antenna and method for making the same - Google Patents

Patch antenna and method for making the same Download PDF

Info

Publication number
EP0795925A2
EP0795925A2 EP97103971A EP97103971A EP0795925A2 EP 0795925 A2 EP0795925 A2 EP 0795925A2 EP 97103971 A EP97103971 A EP 97103971A EP 97103971 A EP97103971 A EP 97103971A EP 0795925 A2 EP0795925 A2 EP 0795925A2
Authority
EP
European Patent Office
Prior art keywords
patch
radome
parasitic
parasitic patch
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP97103971A
Other languages
German (de)
French (fr)
Other versions
EP0795925B1 (en
EP0795925A3 (en
Inventor
Akio Kuramoto
Kosuke Tanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of EP0795925A2 publication Critical patent/EP0795925A2/en
Publication of EP0795925A3 publication Critical patent/EP0795925A3/en
Application granted granted Critical
Publication of EP0795925B1 publication Critical patent/EP0795925B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/56Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
    • B29C65/60Riveting or staking
    • B29C65/606Riveting or staking the rivets being integral with one of the parts to be joined, i.e. staking
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/56Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
    • B29C65/567Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits using a tamping or a swaging operation, i.e. at least partially deforming the edge or the rim of a first part to be joined to clamp a second part to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/56Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
    • B29C65/64Joining a non-plastics element to a plastics element, e.g. by force
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • B29C66/1122Single lap to lap joints, i.e. overlap joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/20Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/21Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being formed by a single dot or dash or by several dots or dashes, i.e. spot joining or spot welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/50General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53Joining single elements to tubular articles, hollow articles or bars
    • B29C66/532Joining single elements to the wall of tubular articles, hollow articles or bars
    • B29C66/5326Joining single elements to the wall of tubular articles, hollow articles or bars said single elements being substantially flat
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/50General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/61Joining from or joining on the inside
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74Joining plastics material to non-plastics material
    • B29C66/742Joining plastics material to non-plastics material to metals or their alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/83General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832Reciprocating joining or pressing tools
    • B29C66/8322Joining or pressing tools reciprocating along one axis
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/40Radiating elements coated with or embedded in protective material
    • H01Q1/405Radome integrated radiating elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/0407Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/13Single flanged joints; Fin-type joints; Single hem joints; Edge joints; Interpenetrating fingered joints; Other specific particular designs of joint cross-sections not provided for in groups B29C66/11 - B29C66/12
    • B29C66/131Single flanged joints, i.e. one of the parts to be joined being rigid and flanged in the joint area
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/34Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3456Antennas, e.g. radomes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/737Articles provided with holes, e.g. grids, sieves

