CN107750337B - Semiconductor chip test socket - Google Patents

Abstract

The present invention relates to a semiconductor chip test socket, and more particularly, to a semiconductor chip test socket which reduces waste of force by easily transmitting force generated according to movement of a cover to a latch system.

Description

Semiconductor chip test socket

Technical Field

The present invention relates to a semiconductor chip test socket, and more particularly, to a semiconductor chip test socket which reduces waste of force by easily transmitting force generated according to movement of a cover to a latch system.

Background

Generally, a semiconductor assembly process consists of: after separating the semiconductor element manufactured through a wafer fabrication process into individual chips (chips), a lead frame is electrically connected to the individual chips, and a package body for protecting the electrical connection portions of the lead frame and the semiconductor chips from an external environment is molded.

When mounting a semiconductor chip to a semiconductor chip test socket, it is important to stably mount and fix the semiconductor chip to the socket. In other words, in particular, close contact between the contact terminals provided on the semiconductor chip and the terminals provided on the test socket is problematic, and for example, the close contact between the terminals cannot be ensured due to deformation caused by heat, foreign matter, or the like, and there is a possibility that defects may occur during operation or testing.

Therefore, various structures of the test socket have been developed, and various structures of fixing and pressing the semiconductor chip according to the movement of the cover have been developed, but various problems have been caused that the force generated according to the movement of the cover cannot be completely transmitted and the effort is wasted.

Therefore, it is necessary to develop a test socket capable of completely transmitting a force generated as a cover of the test socket moves in a manner of ensuring close contact between contact terminals of a semiconductor chip and terminals provided in the test socket for the semiconductor chip.

Disclosure of Invention

Technical problem

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a semiconductor chip test socket which reduces waste of force by easily transmitting force generated according to movement of a cover to a latch system.

Technical scheme

The present invention is made to solve the above-mentioned problems, and a semiconductor chip test socket according to an embodiment of the present invention includes: a quadrangular base having a central receiving opening penetrating in a vertical direction; an adapter inserted into the central receiving opening of the base and capable of mounting a semiconductor chip on an upper portion; a cover coupled to an upper portion of the base movably in an up-down direction with respect to the base, the cover having an opening portion into which a semiconductor chip is inserted; a spring that is provided between the base and the cover and exerts elasticity between the base and the cover; and a latch system which is movable to an open position or a closed position in accordance with the up-and-down movement of the cover, wherein the latch system is located at the closed position in which the semiconductor chip mounted on the adapter is pressurized and supported when the cover is located at the upper portion by the elasticity of the spring, and is located at the open position in which the semiconductor chip is exposed through the opening portion when the cover is moved downward by an external force, and a plurality of latch holders in which rail holes are formed are provided on the base, the latch system including: a cover shaft protruding in both side directions in such a manner as to rotatably connect the latch system to the cover; and a guide shaft provided at a position spaced apart from the cover shaft by a predetermined distance and protruding in both side directions in parallel with the cover shaft, the guide shaft being inserted into the guide rail hole, wherein the latch system rotates around the cover shaft as a center in accordance with the up-and-down movement of the cover, and the guide shaft moves along the guide rail hole to guide the latch system to move between an open position and a closed position along the guide rail hole.

Preferably, the base is formed in a hexahedral shape, the plurality of latch holders are respectively disposed at upper corner portions of the base, two latch holders are disposed to face each other such that the rail holes formed at the two latch holders overlap each other in a side direction, one latch system is disposed between the two latch holders, and both end portions of the guide shaft protruding in the side direction of the latch system are disposed to be respectively inserted into two rail holes such that the latch system moves along the rail holes.

Preferably, the guide rail hole is configured to penetrate in a lateral direction in such a manner that the guide shaft penetrates in the lateral direction, and the guide rail hole includes: a first line formed adjacent to an outer end of the base and extending in an up-down direction; a second line which is bent and extended from an upper end of the first line in an inner direction of the base and has a boat shape protruding in an upward direction; a third line extending from the second line further toward the inside of the base and bent and extending diagonally downward; and a fourth line provided at an end of the third line and extending horizontally in a lateral direction.

Preferably, the guide shaft is located at an end of the fourth line of the guide rail hole when the latch system is in the closed position, and the guide shaft is located at an end of the first line of the guide rail hole when the latch system is in the open position.

Preferably, the latch system comprises: a latch plate which is located on the adapter and presses down a semiconductor chip mounted on the adapter; and a latch beam having one end in a length direction connected with the latch plate and the other end rotatably connected to the cover by the cover shaft, the guide shaft being provided at a middle portion in the length direction of the latch beam.

Preferably, the latch beam has a first through hole penetrating in a lateral direction at one end in a longitudinal direction to allow the cover shaft to penetrate in the lateral direction, the latch beam has a second through hole penetrating in the lateral direction at a middle portion in the longitudinal direction to allow the guide shaft to penetrate in the lateral direction, the cover has a connecting portion provided inside the opening portion and provided on both sides of the latch beam, respectively, the connecting portion is provided to overlap with one end in the longitudinal direction of the latch beam in the lateral direction, a connection hole allowing the cover shaft to penetrate is formed in the connecting portion, and the cover shaft connects the first through hole and the connection hole to allow the latch beam to rotate relative to the cover.

Preferably, the latch beam and the latch plate are configured to be connected by a latch shaft and to be rotatable relative to each other, the latch shaft, the guide shaft and the cover shaft are parallel to each other, and a distance between the latch shaft and the guide shaft is shorter than a distance between the guide shaft and the cover shaft.

Preferably, a ratio of a distance between the first through hole and the second through hole to a distance between the first through hole and the latch shaft is 1:0.4 to 1: 0.42.

Preferably, the base has side guide slot portion at the lateral part, side guide slot portion is sunken to the inboard and extends along upper and lower direction, the lid has side guide portion, side guide portion set up with on the position that guide slot portion corresponds and in the side direction with connecting portion overlap and cover connecting portion, side guide portion follows the upper and lower direction of lid removes and follows guide slot portion removes in the upper and lower direction be formed with the side opening on the guide portion, the side opening in the side direction with the connecting hole overlaps and can makes the lid axle link up.

Preferably, the base is provided at four corner portions thereof with corner portions protruding upward, upper and lower guide portions extending in an up-and-down direction and protruding in an inward direction are provided at inner sides of the corner portions, upper and lower guide rails extending in an up-and-down direction and recessed inward are formed at outer side surfaces of the connection portions, and the upper and lower guide portions are inserted into the upper and lower guide rails so as to guide the cover to move in the up-and-down direction by the upper and lower guide portions and the upper and lower guide rails.

