CN107400866A - ZrMoC/ZrMoCN叠层涂层刀具及其制备工艺 - Google Patents

ZrMoC/ZrMoCN叠层涂层刀具及其制备工艺 Download PDF

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CN107400866A
CN107400866A CN201710533128.8A CN201710533128A CN107400866A CN 107400866 A CN107400866 A CN 107400866A CN 201710533128 A CN201710533128 A CN 201710533128A CN 107400866 A CN107400866 A CN 107400866A
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zrmoc
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宋文龙
张璇
王首军
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Jining University
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Abstract

本发明属于机械制造切削刀具领域，特别是涉及一种ZrMoC/ZrMoCN叠层涂层刀具及其制备工艺。本发明采用沉积方式为非平衡磁控溅射与中频磁控溅射复合镀膜方法制备，直接采用非平衡磁控溅射ZrMoC复合靶作碳源，且沉积温度控制在300℃以下，可在更为广泛的刀具基体上制备。所制备的ZrMoC/ZrMoCN叠层涂层刀具，刀具基体最外层为ZrMoCN涂层，刀具基体与ZrMoCN涂层间有Ti过渡层，ZrMoCN涂层与Ti过渡层之间是ZrMoC涂层与ZrMoCN涂层交替的复合叠层结构。所制备的ZrMoC/ZrMoCN叠层涂层刀具综合了ZrMoCN超硬碳氮化合物涂层、ZrMoC超硬碳化物涂层及叠层结构的优点，可明显改善传统碳氮化合物涂层刀具的物理机械性能，同时ZrMoC/ZrMoCN复合叠层结构可减缓涂层裂纹扩展及剥落，可广泛应用于淬硬钢及有色金属等难加工材料的干切削加工。

