CN107086227B - 发光电路、电子装置、薄膜晶体管及其制备方法 - Google Patents

发光电路、电子装置、薄膜晶体管及其制备方法 Download PDF

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CN107086227B
CN107086227B CN201710329943.2A CN201710329943A CN107086227B CN 107086227 B CN107086227 B CN 107086227B CN 201710329943 A CN201710329943 A CN 201710329943A CN 107086227 B CN107086227 B CN 107086227B
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gate
electrode
thin film
film transistor
active layer
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CN107086227A (zh
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顾鹏飞
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Priority to PCT/CN2017/116508 priority patent/WO2018205613A1/zh
Priority to US16/070,656 priority patent/US10504984B2/en
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    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/121Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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    • G09G3/3233Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
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    • G09G3/30Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
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    • G09G3/3225Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
    • G09G3/3258Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the voltage across the light-emitting element
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
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    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
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    • H01L27/144Devices controlled by radiation
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    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
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    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
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    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
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    • H01L29/78Field effect transistors with field effect produced by an insulated gate
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    • H01L29/76Unipolar devices, e.g. field effect transistors
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    • H01L29/78Field effect transistors with field effect produced by an insulated gate
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    • H10K59/12Active-matrix OLED [AMOLED] displays
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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00Aspects of the constitution of display devices
    • G09G2300/08Active matrix structure, i.e. with use of active elements, inclusive of non-linear two terminal elements, in the pixels together with light emitting or modulating elements
    • G09G2300/0809Several active elements per pixel in active matrix panels
    • G09G2300/0842Several active elements per pixel in active matrix panels forming a memory circuit, e.g. a dynamic memory with one capacitor
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  • Thin Film Transistor (AREA)

Abstract

一种发光电路、电子装置、双栅薄膜晶体管及其制备方法。该发光电路包括:双栅薄膜晶体管以及发光元件,其中,所述双栅薄膜晶体管包括第一栅极、第二栅极、第一电极和第二电极,所述发光元件包括第一端和第二端;所述第一栅极和所述第二栅极配置为电连接到不同的信号线,所述第一电极配置为电连接到第一电源端,所述第二电极电连接到所述发光元件的第一端,所述发光元件的第二端配置为电连接到第二电源端;仅当所述第一栅极和第二栅极上同时接收导通信号时,所述双栅薄膜晶体管导通以驱动所述发光元件。本公开提供的发光电路可以简化电路结构并降低成本。

Description

发光电路、电子装置、薄膜晶体管及其制备方法
技术领域
本发明的实施例涉及一种发光电路、电子装置、薄膜晶体管及其制备方法。
背景技术
AMOLED(Active-matrix organic light emitting diode,有源矩阵有机发光二极管)是一种自发光显示器。与传统的液晶面板相比,AMOLED显示面板具有反应速度更快、对比度更高、视角更广等优点。因此,AMOLED得到了越来越广泛的应用。
AMOLED显示面板使用的像素电路通常为2T1C像素电路,即利用两个 TFT(Thin-film transistor,薄膜晶体管)和一个存储电容Cs来实现驱动OLED 的基本功能。图1示出了该2T1C像素电路的示意图。如图1所示,该2T1C像素电路包括开关(SW)TFT、驱动(DR)TFT以及存储电容Cs。例如,该 SW TFT的栅极连接栅线(扫描线)以接收扫描信号(G1),例如源极连接到数据线以接收数据信号(DATA),漏极连接到DR TFT的栅极;DR TFT的源极连接到第一电源端(VDD),漏极连接到OLED的正极;存储电容Cs的一端连接到SW TFT的漏极以及DRTFT的栅极,另一端连接到DR TFT的漏极以及 OLED的正极;OLED的负极连接到第二电源端(VSS),例如接地。该2T1C 像素电路的驱动方式是将像素的明暗(灰阶)经由两个TFT和存储电容Cs来控制。当通过栅线施加扫描信号G1以开启SW TFT时,外部电路通过数据线送入的数据电压(DATA)将经由SW TFT对存储电容Cs充电,由此将数据信号存储在存储电容Cs中,且此存储的电压信号控制DR TFT导通程度,由此控制流过DR TFT以驱动OLED发光的电流大小,即此电流决定AMOLED的像素发光的灰阶。
发明内容
本发明至少一实施例提供一种发光电路,包括:双栅薄膜晶体管以及发光元件,其中,所述双栅薄膜晶体管包括第一栅极、第二栅极、第一电极和第二电极,所述发光元件包括第一端和第二端;所述第一栅极和所述第二栅极配置为电连接到不同的信号线,所述第一电极配置为电连接到第一电源端,所述第二电极电连接到所述发光元件的第一端,所述发光元件的第二端配置为电连接到第二电源端;仅当所述第一栅极和第二栅极上同时接收导通信号时,所述双栅薄膜晶体管导通以驱动所述发光元件。
本发明至少一实施例提供的一种发光电路,还包括第一电容和/或第二电容,其中,所述第一电容的第一端电连接到所述第一栅极,所述第一电容的第二端连接到所述发光元件的第一端;所述第二电容的第一端连接到所述第二栅极,所述第二电容的第二端连接到所述发光元件的第一端。
本发明至少一实施例提供的一种发光电路中,所述双栅薄膜晶体管为双顶栅薄膜晶体管。
