CN107815353A - 一种可用于去毛刺的去胶剂、其制备方法和应用 - Google Patents
一种可用于去毛刺的去胶剂、其制备方法和应用 Download PDFInfo
- Publication number
- CN107815353A CN107815353A CN201710548063.4A CN201710548063A CN107815353A CN 107815353 A CN107815353 A CN 107815353A CN 201710548063 A CN201710548063 A CN 201710548063A CN 107815353 A CN107815353 A CN 107815353A
- Authority
- CN
- China
- Prior art keywords
- glue
- ether
- acid
- dispenser
- preferred
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 239000002904 solvent Substances 0.000 claims abstract description 37
- 239000002994 raw material Substances 0.000 claims abstract description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000003292 glue Substances 0.000 claims abstract description 22
- 150000001412 amines Chemical class 0.000 claims abstract description 20
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 19
- 150000007529 inorganic bases Chemical class 0.000 claims abstract description 13
- 239000004094 surface-active agent Substances 0.000 claims abstract description 12
- -1 carbonate inorganic base Chemical class 0.000 claims description 59
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 34
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 19
- 235000002639 sodium chloride Nutrition 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 12
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 12
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 12
- 230000007797 corrosion Effects 0.000 claims description 12
- 238000005260 corrosion Methods 0.000 claims description 12
- 239000003112 inhibitor Substances 0.000 claims description 12
- 150000003839 salts Chemical class 0.000 claims description 12
- 239000002585 base Substances 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 10
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 10
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 9
- 239000003513 alkali Substances 0.000 claims description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 7
- 229910000040 hydrogen fluoride Inorganic materials 0.000 claims description 7
- 238000012805 post-processing Methods 0.000 claims description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical group CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 6
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical group C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 6
- PCHPORCSPXIHLZ-UHFFFAOYSA-N diphenhydramine hydrochloride Chemical compound [Cl-].C=1C=CC=CC=1C(OCC[NH+](C)C)C1=CC=CC=C1 PCHPORCSPXIHLZ-UHFFFAOYSA-N 0.000 claims description 6
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 claims description 6
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 claims description 6
- 229920000768 polyamine Polymers 0.000 claims description 6
- 150000004040 pyrrolidinones Chemical class 0.000 claims description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical group OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 5
- WTDHULULXKLSOZ-UHFFFAOYSA-N Hydroxylamine hydrochloride Chemical compound Cl.ON WTDHULULXKLSOZ-UHFFFAOYSA-N 0.000 claims description 5
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 5
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 5
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 5
- 125000001153 fluoro group Chemical group F* 0.000 claims description 5
- 235000011187 glycerol Nutrition 0.000 claims description 5
- YAMHXTCMCPHKLN-UHFFFAOYSA-N imidazolidin-2-one Chemical compound O=C1NCCN1 YAMHXTCMCPHKLN-UHFFFAOYSA-N 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 5
- 229910052700 potassium Inorganic materials 0.000 claims description 5
- 239000011591 potassium Substances 0.000 claims description 5
- 125000001453 quaternary ammonium group Chemical group 0.000 claims description 5
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 5
- 235000011152 sodium sulphate Nutrition 0.000 claims description 5
- 239000002562 thickening agent Substances 0.000 claims description 5
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 4
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 claims description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 4
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 4
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical group [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 4
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 4
- 150000001298 alcohols Chemical group 0.000 claims description 4
- 150000001408 amides Chemical class 0.000 claims description 4
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 4
- 239000003945 anionic surfactant Substances 0.000 claims description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 4
- CCAFPWNGIUBUSD-UHFFFAOYSA-N diethyl sulfoxide Chemical compound CCS(=O)CC CCAFPWNGIUBUSD-UHFFFAOYSA-N 0.000 claims description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 claims description 4
- 150000002576 ketones Chemical class 0.000 claims description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 4
- 235000006408 oxalic acid Nutrition 0.000 claims description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims description 4
