CN107177827B - SiNbC/SiNbCN叠层复合涂层刀具及其制备工艺 - Google Patents
SiNbC/SiNbCN叠层复合涂层刀具及其制备工艺 Download PDFInfo
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Abstract
本发明属于机械制造金属切削刀具领域,特别是涉及一种SiNbC/SiNbCN叠层复合涂层刀具及其制备工艺,在刀具基体上从内到外依次为:Ti过渡层、SiNbC涂层与SiNbCN涂层交替的复合叠层结构,最外层为SiNbCN涂层。本发明采用非平衡磁控溅射+电弧离子镀的复合镀膜方法,直接采用非平衡磁控溅射SiNbC复合靶作碳源,且沉积温度控制在300℃以下,可在更为广泛的刀具或工具基体上制备;本发明所制备的SiNbC/SiNbCN叠层复合涂层刀具综合了SiNbC碳化物涂层、SiNbCN碳氮化合物涂层及叠层结构的优点,较传统的碳氮化合物涂层刀具具有更优良的物理机械性能,可广泛应用于钢、铁素体、马氏体不锈钢、铸铁、钛合金等绝大多数工件材料的精加工和半精加工。
Description
技术领域
本发明属于机械制造金属切削刀具领域,特别是涉及一种SiNbC/SiNbCN叠层复合涂层刀具及其制备工艺。
背景技术
当代切削加工技术的快速发展对刀具的材料和性能提出了更高的要求,干式、高速切削成为刀具切削发展的方向。在刀具表面沉积硬质薄膜成为改善和提高刀具使用性能的重要途径。TiCN是目前最广泛使用的三元碳氮化合物硬质涂层,TiCN涂层由于兼具TiC的高硬度和TiN的良好韧性,显著提高了其摩擦磨损性能(Jinlong Li,Shihong Zhang,Mingxi Li.Influence of the C2H2flow rate on gradient TiCN films deposited bymulti-arc ion plating[J].Applied Surface Science,2013(283):134-144.),已广泛应用于铣削、攻牙、冲压、成型及滚齿的加工,在高速切削时比普通硬质合金刀具的耐磨性高5-8倍。中国专利“汽轮机转子轮槽铣刀表面TiCN多层复合涂层制备工艺”(专利号201510564738.5)利用Ti、氮气(N2)与乙炔气体(C2H2)在450℃沉积温度下合成了TiCN涂层铣刀,解决了26NiCrMov145材料转子加工难题。
TiCN涂层虽然具有高硬度、低摩擦系数的优点,但同时因其热稳定性和红硬性较差,仅适合应用于低速切削或具有良好冷却条件的场合,需要对传统TiCN涂层结构和制备工艺进行改进。目前,多元化是材料改善力学性能、耐蚀性和耐磨性的有效途径,通过制备多元复合涂层,既可提高涂层与基体的结合强度,又兼顾多种单涂层的综合性能,显著提高涂层刀具的性能。
目前TiCN等碳氮化合物主要通过化学气相沉积技术(CVD)等技术制备,即通过TiCl4(或Ti靶)、CH4(或C2H2)以及N2等气体反应生成,沉积温度通常超过400℃,对基体产生不利影响,同时气体碳源容易对涂层设备造成污染,制约了其广泛应用。
层状复合材料是近几年发展起来的材料增强增韧新技术,这种结构是通过模仿贝壳而来,因此又叫仿生叠层复合材料。自然界中贝壳的珍珠层是一种天然的层状结构材料,其断裂韧性却比普通单一均质结构高出3000倍以上。因此,通过模仿生物材料结构形式的层间设计,制备出的叠层复合涂层可以提高目前碳氮化合物涂层的韧性、稳定性及减摩耐磨性等综合性能。
