KR20100075108A - Universal receptacle for testing qfp type package - Google Patents

Abstract

PURPOSE: A universal receptacle for a QFP package test is provided to reduce package test costs by using the QFP packages of various types on the same test board. CONSTITUTION: A universal receptacle(200) for a QFP package test is comprised of an insulation plate with a square shape. A fastener(220) is formed on each edge of a square. Four pin hole groups(230) are comprised of 3 x 18 matrix structure of 54 pin holes which are adjacent to respective four sides between the fasteners with the same space. An insulating plate of the receptacle is made of phenol resin or epoxy resin materials.

Description

Universal receptacle for testing QFP type package

The present invention relates to a general purpose receptacle for testing a QFP package, and more particularly, to a general purpose receptacle for testing a QFP package in which various types of QFP packages can be used on the same test board.

In general, the semiconductor assembly process separates a semiconductor device manufactured by a wafer manufacturing process into individual chips, electrically connects the lead frame and the individual chips, and protects the electrical connection portions of the lead frame and the semiconductor chip from the external environment. It consists of the process of shape | molding a package main body.

The semiconductor package may be a resin sealing package, a tape carrier package (TCP) package, a glass sealing package, a metal sealing package, or the like according to its type. Such semiconductor packages are classified into insertion type and surface mount technology (SMT) types according to the mounting method.

Representative examples of the insertion type include a dual in-line package (DIP) and a pin grid array (PGA), and surface mount types include a quad flat package (QFP) and a plastic leaded chip carrier (PLCC). ), A ceramic leaded chip carrier (CLCC), and a ball grid array (BGA).

The package test process performs an electrical characteristic test on a semiconductor package that has completed the assembly process and sorts the product into defective or defective products. The package test process includes an electrical test signal generated from an inspection apparatus called a tester. It is a series of processes to check whether the semiconductor package works properly by applying it to.

In order to transfer the test signals generated by the tester to the actual semiconductor package, intermediate media that can be connected to each other are required. The test socket is used here.

That is, by checking the test signal generated from the tester while the external connection terminals of the semiconductor package are in direct contact with the terminals of the test socket, the semiconductor package characteristics are checked for abnormalities. On the other hand, the shape and type of test sockets vary greatly depending on the type of semiconductor package.

1 is a photograph showing a conventional test socket for a QFP, FIG. 2 is a plan view of a conventional test socket for a QFP, and FIG. 3 is a plan view of a receptacle for a QFP.

As shown in FIG. 2, the test socket 10 for the QFP is installed on a test board (not shown). The test socket 10 is a consumable to be replaced according to a replacement cycle. It is installed on the test board via a receptacle 20 as shown in FIG.

That is, the receptacle 20 is mounted on the test board upper surface as a pin or needle insertion type, and the receptacle pins (not shown) protruding to the lower surface of the test board are soldered and electrically connected to the test board. do. The test socket 10 is also mounted on the upper surface of the receptacle 20 in a pin insertion type.

Typically, the test socket 10 used to test the QFP has a plurality of contact pins 12 arranged in a quadrangular shape on the top of a square injection-shaped socket frame 11, and four corner portions of the socket frame 11. In each of the fixing holes 13 for screwing the tester to the PCB is formed.

The socket frame 11 is formed with a pinhole (not shown) such that each contact pin 12 is press-fitted. Each contact pin 12 is made of gold-plated nickel, and is a single piece.

On the other hand, when manufacturing a test board (test board) in the case of the QFP type attached to the receptacle 20 as shown in Figure 3 attached to the test board, the QFP test socket 10 is mounted on the receptacle 20 To test the semiconductor chip.

However, the hole spacing of the receptacle connected to the pins or needles of the test socket for QFP is different according to various QFP package types, so that even if a high-quality test board is made and the QFP package type is different, it cannot be reused. There is a problem that must be produced.

Accordingly, an object of the present invention is to provide a general-purpose receptacle for testing a QFP package that can use various types of QFP packages on the same test board.

The general purpose receptacle for testing a QFP package of the present invention for realizing the object as described above is a general purpose receptacle for testing a QFP package consisting of a rectangular insulating plate, fasteners formed at each corner of the rectangle; And four pinhole groups in which 54 pinholes arranged at equal intervals adjacent to each of the four sides between the fasteners are formed in a 3 × 18 matrix structure.

In addition, the insulating plate of the receptacle is characterized in that the production of phenol resin or epoxy resin material.

According to the general-purpose receptacle for testing a QFP package according to the present invention, various types of QFP packages are used on the same test board, thereby reducing the cost of the package test process.

Hereinafter, with reference to the accompanying drawings, the configuration and operation of the preferred embodiment of the present invention will be described in detail so that those skilled in the art can easily practice.