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 4
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical class CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 claims description 4
- 239000011734 sodium Substances 0.000 claims description 4
- 229910052708 sodium Inorganic materials 0.000 claims description 4
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 4
- 150000003457 sulfones Chemical class 0.000 claims description 4
- 150000003462 sulfoxides Chemical class 0.000 claims description 4
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 claims description 4
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 claims description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 4
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical group NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 3
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 150000001299 aldehydes Chemical class 0.000 claims description 3
- 235000001014 amino acid Nutrition 0.000 claims description 3
- 229940024606 amino acid Drugs 0.000 claims description 3
- 150000001413 amino acids Chemical class 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 150000001735 carboxylic acids Chemical class 0.000 claims description 3
- 150000002429 hydrazines Chemical class 0.000 claims description 3
- 238000006197 hydroboration reaction Methods 0.000 claims description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 3
- 150000002443 hydroxylamines Chemical class 0.000 claims description 3
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 claims description 3
- 239000002736 nonionic surfactant Substances 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 3
- KIUKXJAPPMFGSW-DNGZLQJQSA-N (2S,3S,4S,5R,6R)-6-[(2S,3R,4R,5S,6R)-3-Acetamido-2-[(2S,3S,4R,5R,6R)-6-[(2R,3R,4R,5S,6R)-3-acetamido-2,5-dihydroxy-6-(hydroxymethyl)oxan-4-yl]oxy-2-carboxy-4,5-dihydroxyoxan-3-yl]oxy-5-hydroxy-6-(hydroxymethyl)oxan-4-yl]oxy-3,4,5-trihydroxyoxane-2-carboxylic acid Chemical compound CC(=O)N[C@H]1[C@H](O)O[C@H](CO)[C@@H](O)[C@@H]1O[C@H]1[C@H](O)[C@@H](O)[C@H](O[C@H]2[C@@H]([C@@H](O[C@H]3[C@@H]([C@@H](O)[C@H](O)[C@H](O3)C(O)=O)O)[C@H](O)[C@@H](CO)O2)NC(C)=O)[C@@H](C(O)=O)O1 KIUKXJAPPMFGSW-DNGZLQJQSA-N 0.000 claims description 2
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 claims description 2
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical class CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 claims description 2
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical class CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 claims description 2
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims description 2
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 claims description 2
- MBDUIEKYVPVZJH-UHFFFAOYSA-N 1-ethylsulfonylethane Chemical compound CCS(=O)(=O)CC MBDUIEKYVPVZJH-UHFFFAOYSA-N 0.000 claims description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 2
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 claims description 2
- RLNZSUSARYWGKS-UHFFFAOYSA-N 2,2,2-trihydroxyethylazanium fluoride Chemical compound [F-].OC(C[NH3+])(O)O RLNZSUSARYWGKS-UHFFFAOYSA-N 0.000 claims description 2
- WMDZKDKPYCNCDZ-UHFFFAOYSA-N 2-(2-butoxypropoxy)propan-1-ol Chemical compound CCCCOC(C)COC(C)CO WMDZKDKPYCNCDZ-UHFFFAOYSA-N 0.000 claims description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 claims description 2
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 claims description 2
- IVKNZCBNXPYYKL-UHFFFAOYSA-N 2-[2-[2-[2-[2-[2-[2-[2-[2-[2-[4-(2,4,4-trimethylpentan-2-yl)phenoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethanol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(OCCOCCOCCOCCOCCOCCOCCOCCOCCOCCO)C=C1 IVKNZCBNXPYYKL-UHFFFAOYSA-N 0.000 claims description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 2
- 150000008625 2-imidazolidinones Chemical class 0.000 claims description 2
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 claims description 2
- CAAMSDWKXXPUJR-UHFFFAOYSA-N 3,5-dihydro-4H-imidazol-4-one Chemical compound O=C1CNC=N1 CAAMSDWKXXPUJR-UHFFFAOYSA-N 0.000 claims description 2
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 claims description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 2
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical class NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 claims description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims description 2
- 229920002134 Carboxymethyl cellulose Polymers 0.000 claims description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 2
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 2
- 239000004471 Glycine Substances 0.000 claims description 2
- 241001272567 Hominoidea Species 0.000 claims description 2
- 239000004354 Hydroxyethyl cellulose Substances 0.000 claims description 2
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 claims description 2
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 claims description 2
- AGPKZVBTJJNPAG-WHFBIAKZSA-N L-isoleucine Chemical compound CC[C@H](C)[C@H](N)C(O)=O AGPKZVBTJJNPAG-WHFBIAKZSA-N 0.000 claims description 2
