CN107403744B - 基板搬送装置 - Google Patents

基板搬送装置 Download PDF

Info

Publication number
CN107403744B
CN107403744B CN201710346866.1A CN201710346866A CN107403744B CN 107403744 B CN107403744 B CN 107403744B CN 201710346866 A CN201710346866 A CN 201710346866A CN 107403744 B CN107403744 B CN 107403744B
Authority
CN
China
Prior art keywords
substrate
elastic layer
pad
hand
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710346866.1A
Other languages
English (en)
Other versions
CN107403744A (zh
Inventor
相泽雄树
小野岛昇
村上伸辅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Tokki Corp
Original Assignee
Canon Tokki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Tokki Corp filed Critical Canon Tokki Corp
Publication of CN107403744A publication Critical patent/CN107403744A/zh
Application granted granted Critical
Publication of CN107403744B publication Critical patent/CN107403744B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

本发明提供基板搬送装置，能够利用各垫尽可能均匀地承受基板的重量，进而能够使垫与基板的接触面积增加，即便使搬送速度变快也能够进行稳定的搬送。一种基板搬送装置，其具有：搬送用机器人，其对基板(1)进行搬送；手(2)，其设置在该搬送用机器人上；以及垫(3)，其设置在该手(2)的上表面，对所述基板(1)下表面的外周部进行支承，其中，在所述手(2)的上表面上设置有多个所述垫(3)以便对所述基板(1)进行多点支承，在该垫(3)上设置有与所述基板(1)接触而挠曲变形的可动片部(4)。