发明内容
针对目前现有碳氮化合物涂层刀具性能及制备方法的不足,结合层状复合材料结构的优点,本发明目的在于提供一种SiNbC/SiNbCN叠层复合涂层刀具及其制备工艺。
本发明所述的SiNbC/SiNbCN叠层复合涂层刀具,在刀具基体上从内到外依次为:Ti过渡层、SiNbC涂层与SiNbCN涂层交替的复合叠层结构,最外层为SiNbCN涂层;
其中:
刀具基体材料为高速钢、工具钢、模具钢、硬质合金、陶瓷、金刚石、立方氮化硼中的一种。
本发明所述的SiNbC/SiNbCN叠层复合涂层刀具的制备工艺,沉积方式为采用非平衡磁控溅射+电弧离子镀复合镀膜方法,沉积时使用2个非平衡磁控溅射SiNbC复合靶,2个电弧离子镀Ti靶:首先采用电弧离子镀沉积Ti过渡层,然后采用非平衡磁控溅射方法交替沉积SiNbC涂层与SiNbCN涂层,最外层为SiNbCN涂层。
所述非平衡磁控溅射SiNbC复合靶中包含重量分数为40-70wt%的Si、20-40wt%的Nb和10-20wt%的C,所述非平衡磁控溅射SiNbC复合靶采用真空热压法制备,其具体包括以下制备步骤:
(1)将重量配比好的粉末纯度均为99.9%的Si、Nb和C的粉末混匀并装入模具,然后将装有粉末的模具置于真空热压炉;
(2)首先快速升温,并在升温开始施加初始压力20-40MPa,然后慢速升温至1000~1200℃,保温,混合粉经热压烧结后成型得样品;
(3)烧结结束后样品随炉冷却降温至150℃以下后出炉得非平衡磁控溅射SiNbC复合靶。
所述的SiNbC/SiNbCN叠层复合涂层刀具的制备工艺,具体包括以下步骤:
(1)对刀具基体表面预处理;
(2)对刀具基体表面离子清洗;
(3)采用电弧离子镀在刀具基体表面沉积Ti过渡层;
(4)采用非平衡磁控溅射方法在Ti过渡层上沉积SiNbC涂层;
(5)采用非平衡磁控溅射方法在SiNbC涂层上沉积SiNbCN涂层;
(6)采用非平衡磁控溅射方法在SiNbCN涂层上沉积SiNbC涂层;
(7)重复(5)、(6)、(5)……(6)、(5),交替沉积SiNbCN涂层、SiNbC涂层、SiNbCN涂层……SiNbC涂层、SiNbCN涂层,共沉积75min;
(8)后处理:关闭各靶电源、离子源及气体源,涂层结束。
其中:
步骤(1)中首先将刀具基体表面抛光,然后依次放入酒精和丙酮中,超声清洗各40min,干燥充分后迅速放入镀膜机,抽真空至8.0×10-3Pa,加热至280℃,保温40min。
步骤(2)中通Ar气,调其压力为1.1Pa,开启偏压电源,电压600V,占空比0.2,辉光放电清洗50min;降低偏压至400V,占空比0.2,开启离子源离子清洗45min,开启电弧离子镀Ti靶电源,Ti靶电流65A,偏压250V,占空比0.2,离子轰击1~2min。
步骤(3)中调Ar气压0.8~0.9Pa,偏压降至170V,电弧离子镀Ti靶电流90A,沉积温度260℃,沉积Ti过渡层5~6min。
步骤(4)中关闭电弧离子镀Ti靶电源,调Ar气压0.8~0.9Pa,偏压调至150V,沉积温度210℃,开启非平衡磁控溅射SiNbC复合靶电流25A,沉积SiNbC涂层1~2min。