- ROHFNLRQFUQHCH-YFKPBYRVSA-N L-leucine Chemical compound CC(C)C[C@H](N)C(O)=O ROHFNLRQFUQHCH-YFKPBYRVSA-N 0.000 claims description 2
- ROHFNLRQFUQHCH-UHFFFAOYSA-N Leucine Natural products CC(C)CC(N)C(O)=O ROHFNLRQFUQHCH-UHFFFAOYSA-N 0.000 claims description 2
- 241001465754 Metazoa Species 0.000 claims description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 2
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical class CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 claims description 2
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- YMQSVZAVQMDOHH-UHFFFAOYSA-L S(=O)(=O)([O-])[O-].[Na+].C(CCCCC(C)C)O.[Na+] Chemical compound S(=O)(=O)([O-])[O-].[Na+].C(CCCCC(C)C)O.[Na+] YMQSVZAVQMDOHH-UHFFFAOYSA-L 0.000 claims description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical group [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 claims description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 2
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 claims description 2
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 claims description 2
- 235000011054 acetic acid Nutrition 0.000 claims description 2
- 235000004279 alanine Nutrition 0.000 claims description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 2
- PZASBBILHPFPLH-UHFFFAOYSA-N aminoazanium;4-methylbenzenesulfonate Chemical compound NN.CC1=CC=C(S(O)(=O)=O)C=C1 PZASBBILHPFPLH-UHFFFAOYSA-N 0.000 claims description 2
- RWZYAGGXGHYGMB-UHFFFAOYSA-N anthranilic acid Chemical class NC1=CC=CC=C1C(O)=O RWZYAGGXGHYGMB-UHFFFAOYSA-N 0.000 claims description 2
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 claims description 2
- 229910001863 barium hydroxide Inorganic materials 0.000 claims description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 2
- FKPSBYZGRQJIMO-UHFFFAOYSA-M benzyl(triethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC1=CC=CC=C1 FKPSBYZGRQJIMO-UHFFFAOYSA-M 0.000 claims description 2
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims description 2
- 239000004305 biphenyl Substances 0.000 claims description 2
- 235000010290 biphenyl Nutrition 0.000 claims description 2
- 229910021538 borax Inorganic materials 0.000 claims description 2
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 claims description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 claims description 2
- 239000000920 calcium hydroxide Substances 0.000 claims description 2
- 229910001861 calcium hydroxide Inorganic materials 0.000 claims description 2
- 239000004202 carbamide Substances 0.000 claims description 2
- 235000010948 carboxy methyl cellulose Nutrition 0.000 claims description 2
- 229920006184 cellulose methylcellulose Polymers 0.000 claims description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 2
- 229940043237 diethanolamine Drugs 0.000 claims description 2
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims description 2
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 claims description 2
- 229940113088 dimethylacetamide Drugs 0.000 claims description 2
- OCUJLLGVOUDECM-UHFFFAOYSA-N dipivefrin Chemical compound CNCC(O)C1=CC=C(OC(=O)C(C)(C)C)C(OC(=O)C(C)(C)C)=C1 OCUJLLGVOUDECM-UHFFFAOYSA-N 0.000 claims description 2
- 229960001484 edetic acid Drugs 0.000 claims description 2
- 229940116333 ethyl lactate Drugs 0.000 claims description 2
- 235000019387 fatty acid methyl ester Nutrition 0.000 claims description 2
- 239000011790 ferrous sulphate Substances 0.000 claims description 2
- 235000003891 ferrous sulphate Nutrition 0.000 claims description 2
- 239000008103 glucose Substances 0.000 claims description 2
- 229940051250 hexylene glycol Drugs 0.000 claims description 2
- 229920002674 hyaluronan Polymers 0.000 claims description 2
- 229960003160 hyaluronic acid Drugs 0.000 claims description 2
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 claims description 2
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 claims description 2
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 claims description 2
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims description 2
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 claims description 2
- 229910000359 iron(II) sulfate Inorganic materials 0.000 claims description 2
- 229960000310 isoleucine Drugs 0.000 claims description 2
- AGPKZVBTJJNPAG-UHFFFAOYSA-N isoleucine Natural products CCC(C)C(N)C(O)=O AGPKZVBTJJNPAG-UHFFFAOYSA-N 0.000 claims description 2
- 229940102253 isopropanolamine Drugs 0.000 claims description 2
- 235000015110 jellies Nutrition 0.000 claims description 2
- 239000008274 jelly Substances 0.000 claims description 2
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 claims description 2
- VKHZYWVEBNIRLX-UHFFFAOYSA-N methanesulfonohydrazide Chemical group CS(=O)(=O)NN VKHZYWVEBNIRLX-UHFFFAOYSA-N 0.000 claims description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims description 2
- 229920000609 methyl cellulose Polymers 0.000 claims description 2
- 239000001923 methylcellulose Substances 0.000 claims description 2
- 235000010981 methylcellulose Nutrition 0.000 claims description 2
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- UKODFQOELJFMII-UHFFFAOYSA-N pentamethyldiethylenetriamine Chemical compound CN(C)CCN(C)CCN(C)C UKODFQOELJFMII-UHFFFAOYSA-N 0.000 claims description 2
