CN107208251B - 蒸镀掩模的制造方法和蒸镀掩模 - Google Patents

蒸镀掩模的制造方法和蒸镀掩模 Download PDF

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Publication number
CN107208251B
CN107208251B CN201680009233.5A CN201680009233A CN107208251B CN 107208251 B CN107208251 B CN 107208251B CN 201680009233 A CN201680009233 A CN 201680009233A CN 107208251 B CN107208251 B CN 107208251B
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CN
China
Prior art keywords
metal layer
vapor deposition
deposition mask
substrate
pattern
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Active
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CN201680009233.5A
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English (en)
Chinese (zh)
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CN107208251A (zh
Inventor
池永知加雄
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Priority to CN201910940065.7A priority Critical patent/CN110551973B/zh
Publication of CN107208251A publication Critical patent/CN107208251A/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/08—Perforated or foraminous objects, e.g. sieves
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
CN201680009233.5A 2015-02-10 2016-02-05 蒸镀掩模的制造方法和蒸镀掩模 Active CN107208251B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910940065.7A CN110551973B (zh) 2015-02-10 2016-02-05 蒸镀掩模

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-024626 2015-02-10
JP2015024626 2015-02-10
PCT/JP2016/053581 WO2016129534A1 (ja) 2015-02-10 2016-02-05 蒸着マスクの製造方法および蒸着マスク

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201910940065.7A Division CN110551973B (zh) 2015-02-10 2016-02-05 蒸镀掩模

Publications (2)

Publication Number Publication Date
CN107208251A CN107208251A (zh) 2017-09-26
CN107208251B true CN107208251B (zh) 2019-10-25

Family

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Family Applications (2)

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CN201910940065.7A Active CN110551973B (zh) 2015-02-10 2016-02-05 蒸镀掩模
CN201680009233.5A Active CN107208251B (zh) 2015-02-10 2016-02-05 蒸镀掩模的制造方法和蒸镀掩模

Family Applications Before (1)

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CN201910940065.7A Active CN110551973B (zh) 2015-02-10 2016-02-05 蒸镀掩模

Country Status (5)

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JP (1) JP6688478B2 (enExample)
KR (1) KR102474454B1 (enExample)
CN (2) CN110551973B (enExample)
TW (2) TWI682237B (enExample)
WO (1) WO2016129534A1 (enExample)

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EP4148161B1 (en) 2016-12-14 2025-05-14 Dai Nippon Printing Co., Ltd. Method of manufacturing vapor deposition mask device
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CN109778114B (zh) 2017-11-14 2021-10-15 大日本印刷株式会社 用于制造蒸镀掩模的金属板和金属板的制造方法以及蒸镀掩模和蒸镀掩模的制造方法
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KR102520811B1 (ko) * 2018-07-09 2023-04-12 다이니폰 인사츠 가부시키가이샤 증착 마스크의 양부 판정 방법, 증착 마스크의 제조 방법, 증착 마스크 장치의 제조 방법, 증착 마스크의 선정 방법 및 증착 마스크
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WO2020158566A1 (ja) * 2019-01-31 2020-08-06 大日本印刷株式会社 蒸着マスク群、電子デバイスの製造方法及び電子デバイス
CN109913804B (zh) * 2019-03-27 2021-01-26 京东方科技集团股份有限公司 掩膜版及其制造方法
CN114127338B (zh) * 2019-05-13 2022-12-09 创造未来有限公司 精细金属掩模制造用模具制造方法及精细金属掩模制造方法
JP2022067159A (ja) * 2020-10-20 2022-05-06 株式会社ジャパンディスプレイ 蒸着マスクユニットとその製造方法
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JP2023077788A (ja) * 2021-11-25 2023-06-06 株式会社ジャパンディスプレイ 蒸着マスクとその製造方法
TWI828015B (zh) * 2021-12-01 2024-01-01 達運精密工業股份有限公司 精密金屬遮罩的製造方法
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KR102696337B1 (ko) * 2022-08-09 2024-08-20 대진대학교 산학협력단 고정밀 미세 메탈 마스크 제조방법
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Also Published As

Publication number Publication date
TW201921099A (zh) 2019-06-01
JP6688478B2 (ja) 2020-04-28
TWI682237B (zh) 2020-01-11
TWI651588B (zh) 2019-02-21
KR20170110623A (ko) 2017-10-11
JP2016148112A (ja) 2016-08-18
CN107208251A (zh) 2017-09-26
WO2016129534A1 (ja) 2016-08-18
CN110551973A (zh) 2019-12-10
CN110551973B (zh) 2022-06-14
TW201640220A (zh) 2016-11-16
KR102474454B1 (ko) 2022-12-06

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