CN107733389A - 一种石英晶体大片及利用其制造小型晶片的方法 - Google Patents
一种石英晶体大片及利用其制造小型晶片的方法 Download PDFInfo
- Publication number
- CN107733389A CN107733389A CN201711057687.2A CN201711057687A CN107733389A CN 107733389 A CN107733389 A CN 107733389A CN 201711057687 A CN201711057687 A CN 201711057687A CN 107733389 A CN107733389 A CN 107733389A
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- Prior art keywords
- quartz crystal
- small chips
- protective film
- metal protective
- large stretch
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- 239000013078 crystal Substances 0.000 title claims abstract description 106
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 99
- 239000010453 quartz Substances 0.000 title claims abstract description 96
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 60
- 229910052751 metal Inorganic materials 0.000 claims abstract description 60
- 230000001681 protective effect Effects 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 22
- 238000005260 corrosion Methods 0.000 claims abstract description 21
- 230000007797 corrosion Effects 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 150000002739 metals Chemical class 0.000 claims abstract description 10
- 238000004544 sputter deposition Methods 0.000 claims description 9
- 230000003628 erosive effect Effects 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000005530 etching Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
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CN201711057687.2A CN107733389B (zh) | 2017-11-01 | 2017-11-01 | 一种石英晶体大片及利用其制造小型晶片的方法 |
Applications Claiming Priority (1)
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CN201711057687.2A CN107733389B (zh) | 2017-11-01 | 2017-11-01 | 一种石英晶体大片及利用其制造小型晶片的方法 |
Publications (2)
Publication Number | Publication Date |
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CN107733389A true CN107733389A (zh) | 2018-02-23 |
CN107733389B CN107733389B (zh) | 2020-12-01 |
Family
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CN201711057687.2A Active CN107733389B (zh) | 2017-11-01 | 2017-11-01 | 一种石英晶体大片及利用其制造小型晶片的方法 |
Country Status (1)
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CN (1) | CN107733389B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108512518A (zh) * | 2018-03-28 | 2018-09-07 | 应达利电子股份有限公司 | 一种低等效串联电阻小型晶片制作方法及系统 |
CN111058095A (zh) * | 2019-12-12 | 2020-04-24 | 南京中电熊猫晶体科技有限公司 | 一种超小型石英晶片的腐蚀刻蚀方法 |
Citations (11)
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JPS5890814A (ja) * | 1981-11-25 | 1983-05-30 | Citizen Watch Co Ltd | 小型プラノコンペツクス振動片とその加工方法 |
CN1734750A (zh) * | 2004-06-29 | 2006-02-15 | 株式会社半导体能源研究所 | 制造薄膜集成电路和元件衬底的方法 |
CN201830214U (zh) * | 2010-07-23 | 2011-05-11 | 应达利电子(深圳)有限公司 | 一种用于表面贴装石英晶体谐振器和振荡器加工的大基片 |
CN201898485U (zh) * | 2010-11-03 | 2011-07-13 | 应达利电子(深圳)有限公司 | 一种用于表面贴装石英晶体谐振器和振荡器的玻璃外盖大片 |
CN102522329A (zh) * | 2012-01-09 | 2012-06-27 | 薛列龙 | 一种半导体芯片的加工方法 |
CN102683278A (zh) * | 2011-03-08 | 2012-09-19 | 上海华虹Nec电子有限公司 | 芯片和芯片的分离方法 |
CN103021892A (zh) * | 2012-12-28 | 2013-04-03 | 日月光半导体(昆山)有限公司 | 无外引脚半导体封装构造及其制造方法与导线架条 |
CN103086318A (zh) * | 2013-01-11 | 2013-05-08 | 烟台睿创微纳技术有限公司 | 一种mems硅晶圆片划片切割和结构释放方法 |
CN104064519A (zh) * | 2014-06-26 | 2014-09-24 | 昆山光微电子有限公司 | 有镂空薄膜结构的硅片切割方法 |
CN106800272A (zh) * | 2017-02-17 | 2017-06-06 | 烟台睿创微纳技术股份有限公司 | 一种mems晶圆切割和晶圆级释放及测试方法 |
CN107039341A (zh) * | 2015-12-04 | 2017-08-11 | 株式会社迪思科 | 晶片的加工方法 |
-
2017
- 2017-11-01 CN CN201711057687.2A patent/CN107733389B/zh active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5890814A (ja) * | 1981-11-25 | 1983-05-30 | Citizen Watch Co Ltd | 小型プラノコンペツクス振動片とその加工方法 |
CN1734750A (zh) * | 2004-06-29 | 2006-02-15 | 株式会社半导体能源研究所 | 制造薄膜集成电路和元件衬底的方法 |
CN201830214U (zh) * | 2010-07-23 | 2011-05-11 | 应达利电子(深圳)有限公司 | 一种用于表面贴装石英晶体谐振器和振荡器加工的大基片 |
CN201898485U (zh) * | 2010-11-03 | 2011-07-13 | 应达利电子(深圳)有限公司 | 一种用于表面贴装石英晶体谐振器和振荡器的玻璃外盖大片 |
CN102683278A (zh) * | 2011-03-08 | 2012-09-19 | 上海华虹Nec电子有限公司 | 芯片和芯片的分离方法 |
CN102522329A (zh) * | 2012-01-09 | 2012-06-27 | 薛列龙 | 一种半导体芯片的加工方法 |
CN103021892A (zh) * | 2012-12-28 | 2013-04-03 | 日月光半导体(昆山)有限公司 | 无外引脚半导体封装构造及其制造方法与导线架条 |
CN103086318A (zh) * | 2013-01-11 | 2013-05-08 | 烟台睿创微纳技术有限公司 | 一种mems硅晶圆片划片切割和结构释放方法 |
CN104064519A (zh) * | 2014-06-26 | 2014-09-24 | 昆山光微电子有限公司 | 有镂空薄膜结构的硅片切割方法 |
CN107039341A (zh) * | 2015-12-04 | 2017-08-11 | 株式会社迪思科 | 晶片的加工方法 |
CN106800272A (zh) * | 2017-02-17 | 2017-06-06 | 烟台睿创微纳技术股份有限公司 | 一种mems晶圆切割和晶圆级释放及测试方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108512518A (zh) * | 2018-03-28 | 2018-09-07 | 应达利电子股份有限公司 | 一种低等效串联电阻小型晶片制作方法及系统 |
CN111058095A (zh) * | 2019-12-12 | 2020-04-24 | 南京中电熊猫晶体科技有限公司 | 一种超小型石英晶片的腐蚀刻蚀方法 |
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CN107733389B (zh) | 2020-12-01 |
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Effective date of registration: 20200928 Address after: 518000 south side of innovation Avenue and east side of Bianxi River, EBU Town, Shenzhen Special Cooperation Zone, Shenzhen City, Guangdong Province Applicant after: Shenzhen Shenshan special cooperation zone Yingdali Electronic Technology Co.,Ltd. Address before: 518000 Guangdong, Shenzhen, Shenzhen, Guangdong, Baoan District Fuyong street, Fenghuang Second Industrial Park, Dapu Industrial Park, 3 building, building 3, East and C building. Applicant before: INTERQUIP ELECTRONICS (SHENZHEN) Co.,Ltd. |
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