CN107535052B - 电路图案形成片、电路图案制造装置、电路图案制造方法及电路图案制造程序 - Google Patents

电路图案形成片、电路图案制造装置、电路图案制造方法及电路图案制造程序 Download PDF

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Publication number
CN107535052B
CN107535052B CN201680024594.7A CN201680024594A CN107535052B CN 107535052 B CN107535052 B CN 107535052B CN 201680024594 A CN201680024594 A CN 201680024594A CN 107535052 B CN107535052 B CN 107535052B
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CN
China
Prior art keywords
circuit pattern
laser
sheet
manufacturing apparatus
mixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201680024594.7A
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English (en)
Chinese (zh)
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CN107535052A (zh
Inventor
大嶋英司
日下部富男
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Kantatsu Co Ltd
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Kantatsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to CN202110690656.0A priority Critical patent/CN113784527A/zh
Publication of CN107535052A publication Critical patent/CN107535052A/zh
Application granted granted Critical
Publication of CN107535052B publication Critical patent/CN107535052B/zh
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2045—Exposure; Apparatus therefor using originals with apertures, e.g. stencil exposure masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201680024594.7A 2015-06-09 2016-06-01 电路图案形成片、电路图案制造装置、电路图案制造方法及电路图案制造程序 Expired - Fee Related CN107535052B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110690656.0A CN113784527A (zh) 2015-06-09 2016-06-01 电路图案形成片、电路图案制造装置、电路图案制造方法及电路图案制造程序

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-116660 2015-06-09
JP2015116660A JP6668004B2 (ja) 2015-06-09 2015-06-09 回路パターン製造装置、回路パターン製造方法および回路パターン製造プログラム
PCT/JP2016/066225 WO2016199641A1 (ja) 2015-06-09 2016-06-01 回路パターン形成用シート、回路パターン製造装置、回路パターン製造方法および回路パターン製造プログラム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202110690656.0A Division CN113784527A (zh) 2015-06-09 2016-06-01 电路图案形成片、电路图案制造装置、电路图案制造方法及电路图案制造程序

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Publication Number Publication Date
CN107535052A CN107535052A (zh) 2018-01-02
CN107535052B true CN107535052B (zh) 2021-07-09

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CN202110690656.0A Pending CN113784527A (zh) 2015-06-09 2016-06-01 电路图案形成片、电路图案制造装置、电路图案制造方法及电路图案制造程序

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Country Status (4)

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US (2) US10962882B2 (enExample)
JP (1) JP6668004B2 (enExample)
CN (2) CN107535052B (enExample)
WO (1) WO2016199641A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6839476B2 (ja) 2016-09-26 2021-03-10 カンタツ株式会社 パターン形成用シート
JP6892727B2 (ja) 2016-09-26 2021-06-23 カンタツ株式会社 パターン製造装置、パターン製造方法およびパターン製造プログラム
JP2018182126A (ja) 2017-04-17 2018-11-15 カンタツ株式会社 パターン形成用シート、パターン製造装置およびパターン製造方法
DE102018112561A1 (de) * 2018-05-25 2019-11-28 Sacher Lasertechnik Gmbh Laserdioden-Anordnung mit einem externen Resonator
JP2020068339A (ja) * 2018-10-26 2020-04-30 カンタツ株式会社 多層基板形成方法および多層基板形成装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243823A (ja) * 2002-02-13 2003-08-29 Daiken Kagaku Kogyo Kk 回路基板における感光ペースト２段塗着方法及び回路基板の製造方法
JP2009188014A (ja) * 2008-02-04 2009-08-20 Nsk Ltd 露光装置
CN101743515A (zh) * 2007-10-03 2010-06-16 株式会社尼康 空间光调制单元、照明设备、曝光设备和装置制造方法