步骤(5)中开启N2,调N2气压为1.4Pa,Ar气压0.7~0.8Pa,偏压150V,调非平衡磁控溅射SiNbC复合靶电流30A,沉积温度210℃,复合沉积SiNbCN涂层1~2min,沉积完成关闭N2。
步骤(6)中调Ar气压0.8~0.9Pa,偏压调至150V,沉积温度210℃,开启非平衡磁控溅射SiNbC复合靶电流25A,沉积SiNbC涂层1~2min。
本发明所制备的SiNbC/SiNbCN叠层复合涂层刀具,在刀具基体上从内到外依次为:Ti过渡层、SiNbC涂层与SiNbCN涂层交替的复合叠层结构,最外层为SiNbCN涂层,刀具基体上的Ti过渡层主要作用是减缓因涂层成分突变造成的层间应力,提高了涂层与刀具基体间的结合性能,涂层中的其中Si元素改善了涂层硬度和抗化学扩散性能,Nb元素提高了涂层的硬度、强度和抗压、耐磨、耐蚀性能,涂层中的C元素降低了涂层表面的摩擦系数,使涂层具备优异的减摩润滑及耐摩擦磨损性能。同时该叠层复合结构的层间界面可阻止涂层柱状晶的生长,阻碍裂纹和缺陷的扩展,提高涂层的硬度、韧性和耐冲击性。
本发明与现有技术相比,具有以下有益效果。
本发明采用非平衡磁控溅射+电弧离子镀的复合镀膜方法,直接采用非平衡磁控溅射SiNbC复合靶作碳源,且沉积温度控制在300℃以下,可在更为广泛的刀具或工具基体上制备。本发明所制备的SiNbC/SiNbCN叠层复合涂层刀具综合了SiNbC碳化物涂层、SiNbCN碳氮化合物涂层及叠层结构的优点,具有高硬度、优异的抗化学扩散和抗氧化性能,刀片表面不易产生积屑瘤,并且保持良好的减摩润滑及耐摩擦磨损性能,可降低高速干切削过程中的氧化磨损和扩散磨损,提高涂层刀具热稳定性,减少切屑的粘结和摩擦,相比传统TiCN等涂层刀具,降低刀具磨损量60%以上,提高涂层刀具使用寿命和加工效率80%以上,可广泛应用于钢、铁素体、马氏体不锈钢、铸铁、钛合金等绝大多数工件材料的精加工和半精加工。
附图说明
图1为本发明的SiNbC/SiNbCN叠层复合涂层刀具的涂层结构示意图。
图中:1、刀具基体2、Ti过渡层3、SiNbC涂层4、SiNbCN涂层5、SiNbC涂层与SiNbCN涂层交替的复合叠层结构。
具体实施方式
下面给出本发明的二个最佳实施例:
实施例1
本实施例所述的SiNbC/SiNbCN叠层复合涂层刀具,该刀具为普通的车刀片,其刀具基体材料为:硬质合金P25,在刀具基体上从内到外依次为:Ti过渡层、SiNbC涂层与SiNbCN涂层交替的复合叠层结构,最外层为SiNbCN涂层
本实施例所述的SiNbC/SiNbCN叠层复合涂层刀具的制备工艺,沉积方式为采用非平衡磁控溅射+电弧离子镀复合镀膜方法,沉积时使用2个非平衡磁控溅射SiNbC复合靶,2个电弧离子镀Ti靶:首先采用电弧离子镀沉积Ti过渡层,然后采用非平衡磁控溅射方法交替沉积SiNbC涂层与SiNbCN涂层,最外层为SiNbCN涂层。
所述非平衡磁控溅射SiNbC复合靶中包含重量分数为70wt%的Si、20wt%的Nb和10wt%的C。
所述的SiNbC/SiNbCN叠层复合涂层刀具的制备工艺,具体包括以下步骤:
(1)对刀具基体表面预处理:首先将刀具基体表面抛光,去除表面油污、锈迹等杂质,然后依次放入酒精和丙酮中,超声清洗各40min,去除刀具表面油污和其它附着物,电吹风干燥充分后迅速放入镀膜机,抽真空至8.0×10-3Pa,加热至280℃,保温40min;