Preferably, the cover has one or more spring installation beams protruding downward and extending therefrom, the base has a spring insertion groove exposed upward so that the spring installation beams are inserted thereinto, and the spring is inserted into the spring insertion groove together with the spring installation beams in a state of being wound around the spring installation beams as a center, thereby applying an elastic force between the cover and the base.

Preferably, the adapter comprises: a mounting member which is provided on an upper portion of the adapter and mounts a semiconductor chip on an upper surface; and a contact accommodating member provided below the mounting member and accommodating the plurality of contact portions, the mounting member having a mounting portion for mounting a semiconductor chip, the mounting portion having: a plurality of through holes that penetrate in the vertical direction so that the plurality of contact portions are exposed upward; and an outer-side mounting surface formed in a predetermined step along an outer side of the mounting portion so as to mount and support an outer side surface of the semiconductor chip.

Preferably, the contact portion has at least two bent portions between the upper portion and the lower portion so as to apply an elastic force upward when the semiconductor chip is pressed in abutment with the upper portion, and an electrically insulating member is formed on an outer side surface between the bent portions.

Preferably, the mounting part has a center seating surface at a center portion, the center seating surface having the same height as the outer seating surface and having a predetermined area to support a center surface of the semiconductor chip.

Preferably, the adapter comprises: a mounting member provided on an upper portion of the adapter and used for mounting a semiconductor chip on an upper surface; and a contact accommodating member provided below the mounting member and accommodating the plurality of contact portions, the mounting member having a mounting portion for mounting a semiconductor chip, the mounting portion being provided with a plurality of spherical support portions.

Advantageous effects

The semiconductor chip test socket according to the present invention includes a latch system that moves up and down and rotates as a cover moves up and down, thereby reliably supporting and holding a semiconductor chip mounted in the socket. Therefore, the possibility of occurrence of a failure in the test of the semiconductor chip can be reduced and the test reliability can be improved.

Further, by fixing the path along which the latch system moves along the rail hole, the latch system can reliably maintain the position of the semiconductor chip mounted on the adapter.

Further, when the latch system is in the closed position, the upward force transmitted through the lid is converted into the downward force by the guide shaft provided in the latch system to pressurize the semiconductor chip, so that the latch system functions like a lever. Therefore, the semiconductor chip can be stably fixed by transmitting the force applied by the cover without waste.

Drawings

Fig. 1 is a view showing a semiconductor chip test socket according to the present invention.

Fig. 2 is an exploded view of a semiconductor chip test socket according to the present invention.

Fig. 3 is a view showing a base of the semiconductor chip test socket according to the present invention.

Fig. 4 is a diagram showing a form of bonding the socket and the adapter of the semiconductor chip test socket according to the present invention.

Fig. 5 is a view showing a section a-a of fig. 1.

Fig. 6 is an enlarged view of a portion E of fig. 5.

Fig. 7a is a diagram showing a structure of an adapter attachment member according to an embodiment.

Fig. 7b is a diagram showing a structure of a mounting member of an adapter according to another embodiment.

Fig. 8 is a view showing a cross section D-D of fig. 7 a.

Fig. 9 is a diagram showing a state in which a semiconductor chip is mounted on a mounting member of an adapter.

Fig. 10a is a diagram showing a latch system of the semiconductor chip test socket according to the present invention.

Fig. 10b is an exploded view showing a latching system of the semiconductor chip test socket according to the present invention.

Fig. 11 is a diagram showing a configuration of a latch system of the semiconductor chip test socket according to the present invention.

Fig. 12 is a diagram showing a form of engagement of the base, the adapter, and the latch system of the semiconductor chip test socket according to the present invention.

Fig. 13 is a view showing a cover of the semiconductor chip test socket according to the present invention.

Fig. 14 is an X-X sectional view of fig. 13.

Fig. 15 is a diagram showing a structure of connection between the base of the semiconductor chip test socket according to the present invention and the latch system.

Fig. 16 is a diagram showing a structure of connection between a base, a latch system, and a cover of the semiconductor chip test socket according to the present invention.

Fig. 17 is an enlarged view of a portion C of fig. 1.

Fig. 18 is a view showing a form in which the base and the cover are joined by providing the upper and lower guide portions and the upper and lower guide rails at the respective corners of the base and the cover.

Fig. 19 is a diagram showing that the repulsive force of the contact portion is applied to the semiconductor chip and the latch system.

Fig. 20 is a diagram showing a state before the latch system pressurizes the semiconductor chip.

Fig. 21 is a view showing the latch system pressing the semiconductor chip to bring the contact balls of the semiconductor chip into contact with the contact portions of the adapter.

Fig. 22 is a view showing a state in which the latch system is in the closed position.

Fig. 23 to 26 are views showing the semiconductor chip test socket according to the present invention operating to move the latch system from the closed position to the open position.

Detailed Description

Preferred embodiments according to the present invention will be described below with reference to the accompanying drawings.

Fig. 1 is a view showing a semiconductor chip test socket 1 according to the present invention, fig. 2 is an exploded view of the semiconductor chip test socket 1 according to the present invention, fig. 3 is a view showing a base 100 of the semiconductor chip test socket 1 according to the present invention, fig. 4 is a view showing a form in which the base 100 and an adapter 200 of the semiconductor chip test socket 1 according to the present invention are joined, fig. 5 is a view showing an a-a section of fig. 1, fig. 6 is a view showing an enlarged portion E of fig. 5, fig. 7a and 7b are views showing a structure of a mounting member 210 of an adapter 200 according to an embodiment, respectively, fig. 8 is a view showing a D-D section of fig. 7a, fig. 9 is a view showing a state in which a semiconductor chip is supported on the mounting member 210 of the adapter 200, fig. 10a is a view showing a latch system 300 of the semiconductor chip test socket 1 according to the present invention, fig. 10b is an exploded view showing the latch system 300 of the semiconductor chip test socket 1 according to the present invention, fig. 11 is a view showing the structure of the latch system 300 of the semiconductor chip test socket 1 according to the present invention, fig. 12 is a view showing a form in which the base 100, the adapter 200 and the latch system 300 of the semiconductor chip test socket 1 according to the present invention are joined, fig. 13 is a view showing the cover 400 of the semiconductor chip test socket 1 according to the present invention, and fig. 14 is an X-X sectional view of fig. 13.