本发明至少一实施例还提供一种电子装置,包括上述任一所述的发光电路。
本发明至少一实施例提供的一种电子装置,还包括栅极驱动电路和数据驱动电路,其中,所述发光电路的双栅薄膜晶体管中,所述第一栅极配置为接收所述栅极驱动电路施加的栅极信号,所述第二栅极配置为接收所述数据驱动电路施加的数据信号。
本发明至少一实施例还提供一种发光电路的驱动方法,包括:在所述第一栅极上施加固定电压的驱动信号,在所述第二栅极上施加变动电压的驱动信号,以使得所述双栅薄膜晶体管导通以驱动所述发光元件。
本发明至少一实施例还提供一种薄膜晶体管,包括:有源层、第一栅极、第二栅极、源极和漏极,其中,所述第一栅极和所述第二栅极彼此绝缘,所述第一栅极和第二栅极配置为分别控制有源层的不同部分,且仅当所述第一栅极和所述第二栅极上同时接收导通信号时,所述薄膜晶体管导通。
本发明至少一实施例提供的一种薄膜晶体管中,所述第一栅极和所述第二栅极在所述有源层上的正投影位于所述源极和所述漏极在所述有源层上的正投影之间,且在从所述源极到所述漏极的方向上至少不完全重叠。
本发明至少一实施例提供的一种薄膜晶体管中,所述第一栅极和第二栅极位于所述有源层的同一侧,且彼此间具有间隔,所述有源层中对应于所述间隔在所述有源层上的正投影的区域为导电区域。
本发明至少一实施例提供的一种薄膜晶体管中,所述第一栅极包括彼此电连接的第一分支电极和第二分支电极,所述第一分支电极、所述第二栅极和所述第二分支电极依次并排设置。
本发明至少一实施例提供的一种薄膜晶体管,还包括衬底基板,其中,所述有源层、所述第一栅极、所述第二栅极、所述源极和所述漏极设置在所述衬底基板上,所述第一栅极和所述第二栅极设置在所述有源层远离所述衬底基板的同一侧。
本发明至少一实施例还提供一种薄膜晶体管的制备方法,包括:形成所述薄膜晶体管的有源层、第一栅极、第二栅极、源极和漏极,其中,所述第一栅极和所述第二栅极彼此绝缘,所述第一栅极和第二栅极配置为分别控制有源层的不同部分,且仅当所述第一栅极和所述第二栅极上同时接收导通信号时,所述薄膜晶体管导通。
本发明至少一实施例提供的一种薄膜晶体管的制备方法中,所述第一栅极和所述第二栅极在所述有源层上的正投影位于所述源极和所述漏极在所述有源层上的正投影之间,且在从所述源极到所述漏极的方向上至少不完全重叠。
本发明至少一实施例提供的一种薄膜晶体管的制备方法,还包括:提供衬底基板,其中,在所述衬底基板上形成所述有源层,在所述有源层上形成所述第一栅极和所述第二栅极,所述第一栅极和所述第二栅极彼此间具有间隔;使用所述第一栅极和所述第二栅极作为掩模,对所述有源层中对应于所述间隔在所述有源层上的正投影的区域进行导体化处理。
本发明至少一实施例提供的一种薄膜晶体管的制备方法中,所述导体化处理包括离子掺杂或等离子体处理。
附图说明
为了更清楚地说明本发明实施例的技术方案,下面将对实施例的附图作简单地介绍,显而易见地,下面描述中的附图仅仅涉及本发明的一些实施例,而非对本发明的限制。
图1为一种2T1C像素电路;
图2为本发明一实施例提供的一种发光电路;
图3为本发明一实施例提供的一种电子装置;
图4a为本发明一实施例提供的一种薄膜晶体管的平面图;
图4b为图4a中薄膜晶体管的截面图;
图5a为本发明另一实施例提供的一种薄膜晶体管的平面图;
图5b为图5a中薄膜晶体管的截面图;
图6为本发明另一实施例提供的一种发光电路;
图7a-7g为本发明一实施例提供的一种薄膜晶体管的制备工艺流程图。
附图标记:
1-第一栅极;2-第二栅极;3-发光元件;4-第一电容;5-第二电容;6- 数据驱动电路;61-数据线;7-栅极驱动电路;71-栅线;8-像素;101-第一栅极;102-第二栅极;103-源极;104-漏极;107-有源层;1071-第一子沟道; 1072-第二子沟道;1073-导电区域;108a-第一栅绝缘层;108b-第二栅绝缘层; 201-第一栅极;202-第二栅极;2021-第一分支电极;2022-第二分支电极; 203-源极;204-漏极;205-基板;206-缓冲层;207-有源层;2071-第一子沟道;2072-第二子沟道;2073-导电区域;208-栅绝缘层;208a-第一栅绝缘层; 208b-第二栅绝缘层;209-绝缘层;210-间隔。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例的附图,对本发明实施例的技术方案进行清楚、完整地描述。显然,所描述的实施例是本发明的一部分实施例,而不是全部的实施例。基于所描述的本发明的实施例,本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例,都属于本发明保护的范围。
除非另外定义,本公开使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性,而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同,而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接,而是可以包括电性的连接,不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系,当被描述对象的绝对位置改变后,则该相对位置关系也可能相应地改变。