Description

ZrMoC/ZrMoCN叠层涂层刀具及其制备工艺
技术领域
本发明属于机械制造金属切削刀具领域，特别是涉及一种ZrMoC/ZrMoCN叠层涂层刀具及其制备工艺。
背景技术
当代切削加工技术的快速发展对刀具的材料和性能提出了更高的要求，干式、高速切削成为刀具切削发展的方向。在刀具表面沉积硬质薄膜成为改善和提高刀具使用性能的重要途径。TiCN是目前最广泛使用的三元碳氮化合物硬质涂层，TiCN涂层由于兼具TiC的高硬度和TiN的良好韧性，显著提高了其摩擦磨损性能(Jinlong Li,Shihong Zhang,Mingxi Li.Influence of the C2H2 flow rate on gradient TiCN films deposited bymulti-arc ion plating[J].Applied Surface Science,2013(283):134-144.)，已广泛应用于铣削、攻牙、冲压、成型及滚齿的加工，在高速切削时比普通硬质合金刀具的耐磨性高5-8倍。中国专利“汽轮机转子轮槽铣刀表面TiCN多层复合涂层制备工艺”(专利号201510564738.5)利用Ti、氮气(N2)与乙炔气体(C2H2)在450℃沉积温度下合成了TiCN涂层铣刀，解决了26NiCrMov145材料转子加工难题。
TiCN涂层虽然具有高硬度、低摩擦系数的优点，但同时因其热稳定性和红硬性较差，仅适合应用于低速切削或具有良好冷却条件的场合，需要对传统TiCN涂层结构和制备工艺进行改进。目前，多元化是材料改善力学性能、耐蚀性和耐磨性的有效途径，通过制备多元复合涂层，既可提高涂层与基体的结合强度，又兼顾多种单涂层的综合性能，显著提高涂层刀具的性能。
目前TiCN等碳氮化合物主要通过化学气相沉积技术(CVD)等技术制备，即通过TiCl4(或Ti靶)、CH4(或C2H2)以及N2等气体反应生成，沉积温度通常超过400℃，对基体产生不利影响，同时气体碳源容易对涂层设备造成污染，制约了其广泛应用。
层状复合材料是近几年发展起来的材料增强增韧新技术，这种结构是通过模仿贝壳而来，因此又叫仿生叠层复合材料。自然界中贝壳的珍珠层是一种天然的层状结构材料，其断裂韧性却比普通单一均质结构高出3000倍以上。因此，通过模仿生物材料结构形式的层间设计，制备出的叠层复合涂层可以提高目前碳氮化合物涂层的韧性、稳定性及减摩耐磨性等综合性能。
发明内容
针对现有碳氮化合物涂层刀具性能及制备方法的不足，结合层状复合材料结构的优点，本发明目的在于提供一种ZrMoC/ZrMoCN叠层涂层刀具及其制备工艺。
本发明所述的ZrMoC/ZrMoCN叠层涂层刀具，包括刀具基体，刀具基体最外层为ZrMoCN涂层，刀具基体与ZrMoCN涂层间有Ti过渡层，ZrMoCN涂层与Ti过渡层之间是ZrMoC涂层与ZrMoCN涂层交替的复合叠层结构；
其中：
刀具基体材料为高速钢、工具钢、模具钢、硬质合金、陶瓷、金刚石、立方氮化硼中的一种。
本发明所述的ZrMoC/ZrMoCN叠层涂层刀具的制备工艺，沉积方式为采用非平衡磁控溅射+中频磁控溅射的复合镀膜方法，沉积时使用2个非平衡磁控溅射ZrMoC复合靶，2个中频磁控溅射Ti靶：首先采用中频磁控溅射沉积Ti过渡层，然后采用非平衡磁控溅射方法交替沉积ZrMoC涂层与ZrMoCN涂层，最外层为ZrMoCN涂层。
所述非平衡磁控溅射ZrMoC复合靶中包含重量分数为40-70wt％的Zr、20-40wt％的Mo和10-20wt％的C，所述非平衡磁控溅射ZrMoC复合靶采用真空热压法制备，其制备方法具体如下：
(1)将重量配比好的粉末纯度均为99.9％的Zr、Mo和C的粉末混匀并装入模具，然后将装有粉末的模具置于真空热压炉；
(2)升温：首先快速升温，并在升温开始施加初始压力30～50MPa，然后慢速升温至1000～1500℃，保温，混合粉经热压烧结后成型得样品；
(3)烧结结束后样品随炉冷却降温至150℃以下后出炉。
所述的ZrMoC/ZrMoCN叠层涂层刀具的制备工艺，具体包括以下步骤：
(1)对刀具基体表面前处理：将刀具基体表面抛光，去除表面油污、锈迹等杂质，然后依次放入酒精和丙酮中，超声清洗各30min，去除刀具表面油污和其它附着物，电吹风干燥充分后迅速放入镀膜机，抽真空至8.0×10-3Pa，加热至250℃，保温25min；