(2)对刀具基体表面离子清洗:通Ar气,调其压力为1.1Pa,开启偏压电源,电压600V,占空比0.2,辉光放电清洗50min;降低偏压至400V,占空比0.2,开启离子源离子清洗45min,开启电弧离子镀Ti靶电源,Ti靶电流65A,偏压250V,占空比0.2,离子轰击1~2min;
(3)采用电弧离子镀在刀具基体表面沉积Ti过渡层:调Ar气压0.8~0.9Pa,偏压降至170V,电弧离子镀Ti靶电流90A,沉积温度260℃,沉积Ti过渡层5~6min;
(4)采用非平衡磁控溅射方法在Ti过渡层上沉积SiNbC涂层:关闭电弧离子镀Ti靶电源,调Ar气压0.8~0.9Pa,偏压调至150V,沉积温度210℃,开启非平衡磁控溅射SiNbC复合靶电流25A,沉积SiNbC涂层1~2min;
(5)采用非平衡磁控溅射方法在SiNbC涂层上沉积SiNbCN涂层:开启N2,调N2气压为1.4Pa,Ar气压0.7~0.8Pa,偏压150V,调非平衡磁控溅射SiNbC复合靶电流30A,沉积温度210℃,复合沉积SiNbCN涂层1~2min,沉积完成关闭N2;
(6)采用非平衡磁控溅射方法在SiNbCN涂层上沉积SiNbC涂层:调Ar气压0.8~0.9Pa,偏压调至150V,沉积温度210℃,开启非平衡磁控溅射SiNbC复合靶电流25A,沉积SiNbC涂层1~2min;
(7)重复(5)、(6)、(5)……(6)、(5),交替沉积SiNbCN涂层、SiNbC涂层、SiNbCN
涂层……SiNbC涂层、SiNbCN涂层,共沉积75min:
(8)后处理:关闭各靶电源、离子源及气体源,涂层结束。
实施例2
本实施例所述的SiNbC/SiNbCN叠层复合涂层刀具,该刀具为普通铰刀,其刀具基体材料为:高速钢W18Cr4V,在刀具基体上从内到外依次为:Ti过渡层、SiNbC涂层与SiNbCN涂层交替的复合叠层结构,最外层为SiNbCN涂层
本实施例所述的SiNbC/SiNbCN叠层复合涂层刀具的制备工艺,沉积方式为采用非平衡磁控溅射+电弧离子镀复合镀膜方法,沉积时使用2个非平衡磁控溅射SiNbC复合靶,2个电弧离子镀Ti靶:首先采用电弧离子镀沉积Ti过渡层,然后采用非平衡磁控溅射方法交替沉积SiNbC涂层与SiNbCN涂层,最外层为SiNbCN涂层。
所述非平衡磁控溅射SiNbC复合靶中包含重量分数为40wt%的Si、40wt%的Nb和20wt%的C。
所述的SiNbC/SiNbCN叠层复合涂层刀具的制备工艺,具体包括以下步骤:
(1)对刀具基体表面预处理:首先将刀具基体表面抛光,去除表面油污、锈迹等杂质,然后依次放入酒精和丙酮中,超声清洗各40min,去除刀具表面油污和其它附着物,电吹风干燥充分后迅速放入镀膜机,抽真空至8.0×10-3Pa,加热至280℃,保温40min;
(2)对刀具基体表面离子清洗:通Ar气,调其压力为1.1Pa,开启偏压电源,电压600V,占空比0.2,辉光放电清洗50min;降低偏压至400V,占空比0.2,开启离子源离子清洗45min,开启电弧离子镀Ti靶电源,Ti靶电流65A,偏压250V,占空比0.2,离子轰击1~2min;
(3)采用电弧离子镀在刀具基体表面沉积Ti过渡层:调Ar气压0.8~0.9Pa,偏压降至170V,电弧离子镀Ti靶电流90A,沉积温度260℃,沉积Ti过渡层5~6min;
(4)采用非平衡磁控溅射方法在Ti过渡层上沉积SiNbC涂层:关闭电弧离子镀Ti靶电源,调Ar气压0.8~0.9Pa,偏压调至150V,沉积温度210℃,开启非平衡磁控溅射SiNbC复合靶电流25A,沉积SiNbC涂层1~2min;
