CN107119276B - TiMoC/TiMoCN叠层涂层刀具及其制备方法 - Google Patents

TiMoC/TiMoCN叠层涂层刀具及其制备方法 Download PDF

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CN107119276B
CN107119276B CN201710287967.6A CN201710287967A CN107119276B CN 107119276 B CN107119276 B CN 107119276B CN 201710287967 A CN201710287967 A CN 201710287967A CN 107119276 B CN107119276 B CN 107119276B
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宋文龙
王首军
张璇
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XUZHOU SHUNDA STEEL WHEEL MANUFACTURING Co.,Ltd.
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Abstract

本发明属于机械制造金属切削刀具领域，特别是涉及一种TiMoC/TiMoCN叠层涂层刀具及其制备方法。本发明采用非平衡磁控溅射+电弧镀的复合镀膜方法，直接采用TiMoC复合靶作碳源，且沉积温度控制在300℃以下，可在更为广泛的刀具或工具基体上制备，所制备的TiMoC/TiMoCN叠层涂层刀具，刀具基体最外层为TiMoCN涂层，刀具基体与TiMoCN涂层间有Ti过渡层，TiMoCN涂层与Ti过渡层之间为TiMoC涂层与TiMoCN涂层交替的复合叠层结构。所制备的TiMoC/TiMoCN叠层涂层刀具综合了TiMoCN超硬碳氮化合物涂层、TiMoC超硬碳化物涂层及叠层结构的优点，可明显改善传统碳氮化合物涂层刀具的物理机械性能；同时，TiMoC/TiMoCN叠层复合结构通过叠层之间的界面可减缓涂层裂纹扩展，所述TiMoC/TiMoCN叠层复合涂层刀具可广泛应用于各种材料的干切削和高速加工。