(2)对刀具基体表面离子清洗：向镀膜机通入Ar气，调其压力为1.5Pa，开启偏压电源，电压600V，占空比0.3，辉光放电清洗40min；降低偏压至400V，占空比0.2，开启离子源离子清洗20min，开启中频磁控溅射Ti靶电源，Ti靶电流35A，偏压300V，占空比0.2，离子轰击1～2min；
(3)采用中频磁控溅射在刀具基体表面沉积Ti过渡层：调Ar气压0.7～0.8Pa，偏压降至230V，中频磁控溅射Ti靶电流40A，沉积温度180℃，沉积Ti过渡层5～6min；
(4)采用非平衡磁控溅射在Ti过渡层上沉积ZrMoC涂层：关闭中频磁控溅射Ti靶电源，调Ar气压0.6～0.7Pa，偏压调至180V，沉积温度210℃，开启非平衡磁控溅射ZrMoC复合靶电流45A，沉积ZrMoC涂层4～5min；
(5)采用非平衡磁控溅射在ZrMoC涂层上沉积ZrMoCN涂层：开启N2，调N2气压为1.5Pa，Ar气压0.7～0.8Pa，偏压180V，调非平衡磁控溅射ZrMoC复合靶电流35A，沉积温度210℃，复合沉积ZrMoCN涂层4～5min，沉积完成后关闭N2；
(6)采用非平衡磁控溅射在ZrMoCN涂层上沉积ZrMoC涂层：调Ar气压0.6～0.7Pa，偏压调至180V，沉积温度210℃，开启非平衡磁控溅射ZrMoC复合靶电流45A，沉积ZrMoC涂层4～5min；
(7)重复(5)、(6)、(5)、……交替沉积ZrMoCN层、ZrMoC层、ZrMoCN层……ZrMoCN层共85min：
(8)后处理：关闭各靶电源、离子源及气体源，涂层结束。
本发明所制备的ZrMoC/ZrMoCN叠层涂层刀具，刀具基体最外层为ZrMoCN涂层，刀具基体与ZrMoCN涂层间有Ti过渡层，ZrMoCN涂层与Ti过渡层之间是ZrMoC涂层与ZrMoCN涂层交替的复合叠层结构。刀具基体上的Ti过渡层主要作用是减缓因涂层成分突变造成的层间应力，提高了涂层与刀具基体间的结合性能，涂层中的Zr元素提高了涂层的硬度、强度和抗磨损特性，Mo元素增加了涂层的硬度，降低了涂层表面的摩擦系数。同时该叠层复合结构的层间界面可阻止涂层柱状晶的生长，阻碍裂纹和缺陷的扩展，提高涂层的硬度、韧性和耐冲击性。
本发明与现有技术相比，具有以下有益效果。
本发明沉积方式采用非平衡磁控溅射+中频磁控溅射的复合镀膜方法，直接采用非平衡磁控溅射ZrMoC复合靶作碳源，且沉积温度控制在300℃以下，可在更为广泛的刀具或工具基体上制备。本发明所制备的ZrMoC/ZrMoCN叠层涂层刀具综合了ZrMoCN超硬碳氮化合物涂层、ZrMoC超硬碳化物涂层及叠层结构的优点，可明显改善传统碳氮化合物涂层刀具的物理机械性能，可提高涂层的硬度和抗冲击性，降低涂层表面的摩擦系数，改善涂层的红硬性和优异的抗月牙洼磨损能力，并能阻止涂层裂纹的扩展，提高涂层刀具的干切削性能。所述ZrMoC/ZrMoCN叠层涂层刀具可减小干切削过程中刀-屑之间的摩擦和粘结，相比传统TiCN等涂层刀具，降低切削力和切削温度25％以上，比传统刀具减小刀具磨损量30％以上，提高涂层使用寿命40％以上。同时，所述ZrMoC/ZrMoCN复合叠层结构可减缓涂层裂纹扩展及剥落，所述ZrMoC/ZrMoCN叠层涂层刀具可广泛应用于淬硬钢及有色金属等难加工材料的干切削加工。
附图说明
图1、本发明的ZrMoC/ZrMoCN叠层涂层刀具的涂层结构示意图。
图中：1、刀具基体 2、Ti过渡层 3、ZrMoC涂层 4、ZrMoCN涂层 5、ZrMoC涂层与ZrMoCN涂层交替的复合叠层结构。
具体实施方式
下面给出本发明的二个最佳实施例：
实施例1
本实施例所述的ZrMoC/ZrMoCN叠层涂层刀具，该涂层刀具为普通的铣刀片，其刀具基体材料为：硬质合金YT15，刀具基体最外层为ZrMoCN涂层，刀具基体与ZrMoCN涂层间有Ti过渡层，ZrMoCN涂层与Ti过渡层之间是ZrMoC涂层与ZrMoCN涂层交替的复合叠层结构。
本实施例所述的ZrMoC/ZrMoCN叠层涂层刀具的制备工艺，沉积方式为采用非平衡磁控溅射+中频磁控溅射的复合镀膜方法，沉积时使用2个非平衡磁控溅射ZrMoC复合靶，2个中频磁控溅射Ti靶：首先采用中频磁控溅射沉积Ti过渡层，然后采用非平衡磁控溅射方法交替沉积ZrMoC涂层与ZrMoCN涂层，最外层为ZrMoCN涂层。
所述非平衡磁控溅射ZrMoC复合靶中包含重量分数为40wt％的Zr、40wt％的Mo和20wt％的C。
所述ZrMoC/ZrMoCN叠层涂层刀具的制备工艺，具体包括以下步骤：
(1)对刀具基体表面前处理：将刀具基体表面抛光，去除表面油污、锈迹等杂质，然后依次放入酒精和丙酮中，超声清洗各30min，去除刀具表面油污和其它附着物，电吹风干燥充分后迅速放入镀膜机，抽真空至8.0×10-3Pa，加热至250℃，保温25min；