Definitions

  • This invention relates to a patch antenna, and more particularly to, a patch antenna which has a driven patch with a microstrip structure, a parasitic patch which reradiates an electromagnetic field received from the driven patch and a radome containing these patches to protect them, and a method for making the same.
  • a patch antenna composed of a driven patch and a parasitic patch which are structured as two electromagnetic wave radiating layers has an excellent broad-band performance.
  • a patch antenna structure which presents advantages in terms of portability as mobile communication means, reliability and aesthetical appearance can be provided.
  • such structures are disclosed in Japanese patent application laid-open No.2-141007(1990) and Japanese patent application laid-open No.3-74908(1991), where the former discloses a microstrip antenna in which a parasitic patch is adhered to inner surface of a radome and the latter discloses a stacked microstrip antenna in which a parasitic patch is buried in the wall of a radome.
  • a patch antenna comprises:
  • a method for making a patch antenna which comprises a driven patch which is fed with a high-frequency signal and radiates a high-frequency electromagnetic field from its one surface, a parasitic patch which receives the high-frequency electromagnetic field from the driven patch at its one surface and reradiates the high-frequency electromagnetic field from its other surface, and a radome which contains the driven patch and the parasitic patch inside of the radome to protect them and holds the parasitic patch, comprising the steps of:
  • FIGS.1A to 2 where FIG.1A is a cross sectional view thereof and FIG.1B is an enlarged view showing a part in FIG.1A and FIG.2 is a perspective view showing a radome 1A and the other parts separated of the patch antenna in FIG.1A.
  • a microstrip structure is formed by a feeding section 3, a radiating element 4 which are processed of a printed board and a dielectric substrate 5, a grounding conductor 6 which retain the original shape of a printed board.
  • a metal patch 2A and the radiating element 4 form a broad- band microstrip antenna.
  • the high-frequency wave fed through the feeding section 3 is resonated by the metal patch 2A and the radiating element 4. If the diameter and resonance frequency of the radiating element 4 are D1, f1, respectively, the diameter and resonance frequency of the metal patch 2A are D2, f2, respectively and D2>D1 is given, f1>f2 is obtained.
  • a frequency band, which is given by (f1-f2)/f0 is nearly equal to 0.1.
  • the radiating element 4 fed though the feeding section 3 resonates near at the frequency f1 and radiates an electric wave.
  • the metal patch 2A is electromagnetic-coupled with the radiating element 4, thereby resonating near at the frequency f2 and radiating an electric wave.
  • a high-frequency signal with circularly polarized wave electromagnetic field is radiated in the direction of the outer surface 13 of the radome 1A which is made of plastics with a low loss.
  • the microstrip structure including the radiating element 4 and the metal patch 2A are covered with the inner surface of the radome 1A and an antenna board 7 on which the microstrip structure is fixed, thereby protected from the external environment of the radome 1A.
  • the feeding section 3 and the radiating element 4 are formed on the same surface of a printed board by conductive board etching.
  • the metal patch 2A which is made of a thin plate of aluminum and is formed like a disk, receives the circularly polarized wave electromagnetic field at its one surface and then reradiates it from the other surface.
  • the other surface of the metal patch 2A is in contact with the inner surface 12 of the radome 1A, and the metal patch 2A is held between the inner surface 12 of the radome 1A and a holder 11A which protrudes from the inner surface 12 and covers a part of the lower surface of the metal patch 2A.
  • the holder 11A is formed, as explained after, by processing the tip of a boss 11a.
  • the radome 1A is pressed upon the antenna board 7 as it is guided along the circumference of the microstrip structure and is then fixed to the antenna board 7 by screws 8a, 8b.
  • the means for fixing the radome 1A to the antenna board 7 is not limited to the screw, and another fixing means by which the position relationship between the radome 1A and the antenna board 7 are precisely determined may be employed.
  • the metal patch 2A has a boss hole 21 that is a through-hole penetrating from its one surface to other surface at the center of the surface, i.e., at the position of a circle center P1.
  • the inner diameter r of the boss hole 21 is preferably around 5R/100, where R is the outer diameter of the metal patch 2A, taking into account the deterioration in the radiation characteristic of circularly polarized wave electromagnetic field and the holding strength of the metal patch 2A to the radome 1A.
  • the metal patch 2A has an outer diameter of R ⁇ 80 mm, a thickness of t ⁇ 0.5 mm and a boss hole inner diameter of r ⁇ 4 mm.
  • the holder 11A is formed to cover a part of the lower surface of the metal patch 2A which neighbors on the boss hole 21.
  • the holder 11A is a structure which is obtained by processing the tip of the boss 11a that protrudes from the inner surface of the radome 1A.
  • the height h of the boss 11a is greater than the thickness t of the metal patch 2A, and the outer diameter r1 of the boss 11a is a little shorter than the inner diameter r of the boss hole 21 of the metal patch 2A.
  • the boss 11a is positioned such that the circle center P1 of the metal patch 2A is located, as shown in FIG.1A, just above the circle center P0 of the radiating element 4 when the radome 1A is fixed on the antenna board 7.
  • the radome 1A can be made of polycarbonate and the like.
  • the thermosoftening temperature(glass transition temperature) Tg where polycarbonate is softened by heating is around 150°C
  • crystal-melting temperature Tm where it is fluidized is around 240°C
  • heat-resisting temperature where it is used in the solid state is around 125°C.
  • FIGS.3A to 3D show a process of fixing the metal patch 2A to the radome 1A in the patch antenna in FIG.1A, where FIGS.3A to 3D correspond to the first to fourth steps, respectively.
  • the radome 1A on the inner surface of which protruded is the boss 11a which has a height h greater than the thickness t of the metal patch 2A and has an outer diameter r1 a little shorter than the inner diameter r of the boss hole 21 of the metal patch 2A, is made.
  • the metal patch 2A is pressed upon to contact the inner surface 12 as it is guided by the circumference of the boss 11a.
  • the tip of the boss 11a is pressed by a hot plate 30 at a temperature higher than the thermosoftening temperature Tg of the boss 11a and lower than the melting temperature Tm of the boss 11a, thereby a part of the boss 11a protruded from the upper surface of the metal patch 2A being softened and formed to provide the holder 11A that has the form to cover a part of the upper surface of the metal patch 2A.
  • a disk-like spacer 31 with a thermal resistance is inserted between the hot plate 30 and the metal patch 2A.
  • the spacer 31 has a thickness t1 and a hole with a diameter r2 in the center.
  • the spacer 31 serves to control the thickness of the holder 11A when pressing the hot plate 30 upon the boss 11a.
  • the height h of the boss 11a and the thickness t1 of the spacer 31 is set to give a strength that the thickness and diameter of the resultant holder 11A can sufficiently hold the metal patch 2A, and the diameter r2 of the spacer 31 is set to be greater than a range that the holder 11A extends in the direction of the circumference of the metal patch 2A.
  • the hot plate 30 may be substituted by a soldering iron.
  • the hot plate 30 and the spacer 31 are removed and the holder 11A is then cooled and hardened, thereby the metal patch 2A being held between the inner surface of the radome 12 and the holder 11A.
  • the metal patch 2A can be fixed to the radome 1A by using the fabrication method as shown in FIGS.3A to 3D.
  • the radome 1A with the shape shown in FIG.3A can be made by injection molding and the fixing step of the metal patch 2A to the radome 1A by the hot plate 30 is very simple.
  • the patch antenna in the first embodiment can be made at a low cost.
  • the metal patch 2A can be precisely positioned as it is guided by the boss 11a of the radome 1A which can be precisely formed. Therefore, it is not necessary for the patch antenna in the first embodiment to consider the deterioration in electrical performance caused by the position difference between the metal patch 2A and the radiating element 4.
  • FIGS.4A and 4B A patch antenna in the second preferred embodiment according to the invention will be explained in FIGS.4A and 4B, where FIG.4A is a plan view thereof and FIG.4B is a cross sectional view cut along the line A1-A2 in FIG.4A.
  • the radome 1B further comprises holders 11B, 11C and 11D in addition to the holder 11A of the radome 1A in FIG.1A.
  • Each of the holders 11B, 11C and 11D has a form that partially covers the lower surface nearby the circumference of the metal patch 2A, when the metal patch 2A is fixed to the radome 1B.
  • the holders 11B, 11C and 11D are, similarly to the holder 11A, formed by thermosoftening and shaping bosses 11b, 11c and 11d(not shown) which are preformed on the radome 1B, respectively, thereafter cooling and hardening them.
  • the bosses 11b, 11c and 11d are nearly in contact with the circumference of the metal patch 2A and are protruding from the inner surface 12 of the radome 1B at symmetrical points.
  • the holders 11B, 11C and 11D which are made by processing parts of the bosses 11b, 11c and 11d, respectively, are formed to cover the lower surface nearby the circumference of the metal patch 2A.
  • the holders 11B, 11C and 11D in addition to the holder 11A, hold the metal patch 2A onto the inner surface 12 of the radome 1B, the holding strength of the metal patch 2A onto the radome 1B can be increased, therefore enhancing the electrical and mechanical stabilities.
  • FIGS.5A and 5B A patch antenna in the third preferred embodiment according to the invention will be explained in FIGS.5A and 5B, where FIG.5A is a plan view thereof and FIG.5B is a cross sectional view cut along the line B1-B2 in FIG.5A.
  • the radome 1A and the metal patch 2A in the first embodiment as shown in FIG.1A are replaced by a radome 1C and a metal patch 2B, respectively and the other parts in the first embodiment are used as well.
  • the fabrication method in the first embodiment can be also used in the third embodiment.
  • This patch antenna has a structure that the disk-like metal patch 2B is held onto the inner surface of the radome 1C at its circumference. Namely, there is formed no through-hole at the circle center P2 of the metal patch 2B.
  • the radome 1C does not include the holder 11A of the radome 1A as shown in FIG.1A, and it is provided with holders 11E, 11F, 11G and 11H in place of the holder 11A.
  • Each of the holders 11E, 11F, 11G and 11H has a form that partially covers the lower surface nearby the circumference of the metal patch 2B, when the metal patch 2B is fixed to the radome 1C.
  • the holders 11E, 11F, 11G and 11H are formed by thermosoftening and shaping arc-shaped protrusions 11e, 11f(not shown), 11g and 11h which are preformed on the radome 1C, respectively, thereafter cooling and hardening them.
  • the arc-shaped protrusions 11e, 11f, 11g and 11h which are symmetrically formed are protruding from the inner surface 12 of the radome 1C, and the inner walls of the arc-shaped protrusions are nearly in contact with the circumference of the metal patch 2B.
  • the holders 11E, 11F, 11G and 11H which are made by processing parts of the arc-shaped protrusions 11e, 11f, 11g and 11h, respectively, are formed to cover the lower surface nearby the circumference of the metal patch 2B.
  • the holders 11E, 11F, 11G and 11F hold the metal patch 2B onto the inner surface 12 of the radome 1C, the holding strength of the metal patch 2B onto the radome 1C can be increased, therefore enhancing the electrical and mechanical stabilities.
  • the holders 11E, 11F, 11G and 11H are formed as parts of a ring, they may be replaced by an integrated holder which is formed by substituting a ring-shaped protrusion for the arc-shaped protrusions 11e, 11f, 11g and 11h.
  • the radome 1C may include a holder nearby the circle center P2 of the metal patch 2B.