如前面所述,目前AMOLED显示面板使用的像素电路为2T1C像素电路,即利用两个TFT和一个电容Cs来实现驱动OLED的基本功能。有的AMOLED 显示面板也使用基于2T1C像素电路得到其他像素电路。因此该像素电路至少需要两个TFT和一个电容Cs,其结构仍然比较复杂。
本发明至少一实施例提供一种发光电路,包括:双栅薄膜晶体管以及发光元件,其中,所述双栅薄膜晶体管包括第一栅极、第二栅极、第一电极和第二电极,所述发光元件包括第一端和第二端;所述第一栅极和所述第二栅极配置为电连接到不同的信号线,所述第一电极配置为电连接到第一电源端,所述第二电极电连接到所述发光元件的第一端,所述发光元件的第二端配置为电连接到第二电源端;仅当所述第一栅极和第二栅极上同时接收导通信号时,所述双栅薄膜晶体管导通以驱动所述发光元件。
本发明至少一实施例提供一种薄膜晶体管,包括:有源层、第一栅极、第二栅极、源极和漏极,其中,所述第一栅极和所述第二栅极彼此绝缘,所述第一栅极和第二栅极配置为分别控制有源层的不同部分,且仅当所述第一栅极和所述第二栅极上同时接收导通信号时,所述薄膜晶体管导通。
另外,本发明至少一实施例提供一种薄膜晶体管的制备方法,包括:形成所述薄膜晶体管的有源层、第一栅极、第二栅极、源极和漏极,其中,所述第一栅极和所述第二栅极彼此绝缘,所述第一栅极和第二栅极配置为分别控制有源层的不同部分,且仅当所述第一栅极和所述第二栅极上同时接收导通信号时,所述薄膜晶体管导通。
下面通过几个实施例对根据本发明实施例的发光电路、电子装置、薄膜晶体管及其制备方法进行说明。
实施例一
本实施例提供一种发光电路,该发光电路例如可应用于显示装置、发光装置、照明装置等。如图2所示,该发光电路包括:双栅薄膜晶体管TFT 以及与之电连接的发光元件3,发光元件3可以为发光二极管,例如,发光元件3为有机发光二极管(OLED)或无机发光二极管等。该发光元件3包括两端,即第一端和第二端,例如分别为正极端和负极端。发光元件3通过这两端与电路中的其他元件相连。该双栅薄膜晶体管TFT包括第一栅极1、第二栅极2、第一电极和第二电极;第一栅极1和第二栅极2配置为电连接到不同的信号线,从而接受不同的信号。例如,第一栅极1连接到栅线从而连接到栅极驱动电路,并配置为接收栅极驱动电路施加的栅极信号Gate,第二栅极2连接到数据线从而连接到数据驱动电路,并配置为接收数据驱动电路施加的数据信号Data。该实施例中,仅当第一栅极和第二栅极上同时接收导通信号时,双栅薄膜晶体管导通以驱动发光元件。
本实施例中,例如,该双栅薄膜晶体管TFT可以N型晶体管也可以为P 型晶体管。例如,当该双栅薄膜晶体管TFT为N型晶体管时,该双栅薄膜晶体管TFT的第一电极设置为漏极,并配置为电连接到第一电源端VDD,该电源端可以设置为提供工作电压;双栅薄膜晶体管TFT的第二电极设置为源极,并配置为电连接到有机发光二极管3的第一端,而有机发光二极管3 的第二端配置为电连接到第二电源端VSS,本实施例中,有机发光二极管3 的第二端可以接地。
例如,当该双栅薄膜晶体管TFT为P型晶体管时,该双栅薄膜晶体管 TFT的第一电极设置为源极,并配置为电连接到第一电源端VDD,双栅薄膜晶体管TFT的第二电极设置为漏极。
下面以该双栅薄膜晶体管TFT为N型晶体管以及发光元件3为有机发光二极管为例进行说明,但是本发明的实施例并不限于此。
另外,本发明至少一实施例还提供一种电子装置,该电子装置包括上述发光电路,该电子装置可以为任何合适的装置,例如可以是显示装置,也可以是发光装置或照明装置,例如广告牌、照明灯等。
如图3所示,当该电子装置为显示装置时,其还可以包括数据驱动电路 6和栅极驱动电路7,以用于分别提供数据信号和栅极信号。该显示装置包括排列为阵列的多个像素8,数据驱动电路6通过数据线61与像素8电连接,栅极驱动电路7通过栅线71与像素8电连接。不同的像素8可以发出不同颜色的光(例如红、绿或蓝光,或者白光),上述发光电路用于像素8的像素电路,以在工作中发光。该显示装置还可以包括电源端VDD。当发光元件3为OLED时,该显示装置可以为AMOLED。
另外,本实施例还提供一种上述发光电路以及采用该发光电路的电子装置的驱动方法,该发光电路的驱动方法包括:在第一栅极1上施加固定电压的驱动信号,在第二栅极2上施加变动电压的驱动信号,从而使得双栅薄膜晶体管导通以驱动所述发光元件3。
下面以显示装置为例来对本实施例的发光电路以及电子装置的示例性驱动方法进行说明。
在像素8的发光电路的双栅薄膜晶体管中,第一栅极1配置为接收栅极驱动电路7施加的栅极信号,第二栅极2配置为接收数据驱动电路6施加的数据信号。通过这样的配置,使得仅当第一栅极1和第二栅极2上同时接收导通信号时,即第一栅极1和第二栅极2分别同时接收到栅极驱动电路施加的栅极信号Gate和数据驱动电路施加的数据信号Data时,双栅薄膜晶体管被导通(开启),从而电源电压VDD和VSS被加载到发光元件3的两端,以驱动该发光元件3工作,例如发出预定亮度的光。然而,当第一栅极1和第二栅极2中任意一个处于被施加非导通信号的关闭状态时,双栅薄膜晶体 TFT不导通。
例如在一个具体应用中,双栅薄膜晶体管TFT的第一电极设置为漏极,并配置为电连接到第一电源端VDD,该电源端提供12V的恒定电压;双栅薄膜晶体管TFT的第二电极设置为源极,并通过有机发光二极管电连接到第二电源端VSS,该电源端为接地,电压为0V。该双栅薄膜晶体管TFT的阈值电压例如为3V。双栅薄膜晶体管TFT的第一栅极1连接到的栅极驱动电路施加的栅极信号Gate为恒定值20V,从而该信号为导通信号,可使得薄膜晶体管的部分沟道开启;而双栅薄膜晶体管TFT的第二栅极2连接到的数据驱动电路施加的数据信号Data为在0-12V之间变化的灰阶信号,当数据信号大于3V时为导通信号,可使得薄膜晶体管的另外部分沟道开启。当第一栅极和第二栅极上同时接收导通信号时,双栅薄膜晶体管的整个沟道都变得导通,从而该双栅薄膜晶体管被导通(开启)。而且,当第二栅极2的电位在0-12V之间变化时,可以调节双栅薄膜晶体管TFT的导通程度,也即调节了双栅薄膜晶体管TFT的源极和漏极之间的电阻。因此,此时通过调控第二栅极2上施加的电压的大小,可以达到控制源极和漏极之间电阻的效果,进而实现对发光元件3施加不同的电流,从而控制发光元件3的发光亮度,由此例如实现在显示装置中调节灰阶的功能。上述信号电压值可以根据需要变换,本发明的实施例不限于这些具体的数值。
因此,本实施例的AMOLED利用本发明实施例公开的发光电路可用来替代常用的2T1C电路,使电路结构更加简化,同时,该电路通过一个TFT 实现原有2T1C电路中的两个TFT的功能,降低了AMOLED的复杂度、生产成本。
本实施例还提供一种用于上述发光电路中的双栅薄膜晶体管,该双栅薄膜晶体管包括有源层、第一栅极、第二栅极、源极和漏极。第一栅极和第二栅极彼此绝缘,并且该第一栅极和第二栅极配置为分别控制该薄膜晶体管的有源层的不同部分,仅当第一栅极和第二栅极上同时接收导通信号时,双栅薄膜晶体管导通,从而可以驱动发光元件。
图4a为本实施例提供的一种示范性薄膜晶体管的平面图,图4b为图4a 中薄膜晶体管的截面图。
如图4a和图4b所示,本实施例中的薄膜晶体管为双顶栅薄膜晶体管,该薄膜晶体管包括:有源层107、第一栅极101、第二栅极102、源极103 和漏极104。源极103可以连接到发光元件,而漏极104可以连接到电源端 VDD。
在衬底基板105上,第一栅极101和第二栅极102彼此绝缘,如图4a 和图4b所示,第一栅极101和第二栅极102分别通过第一栅绝缘层108a和第二栅绝缘层108b设置在有源层107上,并且并列设置在源极103和漏极 104之间。第一栅极101和第二栅极102之间具有间隔110,有源层107中对应于上述间隔110在所述有源层上的正投影的区域1073为导电区域。在薄膜晶体管中,有源层中对应于栅极的部分为沟道区域,当栅极上被施加导通电压时,沟道区域变为导通状态,否则沟道区域保持为截止状态。在正投影方向(垂直于衬底基板105的方向)上,上述有源层107包括对应于第一栅极101和第二栅极102的第一子沟道1071和第二子沟道1072,分别受第一栅极101和第二栅极102控制,也即当第一栅极101被施加导通信号时,第一子沟道1071变得导电,第二栅极102被施加导通信号时,第二子沟道 1072变得导电。第一子沟道1071和第二子沟道1072构成有源层的沟道。因此,在该示例的薄膜晶体管中,该第一栅极和第二栅极配置为分别控制该薄膜晶体管的有源层的不同部分。上述第一子沟道1071和第二子沟道1072并列设置也可以部分重叠(例如第一栅极和第二栅极位于有源层的不同侧时,即一个为顶栅而另一个底栅时),但不完全重叠,由此仅在第一子沟道1071 和第二子沟道1072都导通时,才会使得整个沟道区导通。
通过这样的配置,仅当第一栅极101和第二栅极102上同时接收导通信号时,双栅薄膜晶体管才被导通(开启),使得源极103和漏极104被电连接;当第一栅极101和第二栅极102中任意一个处于关闭状态时,双栅薄膜晶体TFT均不导通(截止),使得源极103和漏极104被绝缘。
图5a为本实施例提供的另一种示范性薄膜晶体管的平面图,图5b为图 5a中薄膜晶体管的截面图。
本示例的薄膜晶体管同样为双顶栅薄膜晶体管,该薄膜晶体管包括有源层207、第一栅极201、第二栅极202、源极203和漏极204。源极203可以连接到发光元件,而漏极204可以连接到电源端VDD。
第一栅极201和第二栅极202彼此绝缘,如图5a和图5b所示,第一栅极201和第二栅极202分别通过第一栅绝缘层208a和第二栅绝缘层208b设置在有源层207上,并且并列设置在源极203和漏极204之间。与上述示例不同的是,本示例的薄膜晶体管的第二栅极202为“U”形,包括彼此电连接的第一分支电极2021和第二分支电极2011,且第一分支电极2021、第一栅极201和第二分支电极2022依次并排设置在有源层207上。第一栅极201 和第二栅极202之间具有间隔210,有源层207中的对应于上述间隔210在所述有源层上的正投影的区域2073为导电区域。同样,上述有源层207包括对应于第一栅极201和第二栅极202的第一子沟道2071和第二子沟道 2072,分别受第一栅极201和第二栅极202控制,也即当第一栅极201被施加导通信号时,第一子沟道2071变得导电,第二栅极202被施加导通信号时,第二子沟道2072可变得导电。因此,该示例的薄膜晶体管中,该第一栅极和第二栅极配置为分别控制该薄膜晶体管的有源层的不同部分。需要说明的是,本示例的薄膜晶体管的第一栅极201和第二栅极202的形状也可以是任意形状的,本公开在此不做限定。