Hereinafter, for ease of explanation of the positional relationship, the X axis is referred to as the longitudinal direction, the Y axis is referred to as the lateral direction, and the Z axis is referred to as the vertical direction, with reference to the direction shown in the drawings.

First, the base 100 will be explained.

The base 100 constitutes a lower portion of the semiconductor chip test socket 1, and is configured to have a receiving opening portion 102 at a central portion to be able to receive the adapter 200. The shape of the housing opening 102 may have a shape corresponding to the shapes of the adapter 200 and the semiconductor chip, and may have a generally quadrangular shape as shown in fig. 3, for example. Also, the base 100 may have a substantially hexahedral shape as a whole.

A plurality of latch holders 110 may be provided at an upper portion of the base 100. Each latch holder 110 is composed of a plate-shaped member having a predetermined area. Four latch holders 110 may be provided, and the four latch holders 110 are respectively provided at four corner portions of the upper portion of the base 100. In addition, the receiving opening portion 102 is configured in a quadrangular shape, and thus it can also be understood that the latch holder 110 is provided at the peripheral portions of the four corners of the receiving opening portion 102.

The latch holders 110 may be integrally formed with the base 100, and for example, the latch holders 110 may be separately manufactured by metal molding or the like and joined and fixed to the base 100.

A guide rail hole 120 is formed in each latch holder 110. The guide rail hole 120 is a hole penetrating the latch holder 110 in the surface direction, and is formed to extend in a predetermined direction so as to be able to guide a movement path of the guide shaft 330 inserted into the guide rail hole 120 as described later. The latch holder 110 may be disposed such that the rail holes 120 overlap each other facing each other, and a specific disposition relationship will be described in more detail in an engagement relationship between the latch system 300 and the base 100, which will be described later.

Describing the form of the rail hole 120 in more detail, each rail hole 120 includes: a first line 122 formed adjacent to an outer end of the base 100 in a direction and extending in a vertical direction; a second line 124 extending continuously from the first line 122, curved and extending from an upper end of the first line 122 in an inner direction of the base 100, and having a boat shape protruding in an upward direction; and a third line 126 extending continuously from the second line 124, further extending from the second line 124 in the inner direction of the base 100, and bent and extending diagonally downward. The third line 126 has a fourth line 128 extending horizontally in the lateral direction at its end. At this time, when the latch system 300 described later is in the closed position, the guide shaft 330 provided in the latch system 300 may be in a fixed position in contact with the fourth line 128, which is the inner end of the rail hole 120. The details will be described later.

Also, a spring insertion groove 130 formed to be downwardly recessed may be formed on the outer upper surface of the base 100. For example, a plurality of spring insertion grooves 130 may be formed in front and rear sides symmetrically with each other, and the spring insertion grooves 130 may have a size suitable for insertion of a spring 500 and a spring installation beam, which will be described later.

A side guide groove portion 140 recessed inward and extending in the vertical direction may be formed on a side surface portion of the base 100. The side guide groove part 140 is formed on two faces opposite to each other among four side faces of the base 100, and the side guide groove part 140 may be formed at a side lower part of the latch holder 110 as shown in fig. 3. The side guide groove portion 140 is configured to be recessed inward, extend in the vertical direction, have an open upper portion, and be capable of guiding the side guide portion 440 provided on the cover 400 described below downward. In addition, the first side anchor portions 142 protruding outward are provided in the side guide groove portions 140, respectively, so that the cover 400 can be prevented from being detached.

Front recessed portions 150 that can be received when the cover 400 and the latch system 300, which will be described later, are lowered respectively, may be formed on both end surfaces of the base 100 in the longitudinal direction. Further, corner portions 160 extending in the up-down direction and spaced apart from each other are provided at positions which are provided outside the front recess portion 150 and constitute each corner portion of the base 100. The corner portion 160 has an upper and lower guide portion 162, and the upper and lower guide portion 162 is formed at a position where the front recess portion 150 is provided, protrudes in the inward direction, and extends in the up-down direction.

Next, the adapter 200 will be described.

Fig. 4 is a diagram showing a state in which the adapter 200 and the semiconductor chip I are accommodated in the accommodation opening 102 of the base 100.

The adapter 200 is receivable in the receiving opening 102 of the base 100. The adaptor 200 is a component on which a semiconductor chip I is actually placed and mounted, and the adaptor 200 includes: a mounting part 210 which is located at an upper portion of the adaptor 200 and on which a semiconductor chip I is placed; a plurality of contact portions 230; and a receiving member 220 located at a lower portion of the adaptor 200 and receiving the plurality of contact parts 230.

The mounting member 210 has a mounting portion 212, and the mounting portion 212 has a shape corresponding to the outer shape of the semiconductor chip I to place the semiconductor chip I. An outer mounting surface 211 formed in a predetermined step is provided on the outer side of the mounting portion 212 so that the outer portion of the semiconductor chip I abuts and is supported. Therefore, the semiconductor chip I is supported and mounted on the outer seating surface 211 of the mounting part 212 by being placed on the outer seating surface 211. A plurality of through holes 213 are formed in the mounting portion 212 to penetrate in the vertical direction, so that the contact portion 230 can be exposed upward.

The contact accommodating member 220 is a member capable of accommodating the plurality of contact portions 230 therein. The contact portion 230 is formed of a predetermined pin-shaped electronic terminal and extends in the vertical direction, so that the upper portion is exposed to the upper direction and the lower portion is exposed to the lower direction of the mounting member 210 through the through hole 213, whereby the contact portion 230 can be connected to an external electric/electronic device.

Fig. 5 is a view showing a section a-a of fig. 1, and fig. 6 is an enlarged view showing a portion E of fig. 5, and shows a structure of the contact portion 230 provided in the adaptor 200 in detail.

Preferably, the contact portion 230 has a plurality of bent portions 232 and 234, and contact between the contact ball B provided to the semiconductor chip I and the contact portion 230 can be reliably achieved by applying an upward elastic force to the semiconductor chip I.

Also, the outer side surface of the contact portion 230 may be insulated. That is, the coating portion 240 made of an insulating material, for example, is provided on the outer surface of the contact portion 230 to achieve electrical insulation. For example, when the semiconductor chip I is pressed by the latch system 300 while being in contact with the contact portions 230, the pressing amount between the contact portions 230 may be different due to a failure or a design error, and the contact between the adjacent contact portions 230 may be realized as indicated by C. At this time, since the outer side surfaces of the contact portions 230 are insulated, it is possible to prevent the conduction of electricity between the contact portions 230 and to prevent a TEST (TEST) trouble despite the contact between the contact portions 230.