Abstract

Disclosed is a patch antenna which has a driven patch which is fed with a high-frequency signal and radiates a high-frequency electromagnetic field from its one surface; a parasitic patch which receives the high-frequency electromagnetic field from the driven patch at its one surface and reradiates the high-frequency electromagnetic field from its other surface; and a radome which contains the driven patch and the parasitic patch inside of the radome to protect them and holds the parasitic patch; wherein the parasitic patch is held by the inner surface of the radome which contacts the other surface of the parasitic patch and a holder which protrudes from the inner surface of the radome and covers a part of the one surface of the parasitic patch.

Description

  • This invention relates to a patch antenna, and more particularly to, a patch antenna which has a driven patch with a microstrip structure, a parasitic patch which reradiates an electromagnetic field received from the driven patch and a radome containing these patches to protect them, and a method for making the same.
  • It is known that a patch antenna composed of a driven patch and a parasitic patch which are structured as two electromagnetic wave radiating layers has an excellent broad-band performance. By containing such patch antenna inside a radome, a patch antenna structure which presents advantages in terms of portability as mobile communication means, reliability and aesthetical appearance can be provided. For example, such structures are disclosed in Japanese patent application laid-open No.2-141007(1990) and Japanese patent application laid-open No.3-74908(1991), where the former discloses a microstrip antenna in which a parasitic patch is adhered to inner surface of a radome and the latter discloses a stacked microstrip antenna in which a parasitic patch is buried in the wall of a radome.
  • However, in the conventional patch antennas disclosed therein, there is a problem that the number of fabrication steps must increase due to requiring the adhesion of the parasitic patch to the radome or the burying of the parasitic patch in the wall of the radome. Also, there is a problem that it is difficult to position the parasitic patch at a proper position on the radome or in the wall of the radome.
  • Accordingly, it is an object of the invention to provide a patch antenna in which a parasitic patch is precisely positioned and firmly fixed onto the inner surface of a radome.
  • It is a further object of the invention to provide a method for making a patch antenna which facilitates the positioning and fixing of a parasitic patch onto the inner surface of a radome..
  • According to the invention, a patch antenna, comprises:
    • a driven patch which is fed with a high-frequency signal and radiates a high-frequency electromagnetic field from its one surface;
    • a parasitic patch which receives the high-frequency electromagnetic field from the driven patch at its one surface and reradiates the high-frequency electromagnetic field from its other surface; and
    • a radome which contains the driven patch and the parasitic patch inside of the radome to protect them and holds the parasitic patch;
         wherein the parasitic patch is held by the inner surface of the radome which contacts the other surface of the parasitic patch and a holder which protrudes from the inner surface of the radome and covers a part of the one surface of the parasitic patch.
  • According to another aspect of the invention, a method for making a patch antenna, which comprises a driven patch which is fed with a high-frequency signal and radiates a high-frequency electromagnetic field from its one surface, a parasitic patch which receives the high-frequency electromagnetic field from the driven patch at its one surface and reradiates the high-frequency electromagnetic field from its other surface, and a radome which contains the driven patch and the parasitic patch inside of the radome to protect them and holds the parasitic patch, comprising the steps of:
    • making the radome from which a boss which has a height greater than a thickness of the parasitic patch is protruded at its inner surface;
    • pressing the other surface of the parasitic patch to contact the inner surface of radome along the circumferential shape of the boss;
    • thermosoftening a part of the boss protruding from the one surface of the parasitic patch and forming it into a shape to cover a part of the one surface of the parasitic patch in order to provide a holder; and
    • cooling and hardening the holder to hold the parasitic patch between the radome and the holder.
    BRIEF DESCRIPTION OF THE DRAWINGS
  • The invention will be explained in more detail in conjunction with the appended drawings, wherein:
    • FIG.1A is a cross sectional view showing a patch antenna in a first preferred embodiment according to the invention,
    • FIG.1B is an enlarged partial view showing the patch antenna in FIG.1A,
    • FIG.2 is a perspective view showing the separated state of the patch antenna in the first embodiment,
    • FIGS.3A to 3D are cross sectional views showing a method of making a patch antenna in a preferred embodiment according to the invention,
    • FIG.4A is a partial plan view showing a patch antenna in a second preferred embodiment according to the invention,
    • FIG.4B is a cross sectional view cut along the line A1-A2 in FIG.4A,
    • FIG.5A is a partial plan view showing a patch antenna in a third preferred embodiment according to the invention, and
    • FIG.5B is a cross sectional view cut along the line B1-B2 in FIG.5A.
    DESCRIPTION OF THE PREFERRED EMODIMENTS
  • A patch antenna in, the first preferred embodiment will be explained in FIGS.1A to 2, where FIG.1A is a cross sectional view thereof and FIG.1B is an enlarged view showing a part in FIG.1A and FIG.2 is a perspective view showing a radome 1A and the other parts separated of the patch antenna in FIG.1A.
  • As shown in FIG.1A and 2, in this patch antenna, a microstrip structure is formed by a feeding section 3, a radiating element 4 which are processed of a printed board and a dielectric substrate 5, a grounding conductor 6 which retain the original shape of a printed board. A metal patch 2A and the radiating element 4 form a broad- band microstrip antenna. The high-frequency wave fed through the feeding section 3 is resonated by the metal patch 2A and the radiating element 4. If the diameter and resonance frequency of the radiating element 4 are D1, f1, respectively, the diameter and resonance frequency of the metal patch 2A are D2, f2, respectively and D2>D1 is given, f1>f2 is obtained. Further, if a center frequency f0 is given by f0=(f1+f2)/2)
    Figure imgb0001
    , a frequency band, which is given by (f1-f2)/f0, is nearly equal to 0.1. Thus, the radiating element 4 fed though the feeding section 3 resonates near at the frequency f1 and radiates an electric wave. On the other hand, the metal patch 2A is electromagnetic-coupled with the radiating element 4, thereby resonating near at the frequency f2 and radiating an electric wave. As a result, a high-frequency signal with circularly polarized wave electromagnetic field is radiated in the direction of the outer surface 13 of the radome 1A which is made of plastics with a low loss. The microstrip structure including the radiating element 4 and the metal patch 2A are covered with the inner surface of the radome 1A and an antenna board 7 on which the microstrip structure is fixed, thereby protected from the external environment of the radome 1A.
  • Further explaining this patch antenna in detail, the feeding section 3 and the radiating element 4 are formed on the same surface of a printed board by conductive board etching. The radiating element 4, which is formed like a disk, is fed with a phase difference of 90° from two positions with an angle α=90° to each other branched from the feeding circuit 3. By this feeding, the radiating element 4 radiates the circularly polarized wave electromagnetic field from its one surface. The metal patch 2A, which is made of a thin plate of aluminum and is formed like a disk, receives the circularly polarized wave electromagnetic field at its one surface and then reradiates it from the other surface. The other surface of the metal patch 2A is in contact with the inner surface 12 of the radome 1A, and the metal patch 2A is held between the inner surface 12 of the radome 1A and a holder 11A which protrudes from the inner surface 12 and covers a part of the lower surface of the metal patch 2A. The holder 11A is formed, as explained after, by processing the tip of a boss 11a. The radome 1A is pressed upon the antenna board 7 as it is guided along the circumference of the microstrip structure and is then fixed to the antenna board 7 by screws 8a, 8b. The means for fixing the radome 1A to the antenna board 7 is not limited to the screw, and another fixing means by which the position relationship between the radome 1A and the antenna board 7 are precisely determined may be employed.