Description

基板搬送装置
技术领域
本发明涉及基板搬送装置。
背景技术
在真空装置内在基板的搬送中使用的搬送用机器人的手的与基板接触的接触部上设置有树脂制的垫(参照专利文献1等)。
但是，当使搬送用机器人的基板搬送速度变快等而对基板施加比垫与基板之间产生的摩擦力(最大静摩擦力)大的动能(力)时，因基板滑落而无法进行搬送。特别是在机器人转弯时容易产生基板的滑落。
为了防止搬送时的基板的滑落而设置多个垫，但基板的歪斜或保持基板时的挠曲每次不同，有时基板的一部分因没有与垫接触而浮起等，很难使全部的垫均匀地承受基板的重量，由于现状是载荷不均匀地施加在一部分的垫上，所以需要使每一个垫的最大静摩擦力变大。
专利文献1：日本特开2000-277585号公报
发明内容
本发明是鉴于上述那样的现状而完成的，提供一种基板搬送装置，能够通过在垫上分别设置能够挠曲变形的可动片部来吸收因每张基板的歪斜或挠曲而导致的接触不均，从而能够由各垫尽可能均匀地承受基板的重量，进而能够使垫与基板的接触面积增加，即便使搬送速度变快也能够进行稳定的搬送。
一种基板搬送装置，其具有：搬送用机器人，其对基板进行搬送；手，其设置在该搬送用机器人上；以及垫，其设置在该手的上表面，对所述基板的下表面的外周部进行支承，该基板搬送装置的特征在于，在所述手的上表面上设置有多个所述垫，以便对所述基板进行多点支承，在该垫上设置有可动片部，该可动片部与所述基板接触而挠曲变形。
由于本发明如上述那样构成，所以能够通过在垫上分别设置能够挠曲变形的可动片部来吸收因每张基板的歪斜或挠曲而导致的接触的不均，从而能够利用各垫尽可能均匀地承受基板的重量，进而能够使垫与基板的接触面积增加，成为即便使搬送速度变快也能够进行稳定的搬送的基板搬送装置。
附图说明
图1是本实施例的概略说明俯视图。
图2是将本实施例的一部分切去后的放大概略说明侧视图。
图3是本实施例的放大概略说明侧视图。
图4是其他例1的放大概略说明侧视图。
图5是其他例1的放大概略说明侧视图。
图6是其他例2的放大概略说明侧视图。
图7是其他例2的放大概略说明侧视图。
标号说明
1：基板；2：手；3：垫；4：可动片部；5：突出片；6：芯层；7：弹性层。
具体实施方式
根据附图对本发明的优选的实施方式进行简单地说明而示出本发明的作用。
由搬送用机器人的手2接收基板1，在将所接收的基板1搬送到搬送场所时，能够由设置在手2的上表面的各垫3尽可能均匀地承受基板1的重量。
即，当将基板1载置在手2上时，与基板1下表面的外周部接触的各垫3的可动片部4因基板1的重量而挠曲变形，例如即使因基板1的歪斜等而与各垫3的接触方式不同(即使接触存在不均)，各垫3的可动片部4也分别与接触方式相应地挠曲变形而不使基板1的一部分浮起，能够由各垫3分别支承基板1，能够由各垫3均匀地承受载荷。因此，即便使基板1的搬送速度变快也能够进行稳定的搬送。
并且，例如，在所述可动片部4由具有平坦的接触面并因所述基板1的载荷而挠曲变形从而与所述基板1的接触面积增加的弹性部件构成的情况下，能够使与基板1的接触面积与挠曲变形相应地增加而确保最大静摩擦力，能够进行更稳定的搬送。
【实施例】
根据附图对本发明的具体实施例进行说明。
本实施例是基板搬送装置，其具有：搬送用机器人，其在真空环境下对基板1进行搬送；手2，其设置在该搬送用机器人上；垫3，其设置在该手2的上表面，对所述基板1的下表面的作为成膜区域范围以外的部分的周边部进行支承。
本实施例的搬送用机器人设置在所谓集群(clutser)型的成膜装置的搬送室内。在该搬送室的周围连接设置有成膜室等作业室，搬送用机器人进行基板1向各作业室的搬入和基板1从作业室的搬出。
具体来说，本实施例采用了如下结构：在手2的上表面上设置有多个树脂制的垫3，以便对基板1进行多点支承，在该垫3上设置有与基板1接触而挠曲变形的可动片部4。
手2设置在搬送用机器人的伸缩臂的前端。
具体来说，如图1所图示的那样，手2具有与伸缩臂连结的两个平行的棒状的基部8，在该基部8上设置有第1叉部9，该第1叉部9向与基部8的长度方向垂直的方向突出设置。
并且，在最外位置的第1叉部9的外侧设置有分支部10，该分支部10向与所述基部8平行的方向突出设置。并且，在基部8的基端侧位置和前端侧位置分别设置有与所述分支部10并排设置的第2叉部11。
并且，各叉部9、11和分支部10构成为其前端部越靠前端侧越向上倾斜，以使其突出前端侧位于比基部8靠上方的位置。
在该手2的各叉部9、11和分支部10的前端分别设置有垫3。
设置于第1叉部的前端的垫3分别与基板1下表面的外周部的长度方向侧边部接触，设置于第2叉部和分支部的前端的垫3分别与基板1下表面的外周部的宽度方向侧边部接触。
垫3由安装在安装孔12中的安装部13和设置在该安装部13的上部的可动片部4构成，其中，该安装孔13设置于各叉部9、11和分支部10。
在安装部13上设置有：筒状的主体部14，其被压入到安装孔12内；以及直径比主体部14大的防脱卡定部15，其设置在主体部14的前端，防止从安装孔12脱出。
在本实施例中，采用了如下结构：设置3个安装孔12，与3个安装孔12对应地设置有3个所述主体部14和防脱卡定部15。
可动片部4由弹性部件构成，该弹性部件具有平坦的接触面，因所述基板1的载荷而挠曲变形，从而增加与所述基板1接触的接触面积。
具体来说，可动片部4由氟橡胶、硅、氯丁橡胶或丁腈橡胶等柔软且具有较高的摩擦力的材料构成。在本实施例中采用氟橡胶制。
如图2和图3所图示的那样，本实施例的可动片部4具有板状的突出片5，该突出片5设置成相对于所述基板1的中心向内侧突出，从而构成为，在该突出片5与所述基板1接触时，因所述基板1的载荷而在与所述突出片5的突出方向交叉的方向上挠曲变形。
具体来说，可动片部4具有芯层6和板状的弹性层7，该弹性层7以一部分从该芯层6相对于所述基板1的中心向内侧伸出的方式层叠且在其上表面上设有平坦的接触面，该弹性层7的从所述芯层6伸出的突出部分被设定为所述突出片5。
在本实施例中，芯层6由与各叉部9、11和分支部10的上表面接触的基部18和设置在基部18上并对弹性层7进行支承的弹性层支承部19构成，从该弹性层支承部19伸出的突出部分被设定为所述突出片5。图中，标号16是防止基板1飞出的基板飞出防止部，17是用于与芯层6卡定而进行定位的定位卡定部。
因此，柔软的可动片部4因基板1的载荷而变形而使接触面积增加，从而能够确保最大静摩擦力，并且，弹性层7的突出片5成为没有被芯层6支承的悬臂状(舌片状)，容易在突出方向和与突出方向垂直的方向上挠曲变形，能够良好地吸收因基板1的歪斜或挠曲而导致的接触不均。
并且，即使在利用手2对大型的玻璃基板等进行支承时不与垫3接触的中央侧向下方挠曲、基板1外周部向上方翘曲的情况下，可动片部4也良好地随着基板1的翘曲(挠曲)而变形，从而能够确保接触面积(参照图3)，其中，可动片部4具有相对于基板1的中心朝向内侧突出的突出片5。
因此，即便使基板1的搬送速度(手2的旋转速度/伸缩臂的伸缩速度)变快也能够进行稳定的搬送。
另外，可动片部4也可以构成为如在图4和图5中图示的其他例1那样，通过使弹性层7以从芯层6向手2的外侧伸出的方式层叠而使突出片5相对于基板1的中心向外侧突出。
并且，也可以构成为如在图6和图7中图示的其他例2那样构成为，将板状的突出片5以相对于基板1的中心向外侧倾斜的状态立设在弹性层7的上表面上，以使得该突出片5在与基板1接触时相对于基板1的中心向外侧倒伏。在其他例2中并排设置了多个(两个)突出片5。
在其他例1和其他例2的情况下也能够通过突出片5的挠曲变形来良好地吸收基板1的歪斜或挠曲而由各垫3均匀地承受载荷。
另外，本发明并不限于本实施例，能够对各构成要件的具体结构进行适当设计。