Fig. 7a and 7b are views each showing a structure of a mounting member 210 of an adapter 200 according to an embodiment, fig. 8 is a view showing a cross section D-D of fig. 7a, and fig. 9 is a view showing a state in which a semiconductor chip I is supported on the mounting member 210 of the adapter 200.

The mounting member 210 has a mounting portion 212 capable of housing the semiconductor chip I, and the mounting portion 212 is formed with a through hole 213 capable of penetrating and exposing a plurality of contact portions 230 provided in the contact housing member 220 upward. Further, an outer-side mounting surface 211 on which an outer peripheral portion of the semiconductor chip I can be mounted and supported is formed on an outer peripheral portion of the mounting portion 212, and a center mounting surface 214 on which a center portion of the semiconductor chip I can be mounted and supported is formed on a center portion of the mounting portion 212.

As shown in fig. 8, the outer seating surface 211 and the center seating surface 214 have the same height as each other as indicated by a dotted line G, and when the semiconductor chip I is seated on the mounting member 210, the outer peripheral portion and the center portion of the bottom surface of the semiconductor chip I can be supported on the mounting member 210 together. At this time, as shown in the drawing, the center seating surface 214 may be a quadrangle, but is not necessarily limited thereto.

In the embodiment shown in fig. 8, fig. 20 is a diagram showing a state before the latch system 300 presses the semiconductor chip, and fig. 21 is a diagram showing a state where the latch system 300 presses the semiconductor chip to bring the contact ball of the semiconductor chip into contact with the contact portion of the adapter. As shown in fig. 20 and 21, in a state where the semiconductor chip I is mounted on the mounting member 210, when the latch system 300 described later is in the closed position to press and press the semiconductor chip I and the mounting member 210, the bottom surface of the mounting member 210 is in close contact with the upper surface of the contact accommodating member 220, and is pushed DOWN (PUSH DOWN) until the mounting member stops. Thereby, the semiconductor chip I is pressed and fixed between the latch plate 310 and the mounting member 210 as a sandwich.

Thereby, stable support of the semiconductor chip I can be achieved, and even in the case where the thickness of the semiconductor chip I is thin or a TEST (TEST) of the semiconductor chip I is performed at a high temperature such as 125 ℃, deformation of the semiconductor chip I can be prevented.

As shown in fig. 7b, the mounting member 210 of the adapter 200 may have a spherical support part 219 at the upper part. In this case, the center seating surface 214 and the outer seating surface 211 are not provided, but the spherical support part 219 is supported on the mounting part 212 by being in contact with the semiconductor chip I, so that the entire bottom surface of the semiconductor chip I can be supported on the mounting part 212 of the mounting member 210. In this case, the term "spherical shape" is used to mean a part of a ball, which is not necessarily a perfect spherical cup.

Next, the latch system 300 will be explained.

The latch system 300 is a member that presses the semiconductor chip mounted on the adapter 200, and may include a first latch system 300A and a second latch system 300B that are arranged to face symmetrically in the length direction. The first latching system 300A and the second latching system 300B have the same structure, and the following description of the first latching system 300 can also be applied to the second latching system 300A.

The first latching system 300A may include: a latch plate 310 for pressurizing the semiconductor chip; a latch beam 320 having one end connected with the latch plate 310 and the other end rotatably connected with the cover 400; a guide shaft 330; and a cover shaft 340.

The latch plate 310 is a member that is provided to be in contact with and press the semiconductor chip on the adapter 200, and the latch plate 310 may have a predetermined convex portion or various three-dimensional shapes on a lower surface for easy pressing.

The latch beam 320 has one end connected to the latch plate 310 and the other end rotatably connected to the cover 400 by the cover shaft 340. The connections between the latch beam 320 and the latch plate 310 may be rotatably connected to each other by a latch shaft 312, such as a predetermined shaft.

The latch beam 320 has a first through hole 322 and a second through hole 324 formed therein so that the guide shaft 330 and the cover shaft 340 can be inserted therethrough. The second through hole 324 is formed to penetrate the latch beam 320 in a lateral direction at the other end of the latch beam 320, and the first through hole 322 is formed to penetrate the latch beam 320 in the lateral direction at a middle portion of the latch beam 320.

The first through hole 322 is preferably formed at a position between the second through hole 324 and the latch shaft 312, and the position at which the first through hole 322 is formed is preferably offset closer to the latch shaft 312. That is, the distance between the first through hole 322 and the second through hole 324 is longer than the distance between the first through hole 322 and the latch shaft 312. For example, as shown in fig. 11, a ratio between a distance L1 between the first through hole 322 and the second through hole 324 and a distance L2 between the first through hole 322 and the latch shaft 312 may be 1:0.4 to 1: 0.42.

The guide shaft 330 is inserted into the first through hole 322 and protrudes to both sides of the latch beam 320. That is, the length of the guide shaft 330 is longer than the width of the first through hole 322.

The cover shaft 340 is inserted into the second through hole 324 and protrudes to both sides of the latch beam 320. Whereby the length of the cover shaft 340 is also longer than the width of the second through hole 324.

The state and positional relationship of the latch system 300 mounted on the base 100 will be described below with reference to fig. 12.

The latch system 300 is loaded on the base 100. The latch beam 320 and latch plate 310 are located on the adapter 200 and are configured such that the rear end of the latch beam 320 is placed between the latch keepers 110.

At this time, the first through hole 322 and the second through hole 324 overlap and overlap the rail hole 120 formed in the latch holder 110. At this time, referring to fig. 15 and 16, the first through hole 322 overlaps the fourth line 128 of the rail hole 120, and the second through hole 324 overlaps the first line 122 of the rail hole 120. That is, the first through-hole 322 is located at the inner end of the rail hole 120, and the second through-hole 324 is located at the outer end of the rail hole 120.

The guide shaft 330 is inserted into the first through hole 322 and protrudes to both sides of the latch beam 320, and both sides of the guide shaft 330 are exposed to both sides of the first through hole 322 and inserted into and engaged with the rail hole 120. In addition, the length of the guide shaft 330 may be shorter than the distance between the outer sides of the rail holes 120 so that the guide shaft 330 does not protrude to the outer sides of the rail holes 120.