  • Next, the fixing of the metal patch 2A to the radome 1A will be explained in detail. The metal patch 2A has a boss hole 21 that is a through-hole penetrating from its one surface to other surface at the center of the surface, i.e., at the position of a circle center P1. The inner diameter r of the boss hole 21 is preferably around 5R/100, where R is the outer diameter of the metal patch 2A, taking into account the deterioration in the radiation characteristic of circularly polarized wave electromagnetic field and the holding strength of the metal patch 2A to the radome 1A. For example, if the service frequency of the patch antenna is 1.5 GHz to 1.6 GHz, it is suitable that the metal patch 2A has an outer diameter of R≒80 mm, a thickness of t≒0.5 mm and a boss hole inner diameter of r≒4 mm. On the inner surface 12 of the radome 1A, the holder 11A is formed to cover a part of the lower surface of the metal patch 2A which neighbors on the boss hole 21.
  • The holder 11A is a structure which is obtained by processing the tip of the boss 11a that protrudes from the inner surface of the radome 1A. The height h of the boss 11a is greater than the thickness t of the metal patch 2A, and the outer diameter r1 of the boss 11a is a little shorter than the inner diameter r of the boss hole 21 of the metal patch 2A. The boss 11a is positioned such that the circle center P1 of the metal patch 2A is located, as shown in FIG.1A, just above the circle center P0 of the radiating element 4 when the radome 1A is fixed on the antenna board 7. After the upper surface of the metal patch 2A is pressed upon the inner surface 12 of the radome 1A as the metal patch 2A is guided by the boss 11a, the tip of the boss 11a is softened by heating and compressed in the direction of the inner surface 12, thereby transformed into a form to cover a part of the lower surface of the metal patch 2A, then cooled and hardened to provide the holder 11A as shown. The radome 1A can be made of polycarbonate and the like. The thermosoftening temperature(glass transition temperature) Tg where polycarbonate is softened by heating is around 150°C, crystal-melting temperature Tm where it is fluidized is around 240°C and heat-resisting temperature where it is used in the solid state is around 125°C.
  • FIGS.3A to 3D show a process of fixing the metal patch 2A to the radome 1A in the patch antenna in FIG.1A, where FIGS.3A to 3D correspond to the first to fourth steps, respectively.
  • In the first step, the radome 1A, on the inner surface of which protruded is the boss 11a which has a height h greater than the thickness t of the metal patch 2A and has an outer diameter r1 a little shorter than the inner diameter r of the boss hole 21 of the metal patch 2A, is made. In the second step, the metal patch 2A is pressed upon to contact the inner surface 12 as it is guided by the circumference of the boss 11a.
  • In the third step, the tip of the boss 11a is pressed by a hot plate 30 at a temperature higher than the thermosoftening temperature Tg of the boss 11a and lower than the melting temperature Tm of the boss 11a, thereby a part of the boss 11a protruded from the upper surface of the metal patch 2A being softened and formed to provide the holder 11A that has the form to cover a part of the upper surface of the metal patch 2A. Here, between the hot plate 30 and the metal patch 2A, a disk-like spacer 31 with a thermal resistance is inserted. The spacer 31 has a thickness t1 and a hole with a diameter r2 in the center. The spacer 31 serves to control the thickness of the holder 11A when pressing the hot plate 30 upon the boss 11a. The height h of the boss 11a and the thickness t1 of the spacer 31 is set to give a strength that the thickness and diameter of the resultant holder 11A can sufficiently hold the metal patch 2A, and the diameter r2 of the spacer 31 is set to be greater than a range that the holder 11A extends in the direction of the circumference of the metal patch 2A. The hot plate 30 may be substituted by a soldering iron.
  • In the fourth step, the hot plate 30 and the spacer 31 are removed and the holder 11A is then cooled and hardened, thereby the metal patch 2A being held between the inner surface of the radome 12 and the holder 11A.
  • As explained above, in the first embodiment, the metal patch 2A can be fixed to the radome 1A by using the fabrication method as shown in FIGS.3A to 3D. The radome 1A with the shape shown in FIG.3A can be made by injection molding and the fixing step of the metal patch 2A to the radome 1A by the hot plate 30 is very simple. Thus, the patch antenna in the first embodiment can be made at a low cost.
  • Furthermore, the metal patch 2A can be precisely positioned as it is guided by the boss 11a of the radome 1A which can be precisely formed. Therefore, it is not necessary for the patch antenna in the first embodiment to consider the deterioration in electrical performance caused by the position difference between the metal patch 2A and the radiating element 4.
  • A patch antenna in the second preferred embodiment according to the invention will be explained in FIGS.4A and 4B, where FIG.4A is a plan view thereof and FIG.4B is a cross sectional view cut along the line A1-A2 in FIG.4A.
  • In the second embodiment, only the radome 1A in the first embodiment as shown in FIG.1A is replaced by a radome 1B and the other parts in the first embodiment are used as well. The fabrication method in the first embodiment can be also used in the second embodiment. The radome 1B further comprises holders 11B, 11C and 11D in addition to the holder 11A of the radome 1A in FIG.1A. Each of the holders 11B, 11C and 11D has a form that partially covers the lower surface nearby the circumference of the metal patch 2A, when the metal patch 2A is fixed to the radome 1B. The holders 11B, 11C and 11D are, similarly to the holder 11A, formed by thermosoftening and shaping bosses 11b, 11c and 11d(not shown) which are preformed on the radome 1B, respectively, thereafter cooling and hardening them. The bosses 11b, 11c and 11d are nearly in contact with the circumference of the metal patch 2A and are protruding from the inner surface 12 of the radome 1B at symmetrical points. By processing the bosses 11b, 11c and 11d as described above, the holders 11B, 11C and 11D, which are made by processing parts of the bosses 11b, 11c and 11d, respectively, are formed to cover the lower surface nearby the circumference of the metal patch 2A. In the second embodiment, since the holders 11B, 11C and 11D, in addition to the holder 11A, hold the metal patch 2A onto the inner surface 12 of the radome 1B, the holding strength of the metal patch 2A onto the radome 1B can be increased, therefore enhancing the electrical and mechanical stabilities.
  • A patch antenna in the third preferred embodiment according to the invention will be explained in FIGS.5A and 5B, where FIG.5A is a plan view thereof and FIG.5B is a cross sectional view cut along the line B1-B2 in FIG.5A.
  • In the third embodiment, the radome 1A and the metal patch 2A in the first embodiment as shown in FIG.1A are replaced by a radome 1C and a metal patch 2B, respectively and the other parts in the first embodiment are used as well. The fabrication method in the first embodiment can be also used in the third embodiment. This patch antenna has a structure that the disk-like metal patch 2B is held onto the inner surface of the radome 1C at its circumference. Namely, there is formed no through-hole at the circle center P2 of the metal patch 2B. Also, the radome 1C does not include the holder 11A of the radome 1A as shown in FIG.1A, and it is provided with holders 11E, 11F, 11G and 11H in place of the holder 11A. Each of the holders 11E, 11F, 11G and 11H has a form that partially covers the lower surface nearby the circumference of the metal patch 2B, when the metal patch 2B is fixed to the radome 1C.
  • The holders 11E, 11F, 11G and 11H are formed by thermosoftening and shaping arc-shaped protrusions 11e, 11f(not shown), 11g and 11h which are preformed on the radome 1C, respectively, thereafter cooling and hardening them. The arc-shaped protrusions 11e, 11f, 11g and 11h which are symmetrically formed are protruding from the inner surface 12 of the radome 1C, and the inner walls of the arc-shaped protrusions are nearly in contact with the circumference of the metal patch 2B. The holders 11E, 11F, 11G and 11H, which are made by processing parts of the arc-shaped protrusions 11e, 11f, 11g and 11h, respectively, are formed to cover the lower surface nearby the circumference of the metal patch 2B. In the third embodiment, since the holders 11E, 11F, 11G and 11F hold the metal patch 2B onto the inner surface 12 of the radome 1C, the holding strength of the metal patch 2B onto the radome 1C can be increased, therefore enhancing the electrical and mechanical stabilities.
  • Though, in the third embodiment, the holders 11E, 11F, 11G and 11H are formed as parts of a ring, they may be replaced by an integrated holder which is formed by substituting a ring-shaped protrusion for the arc-shaped protrusions 11e, 11f, 11g and 11h. Furthermore, the radome 1C may include a holder nearby the circle center P2 of the metal patch 2B.
  • Although the invention has been described with respect to specific embodiment for complete and clear disclosure, the appended claims are not to be thus limited but are to be construed as embodying all modification and alternative constructions that may be occurred to one skilled in the art which fairly fall within the basic teaching here is set forth.