(5)采用非平衡磁控溅射方法在SiNbC涂层上沉积SiNbCN涂层:开启N2,调N2气压为1.4Pa,Ar气压0.7~0.8Pa,偏压150V,调非平衡磁控溅射SiNbC复合靶电流30A,沉积温度210℃,复合沉积SiNbCN涂层1~2min,沉积完成关闭N2;
(6)采用非平衡磁控溅射方法在SiNbCN涂层上沉积SiNbC涂层:调Ar气压0.8~0.9Pa,偏压调至150V,沉积温度210℃,开启非平衡磁控溅射SiNbC复合靶电流25A,沉积SiNbC涂层1~2min;
(7)重复(5)、(6)、(5)……(6)、(5),交替沉积SiNbCN涂层、SiNbC涂层、SiNbCN
涂层……SiNbC涂层、SiNbCN涂层,共沉积75min:
(8)后处理:关闭各靶电源、离子源及气体源,涂层结束。
Claims (1)
1.一种SiNbC/SiNbCN叠层复合涂层刀具的制备工艺,其特征在于:刀具基体材料为高速钢、工具钢、模具钢、硬质合金、陶瓷、金刚石或立方氮化硼,在刀具基体上从内到外依次为:Ti过渡层、SiNbC涂层与SiNbCN涂层交替的复合叠层结构,最外层为SiNbCN涂层;
沉积方式为采用非平衡磁控溅射+电弧离子镀复合镀膜方法,沉积时使用2个非平衡磁控溅射SiNbC复合靶,2个电弧离子镀Ti靶:首先采用电弧离子镀沉积Ti过渡层,然后采用非平衡磁控溅射方法交替沉积SiNbC涂层与SiNbCN涂层,最外层为SiNbCN涂层;其中:非平衡磁控溅射SiNbC复合靶中包含重量分数为40-70wt%的Si、20-40wt%的Nb和10-20wt%的C;其制备工艺为:
(1)前处理:将刀具基体表面抛光,去除表面油污、锈迹杂质,然后依次放入酒精和丙酮中,超声清洗各40min,去除刀具表面油污和其它附着物,电吹风干燥充分后迅速放入镀膜机,抽真空至8.0×10-3Pa,加热至280℃,保温40min;
(2)离子清洗:通Ar气,其压力为1.1Pa,开启偏压电源,电压600V,占空比0.2,辉光放电清洗50min;降低偏压至400V,占空比0.2,开启离子源离子清洗45min,开启电弧离子镀Ti靶电源,Ti靶电流65A,偏压250V,占空比0.2,离子轰击1~2min;
(3)沉积Ti过渡层:Ar气压0.8~0.9Pa,偏压降至170V,电弧离子镀Ti靶电流90A,沉积温度260℃,沉积Ti过渡层5~6min;
(4)沉积SiNbC层:关闭电弧离子镀Ti靶电源,Ar气压0.8~0.9Pa,偏压调至150V,沉积温度210℃,开启非平衡磁控溅射SiNbC复合靶电流25A,沉积SiNbC层1~2min;
(5)沉积SiNbCN层:开启N2,N2气压为1.4Pa,Ar气压0.7~0.8Pa,偏压150V,SiNbC靶电流30A,沉积温度210℃,复合沉积SiNbCN层1~2min;
(6)沉积SiNbC层:关闭N2,重复(4),沉积SiNbC层1~2min;
(7)重复(5)、(6)、(5)……(6)、(5):交替沉积SiNbC层、SiNbCN层、SiNbC层···SiNbC层、表层的SiNbCN层,共沉积75min;
(8)后处理:关闭各靶电源、离子源及气体源,涂层结束。
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