The cover shaft 340 is inserted into the second through hole 324 and protrudes to both sides of the latch beam 320. In addition, the cover shaft 340 may have a length that can be inserted into a coupling hole 420 of a cover 400, which will be described later, and a length that does not extend to the rail hole 120. That is, the length of the cover shaft 340 may have a length inserted into a coupling hole 420, which will be described later, and the length of the cover shaft 340 is shorter than the distance between the inner side surfaces of the rail holes 120.

Next, the cover 400 will be described with reference to fig. 13 and 14.

The cover 400 is disposed at an upper portion of the base 100 and engaged with the base 100, and the cover 400 is engaged movably in an up-and-down direction with respect to the base 100. The cover 400 has a central opening 402 through which a semiconductor chip can be mounted on the adapter 200. The shape of the central opening 402 may have a shape corresponding to the shape of the semiconductor chip, and may have a quadrangular shape as shown in fig. 13, for example.

A plurality of connection parts 410 are provided inside the cover 400. More specifically, four of the connecting portions 410 are provided, and the connecting portions 410 are provided adjacent to the corner portions of the quadrangular central opening 402. Each of the connection portions 410 is formed with a connection hole 420.

The connection portion 410 is a member that rotatably connects the latch system 300 to the cover 400, and the cover shaft 340 of the latch system 300 is inserted into the connection hole 420 so that the latch system 300 can rotate with respect to the cover 400 centering on the cover shaft 340. The specific arrangement of the connecting portion 410 will be described in more detail in the connection relationship described later.

Further, a front cover 412 may be provided at the outer side in the longitudinal direction of the connection portion 410. The front cover 412 may be disposed at a lengthwise outer side of the connection part 410 and configured by a member covering a lengthwise end face.

Further, an upper and lower guide rail 460 is provided on the lateral outer side of the connecting portion 410, into which the upper and lower guide portions 162 can be inserted and guided. The up-down guide rail 460 is recessed inward in a lateral direction and extends in an up-down direction so as to be inserted into and guide the up-down guide part 162.

A spring installation beam 430 capable of being inserted into the spring insertion groove 130 of the base 100 may be provided at a lower portion of the cover 400. The spring installation beams 430 extend downward and may have an arrangement and number corresponding to the spring insertion grooves 130. The spring set beam 430 is inserted into the spring insertion groove 130, and can change an insertion depth by moving in an up-down direction of the cover 400.

Also, a side guide 440 may be provided at a lower portion of the cover 400 to extend in an up-and-down direction corresponding to the side guide groove part 140 of the base 100. The side guide 440 is positioned at four corner portions of the quadrangular cover 400, and guides the side guide 440 along the side guide groove part 140 according to the up-down movement of the cover 400.

In addition, a side hole 442 may be formed at the side guide 440. The side hole 442 may be penetrated in line with the connection hole 420 of the connection part 410. That is, the side hole 442 is arranged in the lateral direction along the connection hole 420, and penetrates in a line as indicated by a broken line H in fig. 13. The joining relationship with respect to this will be described in the following joining relationship.

And, a second side anchoring portion 444 may be formed at a lower portion of the side guide portion 440. Since the second side anchor 444 is anchored to each other by abutting against the first side anchor 142, the cover 400 can be prevented from being detached from the base 100.

Further, a latch holder accommodating portion 450 may be formed on an inner side surface of the cover 400. The latch holder receiving portion 450 is a portion recessed so that the latch holder 110 can be placed when the cover 400 is lowered, and the latch holder receiving portion 450 may be formed on an upper inner side surface of the side guide portion 440.

As shown in fig. 1, a spring 500 is disposed between the base 100 and the cover 400. The spring 500 exerts elasticity between the base 100 and the cover 400 to elastically maintain the base 100 and the cover 400 at a predetermined position with each other without applying an external force. As shown in fig. 16, the spring 500 is wound centering on the spring installation beam 430, and is inserted into the spring insertion groove 130 in a state of surrounding the spring installation beam 430. That is, the spring installation beam into which the spring 500 is inserted into the spring insertion groove 130, so that the spring 500 exists between the cover 400 and the base 100 to apply an elastic force. The number of springs 500 is not limited.

Fig. 15 is a diagram showing a structure of bonding between the base 100 and the latch system 300 of the semiconductor chip test socket 1 according to the present invention, and fig. 16 is a diagram showing a structure of bonding between the base 100, the latch system 300, and the cover 400 of the semiconductor chip test socket 1 according to the present invention.

Next, the engaging structure of the base 100 and the latch system 300 will be described in detail with reference to fig. 15.

First, as indicated by arrow a, the latch plates 310A, 310B and latch beams 320A, 320B that constitute the latch systems 300A, 300B are placed on the base 100. More specifically, the latch plate 310A, 310B and latch beam 320A, 320B engagement is placed on the structure to which the base 100 and adapter 200 are joined.

Here, the arrangement relationship between the rail hole 120 and the plurality of latch holders 110 will be described in more detail as follows.

The plurality of latch holders 110 are arranged such that every two are paired with each other and the two latch holders 110 are opposite to each other. Thereby, the rail holes 120 formed on the latch holders 110 facing each other overlap each other in a side direction.

That is, as shown in fig. 15, the latch holder 110 includes first to fourth latch holders 110A, 110B, 110C, 110D, and when the first latch holder 110A and the second latch holder 110B face each other and the third latch holder 110C and the fourth latch holder 110D face each other, the guide rail holes 120 of the first latch holder 110A and the second latch holder 110B overlap each other in the side direction, and the guide rail holes 120 of the third latch holder 110C and the fourth latch holder 110D overlap each other in the side direction. I.e. overlap each other when viewed from the lateral direction.

The first and third latch holders 110A and 110C are parallel to each other in the longitudinal direction and are arranged side by side, and the second and fourth latch holders 110B and 110D are parallel to each other in the longitudinal direction and are arranged side by side.

At this time, as described above, the latch beam 320A of the first latch system 300A is placed between the first latch holder 110A and the second latch holder 110B, and the rail hole 120A formed in the first latch holder 110A and the rail hole 120B formed in the second latch holder 110B may overlap with the first through hole 322A formed in the latch beam 320A. Here, the portion overlapping the first through hole 322A is the fourth line 128 portion of the rail holes 120A and 12B. The rail holes 120A and 120B may overlap with the second through hole 324A formed in the latch beam 320A. Here, the portion overlapping with the second through hole 324A is the first wiring 122 portion. Likewise, the second latching system 300B is also disposed between the third latch holder 110C and the fourth latch holder 110D, the arrangement being the same as that described with respect to the first latching system 300A.