Claims (7)

  1. A patch antenna, comprising:
    a driven patch which is fed with a high-frequency signal and radiates a high-frequency electromagnetic field from its one surface;
    a parasitic patch which receives said high-frequency electromagnetic field from said driven patch at its one surface and reradiates said high-frequency electromagnetic field from its other surface; and
    a radome which contains said driven patch and said parasitic patch inside of said radome to protect them and holds said parasitic patch;
       wherein said parasitic patch is held by the inner surface of said radome which contacts said other surface of said parasitic patch and a holder which protrudes from said inner surface of said radome and covers a part of said one surface of said parasitic patch.
  2. A patch antenna, according to claim 1, wherein:
    said parasitic patch has a through-hole at the center of its surface, and
    said holder of said radome comprises a first holding member which penetrates said through-hole of said parasitic patch from said inner surface of said radome and covers said one surface of said parasitic patch nearby said through-hole.
  3. A patch antenna, according to claim 2, wherein:
    said holder of said radome further comprises one or a plurality of second holding members which cover a part of the circumference of said parasitic patch.
  4. A patch antenna, according to any of claims 1 to 3, wherein:
    said holder of said radome covers a part or all of the circumference of said parasitic patch.
  5. A patch antenna, according to any of claims 1 to 4, wherein:
    said holder is formed by thermosoftening, shaping, cooling and then hardening its tip after positioning said other surface of said parasitic patch onto said inner surface of said radome.
  6. A patch antenna, according to claim 5, wherein:
    said parasitic patch is positioned as it is guided by said holder before said thermosoftening.
  7. A method for making a patch antenna, which comprises a driven patch which is fed with a high-frequency signal and radiates a high-frequency electromagnetic field from its one surface, a parasitic patch which receives said high-frequency electromagnetic field from said driven patch at its one surface and reradiates said high-frequency electromagnetic field from its other surface, and a radome which contains said driven patch and said parasitic patch inside of said radome to protect them and holds said parasitic patch, comprising the steps of:
    making said radome from which a boss which has a height greater than a thickness of said parasitic patch is protruded at its inner surface;
    pressing said other surface of said parasitic patch to contact said inner surface of radome along the circumferential shape of said boss;
    thermosoftening a part of said boss protruding from said one surface of said parasitic patch and forming it into a shape to cover a part of said one surface of said parasitic patch in order to provide a holder; and
    cooling and hardening said holder to hold said parasitic patch between said radome and said holder.
EP97103971A 1996-03-11 1997-03-10 Patch antenna and method for making the same Expired - Lifetime EP0795925B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8052719A JP2957463B2 (en) 1996-03-11 1996-03-11 Patch antenna and method of manufacturing the same
JP5271996 1996-03-11
JP52719/96 1996-03-11

Publications (3)

Publication Number Publication Date
EP0795925A2 true EP0795925A2 (en) 1997-09-17
EP0795925A3 EP0795925A3 (en) 1998-01-14
EP0795925B1 EP0795925B1 (en) 2001-11-21