(2)对刀具基体表面离子清洗：向镀膜机通入Ar气，调其压力为1.5Pa，开启偏压电源，电压600V，占空比0.3，辉光放电清洗40min；降低偏压至400V，占空比0.2，开启离子源离子清洗20min，开启中频磁控溅射Ti靶电源，Ti靶电流35A，偏压300V，占空比0.2，离子轰击1～2min；
(3)采用中频磁控溅射在刀具基体表面沉积Ti过渡层：调Ar气压0.7～0.8Pa，偏压降至230V，中频磁控溅射Ti靶电流40A，沉积温度180℃，沉积Ti过渡层5～6min；
(4)采用非平衡磁控溅射在Ti过渡层上沉积ZrMoC涂层：关闭中频磁控溅射Ti靶电源，调Ar气压0.6～0.7Pa，偏压调至180V，沉积温度210℃，开启非平衡磁控溅射ZrMoC复合靶电流45A，沉积ZrMoC涂层4～5min；
(5)采用非平衡磁控溅射在ZrMoC涂层上沉积ZrMoCN涂层：开启N2，调N2气压为1.5Pa，Ar气压0.7～0.8Pa，偏压180V，调非平衡磁控溅射ZrMoC复合靶电流35A，沉积温度210℃，复合沉积ZrMoCN涂层4～5min，沉积完成后关闭N2；
(6)采用非平衡磁控溅射在ZrMoCN涂层上沉积ZrMoC涂层：调Ar气压0.6～0.7Pa，偏压调至180V，沉积温度210℃，开启非平衡磁控溅射ZrMoC复合靶电流45A，沉积ZrMoC涂层4～5min；
(7)重复(5)、(6)、(5)、……交替沉积ZrMoCN层、ZrMoC层、ZrMoCN层……ZrMoCN层共85min：
(8)后处理：关闭各靶电源、离子源及气体源，涂层结束。
实施例2
本实施例所述的ZrMoC/ZrMoCN叠层涂层刀具，该涂层刀具为普通的麻花钻，其刀具基体材料为：高速钢W18Cr4V，刀具基体最外层为ZrMoCN涂层，刀具基体与ZrMoCN涂层间有Ti过渡层，ZrMoCN涂层与Ti过渡层之间是ZrMoC涂层与ZrMoCN涂层交替的复合叠层结构。
本实施例所述的ZrMoC/ZrMoCN叠层涂层刀具的制备工艺，沉积方式为采用非平衡磁控溅射+中频磁控溅射的复合镀膜方法，沉积时使用2个非平衡磁控溅射ZrMoC复合靶，2个中频磁控溅射Ti靶：首先采用中频磁控溅射沉积Ti过渡层，然后采用非平衡磁控溅射方法交替沉积ZrMoC涂层与ZrMoCN涂层，最外层为ZrMoCN涂层。
所述非平衡磁控溅射ZrMoC复合靶中包含重量分数为7wt％的Zr、20wt％的Mo和10wt％的C。
所述ZrMoC/ZrMoCN叠层涂层刀具的制备工艺，具体包括以下步骤：
(1)对刀具基体表面前处理：将刀具基体表面抛光，去除表面油污、锈迹等杂质，然后依次放入酒精和丙酮中，超声清洗各30min，去除刀具表面油污和其它附着物，电吹风干燥充分后迅速放入镀膜机，抽真空至8.0×10-3Pa，加热至250℃，保温25min；
(2)对刀具基体表面离子清洗：向镀膜机通入Ar气，调其压力为1.5Pa，开启偏压电源，电压600V，占空比0.3，辉光放电清洗40min；降低偏压至400V，占空比0.2，开启离子源离子清洗20min，开启中频磁控溅射Ti靶电源，Ti靶电流35A，偏压300V，占空比0.2，离子轰击1～2min；
(3)采用中频磁控溅射在刀具基体表面沉积Ti过渡层：调Ar气压0.7～0.8Pa，偏压降至230V，中频磁控溅射Ti靶电流40A，沉积温度180℃，沉积Ti过渡层5～6min；
(4)采用非平衡磁控溅射在Ti过渡层上沉积ZrMoC涂层：关闭中频磁控溅射Ti靶电源，调Ar气压0.6～0.7Pa，偏压调至180V，沉积温度210℃，开启非平衡磁控溅射ZrMoC复合靶电流45A，沉积ZrMoC涂层4～5min；
(5)采用非平衡磁控溅射在ZrMoC涂层上沉积ZrMoCN涂层：开启N2，调N2气压为1.5Pa，Ar气压0.7～0.8Pa，偏压180V，调非平衡磁控溅射ZrMoC复合靶电流35A，沉积温度210℃，复合沉积ZrMoCN涂层4～5min，沉积完成后关闭N2；
(6)采用非平衡磁控溅射在ZrMoCN涂层上沉积ZrMoC涂层：调Ar气压0.6～0.7Pa，偏压调至180V，沉积温度210℃，开启非平衡磁控溅射ZrMoC复合靶电流45A，沉积ZrMoC涂层4～5min；
(7)重复(5)、(6)、(5)、……交替沉积ZrMoCN层、ZrMoC层、ZrMoCN层……ZrMoCN层共85min：
(8)后处理：关闭各靶电源、离子源及气体源，涂层结束。

