JP2969071B2 - 研摩装置 - Google Patents

研摩装置

Info

Publication number
JP2969071B2
JP2969071B2 JP33578495A JP33578495A JP2969071B2 JP 2969071 B2 JP2969071 B2 JP 2969071B2 JP 33578495 A JP33578495 A JP 33578495A JP 33578495 A JP33578495 A JP 33578495A JP 2969071 B2 JP2969071 B2 JP 2969071B2
Authority
JP
Japan
Prior art keywords
polishing apparatus
dielectric layer
thermal expansion
polishing
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP33578495A
Other languages
English (en)
Japanese (ja)
Other versions
JPH08229806A (ja
Inventor
載遇 盧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daiu Denshi Kk
Original Assignee
Daiu Denshi Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daiu Denshi Kk filed Critical Daiu Denshi Kk
Publication of JPH08229806A publication Critical patent/JPH08229806A/ja
Application granted granted Critical
Publication of JP2969071B2 publication Critical patent/JP2969071B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • H10P14/60—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • H10P52/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP33578495A 1995-02-15 1995-11-30 研摩装置 Expired - Lifetime JP2969071B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019950002765A KR100258802B1 (ko) 1995-02-15 1995-02-15 평탄화 장치 및 그를 이용한 평탄화 방법
KR1995-2765 1995-02-15

Publications (2)

Publication Number Publication Date
JPH08229806A JPH08229806A (ja) 1996-09-10
JP2969071B2 true JP2969071B2 (ja) 1999-11-02

Family

ID=19408152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33578495A Expired - Lifetime JP2969071B2 (ja) 1995-02-15 1995-11-30 研摩装置

Country Status (5)

Country Link
US (1) US5664986A (cg-RX-API-DMAC10.html)
JP (1) JP2969071B2 (cg-RX-API-DMAC10.html)
KR (1) KR100258802B1 (cg-RX-API-DMAC10.html)
CN (1) CN1073911C (cg-RX-API-DMAC10.html)
IN (1) IN185476B (cg-RX-API-DMAC10.html)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6083839A (en) * 1997-12-31 2000-07-04 Intel Corporation Unique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process control
KR100413493B1 (ko) * 2001-10-17 2004-01-03 주식회사 하이닉스반도체 화학적 기계적 연마 장치의 연마 플래튼 및 그를 이용한평탄화방법
KR100835517B1 (ko) 2003-12-26 2008-06-04 동부일렉트로닉스 주식회사 씨엠피 장비의 플래튼 장치
US7198548B1 (en) * 2005-09-30 2007-04-03 Applied Materials, Inc. Polishing apparatus and method with direct load platen
CN103029031A (zh) * 2011-09-30 2013-04-10 上海双明光学科技有限公司 一种晶圆基片加工方法
CN103639886A (zh) * 2013-11-29 2014-03-19 上海华力微电子有限公司 用于w-cmp的化学机械研磨装置及研磨方法
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
CN113579992A (zh) 2014-10-17 2021-11-02 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
JP2016090439A (ja) * 2014-11-06 2016-05-23 株式会社日本自動車部品総合研究所 粒子状物質検出素子及び粒子状物質検出センサ
US10618141B2 (en) 2015-10-30 2020-04-14 Applied Materials, Inc. Apparatus for forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP7299970B2 (ja) 2018-09-04 2023-06-28 アプライド マテリアルズ インコーポレイテッド 改良型研磨パッドのための配合物
CN112605847B (zh) * 2020-11-23 2022-04-19 福建晶安光电有限公司 一种改进的晶片衬底抛光方法与装置
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5127196A (en) 1990-03-01 1992-07-07 Intel Corporation Apparatus for planarizing a dielectric formed over a semiconductor substrate

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3948089A (en) * 1973-10-12 1976-04-06 Westinghouse Electric Corporation Strain gauge apparatus
NO135390C (no) * 1975-09-02 1977-03-30 Rdal Og Sunndal Verk A S Elektrisk kokeplate med termostat.
KR860008003A (ko) * 1985-04-08 1986-11-10 제이·로렌스 킨 양면 포리싱 작업용 캐리어 조립체
AU637087B2 (en) * 1989-03-24 1993-05-20 Sumitomo Electric Industries, Ltd. Apparatus for grinding semiconductor wafer
US5103596A (en) * 1990-11-05 1992-04-14 Toshiba Kikai Kabushiki Kaisha Method and apparatus for controlling cylinder grinding machines
DE69333322T2 (de) * 1992-09-24 2004-09-30 Ebara Corp. Poliergerät

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5127196A (en) 1990-03-01 1992-07-07 Intel Corporation Apparatus for planarizing a dielectric formed over a semiconductor substrate

Also Published As

Publication number Publication date
KR960032635A (ko) 1996-09-17
IN185476B (cg-RX-API-DMAC10.html) 2001-02-03
CN1073911C (zh) 2001-10-31
KR100258802B1 (ko) 2000-06-15
CN1132676A (zh) 1996-10-09
JPH08229806A (ja) 1996-09-10
US5664986A (en) 1997-09-09

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