上述配置可以实现当且仅当第一栅极201和第二栅极202上同时接收导通信号时,双栅薄膜晶体管导通(开启),使得源极203和漏极204被电连接;当第一栅极201和第二栅极202中任意一个处于关闭状态时,双栅薄膜晶体TFT均不导通(截止),使得源极203和漏极204被绝缘。
需要说明的是,上述仅仅着重说明了实施例中的薄膜晶体管主要部分,这些薄膜晶体管当然还可以包括其他结构,例如,本实施例的薄膜晶体管还可以包括衬底基板,有源层、第一栅极、第二栅极、源极和漏极设置在衬底基板上。该衬底基板可以为玻璃基板、塑料基板等。该有源层可以由非晶硅、多晶硅、氧化物半导体材料制备,并且有源层中除沟道区之前的其他部分(包括与第一栅极和第二栅极之间的间隔对应的区域)被处理为导电区域;栅极、源极和漏极例如可以通过金属等导电材料制备,该金属可以为铝、铝合金、铜、铜合金等;栅绝缘层可以为氧化硅、氮化硅、氧氮化硅等材料。该实施例中的薄膜晶体管还可以包括设置在衬底基板上的缓冲层、绝缘层等,在此不再赘述。
需要说明的是,上述附图所示出的示例中的双栅薄膜晶体管均为双顶栅薄膜晶体管,但是在其他实施例中,薄膜晶体管还可以为双底栅薄膜晶体管,也可以为一顶栅一底栅形式的薄膜晶体管,此时,第一栅极和第二栅极也应彼此绝缘,第一栅极和第二栅极在有源层的上方或下方。在这些结构中,该第一栅极和第二栅极配置为分别控制该薄膜晶体管的有源层的不同部分,且仅当第一栅极和第二栅极上同时接收导通信号时,双栅薄膜晶体管导通;当第一栅极和第二栅极中任意一个处于被施加非导通信号的关闭状态时,双栅薄膜晶体均不导通。为了使得第一栅极和第二栅极分别控制该薄膜晶体管的有源层的不同部分且仅当第一栅极和第二栅极上同时接收导通信号时,双栅薄膜晶体管导通,例如,第一栅极和第二栅极在有源层上的正投影位于源极和漏极在有源层上的正投影之间,同时第一栅极和第二栅极在从源极到漏极的方向上至少不完全重叠,即不重叠或不完全重叠,由此有源层上具有分别对应于第一栅极和第二栅极且分别受第一栅极和第二栅极控制的不同子沟道区,这些不同的子沟道区构成有源层的沟道区。
实施例二
在本发明的实施例二中,发光电路除了上述与上述实施例一种相同的结构之外,进一步还包括至少一个电容。例如,如图6所示,根据该实施例的发光电路还包括第一电容4和第二电容5,其中,第一电容4的第一端电连接到第一栅极1,第一电容4的第二端电连接到发光元件3的第一端;第二电容5的第一端电连接到第二栅极2,第二电容5的第二端电连接到发光元件3的第一端。
本实施例提供的发光电路的双栅薄膜晶体管可以采用上一实施例中所述的任一双栅薄膜晶体管。
本实施例提供的发光电路中的第一电容4和第二电容5可以起到保持电信号的作用,当栅极驱动电路施加的栅极信号Gate和驱动电路施加的数据信号Data不是持续信号而有间断时,通过第一电容4和第二电容5可以分别保持施加在与其相连的第一栅极1和第二栅极2上的电信号。
需要说明的是,当栅极驱动电路施加的栅极信号Gate和驱动电路施加的数据信号Data持续时,第一电容4和第二电容5也可以不设置,或者根据实际情况,例如栅极驱动电路施加的栅极信号Gate和数据驱动电路施加的数据信号Data是否为持续信号等,有选择地设置第一电容4和第二电容5 中的一个或两个。
另外,本实施例还提供一种上述发光电路的驱动方法,该方法包括:在第一栅极1上施加固定电压的驱动信号,在第二栅极2上施加变动电压的驱动信号,从而使得双栅薄膜晶体管导通以驱动所述发光元件3。
在本实施例的方法中,由于第一栅极1上施加的驱动信号为固定电压信号,因此,第一栅极1可以不连接第一电容4;由于第二栅极2上施加的驱动信号为变动的电压信号。因此,可以根据该信号特征,判断第二栅极2是否连接电容;例如,当该变动的电压信号可能存在间断时,则可以设置第二电容5;当该变动的电压信号持续时,则可以不设置第二电容5。
另外,本实施例提供的发光电路也可以应用在如图3所示的电子装置中,再利用本实施例所述的驱动方法驱动该电路。在该电子装置中,由于第二栅极2上施加的驱动信号为变动的电压信号,因此可以达到调节双栅薄膜晶体管TFT的导通程度的目的,也即通过第二栅极2电压的调控,可以达到控制源极和漏极之间电阻的效果。当该发光电路或电子装置应用在AMOLED时,可以实现在AMOLED中调灰阶的功能,使像素8持续而稳定地发出所需要的光。
根据本实施例的双栅晶体管例如也可以采用图4a、4b或图5a、5b所示的示范性结构。例如,该双栅薄膜晶体管为双顶栅薄膜晶体管、双底栅薄膜晶体管,也可以为一顶栅一底栅形式的薄膜晶体管,此时,第一栅极和第二栅极也彼此绝缘,第一栅极和第二栅极在有源层的上方或下方,该第一栅极和第二栅极分别控制该薄膜晶体管的有源层的不同部分,且仅当第一栅极和第二栅极上同时接收导通信号时,双栅薄膜晶体管导通;当第一栅极和第二栅极中任意一个处于被施加非导通信号的关闭状态时,双栅薄膜晶体TFT 不导通。
而且对于图4a、4b或图5a、5b示例,为了实现第一电容4和/或第二电容5,可以制备与第一栅极101/201连接的电容电极,以及制备与第二栅极 102/202电连接的电容电极。
在本发明的其他实施例中的发光电路,除了上述双栅TFT之外,还可以包括其他电路元件,例如包括用于补偿该双栅TFT的阈值电压漂移的补偿电路等,本发明的实施例不限于仅使用上述双栅TFT来驱动发光元件。
实施例三
本发明至少一实施例提供一种如上所述的双栅薄膜晶体管的制备方法。下面以图5a和图5b所示的双栅薄膜晶体管为例进行说明,但是本发明的实施例不限于该具体情形。
图7a-7g为本实施例提供的一种薄膜晶体管的制备工艺流程图,如图所示,该方法包括:分别形成薄膜晶体管的有源层207、第一栅极201、第二栅极203、源极203和漏极204,其中,第一栅极201和第二栅202极彼此绝缘,且该第一栅极201和第二栅极202配置为在工作中分别控制该薄膜晶体管的有源层的不同部分,仅当第一栅极201和第二栅极202上同时接收导通信号时,该双栅薄膜晶体管导通。
例如,在一个示例中,第一栅极201和第二栅极202在有源层207上的正投影位于源极203和漏极204在有源层207上的正投影之间,且在从源极 203到漏极204的方向上至少不完全重叠,即不重叠或不完全重叠。
更具体地,如图7a所示,首先在衬底基板205上沉积一层缓冲层206。本实施例中,通过化学气相沉积(CVD),例如可以是等离子体增强化学气相沉积(PECVD)在衬底基板205上沉积一层缓冲层206,该缓冲层206例如可以为SiOx、SiNx或者其复合膜。衬底基板205例如可以为玻璃基板、塑料基板等。
如图7b所示,在沉积完缓冲层206后,使用溅射(sputtering)的方法在缓冲层206上再形成一层有源层207。有源层207可以为非晶硅层、多晶硅层或氧化物半导体层等,但需要说明的是,有源层并不限于上述材料。本实施例中,有源层207可以采用氧化铟镓锌材料,氧化铟镓锌为一种载流子迁移率很高的材料,可以大大提高薄膜晶体管对像素电极的充放电速率,实现更快的刷新率。有源层薄膜形成后,采用例如光刻工艺的构图工艺等对其进行图形化处理以形成最终的有源层207。根据需要,也可以不形成缓冲层,而将有源层直接形成在衬底基板205之上。
光刻工艺的主要过程为:首先在被处理的薄膜表面涂上一层光刻胶,再利用紫外光通过掩膜板照射到光刻胶层上,引起曝光区域的光刻胶发生化学反应,再通过显影技术溶解去除曝光区域或未曝光区域的光刻胶(前者称正性光刻胶,后者称负性光刻胶),使掩膜板上的图案被复制到光刻胶薄膜上,最后利用刻蚀技术将图案转移到基板上。
如图7c所示,有源层207形成后,通过化学气相沉积(CVD),例如等离子体增强化学气相沉积(PECVD),在有源层207上形成一层栅绝缘层208 (GI层),栅绝缘层208例如可以采用SiO2、SiNx或两者的复合材料。
如图7d所示,在栅绝缘层208形成后,使用溅射的方法在栅绝缘层208 上沉积一层栅极薄膜,栅极薄膜的材料可以是铜、铜合金、铝、铝合金等金属。之后,利用光刻工艺对栅极层进行图形化处理,并且在本实施例中,例如利用湿刻蚀工艺,即利用特定的化学溶液对栅极薄膜不需要的部分进行腐蚀,最终得到图形化且彼此间具有间隔的第一栅极201和第二栅极202,并且第二栅极包括彼此电连接的第一分支电极和第二分支电极。本实施例中,第一栅极201和第二栅极202可以同时形成。
如图7e所示,第一栅极201和第二栅极202形成后,以第一栅极201 和第二栅极202作为掩模,对栅绝缘层208进行干刻蚀以形成第一栅绝缘层 208a和第二栅绝缘层208b。
第一栅绝缘层208a和第二栅绝缘层208b形成后,有源层207部分暴露,再以栅极201和202作为掩模,对有源层207中包括对应于栅极201和202 的间隔110的暴露位置进行导体化处理以提高这些区域的导电性,形成导电区域2073。例如,该导体化处理可以为离子掺杂,也可以为等离子体处理。例如本实施例中,可以使用NH4、He、Ar等气体的等离子体对有源层207 进行等离子体处理以形成导电区域2073。
在其他实施例中,例如当有源层为是多晶硅时,则可以通过离子掺杂,例如重掺杂等,以形成导电区域2073;例如当有源层为是非晶硅时,则可以氢化处理,以形成导电区域2073。
如图7f所示,有源层207进行导体化处理后,再在栅极201和202以及有源层207的暴露区等位置上,通过化学气相沉积(CVD)形成一层绝缘层(钝化层)209,该绝缘层209例如可以采用SiO2、SiNx或两者的复合材料,以对薄膜晶体管进行保护。
如图7g所示,采用光刻工艺和干刻蚀工艺,在绝缘层209的对应于栅极201和202两侧的位置形成连通于有源层207的通孔,之后在此通孔中沉积源漏极材料并形成源漏极层,最后通过光刻工艺对上述沉积的源漏极层进行图形化处理以形成源极203和漏极204。源极203可以连接到发光元件,漏极204可以连接到电源端。例如,可以在薄膜晶体管的上层制备发光元件,例如有机发光二极管,且该有机发光二极管可以为各种类型,例如顶发射型、底发射型、双侧发射型等。
在本公开的另一个实施例中,如果栅绝缘层208的厚度不影响后续的导体化处理(例如离子注入),则也可以在形成了第一栅极和第二栅极之后,不对栅绝缘层208进行刻蚀,又或者对栅绝缘层208仅进行部分刻蚀。相应地,该实施例中后续形成暴露有源层的通孔时,还需要继续对保留的栅绝缘层208进行刻蚀。
本实施例提供的薄膜晶体管中,该第一栅极201和第二栅极202配置为分别控制该薄膜晶体管的有源层的不同部分,仅当栅极201和202分别同时接收到导通信号时,薄膜晶体管导通,当栅极201和202中任意一个处于关闭状态时,双栅薄膜晶体TFT均不导通的技术效果。