Family

ID=12922737

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97103971A Expired - Lifetime EP0795925B1 (en) 1996-03-11 1997-03-10 Patch antenna and method for making the same

Country Status (7)

Country Link
US (1) US5977710A (en)
EP (1) EP0795925B1 (en)
JP (1) JP2957463B2 (en)
CN (1) CN1078754C (en)
AU (1) AU726672B2 (en)
CA (1) CA2199581C (en)
DE (1) DE69708358T2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000036703A1 (en) * 1998-12-11 2000-06-22 Robert Bosch Gmbh Half-loop antenna
EP1133001A2 (en) * 2000-03-09 2001-09-12 Alps Electric Co., Ltd. Wideband antenna mountable in vehicle cabin
WO2006061307A1 (en) * 2004-12-09 2006-06-15 Robert Bosch Gmbh Antenna assembly for a radar transceiver
WO2006072511A1 (en) * 2004-12-30 2006-07-13 Robert Bosch Gmbh Antenna array for a radar transceiver
WO2007047002A2 (en) * 2005-09-15 2007-04-26 Qualcomm Incorporated On a radome mounted gps antenna assembly
WO2007062971A1 (en) * 2005-11-29 2007-06-07 Robert Bosch Gmbh Antenna array for a radar sensor
US8038815B2 (en) 2007-07-17 2011-10-18 Qualcomm Incorporated Fluorescent dye to improve primer coverage accuracy for bonding applications

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6366244B1 (en) * 1993-03-11 2002-04-02 Southern California Edison Company Planar dual band microstrip or slotted waveguide array antenna for all weather applications
US5734350A (en) * 1996-04-08 1998-03-31 Xertex Technologies, Inc. Microstrip wide band antenna
US6236367B1 (en) 1998-09-25 2001-05-22 Deltec Telesystems International Limited Dual polarised patch-radiating element
US6421011B1 (en) * 1999-10-22 2002-07-16 Lucent Technologies Inc. Patch antenna using non-conductive frame
US6404389B1 (en) * 1999-10-22 2002-06-11 Lucent Technologies Inc. Patch antenna
US6407704B1 (en) * 1999-10-22 2002-06-18 Lucent Technologies Inc. Patch antenna using non-conductive thermo form frame
WO2002063716A1 (en) * 2001-02-06 2002-08-15 Harris Corporation Split pole mounting of unprotected microwave radio with parabolic antenna
US7071883B2 (en) * 2001-07-11 2006-07-04 Eagle Broadband, Inc. Set-top box having an improved patch antenna
JP2004077399A (en) * 2002-08-22 2004-03-11 Hitachi Ltd Milliwave radar
WO2004038862A1 (en) * 2002-10-25 2004-05-06 National Institute Of Information And Communications Technology Antenna device
DE10318815A1 (en) * 2003-04-17 2004-11-04 Valeo Schalter Und Sensoren Gmbh Slot-coupled radar antenna with radiation areas
JP2005012376A (en) * 2003-06-17 2005-01-13 Mitsumi Electric Co Ltd Antenna device
JP2005073168A (en) * 2003-08-27 2005-03-17 Uniden Corp Reradiation antenna system
KR100542829B1 (en) * 2003-09-09 2006-01-20 한국전자통신연구원 High Gain and Wideband Microstrip Patch Antenna for Transmitting/Receiving and Array Antenna Arraying it
US7167128B1 (en) * 2003-10-03 2007-01-23 Sirius Satellite Radio, Inc. Modular patch antenna providing antenna gain direction selection capability
DE102005005781A1 (en) * 2005-02-08 2006-08-10 Kathrein-Werke Kg Radom, in particular for mobile radio antennas and associated mobile radio antenna
EP1854170B8 (en) 2005-02-11 2018-10-17 Meggitt SA Microstrip patch antenna for high temperature environments
FI20055420A0 (en) 2005-07-25 2005-07-25 Lk Products Oy Adjustable multi-band antenna
US7304612B2 (en) * 2005-08-10 2007-12-04 Navini Networks, Inc. Microstrip antenna with integral feed and antenna structures
FI119009B (en) 2005-10-03 2008-06-13 Pulse Finland Oy Multiple-band antenna
FI118782B (en) 2005-10-14 2008-03-14 Pulse Finland Oy Adjustable antenna
DE102005054286B4 (en) * 2005-11-11 2011-04-07 Delphi Delco Electronics Europe Gmbh antenna array
CN101038983B (en) * 2006-03-13 2012-09-05 中国科学院电子学研究所 Variable frequency coupling feeder apparatus for wide-band microstrip aerial
CN101098037B (en) * 2006-06-26 2012-06-13 耀登科技股份有限公司 Method for producing paster type antenna
US8618990B2 (en) 2011-04-13 2013-12-31 Pulse Finland Oy Wideband antenna and methods
US7505002B2 (en) * 2006-12-04 2009-03-17 Agc Automotive Americas R&D, Inc. Beam tilting patch antenna using higher order resonance mode
US20080129635A1 (en) * 2006-12-04 2008-06-05 Agc Automotive Americas R&D, Inc. Method of operating a patch antenna in a higher order mode
FI20075269A0 (en) 2007-04-19 2007-04-19 Pulse Finland Oy Method and arrangement for antenna matching
US20090027298A1 (en) * 2007-07-24 2009-01-29 Symbol Technologies, Inc. Antenna Radome With Integrated Director Element
FI120427B (en) 2007-08-30 2009-10-15 Pulse Finland Oy Adjustable multiband antenna
US7696930B2 (en) * 2008-04-14 2010-04-13 International Business Machines Corporation Radio frequency (RF) integrated circuit (IC) packages with integrated aperture-coupled patch antenna(s) in ring and/or offset cavities
US8045329B2 (en) * 2009-04-29 2011-10-25 Raytheon Company Thermal dissipation mechanism for an antenna
FI20096134A0 (en) 2009-11-03 2009-11-03 Pulse Finland Oy Adjustable antenna
FI20096251A0 (en) 2009-11-27 2009-11-27 Pulse Finland Oy MIMO antenna
US8847833B2 (en) 2009-12-29 2014-09-30 Pulse Finland Oy Loop resonator apparatus and methods for enhanced field control
FI20105158A (en) 2010-02-18 2011-08-19 Pulse Finland Oy SHELL RADIATOR ANTENNA
CN102332635B (en) * 2010-04-07 2013-12-25 庄昆杰 Small-sized multi-band and high-grain dual polarization microstrip antenna at microwave low band
US9406998B2 (en) 2010-04-21 2016-08-02 Pulse Finland Oy Distributed multiband antenna and methods
FI20115072A0 (en) 2011-01-25 2011-01-25 Pulse Finland Oy Multi-resonance antenna, antenna module and radio unit
US8648752B2 (en) 2011-02-11 2014-02-11 Pulse Finland Oy Chassis-excited antenna apparatus and methods
US9673507B2 (en) 2011-02-11 2017-06-06 Pulse Finland Oy Chassis-excited antenna apparatus and methods
US8866689B2 (en) 2011-07-07 2014-10-21 Pulse Finland Oy Multi-band antenna and methods for long term evolution wireless system
US9450291B2 (en) 2011-07-25 2016-09-20 Pulse Finland Oy Multiband slot loop antenna apparatus and methods
US9123990B2 (en) 2011-10-07 2015-09-01 Pulse Finland Oy Multi-feed antenna apparatus and methods
US9531058B2 (en) 2011-12-20 2016-12-27 Pulse Finland Oy Loosely-coupled radio antenna apparatus and methods
US9484619B2 (en) 2011-12-21 2016-11-01 Pulse Finland Oy Switchable diversity antenna apparatus and methods
US8988296B2 (en) 2012-04-04 2015-03-24 Pulse Finland Oy Compact polarized antenna and methods
US9225070B1 (en) * 2012-10-01 2015-12-29 Lockheed Martin Corporation Cavity backed aperture coupled dielectrically loaded waveguide radiating element with even mode excitation and wide angle impedance matching
US9979078B2 (en) 2012-10-25 2018-05-22 Pulse Finland Oy Modular cell antenna apparatus and methods
US10069209B2 (en) 2012-11-06 2018-09-04 Pulse Finland Oy Capacitively coupled antenna apparatus and methods
US10079428B2 (en) 2013-03-11 2018-09-18 Pulse Finland Oy Coupled antenna structure and methods
US9647338B2 (en) 2013-03-11 2017-05-09 Pulse Finland Oy Coupled antenna structure and methods
US9634383B2 (en) 2013-06-26 2017-04-25 Pulse Finland Oy Galvanically separated non-interacting antenna sector apparatus and methods
US9680212B2 (en) 2013-11-20 2017-06-13 Pulse Finland Oy Capacitive grounding methods and apparatus for mobile devices
US9590308B2 (en) 2013-12-03 2017-03-07 Pulse Electronics, Inc. Reduced surface area antenna apparatus and mobile communications devices incorporating the same
US9350081B2 (en) 2014-01-14 2016-05-24 Pulse Finland Oy Switchable multi-radiator high band antenna apparatus
JP6354267B2 (en) * 2014-04-01 2018-07-11 株式会社デンソーウェーブ Antenna device and communication device
US9948002B2 (en) 2014-08-26 2018-04-17 Pulse Finland Oy Antenna apparatus with an integrated proximity sensor and methods
US9973228B2 (en) 2014-08-26 2018-05-15 Pulse Finland Oy Antenna apparatus with an integrated proximity sensor and methods
US9722308B2 (en) 2014-08-28 2017-08-01 Pulse Finland Oy Low passive intermodulation distributed antenna system for multiple-input multiple-output systems and methods of use
US9906260B2 (en) 2015-07-30 2018-02-27 Pulse Finland Oy Sensor-based closed loop antenna swapping apparatus and methods
GB2556185A (en) 2016-09-26 2018-05-23 Taoglas Group Holdings Ltd Patch antenna construction
JP6597659B2 (en) * 2017-02-01 2019-10-30 株式会社村田製作所 ANTENNA DEVICE AND ANTENNA DEVICE MANUFACTURING METHOD
US10971806B2 (en) 2017-08-22 2021-04-06 The Boeing Company Broadband conformal antenna
US10910706B2 (en) * 2018-01-19 2021-02-02 Mediatek Inc. Radar sensor housing design
US11233310B2 (en) * 2018-01-29 2022-01-25 The Boeing Company Low-profile conformal antenna
US20200021010A1 (en) * 2018-07-13 2020-01-16 Qualcomm Incorporated Air coupled superstrate antenna on device housing
US10916853B2 (en) 2018-08-24 2021-02-09 The Boeing Company Conformal antenna with enhanced circular polarization
US10923831B2 (en) 2018-08-24 2021-02-16 The Boeing Company Waveguide-fed planar antenna array with enhanced circular polarization
US10938082B2 (en) 2018-08-24 2021-03-02 The Boeing Company Aperture-coupled microstrip-to-waveguide transitions
DE102018218891B4 (en) 2018-11-06 2023-12-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Three-dimensional loop antenna device
JPWO2021066140A1 (en) * 2019-10-02 2021-04-08
US11276933B2 (en) 2019-11-06 2022-03-15 The Boeing Company High-gain antenna with cavity between feed line and ground plane