Claims (3)

1.一种基板搬送装置，其具有：搬送用机器人，其对基板进行搬送；手，其设置在该搬送用机器人上；以及垫，在该手的上表面上设置有多个所述垫，对所述基板的下表面的外周部进行支承，该基板搬送装置的特征在于，
所述垫包含：
弹性层支承部，其以沿着所述垫的上表面延伸的方式层叠；以及
弹性层，其以沿着所述弹性层支承部的上表面延伸的方式层叠，该弹性层的一部分从所述弹性层支承部相对于所述基板的中心向内侧或外侧突出，
从所述弹性层支承部突出的所述一部分与所述基板接触而挠曲变形。
2.根据权利要求1所述的基板搬送装置，其特征在于，
所述弹性层因所述基板的载荷而挠曲变形，由此增加与所述基板接触的接触面积。
3.根据权利要求1或2所述的基板搬送装置，其特征在于，
所述一部分与所述基板接触时，因所述基板的载荷而能够在与所述一部分的突出方向交叉的方向上挠曲变形。
CN201710346866.1A 2016-05-18 2017-05-16 基板搬送装置 Active CN107403744B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-099846 2016-05-18
JP2016099846A JP6298099B2 (ja) 2016-05-18 2016-05-18 基板搬送装置

Publications (2)

Publication Number Publication Date
CN107403744A CN107403744A (zh) 2017-11-28
CN107403744B true CN107403744B (zh) 2022-04-29

Family

ID=60404394

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710346866.1A Active CN107403744B (zh) 2016-05-18 2017-05-16 基板搬送装置

Country Status (3)

Country Link
JP (1) JP6298099B2 (zh)
KR (1) KR101931876B1 (zh)
CN (1) CN107403744B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101971824B1 (ko) * 2018-03-05 2019-04-23 캐논 톡키 가부시키가이샤 로봇, 로봇 시스템, 디바이스 제조 장치, 디바이스 제조 방법 및 티칭 위치 조정 방법
JP7265336B2 (ja) * 2018-10-29 2023-04-26 キヤノントッキ株式会社 搬送装置、成膜装置、有機ｅｌ素子の製造システム、および有機ｅｌ素子の製造方法
JP7131334B2 (ja) * 2018-11-29 2022-09-06 株式会社安川電機 基板支持装置、基板搬送ロボットおよびアライナ装置
CN112466798B (zh) * 2020-11-30 2022-05-27 长江存储科技有限责任公司 一种半导体机台
KR20240084479A (ko) 2022-12-06 2024-06-13 도쿄엘렉트론가부시키가이샤 패드 및 엔드 이펙터