其他类型的双栅薄膜晶体管可以采用类似的方式制备,例如,使得第一栅极和第二栅极在有源层上的正投影位于源极和漏极在有源层上的正投影之间,同时第一栅极和第二栅极在从源极到漏极的方向上至少不完全重叠,即不重叠或不完全重叠,由此有源层上具有分别对应于第一栅极和第二栅极且分别受第一栅极和第二栅极控制的不同子沟道区,这些不同的子沟道区构成有源层的沟道区。
本发明的至少一实施例提供的发光电路、电子装置、双栅薄膜晶体管及其制备方法具有以下至少一项有益效果:
(1)本发明至少一实施例提供一种双栅薄膜晶体管,可以实现当且仅当双栅薄膜晶体管的两个栅极同时接收导通信号时,双栅薄膜晶体管导通;当两个栅极中任意一个未接收导通信号时,双栅薄膜晶体不导通。
(2)本发明至少一实施例提供一种发光电路,该发光电路包括一个双栅薄膜晶体管,以简化2T1C像素电路,即以一个TFT实现了2T1C电路中两个TFT的功能,简化了电路结构,并降低了成本。
(3)本发明至少一实施例提供一种发光电路,该电路还可以包括电容,该电容可以起到保持电信号的作用。
另外,本公开还有以下几点需要说明:
(1)本发明实施例附图只涉及到与本发明实施例涉及到的结构,其他结构可参考通常设计。
(2)为了清晰起见,在用于描述本发明的实施例的附图中,层或区域的厚度被放大或缩小,即这些附图并非按照实际的比例绘制。
(3)在不冲突的情况下,本发明的实施例及实施例中的特征可以相互组合以得到新的实施例。
以上所述,仅为本公开的具体实施方式,但本公开的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本公开的保护范围之内。因此,本公开的保护范围应以所述权利要求的保护范围为准。

Claims (15)

1.一种发光电路,包括:双栅薄膜晶体管以及发光元件,
其中,所述双栅薄膜晶体管包括第一栅极、第二栅极、第一电极和第二电极,所述发光元件包括第一端和第二端;
所述第一栅极和所述第二栅极配置为电连接到不同的信号线,所述第一电极配置为电连接到第一电源端,所述第二电极电连接到所述发光元件的第一端,所述发光元件的第二端配置为电连接到第二电源端;
仅当所述第一栅极和第二栅极上同时接收导通信号时,所述双栅薄膜晶体管导通以驱动所述发光元件。
2.根据权利要求1所述的发光电路,还包括第一电容和/或第二电容,
其中,所述第一电容的第一端电连接到所述第一栅极,所述第一电容的第二端连接到所述发光元件的第一端;
所述第二电容的第一端连接到所述第二栅极,所述第二电容的第二端连接到所述发光元件的第一端。
3.根据权利要求1所述的发光电路,其中,所述双栅薄膜晶体管为双顶栅薄膜晶体管。
4.一种电子装置,包括根据权利要求1-3任一所述的发光电路。
5.根据权利要求4所述的电子装置,还包括栅极驱动电路和数据驱动电路,
其中,所述发光电路的双栅薄膜晶体管中,所述第一栅极配置为接收所述栅极驱动电路施加的栅极信号,所述第二栅极配置为接收所述数据驱动电路施加的数据信号。
6.一种根据权利要求1所述的发光电路的驱动方法,包括:
在所述第一栅极上施加固定电压的驱动信号,在所述第二栅极上施加变动电压的驱动信号,以使得所述双栅薄膜晶体管导通以驱动所述发光元件。
7.一种薄膜晶体管,包括:有源层、第一栅极、第二栅极、源极和漏极,
其中,所述第一栅极和所述第二栅极彼此绝缘,所述第一栅极和所述第二栅极配置为分别控制所述有源层的不同部分,且当所述第一栅极和所述第二栅极上同时接收导通信号时,所述薄膜晶体管导通。
8.根据权利要求7所述的薄膜晶体管,其中,所述第一栅极和所述第二栅极在所述有源层上的正投影位于所述源极和所述漏极在所述有源层上的正投影之间,且在从所述源极到所述漏极的方向上至少不完全重叠。
9.根据权利要求8所述的薄膜晶体管,其中,所述第一栅极和第二栅极位于所述有源层的同一侧,且彼此间具有间隔;
所述有源层中对应于所述间隔在所述有源层上的正投影的区域为导电区域。
10.根据权利要求8或9所述的薄膜晶体管,其中,所述第一栅极包括彼此电连接的第一分支电极和第二分支电极,所述第一分支电极、所述第二栅极和所述第二分支电极依次并排设置。
11.根据权利要求8所述的薄膜晶体管,还包括衬底基板,其中,所述有源层、所述第一栅极、所述第二栅极、所述源极和所述漏极设置在所述衬底基板上,
所述第一栅极和所述第二栅极设置在所述有源层远离所述衬底基板的同一侧。
12.一种薄膜晶体管的制备方法,包括:形成所述薄膜晶体管的有源层、第一栅极、第二栅极、源极和漏极;
其中,所述第一栅极和所述第二栅极彼此绝缘,所述第一栅极和所述第二栅极配置为分别控制所述有源层的不同部分,且仅当所述第一栅极和所述第二栅极上同时接收导通信号时,所述薄膜晶体管导通。
13.根据权利要求12所述的制备方法,其中,所述第一栅极和所述第二栅极在所述有源层上的正投影位于所述源极和所述漏极在所述有源层上的正投影之间,且在从所述源极到所述漏极的方向上至少不完全重叠。
14.根据权利要求12所述的制备方法,还包括:提供衬底基板,
其中,在所述衬底基板上形成所述有源层,在所述有源层上形成所述第一栅极和所述第二栅极,所述第一栅极和所述第二栅极彼此间具有间隔;
使用所述第一栅极和所述第二栅极作为掩模,对所述有源层中对应于所述间隔在所述有源层上的正投影的区域进行导体化处理。
15.根据权利要求14所述的制备方法,其中,所述导体化处理包括离子掺杂或等离子体处理。
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