CN107428125A - 层叠体及其制造方法 - Google Patents
层叠体及其制造方法 Download PDFInfo
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- CN107428125A CN107428125A CN201680021062.8A CN201680021062A CN107428125A CN 107428125 A CN107428125 A CN 107428125A CN 201680021062 A CN201680021062 A CN 201680021062A CN 107428125 A CN107428125 A CN 107428125A
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- film
- substrate
- functional layer
- functional
- layer
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
- C23C28/042—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material including a refractory ceramic layer, e.g. refractory metal oxides, ZrO2, rare earth oxides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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| JP2015-085116 | 2015-04-17 | ||
| PCT/JP2016/002037 WO2016166986A1 (ja) | 2015-04-17 | 2016-04-15 | 積層体及びその製造方法 |
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| JP2019010731A (ja) * | 2015-11-24 | 2019-01-24 | コニカミノルタ株式会社 | ガスバリアー性フィルム及び電子デバイス |
| JP7235466B2 (ja) * | 2018-01-26 | 2023-03-08 | レール・リキード-ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード | ランタノイド化合物、ランタノイド含有薄膜、および該ランタノイド化合物を用いたランタノイド含有薄膜の成膜方法 |
| CN112175220B (zh) * | 2020-09-03 | 2023-01-03 | 广东以色列理工学院 | 耐高温的改性聚丙烯薄膜及其制备方法和应用 |
| CN119685802B (zh) * | 2025-02-24 | 2025-05-30 | 浙江大学 | 一种引发式分子层沉积方法及区域选择性沉积调控方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050112874A1 (en) * | 2000-10-23 | 2005-05-26 | Jarmo Skarp | Process for producing metal oxide films at low temperatures |
| JP2011255611A (ja) * | 2010-06-10 | 2011-12-22 | Sumitomo Metal Mining Co Ltd | 誘電体膜を有する金属ベース層付耐熱性樹脂フィルムと金属膜付耐熱性樹脂フィルムの各製造方法および誘電体膜を有する金属ベース層付耐熱性樹脂フィルムの製造装置 |
| CN103158289A (zh) * | 2011-12-15 | 2013-06-19 | 财团法人工业技术研究院 | 水气阻障复合膜及封装结构 |
| WO2014156888A1 (ja) * | 2013-03-27 | 2014-10-02 | 凸版印刷株式会社 | 積層体及びガスバリアフィルム |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003327718A (ja) | 2002-03-08 | 2003-11-19 | Dainippon Printing Co Ltd | 基材フィルム、並びにガスバリア性フィルムおよびこれを用いたディスプレイ |
| US20030203210A1 (en) * | 2002-04-30 | 2003-10-30 | Vitex Systems, Inc. | Barrier coatings and methods of making same |
| KR100496265B1 (ko) * | 2002-11-29 | 2005-06-17 | 한국전자통신연구원 | 반도체 소자의 박막 형성방법 |
| US6888172B2 (en) * | 2003-04-11 | 2005-05-03 | Eastman Kodak Company | Apparatus and method for encapsulating an OLED formed on a flexible substrate |
| JP2007516347A (ja) | 2003-05-16 | 2007-06-21 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 原子層蒸着によって製造されたプラスチック基板用のバリアフィルム |
| JP2005104026A (ja) | 2003-09-30 | 2005-04-21 | Fuji Photo Film Co Ltd | ガスバリア性積層フィルム及び該積層フィルムを用いた画像表示素子 |
| NO20045674D0 (no) * | 2004-12-28 | 2004-12-28 | Uni I Oslo | Thin films prepared with gas phase deposition technique |
| EP2011898B1 (en) * | 2007-07-03 | 2021-04-07 | Beneq Oy | Method in depositing metal oxide materials |
| JP5912228B2 (ja) * | 2010-05-17 | 2016-04-27 | 凸版印刷株式会社 | ガスバリア性積層体の製造方法 |
| WO2012020771A1 (ja) * | 2010-08-13 | 2012-02-16 | 旭硝子株式会社 | 積層体および積層体の製造方法 |
| JP2012116151A (ja) | 2010-12-03 | 2012-06-21 | Sony Corp | バリアフィルム及びその製造方法 |
| KR102081210B1 (ko) * | 2011-07-28 | 2020-02-25 | 도판 인사츠 가부시키가이샤 | 적층체, 가스 배리어 필름, 적층체의 제조 방법 및 적층체 제조 장치 |
| EP2754554A4 (en) * | 2011-09-07 | 2015-07-08 | Toray Industries | BARRIER FILM AGAINST GAS |
| US20130337259A1 (en) * | 2012-06-14 | 2013-12-19 | E I Du Pont De Nemours And Company | Gas permeation barrier material |
| TWI592310B (zh) * | 2012-10-18 | 2017-07-21 | 凸版印刷股份有限公司 | 積層體、阻氣薄膜及其製造方法 |
| WO2014156932A1 (ja) * | 2013-03-27 | 2014-10-02 | 凸版印刷株式会社 | 積層体、バリアフィルム、及びこれらの製造方法 |
-
2015
- 2015-04-17 JP JP2015085116A patent/JP6657588B2/ja active Active
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2016
- 2016-04-15 EP EP16779780.2A patent/EP3284591B1/en active Active
- 2016-04-15 CN CN201680021062.8A patent/CN107428125A/zh active Pending
- 2016-04-15 KR KR1020177032885A patent/KR102450786B1/ko active Active
- 2016-04-15 CN CN202111158968.3A patent/CN113897594A/zh active Pending
- 2016-04-15 WO PCT/JP2016/002037 patent/WO2016166986A1/ja not_active Ceased
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050112874A1 (en) * | 2000-10-23 | 2005-05-26 | Jarmo Skarp | Process for producing metal oxide films at low temperatures |
| JP2011255611A (ja) * | 2010-06-10 | 2011-12-22 | Sumitomo Metal Mining Co Ltd | 誘電体膜を有する金属ベース層付耐熱性樹脂フィルムと金属膜付耐熱性樹脂フィルムの各製造方法および誘電体膜を有する金属ベース層付耐熱性樹脂フィルムの製造装置 |
| CN103158289A (zh) * | 2011-12-15 | 2013-06-19 | 财团法人工业技术研究院 | 水气阻障复合膜及封装结构 |
| WO2014156888A1 (ja) * | 2013-03-27 | 2014-10-02 | 凸版印刷株式会社 | 積層体及びガスバリアフィルム |
Non-Patent Citations (1)
| Title |
|---|
| DONG-SUK HAN ETAL.: "Al2O3/TiO2 multilayer thin films grown by plasma enhanced atomic layer depositon for organic light-emitting diode passivation", 《THIN SOLID FILMS》 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016203431A (ja) | 2016-12-08 |
| CN113897594A (zh) | 2022-01-07 |
| JP6657588B2 (ja) | 2020-03-04 |
| EP3284591A4 (en) | 2019-04-24 |
| WO2016166986A1 (ja) | 2016-10-20 |
| KR20170137855A (ko) | 2017-12-13 |
| EP3284591A1 (en) | 2018-02-21 |
| US11090917B2 (en) | 2021-08-17 |
| KR102450786B1 (ko) | 2022-10-06 |
| EP3284591B1 (en) | 2025-04-30 |
| US20180037017A1 (en) | 2018-02-08 |
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