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0366593A2 (en) * 1988-10-28 1990-05-02 Emerson Electric Co. Method of ultrasonically assembling workpieces
EP0394489A1 (en) * 1988-10-19 1990-10-31 Toyo Communication Equipment Co. Ltd. Array antenna and a feeder device therefor
US4987421A (en) * 1988-06-09 1991-01-22 Mitsubishi Denki Kabushiki Kaisha Microstrip antenna
EP0618061A2 (en) * 1993-03-24 1994-10-05 Nhk Spring Co.Ltd. Method for crimping a thermoplastic resin member and assembly including a thus crimped thermoplastic resin member
EP0629785A2 (en) * 1993-06-01 1994-12-21 TOHOKU MUNEKATA Co., Ltd. Mounting components in plastic casings

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0221221Y2 (en) * 1985-06-27 1990-06-08
JPS625917A (en) * 1985-07-03 1987-01-12 Airin:Kk Production of saponin containing no isoflavone from soybean embro bud
JPS62228705A (en) * 1986-03-31 1987-10-07 東芝テック株式会社 Method of fixing member
JPS61281605A (en) * 1986-06-20 1986-12-12 Hitachi Ltd Phased array antenna
JPH02141007A (en) * 1988-11-21 1990-05-30 Mitsubishi Electric Corp Micro-strip antenna
JPH0374908A (en) * 1989-08-16 1991-03-29 Toyo Commun Equip Co Ltd Microstrip antenna of stack type
JP2749398B2 (en) * 1989-10-06 1998-05-13 株式会社アマダ Work transfer device
JPH0777291B2 (en) * 1990-07-25 1995-08-16 日立電線株式会社 Method for manufacturing molded circuit board
JPH0471011U (en) * 1990-10-31 1992-06-23
US5231406A (en) * 1991-04-05 1993-07-27 Ball Corporation Broadband circular polarization satellite antenna
US5210542A (en) * 1991-07-03 1993-05-11 Ball Corporation Microstrip patch antenna structure
JPH05167332A (en) * 1991-12-13 1993-07-02 Matsushita Electric Works Ltd Antenna for mobile object communication
JP3500524B2 (en) * 1993-12-16 2004-02-23 マスプロ電工株式会社 Mobile satellite communication antenna
JPH08139522A (en) * 1994-09-13 1996-05-31 Matsushita Electric Works Ltd Compound antenna and antenna unit
JP3121716U (en) * 2006-03-06 2006-05-25 クボタ貿易株式会社 Glass built ossuary