Next, as indicated by arrow B, the guide shafts 330A and 330B are inserted into the first through holes 322A and 322B through the guide holes 120A and 120C to connect the two. Here, the guide shafts 330A, 330B pass through the rail hole 120A of the first latch holder 110A, the first through hole 332A of the first latch system 300A, and the rail hole 120B of the second latch holder 100B. The guide shaft 330B passes through the guide rail hole 120C of the third latch holder 110C and the first through hole 332B of the second latch system 300B and through the guide rail hole 120D of the fourth latch holder 100D.

Thereby, both end portions of the guide shaft 330 inserted into the first through-hole 322 are inserted into and hung on the rail holes 120

Next, the arrangement of the cover 400 and the base 100 and the latch system 300 and the joint structure thereof will be described with reference to fig. 16.

First, the cover 400 is placed on the base 100 as indicated by arrow C. More specifically, as described above, the cover 400 is placed on the coupled body of the base 100 and the latch system 300, which are coupled to each other.

At this time, the latch holder 110 is positioned between the side guide 440 and the connecting portion 410, and the guide hole 442, the guide rail hole 120, the coupling hole 420, and the second through hole 324 are aligned in a row so as to overlap in the lateral direction.

That is, as shown in fig. 16, the first to fourth connection parts 410A, 410B, 410C, 410D are provided, and the first connection part 410A and the second connection part 410B face each other so that the connection hole 420A of the first connection part 410A and the connection hole 420B of the second connection part 410B overlap and overlap each other. Further, the third connection portion 410C and the fourth connection portion 410D face each other, so that the connection hole 420C of the third connection portion 410C and the connection hole 420D of the fourth connection portion 410D overlap and coincide with each other. I.e. overlap each other when viewed from the lateral direction.

According to this arrangement, the first latch holder 110A, the first latch system 300A, and the second latch holder 110B are provided between the first connecting portion 410A and the second connecting portion 410B, and the third latch holder 110C, the second latch system 300B, and the fourth latch holder 110D are provided between the third connecting portion 410C and the fourth connecting portion 410D.

In view of the arrangement of the side guide 440 and the side hole 442, the first to fourth side guides 440A, 440B, 440C, 440D are provided on the lateral outer sides of the first to fourth connectors 410A, 410B, 410C, 410D, respectively, and have the first to fourth side holes 442A, 442B, 442C, 442D, respectively.

Next, as indicated by an arrow D, the cover shaft 340A is passed through the first side hole 442A. Further, the cover shaft 340B is also passed through the third side hole 442C. The cover shaft 340A is inserted into and hung on the first and second connection holes 420A and 324A and the second connection hole 420B by passing through the first side hole 442A and the first rail hole 120A. That is, the cover shaft 340A connects the first connection hole 420A and the second through hole 324A and the second connection hole 420B. Similarly, the cover shaft 340B is inserted into the third connection hole 420C, the second through hole 324B, and the fourth connection hole 420D by passing the cover shaft 340B through the third side hole 442C and the third rail hole 120C. That is, the cover shaft 340B connects the third connection hole 420C, the second through hole 324C, and the fourth connection hole 420D. Thus, both end portions of the cover shafts 340A, 340B inserted into the second through holes 324 are inserted into and hung on the coupling holes 420A, 420B, 420C, 420D, respectively. Here, the cover shafts 340A, 340B have a length such that the second through holes 324A, 324 and the connection holes 420A, 420B, 420C, 420D are connected to each other, and do not reach the rail holes 120A, 120B, 120C, 120D and cannot be caught by the rail holes 120A, 120B, 120C, 120D. That is, the cover shafts 340A and 340B connect the connection holes 420A, 420B, 420C, and 420D and the second through holes 324A and 324B, respectively.

In addition, at this time, the first to fourth side guide portions 440A, 440B, 440C, 440D move along the first to fourth side guide groove portions 140A, 140B, 140C, 140D formed in the side base 100, respectively, and the first side anchor portion 444 and the second side anchor portion 144 provided respectively are anchored to each other.

With the engagement structure as described above, the engagement of the base 100, the latch system 300, and the cover 400 can be easily achieved, and the arrangement of the guide shaft 330 and the cover shaft 340 can be easily achieved.

Fig. 17 is an enlarged view of a portion C of fig. 1, showing a connection relationship between the upper and lower guide portions 162 of the base 100 and the upper and lower guide rails 460 of the cover. Fig. 18 is a view showing a form in which the base 100 and the cover 400 are joined by providing the upper and lower guide portions 162 and the upper and lower guide rails 460 at the respective corners of the base 100 and the cover 400, and fig. 19 is a view showing the repulsive force of the contact portion and the force applied to the semiconductor chip and the latch system 300.

As described above, the vertical guide portions 162 protruding inward and extending in the vertical direction are provided inside the corner portions 160 of the base 100. The upper and lower guide rails 460, which are inserted and guided by the upper and lower guide portions 162, are provided on the outer side surface of the connection portion 410 provided in the cover 400. The upper and lower guide rails 460 are recessed inward and extend in the vertical direction so as to be inserted into and guide the upper and lower guide portions 162.

Preferably, as shown in fig. 18, the base 100 and the cover are formed in a quadrangular shape, the upper and lower guide portions 162 are provided at each corner portion 160 of the base 100, and the upper and lower guide rails 460 are provided on the outer side surfaces of each connecting portion 410, thereby enabling four-way coupling.

Thus, when the cover 400 and the base 100 are coupled, the vertical displacement of the cover 400 can be guided by the vertical guide rails 460 and the vertical guide portions 162 formed in the cover 400.

Further, as shown in fig. 19, even when the latch plate 310 of the latch system 300 receives an upward force F1 due to the repulsive force of the contact part 230 and the latch system 300 receives a force F2 pushing the latch system 300 in the outer direction, the upper and lower guide parts 162 and the upper and lower guide rails 460 are abutted and supported with each other, so that it is possible to prevent the cover from being pushed by the repulsive force of the contact part 230 and to prevent the loss of the elastic force of the spring 500.

In addition, at this time, the guide rail hole 120 can also support the upward force F1. That is, since the fourth line 128 extending in the horizontal direction is provided at the inner end of the rail hole 120 and the guide shaft 330 is positioned on the fourth line 128 of the rail hole 120 in the position where the latch system 300 is closed, the fourth line 128 supports the upward force to which the guide shaft 330 is subjected.

The operation of the semiconductor chip test socket 1 according to the present invention will be described below with reference to fig. 20 to 26.