- 125000005010 perfluoroalkyl group Chemical group 0.000 claims description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 2
- 239000010452 phosphate Substances 0.000 claims description 2
- 229920002401 polyacrylamide Polymers 0.000 claims description 2
- 229920000151 polyglycol Polymers 0.000 claims description 2
- 239000010695 polyglycol Substances 0.000 claims description 2
- 229920001451 polypropylene glycol Polymers 0.000 claims description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 2
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 2
- CIBMHJPPKCXONB-UHFFFAOYSA-N propane-2,2-diol Chemical compound CC(C)(O)O CIBMHJPPKCXONB-UHFFFAOYSA-N 0.000 claims description 2
- 229960004063 propylene glycol Drugs 0.000 claims description 2
- 235000013772 propylene glycol Nutrition 0.000 claims description 2
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 claims description 2
- 239000000661 sodium alginate Substances 0.000 claims description 2
- 235000010413 sodium alginate Nutrition 0.000 claims description 2
- 229940005550 sodium alginate Drugs 0.000 claims description 2
- 239000012279 sodium borohydride Substances 0.000 claims description 2
- 229910000033 sodium borohydride Inorganic materials 0.000 claims description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 2
- 239000011780 sodium chloride Substances 0.000 claims description 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 2
- 239000004328 sodium tetraborate Substances 0.000 claims description 2
- 235000010339 sodium tetraborate Nutrition 0.000 claims description 2
- PANBYUAFMMOFOV-UHFFFAOYSA-N sodium;sulfuric acid Chemical compound [Na].OS(O)(=O)=O PANBYUAFMMOFOV-UHFFFAOYSA-N 0.000 claims description 2
- 229960005137 succinic acid Drugs 0.000 claims description 2
- 150000005846 sugar alcohols Chemical class 0.000 claims description 2
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 claims description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 2
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 claims description 2
- 239000011975 tartaric acid Substances 0.000 claims description 2
- 235000002906 tartaric acid Nutrition 0.000 claims description 2
- GTDKXDWWMOMSFL-UHFFFAOYSA-M tetramethylazanium;fluoride Chemical compound [F-].C[N+](C)(C)C GTDKXDWWMOMSFL-UHFFFAOYSA-M 0.000 claims description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical class OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 2
- 229960004418 trolamine Drugs 0.000 claims description 2
- 229930003231 vitamin Natural products 0.000 claims description 2
- 235000013343 vitamin Nutrition 0.000 claims description 2
- 239000011782 vitamin Substances 0.000 claims description 2
- 229940088594 vitamin Drugs 0.000 claims description 2
- 150000003722 vitamin derivatives Chemical class 0.000 claims description 2
- 239000000811 xylitol Substances 0.000 claims description 2
- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 claims description 2
- 235000010447 xylitol Nutrition 0.000 claims description 2
- 229960002675 xylitol Drugs 0.000 claims description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims 3
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims 2
- 229910021529 ammonia Inorganic materials 0.000 claims 2
- 235000015165 citric acid Nutrition 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 claims 2
- IZXIZTKNFFYFOF-UHFFFAOYSA-N 2-Oxazolidone Chemical compound O=C1NCCO1 IZXIZTKNFFYFOF-UHFFFAOYSA-N 0.000 claims 1
- CYDQOEWLBCCFJZ-UHFFFAOYSA-N 4-(4-fluorophenyl)oxane-4-carboxylic acid Chemical compound C=1C=C(F)C=CC=1C1(C(=O)O)CCOCC1 CYDQOEWLBCCFJZ-UHFFFAOYSA-N 0.000 claims 1
- ZZZCUOFIHGPKAK-UHFFFAOYSA-N D-erythro-ascorbic acid Natural products OCC1OC(=O)C(O)=C1O ZZZCUOFIHGPKAK-UHFFFAOYSA-N 0.000 claims 1
- DNXHEGUUPJUMQT-CBZIJGRNSA-N Estrone Chemical compound OC1=CC=C2[C@H]3CC[C@](C)(C(CC4)=O)[C@@H]4[C@@H]3CCC2=C1 DNXHEGUUPJUMQT-CBZIJGRNSA-N 0.000 claims 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 1
- 229920002125 Sokalan® Polymers 0.000 claims 1
- 229930003268 Vitamin C Natural products 0.000 claims 1
- 150000001243 acetic acids Chemical class 0.000 claims 1
- 150000008052 alkyl sulfonates Chemical class 0.000 claims 1
- 239000000908 ammonium hydroxide Substances 0.000 claims 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 1
- 238000003682 fluorination reaction Methods 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 150000002431 hydrogen Chemical class 0.000 claims 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims 1
- 239000011976 maleic acid Substances 0.000 claims 1
- 230000003020 moisturizing effect Effects 0.000 claims 1
- 229920005862 polyol Polymers 0.000 claims 1
- 239000001540 sodium lactate Substances 0.000 claims 1
- 235000011088 sodium lactate Nutrition 0.000 claims 1
- 229940005581 sodium lactate Drugs 0.000 claims 1
- 235000010265 sodium sulphite Nutrition 0.000 claims 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims 1
- 239000011718 vitamin C Substances 0.000 claims 1
- 235000019154 vitamin C Nutrition 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 15