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120235335A1 (en) * 2011-03-18 2012-09-20 Tokyo Electron Limited Substrate holding device
CN102741995A (zh) * 2010-02-05 2012-10-17 东京毅力科创株式会社 基板保持用具、基板输送装置及基板处理装置
CN104733354A (zh) * 2013-12-23 2015-06-24 朗姆研究公司 用于改善的晶片装卸的微结构

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001179672A (ja) 1999-12-21 2001-07-03 Mitsubishi Electric Corp ロボットハンド
JP2002353291A (ja) * 2001-05-30 2002-12-06 Ulvac Japan Ltd 基板搬送装置
JP2010239087A (ja) * 2009-03-31 2010-10-21 Tokyo Electron Ltd 基板支持装置及び基板支持方法
JP5379589B2 (ja) 2009-07-24 2013-12-25 東京エレクトロン株式会社 真空吸着パッド、搬送アーム及び基板搬送装置
JP5577817B2 (ja) * 2010-04-22 2014-08-27 凸版印刷株式会社 基板載置用パッド機構
JP3166983U (ja) * 2011-01-18 2011-03-31 東京エレクトロン株式会社 基板の保持装置
JP2012212746A (ja) * 2011-03-31 2012-11-01 Tokyo Electron Ltd 基板搬送装置及び基板搬送方法
EP2791034B1 (en) * 2011-12-16 2021-01-27 Brooks Automation, Inc. Transport apparatus
JP6224437B2 (ja) * 2013-11-26 2017-11-01 東京エレクトロン株式会社 基板搬送装置
JP6486140B2 (ja) 2015-02-25 2019-03-20 キヤノン株式会社 搬送ハンド、リソグラフィ装置及び被搬送物を搬送する方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102741995A (zh) * 2010-02-05 2012-10-17 东京毅力科创株式会社 基板保持用具、基板输送装置及基板处理装置
US20120235335A1 (en) * 2011-03-18 2012-09-20 Tokyo Electron Limited Substrate holding device
CN104733354A (zh) * 2013-12-23 2015-06-24 朗姆研究公司 用于改善的晶片装卸的微结构

Also Published As

Publication number Publication date
JP2017208451A (ja) 2017-11-24
CN107403744A (zh) 2017-11-28
KR20170130285A (ko) 2017-11-28
JP6298099B2 (ja) 2018-03-20
KR101931876B1 (ko) 2018-12-21

Similar Documents

Publication Publication Date Title
CN107403744B (zh) 基板搬送装置
US11318663B2 (en) Multi-layer stamp
JP6224437B2 (ja) 基板搬送装置
JP5574553B2 (ja) 基板搬送装置及び保持装置
JP5606517B2 (ja) バネによって安定化された真空グリッパー組立体
TW200947598A (en) Robot hand for substrate transportation
WO2011077678A1 (ja) 基板保持装置
JP2007221021A (ja) 搬送装置
JP2001223252A (ja) ロボットの吸着レスハンド
JP2008282870A (ja) 搬送アーム用パッド
CN108807249B (zh) 基板搬运臂
JP5903282B2 (ja) 静電チャック付きロボットハンド
KR102032025B1 (ko) 효과적인 기판 탈부착 구조의 점착 척과 탈착 장치
US9412638B2 (en) End effector pads
KR200488775Y1 (ko) 웨이퍼 이송용 블레이드
CN111628053B (zh) 微型发光二极管载板
KR100949686B1 (ko) 기판 이송 장치 및 이를 포함한 기판 처리 장치
KR102424792B1 (ko) 정전기 방지 기능을 구비한 돔 형태의 건식 패드 구조체
CN211137181U (zh) 工业用机器人的手以及工业用机器人
KR20240093434A (ko) 반도체 웨이퍼 이송용 로봇암 블레이드에 탈부착되는 이중접합에 의한 미끄럼 방지 패드
CN114347060A (zh) 移载机构及具有其的机器手臂
KR20220107948A (ko) 흡착 패드 및 기판 반송 장치
KR20090035890A (ko) 기판 척킹 장치
JPH0537039A (ja) 圧電バイモルフ素子

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant