CN1073911C - 抛光衬底上形成的介质层的装置 - Google Patents

抛光衬底上形成的介质层的装置 Download PDF

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Publication number
CN1073911C
CN1073911C CN95120467A CN95120467A CN1073911C CN 1073911 C CN1073911 C CN 1073911C CN 95120467 A CN95120467 A CN 95120467A CN 95120467 A CN95120467 A CN 95120467A CN 1073911 C CN1073911 C CN 1073911C
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CN
China
Prior art keywords
top surface
hanger
semiconductor substrate
workbench
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN95120467A
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English (en)
Chinese (zh)
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CN1132676A (zh
Inventor
卢载遇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WiniaDaewoo Co Ltd
Original Assignee
Daewoo Electronics Co Ltd
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Filing date
Publication date
Application filed by Daewoo Electronics Co Ltd filed Critical Daewoo Electronics Co Ltd
Publication of CN1132676A publication Critical patent/CN1132676A/zh
Application granted granted Critical
Publication of CN1073911C publication Critical patent/CN1073911C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H10P14/60—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • H10P52/00—

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN95120467A 1995-02-15 1995-12-08 抛光衬底上形成的介质层的装置 Expired - Fee Related CN1073911C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019950002765A KR100258802B1 (ko) 1995-02-15 1995-02-15 평탄화 장치 및 그를 이용한 평탄화 방법
KR2765/1995 1995-02-15

Publications (2)

Publication Number Publication Date
CN1132676A CN1132676A (zh) 1996-10-09
CN1073911C true CN1073911C (zh) 2001-10-31

Family

ID=19408152

Family Applications (1)

Application Number Title Priority Date Filing Date
CN95120467A Expired - Fee Related CN1073911C (zh) 1995-02-15 1995-12-08 抛光衬底上形成的介质层的装置

Country Status (5)

Country Link
US (1) US5664986A (cg-RX-API-DMAC10.html)
JP (1) JP2969071B2 (cg-RX-API-DMAC10.html)
KR (1) KR100258802B1 (cg-RX-API-DMAC10.html)
CN (1) CN1073911C (cg-RX-API-DMAC10.html)
IN (1) IN185476B (cg-RX-API-DMAC10.html)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6083839A (en) * 1997-12-31 2000-07-04 Intel Corporation Unique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process control
KR100413493B1 (ko) * 2001-10-17 2004-01-03 주식회사 하이닉스반도체 화학적 기계적 연마 장치의 연마 플래튼 및 그를 이용한평탄화방법
KR100835517B1 (ko) 2003-12-26 2008-06-04 동부일렉트로닉스 주식회사 씨엠피 장비의 플래튼 장치
US7198548B1 (en) * 2005-09-30 2007-04-03 Applied Materials, Inc. Polishing apparatus and method with direct load platen
CN103029031A (zh) * 2011-09-30 2013-04-10 上海双明光学科技有限公司 一种晶圆基片加工方法
CN103639886A (zh) * 2013-11-29 2014-03-19 上海华力微电子有限公司 用于w-cmp的化学机械研磨装置及研磨方法
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
CN113579992A (zh) 2014-10-17 2021-11-02 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
JP2016090439A (ja) * 2014-11-06 2016-05-23 株式会社日本自動車部品総合研究所 粒子状物質検出素子及び粒子状物質検出センサ
WO2017074773A1 (en) 2015-10-30 2017-05-04 Applied Materials, Inc. An apparatus and method of forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP7299970B2 (ja) 2018-09-04 2023-06-28 アプライド マテリアルズ インコーポレイテッド 改良型研磨パッドのための配合物
CN112605847B (zh) * 2020-11-23 2022-04-19 福建晶安光电有限公司 一种改进的晶片衬底抛光方法与装置
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0197214A2 (en) * 1985-04-08 1986-10-15 Rodel, Inc. Carrier assembly for two-sided polishing operation
US5103596A (en) * 1990-11-05 1992-04-14 Toshiba Kikai Kabushiki Kaisha Method and apparatus for controlling cylinder grinding machines

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3948089A (en) * 1973-10-12 1976-04-06 Westinghouse Electric Corporation Strain gauge apparatus
NO135390C (no) * 1975-09-02 1977-03-30 Rdal Og Sunndal Verk A S Elektrisk kokeplate med termostat.
CA2012878C (en) * 1989-03-24 1995-09-12 Masanori Nishiguchi Apparatus for grinding semiconductor wafer
US5127196A (en) * 1990-03-01 1992-07-07 Intel Corporation Apparatus for planarizing a dielectric formed over a semiconductor substrate
EP0589433B1 (en) * 1992-09-24 1999-07-28 Ebara Corporation Polishing apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0197214A2 (en) * 1985-04-08 1986-10-15 Rodel, Inc. Carrier assembly for two-sided polishing operation
US5103596A (en) * 1990-11-05 1992-04-14 Toshiba Kikai Kabushiki Kaisha Method and apparatus for controlling cylinder grinding machines

Also Published As

Publication number Publication date
CN1132676A (zh) 1996-10-09
KR960032635A (ko) 1996-09-17
IN185476B (cg-RX-API-DMAC10.html) 2001-02-03
JP2969071B2 (ja) 1999-11-02
JPH08229806A (ja) 1996-09-10
US5664986A (en) 1997-09-09
KR100258802B1 (ko) 2000-06-15

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