CN107118537B - 一种环氧树脂混合物及其在生产印刷电路板覆盖膜中的应用 - Google Patents

一种环氧树脂混合物及其在生产印刷电路板覆盖膜中的应用 Download PDF

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CN107118537B
CN107118537B CN201710294932.5A CN201710294932A CN107118537B CN 107118537 B CN107118537 B CN 107118537B CN 201710294932 A CN201710294932 A CN 201710294932A CN 107118537 B CN107118537 B CN 107118537B
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金小林
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Abstract

本发明公开了一种环氧树脂混合物及其在生产印刷电路板覆盖膜中的应用，所述环氧树脂混合物，由以下质量份的原料组成：苯氧树脂100份、环氧树脂5‑20份、羧基饱和聚酯树脂1‑20份、羟基饱和聚酯树脂5‑20份、异氰酸酯固化剂0‑0.5份、填料20‑60份和溶剂20‑100份。采用溶剂将苯氧树脂，羧基饱和聚酯树脂和羟基饱和聚酯树脂溶解，然后加入环氧树脂和填料混合30‑60分钟，加入异氰酸酯固化剂，在聚酰亚胺薄膜上涂布成膜，然后在100‑110度条件下烘烤5‑10分钟，根据应用需要控制总厚度在25‑50微米。以该混合后生产得到的覆盖膜具有良好的室温贮存稳定性和热稳定性，室温放置6个月后，能维持较好的剥离力。

Description

一种环氧树脂混合物及其在生产印刷电路板覆盖膜中的应用
技术领域
本发明属于电路板覆盖膜领域，具体涉及一种可用于生产印刷电路板覆盖膜的环氧树脂混合物。
背景技术
随着消费电子和通讯产品的轻量化、薄型化的发展，柔性线路板的应用越来越广泛。目前，柔性线路板一般由铜箔基材和聚酰亚胺基材的覆盖膜热压成型而成，而覆盖膜的胶水主要由环氧树脂，和双氰胺或脂环胺或二氨基二苯酚／二氨基二苯甲烷或咪唑等高温胺类固化剂，同时添加一定量的羧基丁腈橡胶混合而成。此类技术方案由于采用的固化剂具有较高的耐热性，保证了覆盖膜在回流焊（280度）过程中不起泡、脱落，但同时胺类固化剂及丁腈橡胶的存在导致此类胶水混合物固化后具有较低的贮存稳定性和颜色稳定性，一般只能室温存放三个月或需要低温（5度）保存，直接影响产品的热压后的剥离力稳定性。因此，获得贮存稳定且热稳定性良好的覆盖膜产品，仍是目前需要解决的问题。
发明内容
本发明的目的在于提供一种环氧树脂混合物及其在生产印刷电路板覆盖膜中的应用，环氧树脂混合物生产得到的覆盖膜具有良好的室温贮存稳定性和热稳定性。
为实现上述目的，本发明采用的技术手段为：
一种环氧树脂混合物，由以下质量份的原料组成：苯氧树脂100份、环氧树脂 5-20份、羧基饱和聚酯树脂 1-20份、羟基饱和聚酯树脂 5-20份、异氰酸酯固化剂 0-0.5份、填料 20-60份和溶剂20-100份。
所述苯氧树脂的玻璃化转变温度为30-100度，优选日本三菱JER1256，JER4250，JER4275；Gabriel PKHH，PKHB，PKCP-80，PKHM-301。
所述环氧树脂为双酚A环氧树脂、酚醛环氧树脂、二聚酸改性环氧树脂或者聚氨酯改性环氧树脂中的至少一种。
所述羧基聚酯树脂的酸值应小于90mgKOH／g；优选安徽神剑股份 SJ4G9（酸值17-23mgKOH／g），SJ6652-6（酸值48-55mgKOH／g），SJ3B-6（酸值68-75mgKOH／g）。
所述羟基聚酯树脂的羟值应小于10mgKOH／g 同时Tg值要小于60度。可以选用日本东洋纺Vylon® 637,Vylon® 670,Vylon® 673,Vylon® GK360等。
所述异氰酸酯固化剂为芳香族聚异氰酸酯或脂肪族聚异氰酸酯；优选科思创Desmodur® L-75，Desmodur® N75，Desmodur® BL3175SN。
所述填料包括阻燃剂，导热填料等，例如：氢氧化铝、次磷酸盐阻燃剂、氮化硼等。
所述溶剂为丁酮、乙醇、异丙醇、乙酸乙酯或者甲苯中的至少一种；优选甲苯和丁酮。
所述的环氧树脂混合物在生产印刷电路板覆盖膜中的应用。
采用溶剂将苯氧树脂，羧基饱和聚酯树脂和羟基饱和聚酯树脂溶解，然后加入环氧树脂和填料混合 30-60分钟，加入异氰酸酯固化剂，在聚酰亚胺薄膜上涂布成膜，然后在100-110度条件下烘烤5-10分钟，根据应用需要控制总厚度在25-50微米。
所述聚酰亚胺薄膜的厚度为12.5微米或者25微米。
有益效果：
本发明提供的环氧树脂混合物中通过组分的筛选和用量的优化，得到适用于生产印刷电路板覆盖膜的环氧树脂混合物，以该混合后生产得到的覆盖膜具有良好的室温贮存稳定性和热稳定性，室温放置6个月后，能维持较好的剥离力。
具体实施方式
实施例1
一种环氧树脂混合物，苯氧树脂JER1256 100份，二聚酸改性环氧树脂 20份，羧基聚酯树脂 5份，羟基聚酯树脂 10份，异氰酸酯固化剂L-75 0.05份，丁酮 30份、氢氧化铝20份。
实施例2
一种环氧树脂混合物，苯氧树脂JER1256 70份，苯氧树脂PKHM-301 30份，二聚酸改性环氧树脂 20份，羟基聚酯树脂 20份，异氰酸酯固化剂L-75 0.05份，丁酮 30份、氢氧化铝 20份。
实施例3
一种环氧树脂混合物，苯氧树脂JER1256 100份，聚氨酯改性环氧树脂 15份，羧基聚酯树脂 5份，羟基聚酯树脂 20份，异氰酸酯固化剂BL3175SN 0.1份，丁酮 30份、氢氧化铝10份， 阻燃剂OP935 10份。
实施例4
一种环氧树脂混合物，苯氧树脂JER1256 70份，苯氧树脂PKHM-301 30份，二聚酸改性环氧树脂 20份，羧基聚酯树脂 5份，羟基聚酯树脂 10份，异氰酸酯固化剂BL3175SN0.1份，丁酮 30份、氢氧化铝10份， 阻燃剂OP935 10份。
上述实施例1-4的混合物，先采用溶剂将苯氧树脂，羧基饱和聚酯树脂和羟基饱和聚酯树脂溶解，然后加入环氧树脂和填料混合 30-60分钟，加入异氰酸酯固化剂，在聚酰亚胺薄膜上涂布成膜，然后在100-110度条件下烘烤5-10分钟，根据应用需要控制总厚度在25-50微米，分别测定与铜箔贴合后剥离力，结果见表1。
表1：
实施例1 实施例2 实施例3 实施例4
与铜箔贴合后剥离力N／mm 1.3 1.1 1.5 1.4
与铜箔贴合后剥离力N／mm，室温放置180 天后 1.2 1.1 1.3 1.4

