CN107256854B - 半导体器件 - Google Patents

半导体器件 Download PDF

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Publication number
CN107256854B
CN107256854B CN201710324641.6A CN201710324641A CN107256854B CN 107256854 B CN107256854 B CN 107256854B CN 201710324641 A CN201710324641 A CN 201710324641A CN 107256854 B CN107256854 B CN 107256854B
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CN
China
Prior art keywords
inductor
semiconductor device
current path
signal
horseshoe
Prior art date
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Active
Application number
CN201710324641.6A
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English (en)
Chinese (zh)
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CN107256854A (zh
Inventor
木原崇雄
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Renesas Electronics Corp
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Renesas Electronics Corp
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Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of CN107256854A publication Critical patent/CN107256854A/zh
Application granted granted Critical
Publication of CN107256854B publication Critical patent/CN107256854B/zh
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/14—Inductive couplings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
    • H04L25/03—Shaping networks in transmitter or receiver, e.g. adaptive shaping networks
    • H04L25/03006—Arrangements for removing intersymbol interference
    • H04L25/03343—Arrangements at the transmitter end
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L27/00—Modulated-carrier systems
    • H04L27/32—Carrier systems characterised by combinations of two or more of the types covered by groups H04L27/02, H04L27/10, H04L27/18 or H04L27/26
    • H04L27/34—Amplitude- and phase-modulated carrier systems, e.g. quadrature-amplitude modulated carrier systems
    • H04L27/36—Modulator circuits; Transmitter circuits
    • H04L27/366—Arrangements for compensating undesirable properties of the transmission path between the modulator and the demodulator
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0086—Printed inductances on semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/14—Inductive couplings
    • H01F2038/143—Inductive couplings for signals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
    • H04L25/03—Shaping networks in transmitter or receiver, e.g. adaptive shaping networks
    • H04L25/03006—Arrangements for removing intersymbol interference
    • H04L2025/0335—Arrangements for removing intersymbol interference characterised by the type of transmission
    • H04L2025/03356—Baseband transmission
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/924—Active solid-state devices, e.g. transistors, solid-state diodes with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Transceivers (AREA)
CN201710324641.6A 2012-04-25 2013-04-24 半导体器件 Active CN107256854B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-099687 2012-04-25
JP2012099687A JP5912808B2 (ja) 2012-04-25 2012-04-25 半導体装置
CN201310163409.0A CN103378055B (zh) 2012-04-25 2013-04-24 半导体器件

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201310163409.0A Division CN103378055B (zh) 2012-04-25 2013-04-24 半导体器件

Publications (2)

Publication Number Publication Date
CN107256854A CN107256854A (zh) 2017-10-17
CN107256854B true CN107256854B (zh) 2020-05-19

Family

ID=49462959

Family Applications (3)

Application Number Title Priority Date Filing Date
CN201710324641.6A Active CN107256854B (zh) 2012-04-25 2013-04-24 半导体器件
CN201310163409.0A Active CN103378055B (zh) 2012-04-25 2013-04-24 半导体器件
CN2013202397685U Expired - Fee Related CN203277374U (zh) 2012-04-25 2013-04-24 半导体器件

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201310163409.0A Active CN103378055B (zh) 2012-04-25 2013-04-24 半导体器件
CN2013202397685U Expired - Fee Related CN203277374U (zh) 2012-04-25 2013-04-24 半导体器件

Country Status (3)

Country Link
US (5) US8941213B2 (enExample)
JP (1) JP5912808B2 (enExample)
CN (3) CN107256854B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5912808B2 (ja) * 2012-04-25 2016-04-27 ルネサスエレクトロニクス株式会社 半導体装置
KR102071336B1 (ko) * 2013-09-30 2020-01-30 에스케이하이닉스 주식회사 반도체 메모리 장치
US9312927B2 (en) * 2013-11-11 2016-04-12 Qualcomm Incorporated Tunable guard ring for improved circuit isolation
CN105376352B (zh) * 2014-08-29 2019-11-26 展讯通信（上海）有限公司 移动终端
JP6341852B2 (ja) * 2014-12-26 2018-06-13 ルネサスエレクトロニクス株式会社 半導体装置及びそれを備えた半導体システム
JP2017098334A (ja) * 2015-11-19 2017-06-01 ルネサスエレクトロニクス株式会社 半導体装置
EP3472938A1 (en) * 2016-06-21 2019-04-24 Telefonaktiebolaget LM Ericsson (PUBL) An antenna feed in a wireless communication network node
CN106876379B (zh) * 2016-07-07 2019-10-08 威盛电子股份有限公司 半导体装置
TWI674596B (zh) 2018-12-21 2019-10-11 瑞昱半導體股份有限公司 電感裝置及其控制方法
TWI722946B (zh) * 2019-09-11 2021-03-21 瑞昱半導體股份有限公司 半導體裝置
JP2024543079A (ja) * 2021-11-19 2024-11-19 オークランド・ユニサーヴィシズ・リミテッド ワイヤレス電力伝送装置
US11942795B1 (en) 2022-11-28 2024-03-26 Netronix, Inc. Multi-antenna system for harvesting energy and transmitting data
TWI842230B (zh) * 2022-11-28 2024-05-11 振曜科技股份有限公司 採集能量與資訊傳輸的多天線系統

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1339175A (zh) * 1999-01-29 2002-03-06 科恩格森特系统股份有限公司 具有集成射频能力的多芯片模块
US6825749B1 (en) * 2004-01-26 2004-11-30 National Applied Research Laboratories National Chip Implementation Center Symmetric crossover structure of two lines for RF integrated circuits
CN1738046A (zh) * 2004-08-20 2006-02-22 株式会社瑞萨科技 具备电感器的半导体装置
CN203277374U (zh) * 2012-04-25 2013-11-06 瑞萨电子株式会社 半导体器件

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005503679A (ja) * 2000-10-10 2005-02-03 カリフォルニア・インスティテュート・オブ・テクノロジー 分布型環状電力増幅器の構造
JP4192604B2 (ja) 2003-01-20 2008-12-10 株式会社村田製作所 コイル部品
JP2005327931A (ja) 2004-05-14 2005-11-24 Sony Corp 集積化インダクタおよびそれを用いた受信回路
CN1979704B (zh) * 2005-12-09 2010-06-23 胜美达电机（香港）有限公司 变压器及其制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1339175A (zh) * 1999-01-29 2002-03-06 科恩格森特系统股份有限公司 具有集成射频能力的多芯片模块
US6825749B1 (en) * 2004-01-26 2004-11-30 National Applied Research Laboratories National Chip Implementation Center Symmetric crossover structure of two lines for RF integrated circuits
CN1738046A (zh) * 2004-08-20 2006-02-22 株式会社瑞萨科技 具备电感器的半导体装置
CN203277374U (zh) * 2012-04-25 2013-11-06 瑞萨电子株式会社 半导体器件

Also Published As

Publication number Publication date
US9054936B2 (en) 2015-06-09
US9319091B2 (en) 2016-04-19
US20150263779A1 (en) 2015-09-17
JP2013229716A (ja) 2013-11-07
US20150103949A1 (en) 2015-04-16
US9577698B2 (en) 2017-02-21
CN103378055B (zh) 2017-09-22
JP5912808B2 (ja) 2016-04-27
US9461695B2 (en) 2016-10-04
CN107256854A (zh) 2017-10-17
US20130285198A1 (en) 2013-10-31
CN203277374U (zh) 2013-11-06
US20160373159A1 (en) 2016-12-22
CN103378055A (zh) 2013-10-30
US8941213B2 (en) 2015-01-27
US20160197641A1 (en) 2016-07-07

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