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3891441A (en) 1969-08-01 1975-06-24 Fuji Photo Film Co Ltd Light-sensitive stencil printing material with porous support and cover sheets
US4304839A (en) 1975-06-03 1981-12-08 E. I. Du Pont De Nemours And Company Positive working multilayer photosensitive tonable element
JPH07235772A (ja) * 1994-02-25 1995-09-05 Fujitsu Ltd 薄膜多層回路基板およびその製造方法
JPH08230048A (ja) 1995-02-24 1996-09-10 Ricoh Co Ltd ３次元造形装置
JP2000238137A (ja) 1999-02-17 2000-09-05 Mitsubishi Heavy Ind Ltd 光造形装置及び光造形方法
DE20106887U1 (de) 2001-04-20 2001-09-06 Envision Technologies GmbH, 45768 Marl Vorrichtung zum Herstellen eines dreidimensionalen Objekts
US6894712B2 (en) 2002-04-10 2005-05-17 Fuji Photo Film Co., Ltd. Exposure head, exposure apparatus, and application thereof
US6866972B2 (en) 2002-05-15 2005-03-15 Nec Lcd Technologies, Ltd. Color layer forming method
JP2004022623A (ja) * 2002-06-13 2004-01-22 Shinko Electric Ind Co Ltd 配線基板の製造方法
JP2004128418A (ja) * 2002-10-07 2004-04-22 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2004281738A (ja) * 2003-03-17 2004-10-07 Central Glass Co Ltd レーザ走査による導電線パターンの描画方法
JP4244156B2 (ja) * 2003-05-07 2009-03-25 富士フイルム株式会社 投影露光装置
EP1507171A3 (en) 2003-08-15 2008-03-05 FUJIFILM Corporation Light-Sensitive sheet comprising support, first and second light-sensitive layers and barrier layer
JP4376693B2 (ja) 2004-04-30 2009-12-02 富士フイルム株式会社 露光方法および装置
US7534702B2 (en) * 2004-06-29 2009-05-19 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device
US20060215138A1 (en) 2005-03-22 2006-09-28 Matsushita Electric Industrial Co., Ltd. Laser beam pattern generator with a two-axis scan mirror
JP4513643B2 (ja) 2005-05-12 2010-07-28 株式会社デンソー シート位置決め方法および位置決め装置ならびにそれらを用いたシート積層装置
JP4753625B2 (ja) 2005-05-31 2011-08-24 大日本スクリーン製造株式会社 パターン描画装置およびブロック数決定方法
US8080350B2 (en) * 2005-11-30 2011-12-20 Sumitomo Bakelite Company, Ltd. Positive photosensitive resin composition, and semiconductor device and display therewith
JP4660826B2 (ja) * 2006-08-18 2011-03-30 山栄化学株式会社 レジストパターンの形成方法
EP1992443B1 (en) * 2006-12-22 2013-09-25 Panasonic Corporation Laser processing apparatus and laser processing method using the same
JP2009277903A (ja) * 2008-05-15 2009-11-26 Panasonic Corp 電子部品形成装置および電子部品
JP2012014015A (ja) * 2010-07-01 2012-01-19 Daiso Co Ltd 光硬化性導電ペースト組成物とその応用
KR101639082B1 (ko) 2010-10-20 2016-07-13 코오롱인더스트리 주식회사 광중합성 조성물 및 이로부터 형성된 수지 경화층을 포함하는 광학시트
EP2630400A4 (en) 2010-10-22 2015-03-25 Shawcor Ltd NON-RETICULATED THERMOR-RETRACTABLE HOUSING ELEMENT FOR FORMING A CONNECTION BETWEEN TUBULAR SECTIONS AND METHOD FOR FORMING SUCH INDUCTION FUSION CONNECTION
JP5335840B2 (ja) 2011-03-15 2013-11-06 株式会社オーク製作所 露光装置
TW201224678A (en) 2010-11-04 2012-06-16 Orc Mfg Co Ltd Exposure device
JP2012119410A (ja) * 2010-11-30 2012-06-21 Mitsumi Electric Co Ltd フレキシブルプリント基板、フレキシブルプリント基板の貼着方法及び電子機器
WO2012081292A1 (ja) * 2010-12-13 2012-06-21 株式会社ニコン 空間光変調器及びその駆動方法、並びに露光方法及び装置
CN102905473B (zh) * 2011-07-29 2017-06-06 富泰华工业（深圳）有限公司 电路板及电路板的制作方法
JP2013067016A (ja) 2011-09-20 2013-04-18 Keyence Corp ３次元造形装置
JP2013075389A (ja) 2011-09-29 2013-04-25 Brother Industries Ltd 立体造形装置
US9636873B2 (en) 2012-05-03 2017-05-02 B9Creations, LLC Solid image apparatus with improved part separation from the image plate
JP2013235202A (ja) * 2012-05-11 2013-11-21 Opcell Co Ltd ハイブリッドレーザ走査装置
KR101761943B1 (ko) * 2012-09-20 2017-07-26 삼성전기주식회사 인쇄회로기판의 제조에 있어서의 시드층의 제거방법 및 그를 이용하여 제조된 인쇄회로기판
JP6088311B2 (ja) * 2013-03-27 2017-03-01 三菱製紙株式会社 導電性パターン転写用基材および導電性パターン転写方法
US10583459B2 (en) 2013-12-27 2020-03-10 Rohm And Haas Electronic Materials Llc Imaging three dimensional substrates using a transfer film
DE102014101238A1 (de) * 2014-01-31 2015-08-06 Hs Elektronik Systeme Gmbh In Leiterplatten eingebettetes Leistungsmodul
EP3210754A4 (en) 2014-10-20 2018-05-23 Sony Corporation Optical molding apparatus and method for manufacturing molded object
JP6356177B2 (ja) 2016-05-13 2018-07-11 株式会社ソディック 積層造形装置
WO2017203670A1 (ja) * 2016-05-26 2017-11-30 カンタツ株式会社 光造形装置
CN107660033B (zh) 2016-07-25 2018-12-18 北京梦之墨科技有限公司 一种制作冷光片的装置与方法
JP6839476B2 (ja) 2016-09-26 2021-03-10 カンタツ株式会社 パターン形成用シート
JP6892727B2 (ja) 2016-09-26 2021-06-23 カンタツ株式会社 パターン製造装置、パターン製造方法およびパターン製造プログラム
JP2018182126A (ja) 2017-04-17 2018-11-15 カンタツ株式会社 パターン形成用シート、パターン製造装置およびパターン製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243823A (ja) * 2002-02-13 2003-08-29 Daiken Kagaku Kogyo Kk 回路基板における感光ペースト２段塗着方法及び回路基板の製造方法
CN101743515A (zh) * 2007-10-03 2010-06-16 株式会社尼康 空间光调制单元、照明设备、曝光设备和装置制造方法
JP2009188014A (ja) * 2008-02-04 2009-08-20 Nsk Ltd 露光装置

Also Published As

Publication number Publication date
CN113784527A (zh) 2021-12-10
WO2016199641A1 (ja) 2016-12-15
CN107535052A (zh) 2018-01-02
JP6668004B2 (ja) 2020-03-18
US20220019147A1 (en) 2022-01-20
US20180139849A1 (en) 2018-05-17
US10962882B2 (en) 2021-03-30
JP2017005077A (ja) 2017-01-05

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