- 239000000463 material Substances 0.000 abstract description 8
- 238000009713 electroplating Methods 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 description 16
- 229920002120 photoresistant polymer Polymers 0.000 description 13
- 238000007747 plating Methods 0.000 description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000003814 drug Substances 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 6
- 238000007654 immersion Methods 0.000 description 5
- 238000002791 soaking Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005088 metallography Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000012536 packaging technology Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000002848 electrochemical method Methods 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- JTPZTKBRUCILQD-UHFFFAOYSA-N 1-methylimidazolidin-2-one Chemical class CN1CCNC1=O JTPZTKBRUCILQD-UHFFFAOYSA-N 0.000 description 1
- GOJUJUVQIVIZAV-UHFFFAOYSA-N 2-amino-4,6-dichloropyrimidine-5-carbaldehyde Chemical group NC1=NC(Cl)=C(C=O)C(Cl)=N1 GOJUJUVQIVIZAV-UHFFFAOYSA-N 0.000 description 1
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- 108010082495 Dietary Plant Proteins Proteins 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- XEUCQOBUZPQUMQ-UHFFFAOYSA-N Glycolone Chemical compound COC1=C(CC=C(C)C)C(=O)NC2=C1C=CC=C2OC XEUCQOBUZPQUMQ-UHFFFAOYSA-N 0.000 description 1
- OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical compound CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 108010009736 Protein Hydrolysates Proteins 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 108010073771 Soybean Proteins Proteins 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- LDDQLRUQCUTJBB-UHFFFAOYSA-N ammonium fluoride Chemical compound [NH4+].[F-] LDDQLRUQCUTJBB-UHFFFAOYSA-N 0.000 description 1
- 235000021120 animal protein Nutrition 0.000 description 1
- VEQOALNAAJBPNY-UHFFFAOYSA-N antipyrine Chemical compound CN1C(C)=CC(=O)N1C1=CC=CC=C1 VEQOALNAAJBPNY-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- NDKBVBUGCNGSJJ-UHFFFAOYSA-M benzyltrimethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)CC1=CC=CC=C1 NDKBVBUGCNGSJJ-UHFFFAOYSA-M 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- FUGIIBWTNARRSF-UHFFFAOYSA-N decane-5,6-diol Chemical compound CCCCC(O)C(O)CCCC FUGIIBWTNARRSF-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- MJEMIOXXNCZZFK-UHFFFAOYSA-N ethylone Chemical compound CCNC(C)C(=O)C1=CC=C2OCOC2=C1 MJEMIOXXNCZZFK-UHFFFAOYSA-N 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000003531 protein hydrolysate Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 235000019710 soybean protein Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
- C11D1/12—Sulfonic acids or sulfuric acid esters; Salts thereof
- C11D1/14—Sulfonic acids or sulfuric acid esters; Salts thereof derived from aliphatic hydrocarbons or mono-alcohols
- C11D1/146—Sulfuric acid esters
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/008—Polymeric surface-active agents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
- C11D1/12—Sulfonic acids or sulfuric acid esters; Salts thereof
- C11D1/22—Sulfonic acids or sulfuric acid esters; Salts thereof derived from aromatic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
- C11D1/34—Derivatives of acids of phosphorus
- C11D1/345—Phosphates or phosphites
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/044—Hydroxides or bases
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/046—Salts
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/10—Carbonates ; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2006—Monohydric alcohols
- C11D3/2017—Monohydric alcohols branched
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2006—Monohydric alcohols
- C11D3/2034—Monohydric alcohols aromatic
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2065—Polyhydric alcohols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2086—Hydroxy carboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2093—Esters; Carbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2096—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/22—Carbohydrates or derivatives thereof
- C11D3/222—Natural or synthetic polysaccharides, e.g. cellulose, starch, gum, alginic acid or cyclodextrin
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/22—Carbohydrates or derivatives thereof
- C11D3/222—Natural or synthetic polysaccharides, e.g. cellulose, starch, gum, alginic acid or cyclodextrin
- C11D3/225—Natural or synthetic polysaccharides, e.g. cellulose, starch, gum, alginic acid or cyclodextrin etherified, e.g. CMC
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/28—Heterocyclic compounds containing nitrogen in the ring
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/3454—Organic compounds containing sulfur containing sulfone groups, e.g. vinyl sulfones
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/349—Organic compounds containing sulfur additionally containing nitrogen atoms, e.g. nitro, nitroso, amino, imino, nitrilo, nitrile groups containing compounds or their derivatives or thio urea