Claims (4)

1.一种环氧树脂混合物，其特征在于，所述环氧树脂混合物由以下质量份的原料组成：
苯氧树脂 100份、环氧树脂 5-20份、羧基饱和聚酯树脂 1-20份、羟基饱和聚酯树脂5-20份、异氰酸酯固化剂 0-0.5份、填料 20-60份和溶剂20-100份；
其中：所述苯氧树脂的玻璃化转变温度为30-100度；所述环氧树脂为双酚A环氧树脂、酚醛环氧树脂、二聚酸改性环氧树脂或者聚氨酯改性环氧树脂中的至少一种；所述羧基聚酯树脂的酸值应小于90mgKOH／g；所述羟基聚酯树脂的羟值应小于10mgKOH／g 同时Tg值要小于60度；所述异氰酸酯固化剂为芳香族聚异氰酸酯或脂肪族聚异氰酸酯；所述溶剂为丁酮、乙醇、异丙醇、乙酸乙酯或者甲苯中的至少一种。
2.权利要求1所述的环氧树脂混合物在生产印刷电路板覆盖膜中的应用。
3. 根据权利要求2所述的应用，其特征在于，采用溶剂将苯氧树脂，羧基饱和聚酯树脂和羟基饱和聚酯树脂溶解，然后加入环氧树脂和填料混合 30-60分钟，加入异氰酸酯固化剂，在聚酰亚胺薄膜上涂布成膜，然后在100-110度条件下烘烤5-10分钟，根据应用需要控制总厚度在25-50微米。
4.根据权利要求3所述的应用，其特征在于，所述聚酰亚胺薄膜的厚度为12.5微米或者25微米。
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