The closed position of the latching system 300 is described with reference to fig. 20-22, and the open position of the latching system 300 is described with reference to fig. 23-26.

The latching system 300 moves between a closed position and an open position. Here, the closed position refers to a state in which the latch system 300 is closed and the semiconductor chip is pressurized by the latch system 300. In the closed state, the longitudinal outer end of the latch system 300 is positioned at the upper portion by the spring 500 receiving the elasticity in the upward direction, and the inner side of the latch plate 310 presses the semiconductor chip on the adapter 200 in the downward direction.

The open position refers to the latch system 300 being in an open state in which the cover 400 is close to the base 100 and lowered by compressing the spring 500 by an external force. Thereby, the outer end of the latch system 300 is also lowered, and the guide shaft 330 moves along the rail hole 120 to open the latch system 300 and expose the adapter 200.

First, with reference to fig. 20 and 21, the pressurization of the semiconductor chip I by the latch system 300 and the contact between the contact ball B of the semiconductor chip I and the contact portion 230 of the adapter 200 caused by the pressurization when the latch system 300 is in the closed state will be described.

Fig. 20 shows a state before the latch system 300 presses the semiconductor chip I, and fig. 21 shows a state where the latch system 300 presses the semiconductor chip I to bring the contact ball B of the semiconductor chip I into contact with the contact portion 230 of the adapter 200. Fig. 22 is a diagram showing a state in which the latch system 300 is in the closed position.

The state of fig. 21 is a state in which the semiconductor chip I is housed in the adapter 200 and the spring 500 applies elasticity to the cover 400 and the base 100 without applying an external force, and shows that the latch system 300 is in the closed position. Fig. 21 shows an embodiment in which the mounting member 210 includes an outer mounting surface 211 and a center mounting surface 214 as in the embodiment shown in fig. 8.

Referring to fig. 21, since the latch plate 310 of the latch system 300 presses the semiconductor chip, the semiconductor chip I and the mounting member 210 of the adapter 200 are pressed and pushed DOWN (PUSH DOWN), and thus the contact portion 230 provided in the contact accommodating member 220 can be exposed to the upper side through the through hole 213 of the mounting member 210 to achieve contact between the contact portion 230 and the contact ball B.

Considering such a closed position, the cover 400 receives an upward elastic force by the spring 500, and an outer end of the latch system 300 connected to the cover 400 by the cover shaft 340 also receives an upward force. That is, the outer end of the latch beam 320 receives an upward force.

At this time, the guide shaft 330 is supported to be located at the inner end of the rail hole 120 and fixed in position. That is, when the latch system 300 is in the closed position, the guide shaft 330 is abutted and supported at the end of the fourth line 128 of the guide rail hole 120.

Thereby, the lengthwise inner end of the latch beam 320 applies downward pressing force to the latch plate 310. That is, the upward force G1 applied to the outer end of the latch beam 320 acts as a rotational force R about the guide shaft 330 and is converted into a downward force G2 at the inner end position of the latch beam 320. The inner end of the latch beam 320 pressurizes the semiconductor chip located below by the latch plate 310.

Here, as shown in fig. 11, since the distance L1 between the cover shaft 340 and the guide shaft 330 is greater than the distance L2 between the guide shaft 330 and the latch shaft 312, the semiconductor chip can be more effectively pressurized with a structure like a lever.

That is, the latch beam 320 performs the function of a lever having a force point, an action point, and a support point. Here, the cover shaft 340 for transmitting the upward force generated by the cover 400 to the outer end of the latch beam 320 functions as a point of force. The guide shaft 330, which is fixed in position by the end of the third line 126 of the rail hole 120 and is inserted into the first through hole 322 of the latch beam 320, functions as a support point. The inboard end of the latch beam 320 and the latch plate 310 connected thereto function as the point of action. That is, the upward force applied to the force point changes its direction by the support point, and acts as a downward force. Therefore, the upward force applied to the cover 400 by the spring 500 can be easily transmitted to the latch plate 310. Therefore, the semiconductor chip can be fixed without wasting a force.

Further, the process of moving the latch system 300 from the closed position to the open position is considered as follows with reference to fig. 23 to 26.

As shown in fig. 23 to 26, when the lid 400 is moved by being pressed downward as indicated by an arrow P, the lid shaft 340 is lowered together. The outer end of the latch system 300 descends and moves together with the cover shaft 340 along with the movement of the cover shaft 340. At this point, the latching system 300 and the connecting portion 410 are partially lowered through the front recess 150 of the base 100. Since the middle portion of the latch system 300 is connected to the rail hole 120 by the guide shaft 330, the inner portion of the latch system 300 moves in an upward direction during the descent. Then, the latch holder 110 moves into the latch holder accommodating portions 450 formed inside the covers 400.

Thereby, the latch system 300 rotates about the cover shaft 340 while the cover shaft 340 is lowered, and the rotation locus follows the rail hole 120. That is, since the latch system 300 rotates about the cover shaft 340 and the guide shaft 330 is caught by the rail hole 120, the guide shaft 330 follows a path moving along the rail hole 120. Thereby, the guide shaft 330 moves toward the first line along the third line 126 and the second line 124 of the guide rail hole 120.

With the lid 400 fully lowered, the latch system 300 is generally upright with the open position, as shown in fig. 26. The adapter 200 or the semiconductor chip mounted on the adapter 200 is exposed in the open position, so that the semiconductor chip can be mounted on the adapter 200 or the semiconductor chip can be detached from the adapter 200.

While the preferred embodiments have been illustrated and described, the present invention is not limited to the specific embodiments described above, and it is needless to say that various modifications can be made by those skilled in the art without departing from the gist of the present invention claimed in the claims, and such modifications cannot be understood from the technical idea or the prospect of the present invention.