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Inorganic Chemistry (AREA)
- Molecular Biology (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Detergent Compositions (AREA)
Abstract
本发明公开了一种可用于去毛刺的去胶剂、其制备方法和应用。本发明的应用中,所述的去胶剂由下述原料制得,所述的原料包括下列质量分数的组分:20%‑70%的溶剂、10%‑50%有机胺、0.01%‑50%还原剂、0.01%‑5%无机碱、0.01%‑10%表面活性剂和水,各组分质量分数之和为100%;所述去胶剂的pH值为7.5‑13.5。本发明的去胶剂可单独去除tape胶或溢料,或者同时去除tape胶和溢料,并减少后续电镀工艺的毛刺的产生;对塑封体和基材无损伤。
Description
技术领域
本发明涉及一种可用于去毛刺的去胶剂、其制备方法和应用。
背景技术
半导体在封装的过程中,塑封体和引脚上会残留各种胶状物质,如tape胶(胶带的胶膜,或称为胶带胶膜,成分一般为硅烷类树脂)或溢料(又称毛刺或飞边,成分一般为环氧塑封料)等,需要清除。否则会导致封装工艺中的框架变形、漏镀、镀层缺陷而影响产品的可靠性,造成产品断路、虚焊等问题,影响管脚的电气导通性能,严重的会导致返工及芯片功能失效甚至报废,这带来了封装工艺的繁杂及成本的上升。因此,去tape胶(detape)和去溢料(deflash或debur)是半导体集成电路封装后处理的重要工艺步骤,尤其是“倒装QFN”(FCQFN)的封装工艺中需要用到。
目前去tape胶(detape)或去溢料(deflash或debur)的方法有高压水喷射去胶、高压水喷砂去胶、激光去胶、化学药水去胶及电化学方法去胶等。其中高压水喷射去胶、高压水喷砂去胶、激光去胶和电化学方法去胶,成本较高且方法剧烈,化学药水去胶由于其低成本及条件温和,逐渐成为主流方法。
化学药水去胶也存在效果不佳的问题,如药水寿命短、药水去除力不够、药水对塑封体和基材有损伤、药水无法一步法去除tape胶和溢料(即只能够单独去除tape或溢料,而不能同时去除tape胶和溢料)等问题。
CN102864458A中公开了一种环保型弱酸性去毛刺软化液,其组分和百分比为:二甲基乙酰胺30-50%、二甲基亚砜30%-50%、糠醛0.5%-1%、OP-10表面活性剂0.5-1%、其余为水。该软化液存在寿命短的缺陷,寿命在一周左右(见[0022]段),且该软化液仅是用于去毛刺(溢料)。
CN102808190A中公开了一种环保型弱碱性低温去毛刺软化液,其各组分和质量百分比为:四氢呋喃10-35%、丙二醇10%-35%、烷基酚聚氧乙醚烯1-5%、乙醇胺5-20%、N-甲基二乙醇胺1-10%、其余为水。该软化液仅是用于去毛刺(溢料)。
CN1935939A中公开了一种集成电路封装后处理用去毛刺溶液,采用下列配方:乙二醇苯醚35%、二乙二醇二丁醚20%、己内酰胺15%、甘油10%和异氟尔酮20%。该去毛刺溶液仅是用于去毛刺(溢料)。
CN103128892A中公开了一种去溢料的溶液,包含质量百分数为10-60%的1,3-二甲基-2-咪唑烷酮、10-30%的乙醇胺、10-60%的六甲基磷酰三胺、0-10%的去离子水。该去溢料的溶液仅是用于去溢料。
CN102270587B中公开了一种塑封晶体管溢料软化液,包含酰胺化合物、烷基醚、NH4F、碱性调整剂、水。该软化液仅是用于去毛刺(溢料)。
因此,本领域迫切需要开发一种集成电路封装后处理用去tape胶和/或去溢料的方法,来解决这些问题。
发明内容
本发明所要解决的技术问题是为了克服现有技术中半导体在封装的过程中,引脚上残留的各种胶状物质如tape胶或溢料等,在使用化学药水去胶方法去除时,存在的化学药水寿命短、去除力不够、对塑封体和基材有损伤、药水无法一步法去除tape胶和溢料等缺陷,而提供了一种可用于去毛刺的去胶剂、其制备方法和应用。本发明的去胶剂寿可单独去除tape胶或溢料,或者同时去除tape胶和溢料,并减少后续电镀工艺的毛刺的产生;对塑封体和基材无损伤。
本发明主要是通过以下技术手段解决上述技术问题的。
本发明提供了一种去胶剂,其由下述原料制得,所述的原料包括下列质量分数的组分:20%-70%的溶剂、10%-50%有机胺、0.01%-50%还原剂、0.01%-5%无机碱、0.01%-10%表面活性剂和水,各组分质量分数之和为100%;所述去胶剂的pH值为7.5-13.5。
所述的溶剂的质量分数优选35%-55%,更优选40%-50%。所述的有机胺的质量分数优选15%-45%,更优选20%-40%。所述的还原剂的质量分数优选0.1%-10%,更优选0.15%-5%。所述的无机碱的质量分数优选0.1%-4%,更优选0.15%-0.35%。所述的表面活性剂的质量分数优选0.1%-5%,更优选0.15%-3%。所述去胶剂的pH值优选8-12,更优选9-11。
所述的溶剂可为本领域常规的溶剂,优选醇类溶剂、酮类溶剂、醚类溶剂、亚砜类溶剂、砜类溶剂、酰胺类溶剂和酯类溶剂中的一种或多种。
其中,所述的醇类溶剂优选甘油、甲醇、乙醇、异丙醇、乙二醇、三缩三乙二醇、正丁醇、异丁醇和苯甲醇中的一种或多种。
其中,所述的酮类溶剂优选丙酮、咪唑烷酮、吡咯烷酮、咪唑啉酮和异氟尔酮中的一种或多种。所述的咪唑烷酮优选2-咪唑烷酮、1,3-二甲基-2-咪唑烷酮和1,3-二乙基-2-咪唑烷酮中的一种或多种。所述的吡咯烷酮优选N-甲基吡咯烷酮、N-乙基吡咯烷酮、N-环己基吡咯烷酮、2-吡咯烷酮和N-羟乙基吡咯烷酮中的一种或多种。所述的咪唑啉酮优选1,3-二甲基-2-咪唑啉酮。
其中,所述的亚砜类溶剂优选二甲基亚砜、二乙基亚砜和甲乙基亚砜中的一种或多种。
其中,所述的砜类溶剂优选甲基砜、乙基砜和环丁砜中的一种或多种。
其中,所述的醚类溶剂优选四氢呋喃、乙二醇单烷基醚、二乙二醇单烷基醚、丙二醇单烷基醚、二丙二醇单烷基醚和三丙二醇单烷基醚中的一种或多种。所述的乙二醇单烷基醚优选乙二醇单甲醚、乙二醇单乙醚、乙二醇苯醚和乙二醇单丁醚中的一种或多。所述的二乙二醇单烷基醚优选二乙二醇单甲醚、二乙二醇单乙醚和二乙二醇单丁醚中的一种或多种。所述的丙二醇单烷基醚优选丙二醇单甲醚、丙二醇单乙醚和丙二醇单丁醚中的一种或多种。所述的二丙二醇单烷基醚优选二丙二醇单甲醚、二丙二醇单乙醚和二丙二醇单丁醚中的一种或多种。所述的三丙二醇单烷基醚优选三丙二醇单甲醚。
其中,所述的酰胺较佳的为二甲基甲酰胺和/或二甲基乙酰胺。
其中,所述的酯类溶剂优选乙酸乙酯、乳酸乙酯和二乙酸乙二醇酯中的一种或多种。
所述的有机胺可为本领域常规的有机胺,优选醇胺、有机多胺、含羧基的有机胺和季铵碱类有机胺中的一种或多种。所述的醇胺优选乙醇胺、二乙醇胺、三乙醇胺、异丙醇胺、N,N-二甲基乙醇胺和N-甲基二乙醇胺中的一种或多种。所述的有机多胺优选二乙烯三胺、五甲基二乙烯三胺和多乙烯多胺中的一中或多种。所述的含羧基的有机胺优选2-氨基乙酸、2-氨基苯甲酸、亚氨基二乙酸,氨三乙酸和乙二胺四乙酸中的一种或多种。所述的季铵碱类有机胺优选四甲基氢氧化铵、四乙基氢氧化铵、三甲基苄基氢氧化铵、四乙基氢氧化铵和三乙基苄基氢氧化铵中的一种或多种。
所述的还原剂可为本领域常规的还原剂,优选硼氢化类还原剂(例如硼氢化钠和/或硼氢化钾)、处于低化合物价时的氧化物(例如双氧水)、处于低化合物价时的盐(例如亚硫酸钠、次磷酸钠、硫酸亚铁和氯化亚铁中的一种或多种)、羟基胺、羟胺衍生物(如硫酸羟胺和/或盐酸羟胺)、联氨、水合肼、肼类衍生物(如甲磺酰肼和/或对甲苯磺酸肼)、醛类还原剂(如甲醛、乙醛、葡萄糖和糠醛中的一种或多种)和羧酸类还原剂(如草酸、柠檬酸和维生素C中的一种或多种)中的一种或多种。
所述的无机碱可为本领域常规的无机碱,优选碳酸盐类无机碱(例如碳酸钠和/或碳酸钾)、碳酸氢盐类无机碱(例如碳酸氢钠)、氢氧化盐类无机碱(例如氢氧化钠、氢氧化钾、氢氧化钡和氢氧化钙中的一种或多种)和氨水中的一种或多种。
所述表面活性剂可为本领域常规的表面活性剂,优选阴离子表面活性剂和/或非离子表面活性剂。所述的阴离子表面活性剂优选全氟烷基磺酸钾、仲烷基磺酸钠、十二烷基苯磺酸(LAS)、脂肪醇醚硫酸钠(AES)、乙氧基化脂肪酸甲酯磺酸钠(FMES)、醇醚羧酸盐(AEC)、醇醚磷酸盐、异辛醇硫酸钠、MOA-3PK、MOA-5PK、苯酚聚氧乙烯醚硫酸钠和烷基磺酸盐中的一种或多种。所述的非离子表面活性剂优选聚乙二醇、渗透剂JFC、聚乙二醇醚、OP-10、羟基聚醚、聚乙烯醇(PVA)、聚乙烯吡咯烷酮、聚氧乙烯(POE)、聚硅氧烷(PSOA)、氟代聚乙烯醇、氟代聚乙烯吡咯烷酮、氟代聚氧乙烯、氟代聚硅氧烷、脂肪醇聚氧乙烯醚、多元醇酯、烷基酚聚氧乙烯醚中的一种或多种。
所述的去胶剂的pH值可根据去胶剂中各组分和含量的实际情况调节。例如可使用有机酸、无机酸、无机碱、强碱弱酸盐和缓冲溶液中的一种或多种。当去胶剂的pH值至过低,可使用无机碱和/或强碱弱酸盐调节;当去胶剂的pH值过高时,可使用有机酸和/或无机酸进行调节;另外,若避免去胶剂的pH值发生剧烈波动,可使用本领域常规的缓冲溶液进行调节。
所述的去胶剂的原料组分还可进一步包含氟化物。所述的氟化物可为本领域常规的氟化剂。所述的氟化剂优选氟化氢、氟硅酸、氟硅酸铵、氟硼酸、氟硼酸铵、和、氟化氢与碱形成的盐中的一种或多种。其中,所述的氟化氢与碱形成的盐中所述的碱优选氨水、季胺氢氧化物或醇胺。所述的氟化氢与碱形成的盐优选氟化氢铵(NH4HF2)、四甲基氟化铵(N(CH3)4F)和三羟乙基氟化铵(N(CH2OH)3HF)中的一种或多种。所述的氟化物的质量分数优选0-1%,但不为0;更优选0.1%-0.5%。
所述的去胶剂的原料组分还可进一步包含金属腐蚀抑制剂。所述金属腐蚀抑制剂可为本领域常规的金属腐蚀抑制剂,优选联苯三酚、邻苯二酚、草酸、酒石酸、琥珀酸、马来酸、乙酸、柠檬酸、3-氨基-1,2,4-三氮唑、苯并三氮唑、甘氨酸、丙氨酸、亮氨酸和异亮氨酸中的一种或多种。所述金属腐蚀抑制剂的质量分数优选0-1%,但不为0;更优选0.1%-0.5%。
所述的去胶剂的原料组分还可进一步包含保湿剂。所述保湿剂可为本领域常规的保湿剂,优选甘油、丁二醇、聚乙二醇、丙二醇、已二醇、木糖醇、聚丙二醇、山梨糖醇、乳酸钠、尿素、吡咯烷酮羧酸钠、动物胶、透明质酸、维生素和氨基酸类保湿剂中的一种或多种。所述氨基酸类保湿剂可为植物蛋白、大豆蛋白、动物蛋白和水解蛋白中的一种或多种等。所述保湿剂的质量分数优选0-1%,但不为0;更优选0.1%-0.5%。
所述的去胶剂的原料组分中优选不包含增稠剂。所述增稠剂可为本领域常规的增稠剂,优选硫酸钠、氯化钠、硼砂、CMC、HPMC、甲基纤维素、羟乙基纤维素、海藻酸钠、聚丙烯酸钠、聚丙烯酰胺和聚乙烯醇中的一种或多种。
所述的水优选去离子水、纯水或超纯水。
在本发明一优选实施方式中,所述的去胶剂由下述原料制得,所述的原料由下列质量分数的组分组成:20%-70%的溶剂、10%-50%有机胺、0.01%-50%还原剂、0.01%-5%无机碱、0.01%-10%表面活性剂、水、0-1%的氟化物、0-1%的金属腐蚀抑制剂和0-1%的保湿剂,各组分质量分数之和为100%;所述去胶剂的pH值为7.5-13.5。其中,当所述的原料包含氟化物、金属腐蚀抑制剂和保湿剂中的一种或多种时,所述的氟化物、金属腐蚀抑制剂或保湿剂的质量分数不为0。
本发明还提供了一种所述的去胶剂的制备方法,其包括下列步骤,将所述的原料混合,即可。所述的混合优选将所述的原料组分中的固体组分加入到液体组分中,搅拌均匀,即可。
所述的去胶剂中的原料还可以若干独立组分的套装形式保存。
本发明还提供了一种所述的去胶剂在去除集成电路封装后处理中的tape胶和/或溢料中的应用。
所述的应用优选包括下列步骤:将集成电路封装后处理中的引线框架浸泡在所述的去胶剂中,然后去除去胶剂,干燥,即可。
所述的浸泡的温度可为本领域常规的浸泡温度,优选60-130℃,更优选65-100℃,最优选70-80℃。
所述的浸泡的时间可为本领域常规的时间,优选10-100min,更优选15-90min,最优选30-85min(例如40min、50min或80min)。