Description

TiMoC/TiMoCN叠层涂层刀具及其制备方法
技术领域
本发明属于机械制造金属切削刀具领域，特别是涉及一种TiMoC/TiMoCN叠层涂层刀具及其制备方法。
背景技术
近10年来，涂层技术在刀具行业的应用得到了快速普及，涂层刀具已成为切削加工不可缺少的主流刀具。与此同时，随着切削加工向高速切削、强力切削和干式切削的迅速发展，对涂层刀具的性能提出了更高的要求。TiCN是目前最广泛使用的三元碳氮化合物涂层，TiCN涂层由于兼具TiC的高硬度和TiN的良好韧性，显著提高了其摩擦磨损性能(Jinlong Li,Shihong Zhang，Mingxi Li.Influence ofthe C2H2flow rate on gradientTiCN films deposited by multi-arc ion plating[J].Applied Surface Science,2013(283):134-144.)，已广泛应用于铣削、攻牙、冲压、成型及滚齿的加工，在高速切削时比普通硬质合金刀具的耐磨性高5-8倍。中国专利“汽轮机转子轮槽铣刀表面TiCN多层复合涂层制备方法”(专利号201510564738.5)利用Ti、氮气(N2)与乙炔气体(C2H2)在450℃沉积温度下合成了TiCN涂层铣刀，解决了26NiCrMov145材料转子加工难题。
TiCN涂层虽然具有高硬度、低摩擦系数的优点，但同时因其热稳定性和红硬性较差，仅适合应用于低速切削或具有良好冷却条件的场合，需要对传统TiCN涂层结构和制备方法进行改进。目前，多元化是材料改善力学性能、耐蚀性和耐磨性的有效途径，通过制备多元复合涂层，既可提高涂层与基体的结合强度，又兼顾多种单涂层的综合性能，显著提高涂层刀具的性能。
目前TiCN等碳氮化合物主要通过化学气相沉积技术(CVD)等技术制备，即通过TiCl4(或Ti靶)、CH4(或C2H2)以及N2等气体反应生成，沉积温度通常超过400℃，对基体产生不利影响，同时气体碳源容易对涂层设备造成污染，制约了其广泛应用。
层状复合材料是近几年发展起来的材料增强增韧新技术，这种结构是通过模仿贝壳而来，因此又叫仿生叠层复合材料。自然界中贝壳的珍珠层是一种天然的层状结构材料，其断裂韧性却比普通单一均质结构高出3000倍以上。因此，通过模仿生物材料结构形式的层间设计，制备出的叠层复合涂层可以提高目前碳氮化合物涂层的韧性、稳定性及减摩耐磨性等综合性能。
发明内容
针对现有碳氮化合物涂层刀具性能及制备方法的不足，结合层状复合材料结构的优点本发明目的在于提供一种TiMoC/TiMoCN叠层涂层刀具及其制备方法。
本发明所述的TiMoC/TiMoCN叠层涂层刀具，刀具基体最外层为TiMoCN涂层，刀具基体与TiMoCN涂层间有Ti过渡层，TiMoCN涂层与Ti过渡层之间为TiMoC涂层与TiMoCN涂层交替的复合叠层结构。
所述刀具基体材料为高速钢、工具钢、模具钢、硬质合金、陶瓷、金刚石或立方氮化硼中的一种。
本发明所述的TiMoC/TiMoCN叠层涂层刀具的制备方法，沉积方式为采用非平衡磁控溅射+电弧镀的复合镀膜方法，沉积时使用2个复合TiMoC非平衡磁控溅射靶，2个电弧Ti靶：首先采用电弧镀沉积Ti过渡层，然后采用非平衡磁控溅射方法交替沉积TiMoC涂层与TiMoCN涂层，最外层为TiMoCN涂层；其中，TiMoC非平衡磁控溅射靶包含重量分数为50％-70％的Ti、20％-40％的Mo和10％-15％的C。
具体包括以下步骤：
(1)刀具基体表面前处理；
(2)刀具基体表面离子清洗；
(3)采用电弧镀在刀具基体表面沉积Ti过渡层；
(4)采用非平衡磁控溅射在Ti过渡层上沉积TiMoC涂层；
(5)采用非平衡磁控溅射在TiMoC涂层上沉积TiMoCN涂层；
(6)采用非平衡磁控溅射在TiMoCN涂层上沉积TiMoC涂层；
(7)重复(5)、(6)、(5)……(5)，交替沉积TiMoCN涂层、TiMoC涂层、TiMoCN涂层……TiMoCN涂层共80min；
(8)后处理：关闭各靶电源、离子源及气体源，涂层结束。
其中：
步骤(1)中首先将刀具基体表面抛光，然后依次放入酒精和丙酮中，超声清洗各20min，干燥充分后迅速放入镀膜机，抽真空至6.0×10-3Pa，加热至250℃，保温40min。
步骤(2)中通入Ar气，其压力为1.4Pa，开启偏压电源，电压600V，占空比0.3，辉光放电清洗25min；降低偏压至400V，占空比0.2，开启离子源离子清洗25min，开启电弧Ti靶电源，Ti靶电流40A，偏压300V，离子轰击1～2min。
步骤(3)中调Ar气压0.8～0.9Pa，偏压降至250V，Ti靶电流80A，沉积温度220℃，电弧镀Ti过渡层4～5min。
步骤(4)中调Ar气压0.5～0.6Pa，偏压调至220V，关闭电弧Ti靶电源，开启TiMoC非平衡磁控溅射靶电流40A，沉积TiMoC层4～5min。
步骤(5)中开启N2，N2气压为1.5Pa，Ar气压0.8Pa，偏压200V，调TiMoC非平衡磁控溅射靶电流35A，沉积温度250℃，复合沉积TiMoCN涂层4～5min，沉积完成关闭N2。
步骤(6)中调Ar气压0.5～0.6Pa，偏压调至220V，调TiMoC非平衡磁控溅射靶电流40A，沉积TiMoC涂层4～5min。
本发明所述TiMoC非平衡磁控溅射靶，采用真空热压法制备，即将装有Ti粉末、Mo粉末、C粉末混合粉的模具置入真空热压炉，经热压烧结后的成型所得。
本发明所制备的TiMoC/TiMoCN叠层涂层刀具，刀具基体最外层为TiMoCN涂层，刀具基体与涂层间有Ti过渡层，TiMoCN涂层与Ti过渡层之间是TiMoC涂层和TiMoCN涂层交替的复合叠层结构。Ti过渡层主要作用是减缓因涂层成分突变造成的层间应力，提高了涂层与刀具基体间的结合性能，涂层中的Mo元素提高了涂层的硬度和强度，改善了涂层的抗高温氧化能力，降低了涂层表面的摩擦系数，同时所述叠层复合结构的层间界面可阻止涂层柱状晶的生长，阻碍裂纹和缺陷的扩展，提高涂层的硬度、韧性和耐冲击性。
本发明与现有技术相比，具有以下有益效果。