4 is a plan view illustrating a universal receptacle for testing a QFP package according to an embodiment of the present invention, and FIG. 5 is a 100-pin QFP package test socket and 208 mounted to a universal receptacle for testing a QFP package according to an embodiment of the present invention. This is a side view showing the pin spacing of the pin QFP package test socket.

The general-purpose receptacle 200 for testing a QFP package according to an embodiment of the present invention includes an insulating plate 210, a fastener 220, and a pinhole group 230.

The insulating plate 210 is formed in a substantially rectangular shape, and preferably made of a phenolic resin or an epoxy resin.

The fastener 220 is formed at each corner of the insulating plate 210, and a fastener having the same size is formed in the corresponding test socket, and the test socket and the receptacle are connected to the test board by a fastening means such as a bolt. It is to fix the (200).

The pinhole group 230 includes four subgroups 230T, 230R, and 230B in which 54 pinholes arranged at equal intervals adjacent to each other between the fasteners 220 are formed in a 3 × 18 matrix structure. , 230L).

Here, the spacing between the pinhole and the pinhole of the pinhole group 230 is preferably formed to 0.8 ~ 1.2mm.

According to a general-purpose receptacle for testing a QFP package according to an embodiment of the present invention, the upper surface of the insulating plate on the substantially rectangular plate has a predetermined pitch and a plurality of rows and columns, and a plurality of needles in which all the needles present in the test socket are in contact. Conductive pin holes are formed.

Thus, the number of the conductive pinholes is equal to or greater than the number of pins of the QFP package having the largest number of pins among the QFP packages to be tested.

Therefore, by mounting a test socket corresponding to the body size of the QFP package to be tested in the universal receptacle for testing a QFP package according to an embodiment of the present invention, it is possible to quickly and accurately test the QFP package of various sizes do.

In this case, the spacing between the needles of the test socket of the QFP package to be tested coincides with the spacing between the pinholes of the general-purpose receptacle for testing a QFP package according to an embodiment of the present invention, and is not related to the size of the QFP package or the number of pins. none.

In other words, if the spacing of the pinholes connected to the needles of the test sockets on the receptacle is the same regardless of the QFP package type, and the spacing between the needles of the test sockets is the same, all the QFPs with one test board and the receptacle Package type semiconductor chips can be tested.

Therefore, since the most common QFP package type having the largest number of pins is a 208-pin QFP package, a receptacle containing a 208-pin test socket becomes a standard. In addition, 144 and 100 pin test sockets are created to fit all types of test sockets into standard receptacles.

However, the consideration here is that chips smaller than the 208-pin thin quad flat package (TQFP) package also have a small test socket. Therefore, the size of the standard receptacle should be smaller.

And since the spacing between the needles of the test socket is standardized, it should be made of a combination of various QFP package types as shown in FIG.

In FIG. 4, the pinhole included in the broken line is a pinhole used when testing a 144-pin QFP package, and the pinhole included in a dashed line is used when testing a 100-pin QFP package. It's a pinhole.

In addition, as shown in FIG. 5, even if the socket of another TQFP package, the spacing between the needles must match exactly. Shown at the top of FIG. 5 attached is a test socket of a 100 pin QFP package, and shown at the bottom is a test socket of a 208 pin QFP package.

This is to ensure that the needle of the test socket accurately enters the pinhole of the general-purpose receptacle for testing a QFP package according to an embodiment of the present invention.

It is apparent to those skilled in the art that the present invention is not limited to the above-described embodiments and can be practiced in various ways within the scope not departing from the technical gist of the present invention. It is.

1 is a photograph showing a test socket for a conventional QFP,

2 is a plan view of a test socket for a conventional QFP,

3 is a plan view of a receptacle for a QFP;

4 is a plan view showing a general purpose receptacle for testing a QFP package according to an embodiment of the present invention;

Figure 5 is a side view showing the pin spacing of the 100-pin QFP package test socket and the 208-pin QFP package test socket mounted to the universal receptacle for testing QFP package according to an embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

10: test socket 20, 200: receptacle

11: Socket frame 12: Contact pin

13: fixing hole 210: insulating plate

220: fastener 230: pinhole group

Claims (2)

Claims [1] A general-purpose receptacle for testing a QFP package consisting of a rectangular insulating plate, comprising: a fastener formed at each corner of the quadrangle; And four pinhole groups in which 54 pinholes arranged at equal intervals adjacent to each of the four sides between the fasteners are formed in a 3 × 18 matrix structure. . The general-purpose receptacle for testing a QFP package according to claim 1, wherein the insulating plate of the receptacle is made of phenol resin or epoxy resin.

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