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4987421A (en) * 1988-06-09 1991-01-22 Mitsubishi Denki Kabushiki Kaisha Microstrip antenna
EP0394489A1 (en) * 1988-10-19 1990-10-31 Toyo Communication Equipment Co. Ltd. Array antenna and a feeder device therefor
EP0366593A2 (en) * 1988-10-28 1990-05-02 Emerson Electric Co. Method of ultrasonically assembling workpieces
EP0618061A2 (en) * 1993-03-24 1994-10-05 Nhk Spring Co.Ltd. Method for crimping a thermoplastic resin member and assembly including a thus crimped thermoplastic resin member
EP0629785A2 (en) * 1993-06-01 1994-12-21 TOHOKU MUNEKATA Co., Ltd. Mounting components in plastic casings

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 383 (E-0966), 17 August 1990 & JP 02 141007 A (MITSUBISHI ELECTRIC CORP), 30 May 1990, *
PATENT ABSTRACTS OF JAPAN vol. 015, no. 241 (E-1080), 21 June 1991 & JP 03 074908 A (TOYO COMMUN EQUIP CO LTD), 29 March 1991, *
PATENT ABSTRACTS OF JAPAN vol. 095, no. 010, 30 November 1995 & JP 07 176925 A (MASPRO DENKOH CORP), 14 July 1995, *

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6590541B1 (en) 1998-12-11 2003-07-08 Robert Bosch Gmbh Half-loop antenna
WO2000036703A1 (en) * 1998-12-11 2000-06-22 Robert Bosch Gmbh Half-loop antenna
EP1133001A2 (en) * 2000-03-09 2001-09-12 Alps Electric Co., Ltd. Wideband antenna mountable in vehicle cabin
EP1133001A3 (en) * 2000-03-09 2003-07-30 Alps Electric Co., Ltd. Wideband antenna mountable in vehicle cabin
WO2006061307A1 (en) * 2004-12-09 2006-06-15 Robert Bosch Gmbh Antenna assembly for a radar transceiver
US7671806B2 (en) 2004-12-30 2010-03-02 Robert Bosch Gmbh Antenna system for a radar transceiver
WO2006072511A1 (en) * 2004-12-30 2006-07-13 Robert Bosch Gmbh Antenna array for a radar transceiver
WO2007047002A2 (en) * 2005-09-15 2007-04-26 Qualcomm Incorporated On a radome mounted gps antenna assembly
WO2007047002A3 (en) * 2005-09-15 2007-07-05 Qualcomm Inc On a radome mounted gps antenna assembly
US7336241B2 (en) 2005-09-15 2008-02-26 Qualcomm Incorporated GPS radome-mounted antenna assembly
WO2007062971A1 (en) * 2005-11-29 2007-06-07 Robert Bosch Gmbh Antenna array for a radar sensor
US8038815B2 (en) 2007-07-17 2011-10-18 Qualcomm Incorporated Fluorescent dye to improve primer coverage accuracy for bonding applications
US8410992B2 (en) 2007-07-17 2013-04-02 Qualcomm Incorporated Fluorescent dye to improve primer coverage accuracy for bonding applications

Also Published As

Publication number Publication date
JPH09246851A (en) 1997-09-19
EP0795925B1 (en) 2001-11-21
AU726672B2 (en) 2000-11-16
CN1164134A (en) 1997-11-05
CN1078754C (en) 2002-01-30
JP2957463B2 (en) 1999-10-04
US5977710A (en) 1999-11-02
CA2199581C (en) 2000-05-02
DE69708358D1 (en) 2002-01-03
DE69708358T2 (en) 2002-07-18
AU1620797A (en) 1997-09-18
CA2199581A1 (en) 1997-09-11
EP0795925A3 (en) 1998-01-14

Similar Documents

Publication Publication Date Title
EP0795925B1 (en) Patch antenna and method for making the same
KR101982030B1 (en) Antenna device and method for manufacturing antenna device
EP0278070B1 (en) Circular microstrip vehicular rf antenna
US4724443A (en) Patch antenna with a strip line feed element
EP0332139B1 (en) Wide band antenna for mobile communications
JP3788115B2 (en) Method for manufacturing antenna device
WO2001041256A1 (en) An antenna assembly and a method of mounting an antenna assembly
WO1998027609A1 (en) Small omni-directional, slot antenna
US20040021606A1 (en) Small plane antenna and composite antenna using the same
US7079078B2 (en) Patch antenna apparatus preferable for receiving ground wave and signal wave from low elevation angle satellite
JP2001326506A (en) Array antenna
KR102228689B1 (en) Antenna device and manufacturing method thereof
US20080055183A1 (en) Antenna apparatus
CN112968267B (en) Electronic equipment
CN112117540B (en) Electronic device
JP2956598B2 (en) Planar antenna
US7557679B2 (en) Sealed microwave feedthrough
JPH07288420A (en) Dual band antenna
KR19990084408A (en) Planar antenna using multilayer dielectric with air layer
JP2004048367A (en) Composite antenna
CN217881884U (en) Antenna module and communication equipment
KR102139075B1 (en) Electronic device with slot antenna
JP3147609B2 (en) Antenna and resonance frequency adjusting method thereof
JPH0936646A (en) Method for adjusting resonance frequency of microstrip antenna
JPH0936648A (en) Method for adjusting resonance frequency of microstrip antenna

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): DE FR GB IT NL

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): DE FR GB IT NL

17P Request for examination filed

Effective date: 19971203

17Q First examination report despatched

Effective date: 19990125

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB IT NL

REG Reference to a national code

Ref country code: GB

Ref legal event code: IF02

REF Corresponds to:

Ref document number: 69708358

Country of ref document: DE

Date of ref document: 20020103

ET Fr: translation filed
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20090315

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20090304

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20090319

Year of fee payment: 13

Ref country code: DE

Payment date: 20090306

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20090316

Year of fee payment: 13

REG Reference to a national code

Ref country code: NL

Ref legal event code: V1

Effective date: 20101001

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20100310

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20101130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20101001

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20101001

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100310

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100310