Claims (12)

1. A semiconductor chip test socket comprising:

a quadrangular base having a central receiving opening penetrating in a vertical direction;

an adapter inserted into the central receiving opening of the base and capable of mounting a semiconductor chip on an upper portion;

a cover coupled to an upper portion of the base movably in an up-down direction with respect to the base, the cover having an opening portion into which a semiconductor chip is inserted;

a spring that is provided between the base and the cover and exerts elasticity between the base and the cover; and

a latch system capable of moving to an open position or a closed position with the up-and-down movement of the cover,

wherein the latch system is located at a closed position where the cover is located at an upper portion by elasticity applied by the spring and the semiconductor chip mounted on the adapter is pressurized and supported, and is located at an open position where the semiconductor chip is exposed through the opening portion when the cover is moved downward by an external force,

a plurality of latch holders formed with rail holes are provided on the base,

the latch system includes:

a cover shaft protruding in both side directions in such a manner as to rotatably connect the latch system to the cover; and

a guide shaft provided at a position spaced apart from the cover shaft by a predetermined distance and protruding in both side directions in parallel with the cover shaft, the guide shaft being inserted into the guide rail hole,

wherein the latch system rotates around the cover shaft as a center with the up-and-down movement of the cover, the guide shaft moves along the rail hole to guide the latch system to move between an open position and a closed position along the rail hole,

the guide rail hole is configured to penetrate in a lateral direction in such a manner that the guide shaft penetrates in the lateral direction,

the guide rail hole includes:

a first line formed adjacent to an outer end of the base in a direction and extending in a vertical direction;

a second line extending continuously from the first line, bent and extending from an upper end of the first line in an inner direction of the base, and having a boat shape protruding in an upward direction;

a third line extending continuously from the second line, further extending from the second line toward an inner side of the base, and bent and extending diagonally downward; and

a fourth line provided at an end of the third line and extending horizontally in a lateral direction,

the latch system includes:

a latch plate which is located on the adapter and presses down a semiconductor chip mounted on the adapter; and

a latch beam having one end in a length direction connected with the latch plate and the other end rotatably connected to the cover through the cover shaft,

the guide shaft is provided at a middle portion in a length direction of the latch beam,

the latch beam has a first through hole penetrating in a lateral direction at a middle portion in a longitudinal direction to enable the guide shaft to penetrate in the lateral direction,

the latch beam has a second through hole penetrating in a lateral direction at one end in a longitudinal direction to allow the cover shaft to penetrate in the lateral direction,

the cover has a connecting portion provided inside the opening portion and respectively provided on both sides of the latch beam, the connecting portion being provided to overlap with one end of the latch beam in a length direction in a side direction,

a connection hole through which the cover shaft can pass is formed in the connection portion,

the cover shaft connects the second through hole and the connection hole to enable the latch beam to rotate with respect to the cover,

when the latch system is in the closed position,

a second through hole formed at the latch beam, a part of the first wire formed at the rail hole of the latch holder, and the connection hole formed at the connection part of the cover are overlapped in a lateral direction,

the cover shaft passes through the guide rail hole and is inserted into the connecting hole and the second through hole, so that the latch system and the cover are connected through the cover shaft.

2. The semiconductor chip test socket according to claim 1,

the base is formed in a hexahedral shape,

the plurality of latch holders are respectively provided at upper corner portions of the base,

the two latch holders are disposed to face each other such that the rail holes formed on the two latch holders overlap each other in a lateral direction,

one latch system is provided between the two latch holders, and both end portions of the guide shaft protruding in a lateral direction of the latch system are provided to be inserted into two rail holes, respectively, to move the latch system along the rail holes.

3. The semiconductor chip test socket according to claim 1,

the guide shaft is located at and supported by an end of a fourth line of the guide rail hole when the latch system is in a closed position,

the guide shaft is located at an end of the first line of the guide track hole when the latch system is in an open position.

4. The semiconductor chip test socket according to claim 1,

the latch beam and the latch plate are configured to be connected by a latch shaft and rotatable relative to each other,

the latch shaft, the guide shaft and the cover shaft are parallel to each other,

the distance between the latch shaft and the guide shaft is shorter than the distance between the guide shaft and the cover shaft.

5. The semiconductor chip test socket according to claim 4,

the ratio of the distance between the first through-hole and the second through-hole to the distance between the first through-hole and the latch shaft is 1:0.4 to 1: 0.42.

6. The semiconductor chip test socket according to claim 1,

the base has a side guide groove portion at a side portion thereof, the side guide groove portion being recessed inward and extending in an up-down direction,

the cover has a side guide portion provided at a position corresponding to the guide groove portion and overlapping the connection portion in a side direction to cover the connection portion, the side guide portion moving in an up-down direction along the guide groove portion as the cover moves in the up-down direction,

a side hole is formed in the guide portion, and the side hole overlaps the connection hole in a lateral direction and allows the cover shaft to pass through.

7. The semiconductor chip test socket according to claim 1,

four corner parts of the base are provided with corner parts protruding upwards, the inner sides of the corner parts are provided with upper and lower guide parts extending along the vertical direction and protruding towards the inner side direction,

an upper and lower guide rail extending in the vertical direction and recessed inward is formed on the outer side surface of the connecting part,

the upper and lower guide portions are inserted into the upper and lower guide rails, and thus the cover is guided to move in the vertical direction by the upper and lower guide portions and the upper and lower guide rails.

8. The semiconductor chip test socket according to claim 1,

the cover has one or more spring set beams projecting downwardly and extending therefrom,

the base has a spring insertion groove upwardly exposed in a manner in which the spring setting beam is inserted,

the spring is inserted into the spring insertion groove together with the spring installation beam in a state of being wound around the spring installation beam as a center, and applies an elastic force between the cover and the base.

9. The semiconductor chip test socket according to claim 1,

the adapter includes:

a mounting member which is provided on an upper portion of the adapter and mounts a semiconductor chip on an upper surface; and

a contact accommodating member provided below the mounting member and accommodating a plurality of contact portions,

the mounting member has a mounting portion for mounting a semiconductor chip,

the mounting portion has:

a plurality of through holes that penetrate in the vertical direction so that the plurality of contact portions are exposed upward; and

and an outer mounting surface formed in a predetermined step along an outer side of the mounting portion so as to mount and support an outer side surface of the semiconductor chip.

10. The semiconductor chip test socket according to claim 9,

the contact portion has at least two bent portions between the upper portion and the lower portion so as to apply an elastic force upward when the semiconductor chip is pressed in abutment with the upper portion,

an electrically insulating element is formed on the outer side surface between the bent portions.

11. The semiconductor chip test socket according to claim 9,

the mounting part has a center seating surface at a center portion, the center seating surface having the same height as the outer seating surface and having a predetermined area to support a center surface of a semiconductor chip.

12. The semiconductor chip test socket according to claim 1,

the adapter includes:

a mounting member provided on an upper portion of the adapter and used for mounting a semiconductor chip on an upper surface; and

a contact accommodating member provided below the mounting member and accommodating a plurality of contact portions,

the mounting member has a mounting portion for mounting a semiconductor chip,

a plurality of spherical supporting parts are arranged on the mounting part.

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