Claims (4)

1.一种ZrMoC/ZrMoCN叠层涂层刀具，包括刀具基体，其特征在于：刀具基体最外层为ZrMoCN涂层，刀具基体与ZrMoCN涂层间有Ti过渡层，ZrMoCN涂层与Ti过渡层之间是ZrMoC涂层与ZrMoCN涂层交替的复合叠层结构；
其中：
刀具基体材料为高速钢、工具钢、模具钢、硬质合金、陶瓷、金刚石、立方氮化硼中的一种。
2.一种ZrMoC/ZrMoCN叠层涂层刀具的制备工艺，其特征在于：沉积方式为采用非平衡磁控溅射+中频磁控溅射的复合镀膜方法，沉积时使用2个非平衡磁控溅射ZrMoC复合靶，2个中频磁控溅射Ti靶：首先采用中频磁控溅射沉积Ti过渡层，然后采用非平衡磁控溅射方法交替沉积ZrMoC涂层与ZrMoCN涂层，最外层为ZrMoCN涂层。
3.根据权利要求2所述的ZrMoC/ZrMoCN叠层涂层刀具的制备工艺，其特征在于：非平衡磁控溅射ZrMoC复合靶中包含重量分数为40-70wt％的Zr、20-40wt％的Mo和10-20wt％的C。
4.根据权利要求2或3所述的ZrMoC/ZrMoCN叠层涂层刀具的制备工艺，其特征在于：具体包括以下步骤：
(1)对刀具基体表面前处理：将刀具基体表面抛光，然后依次放入酒精和丙酮中，超声清洗各30min，吹风干燥充分后迅速放入镀膜机，抽真空至8.0×10-3Pa，加热至250℃，保温25min；
(2)对刀具基体表面离子清洗：向镀膜机通入Ar气，调其压力为1.5Pa，开启偏压电源，电压600V，占空比0.3，辉光放电清洗40min；降低偏压至400V，占空比0.2，开启离子源离子清洗20min，开启中频磁控溅射Ti靶电源，Ti靶电流35A，偏压300V，占空比0.2，离子轰击1～2min；
(3)采用中频磁控溅射在刀具基体表面沉积Ti过渡层：调Ar气压0.7～0.8Pa，偏压降至230V，中频磁控溅射Ti靶电流40A，沉积温度180℃，沉积Ti过渡层5～6min；
(4)采用非平衡磁控溅射在Ti过渡层上沉积ZrMoC涂层：关闭中频磁控溅射Ti靶电源，调Ar气压0.6～0.7Pa，偏压调至180V，沉积温度210℃，开启非平衡磁控溅射ZrMoC复合靶电流45A，沉积ZrMoC涂层4～5min；
(5)采用非平衡磁控溅射在ZrMoC涂层上沉积ZrMoCN涂层：开启N2，调N2气压为1.5Pa，Ar气压0.7～0.8Pa，偏压180V，调非平衡磁控溅射ZrMoC复合靶电流35A，沉积温度210℃，复合沉积ZrMoCN涂层4～5min，沉积完成后关闭N2；
(6)采用非平衡磁控溅射在ZrMoCN涂层上沉积ZrMoC涂层：调Ar气压0.6～0.7Pa，偏压调至180V，沉积温度210℃，开启非平衡磁控溅射ZrMoC复合靶电流45A，沉积ZrMoC涂层4～5min；
(7)重复(5)、(6)、(5)、……交替沉积ZrMoCN层、ZrMoC层、ZrMoCN层……ZrMoCN层共85min：
(8)后处理：关闭各靶电源、离子源及气体源，涂层结束。
CN201710533128.8A 2017-07-03 2017-07-03 ZrMoC/ZrMoCN叠层涂层刀具及其制备工艺 Pending CN107400866A (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102277554A (zh) * 2011-07-29 2011-12-14 山推工程机械股份有限公司 梯度叠层涂层刀具及其制备方法
CN106086787A (zh) * 2016-06-15 2016-11-09 济宁学院 Ti‑TiN+MoS2/Ti叠层复合涂层刀具及其制备工艺
CN106163708A (zh) * 2014-04-10 2016-11-23 株式会社图格莱 包覆工具

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102277554A (zh) * 2011-07-29 2011-12-14 山推工程机械股份有限公司 梯度叠层涂层刀具及其制备方法
CN106163708A (zh) * 2014-04-10 2016-11-23 株式会社图格莱 包覆工具
CN106086787A (zh) * 2016-06-15 2016-11-09 济宁学院 Ti‑TiN+MoS2/Ti叠层复合涂层刀具及其制备工艺

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