所述的去除去胶剂的方法可为本领域常规的方法,优选将浸泡后的引线框架用水冲洗,即可。
在去除去胶剂后,还可包含将浸泡后的塑封体过水刀的操作。所述的过水刀的操作可为本领域常规的操作。
所述的干燥的方法可为本领域常规的方法,优选氮气吹干。
所述的应用中,浸泡在去胶剂中的引线框架可以是单片,也可以是一批(即多片,个数可不作限定,根据实际能够浸泡的个数确定)。
所述的集成电路封装的方法可为本领域常规的集成电路封装的方法,优选采用QFN封装。所述的QFN封装优选倒装QFN(即FCQFN)。
在不违背本领域常识的基础上,上述各优选条件,可任意组合,即得本发明各较佳实例。
本发明中,所述QFN封装是指方形扁平无引脚封装(Quad Flat No-leadPackage)。
本发明中,各组分的质量分数是指各组分的质量占所有原料组分总质量的质量百分比。
本发明中,所述的室温是指10-30℃。
本发明所用试剂和原料均市售可得。
本发明的积极进步效果在于:
1、本发明的去胶剂寿命长,可在3个月内循环重复使用;可单独去除tape胶或溢料,或者同时去除tape胶和溢料,并减少后续电镀工艺的锡毛刺的产生;对塑封体(基材)无损伤。
2、本发明的去胶剂可实现操作安全、方便、稳定,操作成本低,可适用于单片或批量处理,生产效率高,便于自动化操作,对基体无损害,电性能优良,因此可以广泛地应用于各种集成电路封装后处理中,尤其是QFN封装后处理。
3、本发明的去胶剂具有非常广阔的市场应用前景,为微电子企业解决了难题,对促进我国微电子行业的发展起了积极的作用,也具有较高的经济效益。
具体实施方式
下面通过实施例的方式进一步说明本发明,但并不因此将本发明限制在所述的实施例范围之中。下列实施例中未注明具体条件的实验方法,按照常规方法和条件,或按照商品说明书选择。
下述各实施例中,去胶剂的制备方法均为将各实施例中去胶剂原料组分中的固体组分加入到液体组分中,搅拌均匀,即可。
下述实例中,未限定具体操作温度的,均是在室温条件下进行。
去胶剂在去除集成电路封装后处理中的tape胶和/或溢料中的应用的具体操作为:将倒装QFN工艺中molding(封装)后的各单片引线框架(6cm*6cm)浸泡在各实施例的去胶剂中,浸泡时间和温度参照下述应用实施例,操作完成后,用纯水冲洗,过水刀、用氮气吹干,即可。用金相显微镜观察去胶效果,然后进一步电镀锡,并用金相显微镜观察电镀效果。
下述实施例1-14中,水是指去离子水。
去胶剂使用寿命是指去胶剂在浸泡槽中从配槽(将新的去胶剂倒入洗干净的浸泡槽中)开始使用到下一次换槽(将浸泡槽中老去胶剂全部排干净,然后洗干净槽,再倒入新去胶剂)的周期,其间由于去胶剂挥发,样条(即引脚框架)携带等原因会导致浸泡槽中去胶剂液位下降,故每天都会进行补加新去胶剂使浸泡槽中的液位保持稳定。因此,使用寿命是单槽去胶剂换槽的周期。
实施例1-6
表1去胶剂的各原料组分
表2各原料组分的质量分数和去胶剂pH值
实施例7-14
实施例7-14为在实施例2的基础上,增加下述组分,并相应调整水的用量,使各组分的质量分数之和为100%。表3中,“/”表示该组分无添加。
表3实施例7-14新添加的各原料组分和质量分数
应用实施例1-15
表4
表5各符号含义
严重残留 | × | 严重毛刺 | × |
中等残留 | △ | 中等毛刺 | △ |
轻微残留 | ○ | 轻微毛刺 | ○ |
无残留 | ◎ | 无毛刺 | ◎ |
从以上各应用实施例(1-15)可以看出,本发明的去胶剂去tape胶和去溢料较佳,进而使的镀锡效果也较佳。在操作时间较短或添加增稠剂时,会有轻微残留及镀锡毛刺出现,但并不会影响到引线框架产品的使用效果。
以上各应用实施例(1-15)中,在金相显微镜观察时,并没有观察到镀锡前后的引线框架有基质受损的情况。
另外,将以上各应用实施例(1-15)中的单片引线框架的操作变为批量多片操作,并不影响去tape胶、去溢料及后续的镀锡效果。
进一步进行去胶剂寿命实验发现,本发明的上述各实施例中的去胶剂可重复循环使用3个月以上,使用寿命较长。
对比实施例1-6
表6去胶剂各原料组分
表7各原料组分质量分数和去胶剂的pH值
应用实施例16-27
应用实施例23-27对应的对比实例8-12分别为CN102864458A中的实施例1中的去毛刺软化液、CN102808190A中的实施例1中的去毛刺软化液、CN1935939A中的实施例的去毛刺溶液、CN103128892A实施例1中的去毛刺溶液和CN102270587A实施例1中的毛刺软化液。
表8
从以上各应用实施例(16-22)可以看出,对比例1-12的去胶剂去tape胶和去溢料较差,进而使的镀锡效果也较差。在金相显微镜观察时,观察到镀锡前后的引线框架有基质有受损的情况。
进一步进行去胶剂寿命实验发现,上述各对比实施例中的去胶剂最长可重复循环使用2个月,对比例7和8甚至只能重复循环使用一个星期,使用寿命短。
Claims (10)
1.一种去胶剂在去除集成电路封装后处理中的tape胶和/或溢料中的应用,所述的去胶剂由下述原料制得,所述的原料包括下列质量分数的组分:20%-70%的溶剂、10%-50%有机胺、0.01%-50%还原剂、0.01%-5%无机碱、0.01%-10%表面活性剂和水,各组分质量分数之和为100%;所述去胶剂的pH值为7.5-13.5。
2.如权利要求1所述的应用,其特征在于,
所述的溶剂的质量分数为35%-55%;
和/或,所述的有机胺的质量分数为15%-45%;
和/或,所述的还原剂的质量分数为0.1%-10%;
和/或,所述的无机碱的质量分数为0.1%-4%;
和/或,所述的表面活性剂的质量分数为0.1%-5%;
和/或,所述去胶剂的pH值为8-12。
3.如权利要求2所述的应用,其特征在于,
所述的有机胺的质量分数为40%-50%;
和/或,所述的还原剂的质量分数为20%-40%;
和/或,所述的无机碱的质量分数为0.15%-0.35%;
和/或,所述的表面活性剂的质量分数为0.15%-3%;
和/或,所述去胶剂的pH值为9-11。
4.如权利要求1所述的应用,其特征在于,
所述的溶剂为醇类溶剂、酮类溶剂、醚类溶剂、亚砜类溶剂、砜类溶剂、酰胺类溶剂和酯类溶剂中的一种或多种;
和/或,所述的有机胺为醇胺、有机多胺、含羧基的有机胺和季铵碱类有机胺中的一种或多种;
和/或,所述的还原剂为硼氢化类还原剂、处于低化合物价时的氧化物、处于低化合物价时的盐、羟基胺、羟胺衍生物、联氨、水合肼、肼类衍生物、醛类还原剂和羧酸类还原剂中的一种或多种;
和/或,所述的无机碱为碳酸盐类无机碱、碳酸氢盐类无机碱、氢氧化盐类无机碱和氨水中的一种或多种;
和/或,所述表面活性剂为阴离子表面活性剂和/或非离子表面活性剂。
5.如权利要求4所述的应用,其特征在于,
所述的醇类溶剂为甘油、甲醇、乙醇、异丙醇、乙二醇、三缩三乙二醇、正丁醇、异丁醇和苯甲醇中的一种或多种;
和/或,所述的酮类溶剂为丙酮、咪唑烷酮、吡咯烷酮、咪唑啉酮和异氟尔酮中的一种或多种;其中,所述的咪唑烷酮优选2-咪唑烷酮、1,3-二甲基-2-咪唑烷酮和1,3-二乙基-2-咪唑烷酮中的一种或多种;所述的吡咯烷酮优选N-甲基吡咯烷酮、N-乙基吡咯烷酮、N-环己基吡咯烷酮、2-吡咯烷酮和N-羟乙基吡咯烷酮中的一种或多种;所述的咪唑啉酮优选1,3-二甲基-2-咪唑啉酮;
和/或,所述的亚砜类溶剂为二甲基亚砜、二乙基亚砜和甲乙基亚砜中的一种或多种;
和/或,所述的砜类溶剂为甲基砜、乙基砜和环丁砜中的一种或多种;
和/或,所述的醚类溶剂为四氢呋喃、乙二醇单烷基醚、二乙二醇单烷基醚、丙二醇单烷基醚、二丙二醇单烷基醚和三丙二醇单烷基醚中的一种或多种;所述的乙二醇单烷基醚优选乙二醇单甲醚、乙二醇单乙醚、乙二醇苯醚和乙二醇单丁醚中的一种或多;所述的二乙二醇单烷基醚优选二乙二醇单甲醚、二乙二醇单乙醚和二乙二醇单丁醚中的一种或多种;所述的丙二醇单烷基醚优选丙二醇单甲醚、丙二醇单乙醚和丙二醇单丁醚中的一种或多种;所述的二丙二醇单烷基醚优选二丙二醇单甲醚、二丙二醇单乙醚和二丙二醇单丁醚中的一种或多种;所述的三丙二醇单烷基醚优选三丙二醇单甲醚;
和/或,所述的酰胺类溶剂为二甲基甲酰胺和/或二甲基乙酰胺;
和/或,所述的酯类溶剂优选乙酸乙酯、乳酸乙酯和二乙酸乙二醇酯中的一种或多种;
和/或,所述的醇胺为乙醇胺、二乙醇胺、三乙醇胺、异丙醇胺、N,N-二甲基乙醇胺和N-甲基二乙醇胺中的一种或多种;
和/或,所述的有机多胺优选二乙烯三胺、五甲基二乙烯三胺和多乙烯多胺中的一中或多种;
和/或,所述的含羧基的有机胺优选2-氨基乙酸、2-氨基苯甲酸、亚氨基二乙酸,氨三乙酸和乙二胺四乙酸中的一种或多种;
和/或,所述的季铵碱类有机胺优选四甲基氢氧化铵、四乙基氢氧化铵、三甲基苄基氢氧化铵、四乙基氢氧化铵和三乙基苄基氢氧化铵中的一种或多种;
和/或,所述的硼氢化类还原剂优选硼氢化钠和/或硼氢化钾;
和/或,所述的处于低化合物价时的氧化物为双氧水;
和/或,所述的处于低化合物价时的盐为亚硫酸钠、次磷酸钠、硫酸亚铁和氯化亚铁中的一种或多种;
和/或,所述的羟胺衍生物为硫酸羟胺和/或盐酸羟胺;
和/或,所述的肼类衍生物为甲磺酰肼和/或对甲苯磺酸肼;
和/或,所述的醛类还原剂为甲醛、乙醛、葡萄糖和糠醛中的一种或多种;
和/或,所述的羧酸类还原剂为草酸、柠檬酸和维生素C中的一种或多种;
和/或,所述的碳酸盐类无机碱为碳酸钠和/或碳酸钾;
和/或,所述的碳酸氢盐类无机碱为碳酸氢钠;
和/或,所述的氢氧化盐类无机碱为氢氧化钠、氢氧化钾、氢氧化钡和氢氧化钙中的一种或多种;
和/或,所述的阴离子表面活性剂为全氟烷基磺酸钾、仲烷基磺酸钠、十二烷基苯磺酸、脂肪醇醚硫酸钠、乙氧基化脂肪酸甲酯磺酸钠、醇醚羧酸盐、醇醚磷酸盐、异辛醇硫酸钠、MOA-3PK、MOA-5PK、苯酚聚氧乙烯醚硫酸钠和烷基磺酸盐中的一种或多种;
和/或,所述的非离子表面活性剂为聚乙二醇、渗透剂JFC、聚乙二醇醚、OP-10、羟基聚醚、聚乙烯醇、聚乙烯吡咯烷酮、聚氧乙烯、聚硅氧烷、氟代聚乙烯醇、氟代聚乙烯吡咯烷酮、氟代聚氧乙烯、氟代聚硅氧烷、脂肪醇聚氧乙烯醚、多元醇酯、烷基酚聚氧乙烯醚中的一种或多种。
6.如权利要求1所述的应用,其特征在于,所述的去胶剂的原料组分还进一步包含氟化物、金属腐蚀抑制剂和保湿剂中的一种或多种。
7.如权利要求6所述的应用,其特征在于,
所述的氟化物的质量分数为0-1%,但不为0;优选0.1%-0.5%;
和/或,所述金属腐蚀抑制剂的质量分数为0-1%,但不为0;优选0.1%-0.5%;
和/或,所述保湿剂的质量分数优选为0-1%,但不为0;更优选0.1%-0.5%。
8.如权利要求6所述的应用,其特征在于,
所述的氟化剂为氟化氢、氟硅酸、氟硅酸铵、氟硼酸、氟硼酸铵、和、氟化氢与碱形成的盐中的一种或多种;其中,所述的氟化氢与碱形成的盐中所述的碱优选氨水、季胺氢氧化物或醇胺;所述的氟化氢与碱形成的盐优选氟化氢铵、四甲基氟化铵和三羟乙基氟化铵中的一种或多种;
和/或,所述金属腐蚀抑制剂为联苯三酚、邻苯二酚、草酸、酒石酸、琥珀酸、马来酸、乙酸、柠檬酸、3-氨基-1,2,4-三氮唑、苯并三氮唑、甘氨酸、丙氨酸、亮氨酸和异亮氨酸中的一种或多种;
和/或,所述保湿剂为甘油、丁二醇、聚乙二醇、丙二醇、已二醇、木糖醇、聚丙二醇、山梨糖醇、乳酸钠、尿素、吡咯烷酮羧酸钠、动物胶、透明质酸、维生素和氨基酸类保湿剂中的一种或多种。
9.如权利要求1所述的应用,其特征在于,所述的去胶剂的原料组分中不包含增稠剂;所述增稠剂优选硫酸钠、氯化钠、硼砂、CMC、HPMC、甲基纤维素、羟乙基纤维素、海藻酸钠、聚丙烯酸钠、聚丙烯酰胺和聚乙烯醇中的一种或多种。