本发明采用非平衡磁控溅射+电弧镀的复合镀膜方法，直接采用TiMoC非平衡磁控溅射靶作碳源，且沉积温度控制在300℃以下，可在更为广泛的刀具或工具基体上制备。本发明所制备的TiMoC/TiMoCN叠层涂层刀具综合了TiMoCN超硬碳氮化合物涂层、TiMoC超硬碳化物涂层及叠层结构的优点，可明显改善传统TiCN涂层刀具的物理机械性能。所述TiMoC/TiMoCN叠层复合刀具可降低高速干切削过程中的摩擦，降低切削力和切削温度20％以上，减少刀具表面的粘结和磨损，比传统刀具减小刀具磨损20-30％，提高涂层使用寿命40％以上。同时，TiMoC/TiMoCN叠层复合结构通过叠层之间的界面可减缓涂层裂纹扩展，所述TiMoC/TiMoCN叠层复合涂层刀具可广泛应用于各种材料的干切削和高速加工。
附图说明
图1、本发明的TiMoC/TiMoCN叠层涂层刀具的涂层结构示意图。
图中：1、为刀具基体2、Ti过渡层3、TiMoC涂层4、TiMoCN涂层5、TiMoC涂层与TiMoCN涂层交替的叠层复合结构。
具体实施方式
下面给出本发明的二个最佳实施例：
实施例1
一种TiMoC/TiMoCN叠层涂层刀具及其制备方法，该刀具为普通的铣刀片，其刀具基体材料为：硬质合金YT15，刀具基体最外层为TiMoCN涂层，刀具基体与TiMoCN涂层间有Ti过渡层，TiMoCN涂层与Ti过渡层之间为TiMoC涂层与TiMoCN涂层交替的复合叠层结构。本发明沉积方式为采用非平衡磁控溅射+电弧镀的复合镀膜方法，沉积时使用2个复合TiMoC非平衡磁控溅射靶，2个电弧Ti靶：首先采用电弧镀沉积Ti过渡层，然后采用非平衡磁控溅射方法交替沉积TiMoC涂层与TiMoCN涂层，最后表面为TiMoCN复合涂层；其中，TiMoC非平衡磁控溅射靶包含重量分数为70％的Ti、20％的Mo和10％的C。
具体制备步骤如下：
(1)刀具基体表面前处理：将刀具基体表面抛光，去除表面油污、锈迹等杂质，然后依次放入酒精和丙酮中，超声清洗各20min，去除刀具表面油污和其它附着物，电吹风干燥充分后迅速放入镀膜机，抽真空至6.0×10-3Pa，加热至250℃，保温40min；
(2)刀具基体表面离子清洗：通Ar气，其压力为1.4Pa，开启偏压电源，电压600V，占空比0.3，辉光放电清洗25min；降低偏压至400V，占空比0.2，开启离子源离子清洗25min，开启电弧Ti靶电源，Ti靶电流40A，偏压300V，离子轰击1～2min；
(3)采用电弧镀在刀具基体表面沉积Ti过渡层：调Ar气压0.8～0.9Pa，偏压降至250V，Ti靶电流80A，沉积温度220℃，电弧镀Ti过渡层4～5min；
(4)采用非平衡磁控溅射在Ti过渡层上沉积TiMoC涂层：调Ar气压0.5～0.6Pa，偏压调至220V，关闭电弧Ti靶电源，开启TiMoC非平衡磁控溅射靶电流40A，沉积TiMoC涂层4～5min；
(5)采用非平衡磁控溅射在TiMoC涂层上沉积TiMoCN涂层：开启N2，N2气压为1.5Pa，Ar气压0.8Pa，偏压200V，TiMoC非平衡磁控溅射靶电流35A，沉积温度250℃，复合沉积TiMoCN层4～5min，沉积完成关闭N2；
(6)采用非平衡磁控溅射在TiMoCN涂层上沉积TiMoC涂层：调Ar气压0.5～0.6Pa，偏压调至220V，调TiMoC非平衡磁控溅射靶电流40A，沉积TiMoC涂层4～5min；
(7)重复(5)、(6)、(5)……(5)，交替沉积TiMoCN涂层、TiMoC涂层、TiMoCN涂层……TiMoCN涂层共80min：
(8)后处理：关闭各靶电源、离子源及气体源，涂层结束。
实施例2
一种TiMoC/TiMoCN叠层涂层刀具及其制备方法，该刀具为普通麻花钻，其刀具基体材料为：高速钢W18Cr4V，刀具基体最外层为TiMoCN涂层，刀具基体与TiMoCN涂层间有Ti过渡层，TiMoCN涂层与Ti过渡层之间为TiMoC涂层与TiMoCN涂层交替的复合叠层结构。本发明沉积方式为采用非平衡磁控溅射+电弧镀的复合镀膜方法，沉积时使用2个复合TiMoC非平衡磁控溅射靶，2个电弧Ti靶：首先采用电弧镀沉积Ti过渡层，然后采用非平衡磁控溅射方法交替沉积TiMoC与TiMoCN层，最外层为TiMoCN复合涂层；其中，TiMoC非平衡磁控溅射靶包含重量分数为50％的Ti、40％的Mo和10％的C。
具体制备步骤如下：
(1)刀具基体表面前处理：将刀具基体表面抛光，去除表面油污、锈迹等杂质，然后依次放入酒精和丙酮中，超声清洗各20min，去除刀具表面油污和其它附着物，电吹风干燥充分后迅速放入镀膜机，抽真空至6.0×10-3Pa，加热至250℃，保温40min；
(2)刀具基体表面离子清洗：通Ar气，其压力为1.4Pa，开启偏压电源，电压600V，占空比0.3，辉光放电清洗25min；降低偏压至400V，占空比0.2，开启离子源离子清洗25min，开启电弧Ti靶电源，Ti靶电流40A，偏压300V，离子轰击1～2min；
(3)采用电弧镀在刀具基体表面沉积Ti过渡层：调Ar气压0.8～0.9Pa，偏压降至250V，Ti靶电流80A，沉积温度220℃，电弧镀Ti过渡层4～5min；
(4)采用非平衡磁控溅射在Ti过渡层上沉积TiMoC涂层：调Ar气压0.5～0.6Pa，偏压调至220V，关闭电弧Ti靶电源，开启TiMoC非平衡磁控溅射靶电流40A，沉积TiMoC涂层4～5min；
(5)采用非平衡磁控溅射在TiMoC涂层上沉积TiMoCN涂层：开启N2，N2气压为1.5Pa，Ar气压0.8Pa，偏压200V，TiMoC非平衡磁控溅射靶电流35A，沉积温度250℃，复合沉积TiMoCN层4～5min，沉积完成关闭N2；
(6)采用非平衡磁控溅射在TiMoCN涂层上沉积TiMoC涂层：调Ar气压0.5～0.6Pa，偏压调至220V，调TiMoC非平衡磁控溅射靶电流40A，沉积TiMoC涂层4～5min；
(7)重复(5)、(6)、(5)……(5)，交替沉积TiMoCN涂层、TiMoC涂层、TiMoCN涂层……TiMoCN涂层共80min：
(8)后处理：关闭各靶电源、离子源及气体源，涂层结束。

Claims (1)

1.一种TiMoC/TiMoCN叠层涂层刀具的制备方法，其特征在于：刀具基体材料为高速钢、工具钢、模具钢、硬质合金、陶瓷、金刚石或立方氮化硼中的一种，刀具基体最外层为TiMoCN涂层，刀具基体与TiMoCN涂层间有Ti过渡层，TiMoCN涂层与Ti过渡层之间为TiMoC涂层与TiMoCN涂层交替的复合叠层结构；沉积方式为采用非平衡磁控溅射+电弧镀的复合镀膜方法，沉积时使用2个复合TiMoC非平衡磁控溅射靶，2个电弧Ti靶：首先采用电弧镀沉积Ti过渡层，然后采用非平衡磁控溅射方法交替沉积TiMoC涂层与TiMoCN涂层，最外层为TiMoCN涂层；其中，TiMoC非平衡磁控溅射靶包含重量分数为50％-70％的Ti、20％-40％的Mo和10％-15％的C；具体包括以下步骤：
(1)前处理：将刀具基体表面抛光，去除表面油污、锈迹杂质，然后依次放入酒精和丙酮中，超声清洗各20min，去除刀具表面油污和其它附着物，电吹风干燥充分后迅速放入镀膜机，抽真空至6.0×10-3Pa，加热至250℃，保温40min；
(2)离子清洗：通Ar气，其压力为1.4Pa，开启偏压电源，电压600V，占空比0.3，辉光放电清洗25min；降低偏压至400V，占空比0.2，开启离子源离子清洗25min，开启电弧Ti靶电源，Ti靶电流40A，偏压300V，离子轰击1～2min；
(3)沉积Ti过渡层：Ar气压0.8～0.9Pa，偏压降至250V，Ti靶电流80A，沉积温度220℃，电弧镀Ti过渡层4～5min；
(4)沉积TiMoC层：Ar气压0.5～0.6Pa，偏压调至220V，关闭电弧Ti靶电源，开启磁控溅射TiMoC复合靶电流40A，沉积TiMoC层4～5min；
(5)沉积TiMoCN层：开启N2，N2气压为1.5Pa，Ar气压0.8Pa，偏压200V，TiMoC靶电流35A，沉积温度250℃，复合沉积TiMoCN层4～5min；
(6)沉积TiMoC层：关闭N2，重复(4)；
(7)沉积TiMoCN层：开启N2，重复(5)；
(8)重复(4)、(5)、(4)···：交替沉积TiMoC层、TiMoCN层、TiMoC层···TiMoCN层共80min；
(9)后处理：关闭各靶电源、离子源及气体源，涂层结束。
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