CN105803394B - TiZrCrAlN多元复合耐磨涂层刀具及其制备方法 - Google Patents
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Abstract
本发明公开了一种TiZrCrAlN多元复合耐磨涂层刀具及其制备方法，属于金属切削刀具技术领域，包括刀具基体，刀具基体上设有涂层，刀具由下至上依次为：刀具基体、Ti过渡层、Ti/Zr/Cr/Al过渡层和TiZrCrAlN多元复合涂层；所述制备方法依次通过前处理、离子清洗、沉积Ti过渡层、沉积Ti/Zr/Cr/Al过渡层、沉积TiZrCrAlN多元复合涂层和后处理。本发明TiZrCrAlN多元复合耐磨涂层刀具及其制备方法，采用多弧离子镀和非平衡磁控溅射复合镀膜方法制备多元复合涂层，表面涂层为TiZrCrAlN多元涂层，刀具基体与表面涂层之间有Ti过渡层和Ti/Zr/Cr/Al过渡层，以减小残余应力，显著提高涂层的强度和韧性，具有更好的耐冲击性和抗磨损性，能够改善原有二元涂层耐磨性差的缺点，显著提高刀具的使用寿命以及切削性能。
Description
技术领域
本发明属于金属切削刀具技术领域，具体涉及一种TiZrCrAlN多元复合耐磨涂层刀具及其制备方法。
背景技术
对刀具进行涂层处理是提高刀具性能的重要途径之一。涂层刀具将刀具基体与涂层相结合，使刀具性能大大提高。TiN、ZrN等氮化物单涂层刀具自上世纪70年代成功应用于切削刀具后，成为目前应用最为广泛的涂层刀具。然而，随着切削加工技术的发展以及高速切削技术的推广，二元氮化物涂层相对较差的韧性和耐磨性限制了其应用。通过制备多元复合结构的涂层可以显著提高涂层的韧性、强度及耐冲击性等综合性能，涂层的多元复合结构已经成为涂层刀具的重要发展方向。
发明内容
本发明提供了一种TiZrCrAlN多元复合耐磨涂层刀具及其制备方法，其目的在于，克服现有二元涂层刀具技术的不足，采用多弧离子镀和非平衡磁控溅射复合镀膜方法制备多元复合涂层，提高涂层的韧性、强度及耐冲击性等综合性能。
本发明TiZrCrAlN多元复合耐磨涂层刀具，包括刀具基体，涂层为Ti、Ti/Zr/Cr/Al和TiZrCrAlN；刀具由下至上依次为：刀具基体、Ti过渡层、Ti/Zr/Cr/Al过渡层和TiZrCrAlN多元复合涂层。
所述刀具基体的材料为硬质合金或高速钢。
本发明所述的TiZrCrAlN多元复合耐磨涂层刀具的制备方法，在刀具基体表面电弧离子镀沉积Ti过渡层，然后多弧离子镀+非平衡磁控溅射复合沉积Ti/Zr/Cr/Al过渡层，最后同时沉积TiZrCrAlN多元复合涂层(沉积时使用1个Ti电弧靶、1个Zr电弧靶、1个Cr非平衡磁控溅射靶和1个Al非平衡磁控溅射靶)，其制备步骤如下：
1)前处理：将刀具基体表面打磨、抛光，去除表面油污、锈迹等杂质，然后依次放入酒精和丙酮中，超声清洗各30min，去除刀具表面油污和其它附着物，电吹风干燥充分后迅速放入镀膜机，抽真空至5.0×10-3Pa，加热至300℃，保温30-40min；
2)离子清洗：通Ar气，其压力为1.5Pa，开启偏压电源，电压1000V，占空比0.5，辉光放电清洗15min；降低偏压至800V，开启离子源离子清洗25min，开启Ti靶的电弧源，靶电流50A，偏压500V，离子轰击Ti靶2min；
3)沉积Ti过渡层：调整Ar气压0.5-0.6Pa，偏压降至400V，沉积温度300℃，Ti靶电流70A，电弧镀Ti过渡层3-4min；
4)沉积Ti/Zr/Cr/Al过渡层：调整Ar气压0.5Pa，偏压降至300V，Ti多弧靶的靶电流80A；Zr多弧靶电流为70A，Cr非平衡磁控溅射靶电流为35A，Al非平衡磁控溅射靶电流为30A，沉积温度250-280℃，共沉积Ti/Zr/Cr/Al过渡层10min；
5)沉积TiZrCrAlN多元复合涂层：保持其它参数不变，开启N2，N2气压1.0Pa，占空比为0.5，复合沉积沉TiZrCrAlN层50min；其它参数不变，占空比降为0.4，复合TiZrCrAlN多元复合涂层10min；占空比降为0.3，复合TiZrCrAlN多元复合涂层10min；占空比降为0.2，复合TiZrCrAlN多元复合涂层10min；
6)后处理：关闭各电源、离子源及气体源，涂层结束。
与现有技术相比，本发明的有益效果为：本发明TiZrCrAlN多元复合耐磨涂层刀具及其制备方法，采用多弧离子镀和非平衡磁控溅射复合镀膜方法制备多元复合涂层，表面涂层为TiZrCrAlN多元涂层，刀具基体与表面涂层之间有Ti过渡层和Ti/Zr/Cr/Al过渡层，以减小残余应力，增加涂层与刀具基体间的结合强度，该TiZrCrAlN多元复合耐磨涂层刀具在涂层中同时增加了Ti、Zr、Cr、Al等4中金属，显著提高涂层的强度和韧性，具有更好的耐冲击性和抗磨损性，能够改善原有二元涂层耐磨性差的缺点，显著提高刀具的使用寿命以及切削性能。
附图说明
图1为本发明的的TiZrCrAlN多元复合耐磨涂层刀具的结构示意图。
图中：1、刀具基体，2、Ti过渡层，3、Ti/Zr/Cr/Al过渡涂层，4、TiZrCrAlN多元复合涂层。
具体实施方式：
下面给出本发明的两个最佳实施例。
实施例一
一种TiZrCrAlN多元复合耐磨涂层刀具，该刀具为普通的铣刀片，其刀具基体1的材料为：硬质合金YT15；涂层材料为：Ti、Ti/Zr/Cr/Al和TiZrCrAlN；刀具由下至上依次为：刀具基体1、Ti过渡层2、Ti/Zr/Cr/Al过渡层3和TiZrCrAlN多元复合涂层4。
本发明所述的TiZrCrAlN多元复合耐磨涂层刀具的制备方法，沉积方式为：在刀具基体表面电弧离子镀沉积Ti过渡层，然后多弧离子镀+非平衡磁控溅射复合沉积Ti/Zr/Cr/Al过渡层，最后同时沉积TiZrCrAlN多元复合涂层(沉积时使用1个Ti电弧靶、1个Zr电弧靶、1个Cr非平衡溅射靶和1个Al非平衡磁控溅射靶)，其制备步骤如下：
1)前处理：将硬质合金YT15铣刀片基体表面抛光，去除表面油污、锈迹等杂质，然后依次放入酒精和丙酮中，超声清洗各30min，去除刀具表面油污和其它附着物，电吹风干燥充分后迅速放入镀膜机，抽真空至5.0×10-3Pa，加热至300℃，保温30min；
2)离子清洗：通Ar气，其压力为1.5Pa，开启偏压电源，电压1000V，占空比0.5，辉光放电清洗15min；降低偏压至800V，开启离子源离子清洗25min，开启Ti靶的电弧源，靶电流50A，偏压500V，离子轰击Ti靶2min；
3)沉积Ti过渡层：调整Ar气压0.5Pa，偏压降至400V，沉积温度300℃，Ti靶电流70A，电弧镀Ti过渡层3min；
4)沉积Ti/Zr/Cr/Al过渡层：Ar气压0.5Pa，偏压300V，Ti多弧靶的靶电流80A；Zr多弧靶电流为70A，Cr非平衡磁控溅射靶电流为35A，Al非平衡磁控溅射靶电流为30A，沉积温度250℃，共沉积Ti/Zr/Cr/Al过渡层10min；
5)TiZrCrAlN多元复合涂层：保持其它参数不变，开启N2，N2气压1.0Pa，占空比为0.5，复合沉积沉TiZrCrAlN层50min；其它参数不变，占空比降为0.4，复合TiZrCrAlN多元复合涂层10min；占空比降为0.3，复合TiZrCrAlN多元复合涂层10min；占空比降为0.2，复合TiZrCrAlN多元复合涂层10min；
6)后处理：关闭各电源、离子源及气体源，涂层结束。
实施例二
一种TiZrCrAlN多元复合耐磨涂层刀具，该刀具为普通麻花钻，其基体材料为：高速钢W18Cr4V；涂层材料为：Ti、Ti/Zr/Cr/Al和TiZrCrAlN；刀具由下至上依次为：刀具基体1、Ti过渡层2、Ti/Zr/Cr/Al过渡层3和TiZrCrAlN多元复合涂层4。
本发明所述的TiZrCrAlN多元复合耐磨涂层刀具的制备方法，沉积方式为：在刀具基体表面电弧离子镀沉积Ti过渡层，然后多弧离子镀+非平衡磁控溅射复合沉积Ti/Zr/Cr/Al过渡层，最后同时沉积TiZrCrAlN多元复合涂层(沉积时使用1个Ti电弧靶、1个Zr电弧靶、1个Cr非平衡溅射靶和1个Al非平衡磁控溅射靶)，其制备步骤如下：
1)前处理：将基体材料为W18Cr4V的麻花钻刀具基体表面用金相砂纸打磨，去除表面油污、锈迹等杂质，然后依次放入酒精和丙酮中，超声清洗各30min，去除刀具表面油污和其它附着物，电吹风干燥充分后迅速放入镀膜机，抽真空至5.0×10-3Pa，加热至300℃，保温40min；
2)离子清洗：通Ar气，其压力为1.5Pa，开启偏压电源，电压1000V，占空比0.5，辉光放电清洗15min；降低偏压至800V，开启离子源离子清洗25min，开启Ti靶的电弧源，靶电流50A，偏压500V，离子轰击Ti靶2min；
3)沉积Ti过渡层：调整Ar气压0.6Pa，偏压降至400V，沉积温度300℃，Ti靶电流70A，电弧镀Ti过渡层4min；
4)沉积Ti/Zr/Cr/Al过渡层：Ar气压0.5Pa，偏压300V，Ti多弧靶的靶电流80A；Zr多弧靶电流为70A，Cr非平衡磁控溅射靶电流为35A，Al非平衡磁控溅射靶电流为30A，沉积温度280℃，共沉积Ti/Zr/Cr/Al过渡层10min；
5)TiZrCrAlN多元复合涂层：保持其它参数不变，开启N2，N2气压1.0Pa，占空比为0.5，复合沉积沉TiZrCrAlN层50min；其它参数不变，占空比降为0.4，复合TiZrCrAlN多元复合涂层10min；占空比降为0.3，复合TiZrCrAlN多元复合涂层10min；占空比降为0.2，复合TiZrCrAlN多元复合涂层10min；
6)后处理：关闭各电源、离子源及气体源，涂层结束。
Claims (1)
1.一种TiZrCrAlN多元复合耐磨涂层刀具的制备方法，该刀具基体的材料为硬质合金或高速钢，涂层由下至上依次为Ti、Ti/Zr/Cr/Al和TiZrCrAlN，其特征在于，在刀具基体表面电弧离子镀沉积Ti过渡层，然后多弧离子镀+非平衡磁控溅射复合沉积Ti/Zr/Cr/Al过渡层，最后同时沉积TiZrCrAlN多元涂层，沉积时使用1个Ti电弧靶、1个Zr电弧靶、1个Cr非平衡磁控溅射靶和1个Al非平衡磁控溅射靶，其制备步骤如下：
1)前处理：将刀具基体表面打磨、抛光，去除表面油污、锈迹，然后依次放入酒精和丙酮中，超声清洗各30min，去除刀具表面油污和其它附着物，电吹风干燥充分后迅速放入镀膜机，抽真空至5.0×10-3Pa，加热至300℃，保温30-40min；
2)离子清洗：通Ar气，其压力为1.5Pa，开启偏压电源，电压1000V，占空比0.5，辉光放电清洗15min；降低偏压至800V，开启离子源离子清洗25min，开启Ti靶的电弧源，靶电流50A，偏压500V，离子轰击Ti靶2min；
3)沉积Ti过渡层：调整Ar气压0.5-0.6Pa，偏压降至400V，沉积温度300℃，Ti靶电流70A，电弧镀Ti过渡层3-4min；
4)沉积Ti/Zr/Cr/Al过渡层：调整Ar气压0.5Pa，偏压降至300V，Ti多弧靶的靶电流80A；Zr多弧靶电流为70A，Cr非平衡磁控溅射靶电流为35A，Al非平衡磁控溅射靶电流为30A，沉积温度250-280℃，共沉积Ti/Zr/Cr/Al过渡层10min；
5)沉积TiZrCrAlN多元涂层：保持其它参数不变，开启N2，N2气压1.0Pa，占空比为0.5，复合沉积沉TiZrCrAlN层50min；其它参数不变，占空比降为0.4，复合沉积TiZrCrAlN层10min；占空比降为0.3，复合沉积TiZrCrAlN层10min；占空比降为0.2，复合沉积TiZrCrAlN层10min；
6)后处理：关闭各电源、离子源及气体源，涂层结束。
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