CN107251659B - 柔性基板、带柔性基板的部件以及带柔性基板的部件的制造方法 - Google Patents

柔性基板、带柔性基板的部件以及带柔性基板的部件的制造方法 Download PDF

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Publication number
CN107251659B
CN107251659B CN201680010235.6A CN201680010235A CN107251659B CN 107251659 B CN107251659 B CN 107251659B CN 201680010235 A CN201680010235 A CN 201680010235A CN 107251659 B CN107251659 B CN 107251659B
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China
Prior art keywords
flexible substrate
electrical connection
component
main body
connection portion
Prior art date
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Active
Application number
CN201680010235.6A
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English (en)
Chinese (zh)
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CN107251659A (zh
Inventor
片山悦治
三代川纯
有贺麻衣子
菅谷俊雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Publication date
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Publication of CN107251659A publication Critical patent/CN107251659A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/053—Tails
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
CN201680010235.6A 2015-02-12 2016-02-10 柔性基板、带柔性基板的部件以及带柔性基板的部件的制造方法 Active CN107251659B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015025827 2015-02-12
JP2015-025827 2015-02-12
PCT/JP2016/000690 WO2016129278A1 (fr) 2015-02-12 2016-02-10 Substrat souple, composant à substrat souple et procédé de fabrication de composant à substrat souple

Publications (2)

Publication Number Publication Date
CN107251659A CN107251659A (zh) 2017-10-13
CN107251659B true CN107251659B (zh) 2021-02-09

Family

ID=56614350

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680010235.6A Active CN107251659B (zh) 2015-02-12 2016-02-10 柔性基板、带柔性基板的部件以及带柔性基板的部件的制造方法

Country Status (4)

Country Link
US (1) US10869395B2 (fr)
JP (1) JPWO2016129278A1 (fr)
CN (1) CN107251659B (fr)
WO (1) WO2016129278A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102419325B1 (ko) * 2018-02-01 2022-07-12 삼성디스플레이 주식회사 플렉서블 표시 패널 및 이의 제조 방법
US11231464B2 (en) * 2018-06-20 2022-01-25 Denso Corporation Monitoring apparatus
GB201814347D0 (en) * 2018-09-04 2018-10-17 Pilkington Group Ltd Electrical device, interlayer ply including an electrical device and methods for making said electrical device and interlayer ply
CN113614925A (zh) 2019-03-28 2021-11-05 古河电气工业株式会社 光模块

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11345987A (ja) * 1998-06-02 1999-12-14 Sony Corp 光リンク用送受信モジュール実装方法及びそのリジッド・フレキシブル基板
JP2005056952A (ja) * 2003-07-31 2005-03-03 Optrex Corp 回路基板の接続構造

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3550253B2 (ja) * 1996-07-23 2004-08-04 株式会社東芝 電子機器
JP2005292389A (ja) * 2004-03-31 2005-10-20 Optrex Corp 電気光学表示装置
WO2006075744A1 (fr) * 2005-01-17 2006-07-20 Olympus Corporation Connecteur electrique pour endoscope, endoscope, et procede de montage de connecteur electrique
JP4572140B2 (ja) * 2005-05-27 2010-10-27 株式会社フジクラ フレキシブル基板の接続構造
JP2007281012A (ja) 2006-04-03 2007-10-25 Nec Electronics Corp フレキシブル基板及び該フレキシブル基板が実装された実装機器
JP2008091797A (ja) * 2006-10-04 2008-04-17 Olympus Corp フレキシブル基板の接合装置
JP2008263122A (ja) 2007-04-13 2008-10-30 Oki Electric Ind Co Ltd 光モジュール装置
US8161497B2 (en) * 2008-03-26 2012-04-17 Tektronix, Inc. Holdoff algorithm for no dead time acquisition
JP2011155199A (ja) * 2010-01-28 2011-08-11 Nec Corp 回路実装基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11345987A (ja) * 1998-06-02 1999-12-14 Sony Corp 光リンク用送受信モジュール実装方法及びそのリジッド・フレキシブル基板
JP2005056952A (ja) * 2003-07-31 2005-03-03 Optrex Corp 回路基板の接続構造

Also Published As

Publication number Publication date
JPWO2016129278A1 (ja) 2017-11-24
US10869395B2 (en) 2020-12-15
US20170339793A1 (en) 2017-11-23
CN107251659A (zh) 2017-10-13
WO2016129278A1 (fr) 2016-08-18

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