10.如权利要求1-9任一项所述的应用,其特征在于,所述的原料由下列质量分数的组分组成:20%-70%的溶剂、10%-50%有机胺、0.01%-50%还原剂、0.01%-5%无机碱、0.01%-10%表面活性剂、水、0-1%的氟化物、0-1%的金属腐蚀抑制剂和0-1%的保湿剂,各组分质量分数之和为100%;所述去胶剂的pH值为7.5-13.5;其中,当所述的原料包含氟化物、金属腐蚀抑制剂和保湿剂中的一种或多种时,所述的氟化物、金属腐蚀抑制剂或保湿剂的质量分数不为0。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710548063.4A CN107815353B (zh) | 2017-07-06 | 2017-07-06 | 一种可用于去毛刺的去胶剂、其制备方法和应用 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710548063.4A CN107815353B (zh) | 2017-07-06 | 2017-07-06 | 一种可用于去毛刺的去胶剂、其制备方法和应用 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107815353A true CN107815353A (zh) | 2018-03-20 |
CN107815353B CN107815353B (zh) | 2020-12-15 |
Family
ID=61600937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710548063.4A Active CN107815353B (zh) | 2017-07-06 | 2017-07-06 | 一种可用于去毛刺的去胶剂、其制备方法和应用 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107815353B (zh) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108929797A (zh) * | 2018-09-04 | 2018-12-04 | 惠州市兴都化工科技有限公司 | 一种环保红胶清洗剂 |
CN109370792A (zh) * | 2018-11-26 | 2019-02-22 | 江苏艾森半导体材料股份有限公司 | 用于qfn的除胶软化一体浸泡液 |
CN109963414A (zh) * | 2019-03-29 | 2019-07-02 | 瀚宇博德科技(江阴)有限公司 | 一种克服板面沾胶的印刷电路板嫁接方法 |
CN110093607A (zh) * | 2019-04-09 | 2019-08-06 | 上海新阳半导体材料股份有限公司 | 用于引线框架的去毛刺液、其制备方法和应用 |
CN110211886A (zh) * | 2019-06-06 | 2019-09-06 | 中芯长电半导体(江阴)有限公司 | 半导体制备方法 |
CN110577371A (zh) * | 2018-07-24 | 2019-12-17 | 蓝思科技(长沙)有限公司 | 用于退除耐强酸蚀刻玻璃保护油墨的退镀液、退镀工艺及退镀后的玻璃、电子设备 |
CN110777011A (zh) * | 2019-09-11 | 2020-02-11 | 清研高装科技(天津)有限公司 | 一种除胶剂及其在轨道交通车辆车窗检修中的应用 |
CN110846155A (zh) * | 2019-10-09 | 2020-02-28 | 富泰华精密电子(郑州)有限公司 | 除胶剂及除胶剂的应用方法 |
CN111826241A (zh) * | 2020-06-19 | 2020-10-27 | 扬州虹扬科技发展有限公司 | 一种电子元器件塑封料油脂清洗剂及其应用 |
CN111876274A (zh) * | 2020-08-24 | 2020-11-03 | 湖南湘江关西涂料(长沙)有限公司 | 碱性清洗剂及其制备方法和应用 |
WO2021051639A1 (zh) * | 2019-09-19 | 2021-03-25 | 江华飞信达科技有限公司 | 一种lcd基板清洗剂及其使用方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1935939A (zh) * | 2005-09-20 | 2007-03-28 | 上海新阳电子化学有限公司 | 一种集成电路封装后处理用去毛刺溶液 |
CN101899365A (zh) * | 2009-05-27 | 2010-12-01 | 宁波百仕高联合工业有限公司 | 一种除胶剂及其制作方法 |
CN102270587A (zh) * | 2011-04-04 | 2011-12-07 | 修建东 | 一种塑封晶体管溢料软化液及其制备方法 |
CN103789780A (zh) * | 2014-02-26 | 2014-05-14 | 苏州禾川化学技术服务有限公司 | 一种ic元件用碱性通用型去毛刺液 |
-
2017
- 2017-07-06 CN CN201710548063.4A patent/CN107815353B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1935939A (zh) * | 2005-09-20 | 2007-03-28 | 上海新阳电子化学有限公司 | 一种集成电路封装后处理用去毛刺溶液 |
CN101899365A (zh) * | 2009-05-27 | 2010-12-01 | 宁波百仕高联合工业有限公司 | 一种除胶剂及其制作方法 |
CN102270587A (zh) * | 2011-04-04 | 2011-12-07 | 修建东 | 一种塑封晶体管溢料软化液及其制备方法 |
CN103789780A (zh) * | 2014-02-26 | 2014-05-14 | 苏州禾川化学技术服务有限公司 | 一种ic元件用碱性通用型去毛刺液 |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110577371A (zh) * | 2018-07-24 | 2019-12-17 | 蓝思科技(长沙)有限公司 | 用于退除耐强酸蚀刻玻璃保护油墨的退镀液、退镀工艺及退镀后的玻璃、电子设备 |
CN110577371B (zh) * | 2018-07-24 | 2022-05-17 | 蓝思科技(长沙)有限公司 | 用于退除耐强酸蚀刻玻璃保护油墨的退镀液、退镀工艺及退镀后的玻璃、电子设备 |
CN108929797A (zh) * | 2018-09-04 | 2018-12-04 | 惠州市兴都化工科技有限公司 | 一种环保红胶清洗剂 |
CN109370792A (zh) * | 2018-11-26 | 2019-02-22 | 江苏艾森半导体材料股份有限公司 | 用于qfn的除胶软化一体浸泡液 |
CN109963414A (zh) * | 2019-03-29 | 2019-07-02 | 瀚宇博德科技(江阴)有限公司 | 一种克服板面沾胶的印刷电路板嫁接方法 |
CN110093607B (zh) * | 2019-04-09 | 2021-07-09 | 上海新阳半导体材料股份有限公司 | 用于引线框架的去毛刺液、其制备方法和应用 |
CN110093607A (zh) * | 2019-04-09 | 2019-08-06 | 上海新阳半导体材料股份有限公司 | 用于引线框架的去毛刺液、其制备方法和应用 |
CN110211886A (zh) * | 2019-06-06 | 2019-09-06 | 中芯长电半导体(江阴)有限公司 | 半导体制备方法 |
CN110777011A (zh) * | 2019-09-11 | 2020-02-11 | 清研高装科技(天津)有限公司 | 一种除胶剂及其在轨道交通车辆车窗检修中的应用 |
WO2021051639A1 (zh) * | 2019-09-19 | 2021-03-25 | 江华飞信达科技有限公司 | 一种lcd基板清洗剂及其使用方法 |
CN110846155A (zh) * | 2019-10-09 | 2020-02-28 | 富泰华精密电子(郑州)有限公司 | 除胶剂及除胶剂的应用方法 |
CN111826241A (zh) * | 2020-06-19 | 2020-10-27 | 扬州虹扬科技发展有限公司 | 一种电子元器件塑封料油脂清洗剂及其应用 |
CN111876274A (zh) * | 2020-08-24 | 2020-11-03 | 湖南湘江关西涂料(长沙)有限公司 | 碱性清洗剂及其制备方法和应用 |
CN111876274B (zh) * | 2020-08-24 | 2021-07-23 | 湖南湘江关西涂料(长沙)有限公司 | 碱性清洗剂及其制备方法和应用 |
Also Published As
Publication number | Publication date |
---|---|
CN107815353B (zh) | 2020-12-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107815353A (zh) | 一种可用于去毛刺的去胶剂、其制备方法和应用 | |
CN107817656A (zh) | 一种可用于去毛刺的去胶剂、其制备方法和应用 | |
CN107805550A (zh) | 一种可用于去毛刺的去胶剂、其制备方法和应用 | |
CN103789780B (zh) | 一种ic元件用碱性通用型去毛刺液 | |
CN106919013B (zh) | 一种低蚀刻的去除光阻残留物的清洗液 | |
RU2631870C2 (ru) | Композиция для очистки после химико-механического полирования (после - смр), содержащая конкретное содержащее серу соединение и сахарный спирт или поликарбоновую кислоту | |
CN110093607A (zh) | 用于引线框架的去毛刺液、其制备方法和应用 | |
CN103869636A (zh) | 一种光刻胶去除剂 | |
TW201231725A (en) | Etchant composition for copper-containing material and method for etching copper-containing material | |
CN111363631B (zh) | 可用于去毛刺的去胶剂及其制备方法和应用 | |
CN105255621A (zh) | 一种半水基型液晶清洗剂的制备方法 | |
KR102245577B1 (ko) | Cmp-후 세정액 조성물 | |
CN105022237B (zh) | 一种金属低刻蚀光刻胶剥离液 | |
CN109734931A (zh) | 用于去除半导体封装后毛刺的环保型去胶剂及其制备方法 | |
CN101685272A (zh) | 一种光刻胶清洗剂 | |
CN110071054A (zh) | 一种集成电路封装后处理的去胶方法 | |
CN109370792A (zh) | 用于qfn的除胶软化一体浸泡液 | |
CN106933068A (zh) | 一种低蚀刻的去除光刻胶残留物的清洗液 | |
WO2023221731A1 (zh) | 一种双组份硅片清洗剂及清洗方法 | |
CN106011993A (zh) | 一种电解去溢料溶液及其制备方法 | |
KR102512488B1 (ko) | 포토레지스트 제거용 박리액 조성물 | |
CN102096345A (zh) | 一种厚膜光刻胶清洗液及其清洗方法 | |
CN109939977A (zh) | 树脂掩模剥离清洗方法 | |
CN112592769A (zh) | 低voc的半导体芯片清洗剂及其制备方法 | |
CN106547177A (zh) | 抗蚀剂剥离液组合物、平板显示器基板及其制造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |