CN107112040B - 用于更好信号质量的新颖高速信号路由拓扑 - Google Patents

用于更好信号质量的新颖高速信号路由拓扑 Download PDF

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Publication number
CN107112040B
CN107112040B CN201680005415.5A CN201680005415A CN107112040B CN 107112040 B CN107112040 B CN 107112040B CN 201680005415 A CN201680005415 A CN 201680005415A CN 107112040 B CN107112040 B CN 107112040B
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signal
transmission line
pcb
chip
length
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Chinese (zh)
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CN107112040A (zh
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Y·萨布拉马尼安
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Qualcomm Inc
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Qualcomm Inc
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/025—Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0246—Termination of transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0248—Skew reduction or using delay lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09254—Branched layout

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Logic Circuits (AREA)
  • Dc Digital Transmission (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
CN201680005415.5A 2015-01-12 2016-01-11 用于更好信号质量的新颖高速信号路由拓扑 Active CN107112040B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/595,175 US9980366B2 (en) 2015-01-12 2015-01-12 High speed signal routing topology for better signal quality
US14/595,175 2015-01-12
PCT/US2016/012912 WO2016115056A2 (en) 2015-01-12 2016-01-11 A novel high speed signal routing topology for better signal quality

Publications (2)

Publication Number Publication Date
CN107112040A CN107112040A (zh) 2017-08-29
CN107112040B true CN107112040B (zh) 2020-10-30

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CN201680005415.5A Active CN107112040B (zh) 2015-01-12 2016-01-11 用于更好信号质量的新颖高速信号路由拓扑

Country Status (6)

Country Link
US (2) US9980366B2 (enExample)
EP (1) EP3245853B1 (enExample)
JP (1) JP2018506897A (enExample)
KR (1) KR20170105493A (enExample)
CN (1) CN107112040B (enExample)
WO (1) WO2016115056A2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9980366B2 (en) 2015-01-12 2018-05-22 Qualcomm Incorporated High speed signal routing topology for better signal quality
US10718851B2 (en) * 2016-02-02 2020-07-21 Qualcomm Incorporated Displacement and rotation measurement for unmanned aerial vehicles
KR102640968B1 (ko) 2018-05-29 2024-02-27 삼성전자주식회사 인쇄 회로 기판, 스토리지 장치, 및 인쇄 회로 기판을 포함하는 스토리지 장치
KR20220066445A (ko) 2020-11-16 2022-05-24 삼성전자주식회사 모듈 보드 및 이를 포함하는 메모리 모듈
CN113316319B (zh) * 2021-05-08 2022-11-11 珠海全志科技股份有限公司 智能设备、可读存储介质、印刷电路板及其使用方法
KR20230000483A (ko) * 2021-06-24 2023-01-03 삼성전자주식회사 전자 장치, 및 인쇄 회로 기판을 포함하는 전자 장치
KR20230009732A (ko) 2021-07-09 2023-01-17 삼성전자주식회사 균형 배선 구조를 갖는 반도체 패키지

Citations (4)

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CN1523842A (zh) * 2003-02-21 2004-08-25 v 信号传输装置与互连结构
US7245145B2 (en) * 2003-06-11 2007-07-17 Micron Technology, Inc. Memory module and method having improved signal routing topology
CN103093064A (zh) * 2013-02-19 2013-05-08 浪潮电子信息产业股份有限公司 一种pcb高速信号线轨迹控制方法
CN103812497A (zh) * 2012-11-06 2014-05-21 珠海全志科技股份有限公司 驱动器及低抖动串行信号的输出方法

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JP3957237B2 (ja) 1998-01-19 2007-08-15 富士通株式会社 集積回路装置モジュール
JP2001084070A (ja) * 1999-09-10 2001-03-30 Toshiba Corp プリント配線基板及び電子機器のプリント配線基板
US6545875B1 (en) * 2000-05-10 2003-04-08 Rambus, Inc. Multiple channel modules and bus systems using same
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JP3808335B2 (ja) 2001-07-26 2006-08-09 エルピーダメモリ株式会社 メモリモジュール
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KR100689967B1 (ko) 2006-02-03 2007-03-08 삼성전자주식회사 개선된 멀티 모듈 메모리 버스 구조를 가진 메모리 시스템
JP5696301B2 (ja) 2007-09-28 2015-04-08 ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． アドレス線配線構造及びこれを有するプリント配線基板
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CN1523842A (zh) * 2003-02-21 2004-08-25 v 信号传输装置与互连结构
US7245145B2 (en) * 2003-06-11 2007-07-17 Micron Technology, Inc. Memory module and method having improved signal routing topology
CN103812497A (zh) * 2012-11-06 2014-05-21 珠海全志科技股份有限公司 驱动器及低抖动串行信号的输出方法
CN103093064A (zh) * 2013-02-19 2013-05-08 浪潮电子信息产业股份有限公司 一种pcb高速信号线轨迹控制方法

Also Published As

Publication number Publication date
EP3245853B1 (en) 2018-09-26
KR20170105493A (ko) 2017-09-19
WO2016115056A2 (en) 2016-07-21
WO2016115056A3 (en) 2016-09-09
CN107112040A (zh) 2017-08-29
JP2018506897A (ja) 2018-03-08
EP3245853A2 (en) 2017-11-22
US20180220524A1 (en) 2018-08-02
US9980366B2 (en) 2018-05-22
US20160205767A1 (en) 2016-07-14
US10039183B1 (en) 2018-07-31

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