WO2015051646A1 - 有源矩阵有机电致发光显示器件、显示装置及其制作方法 - Google Patents
有源矩阵有机电致发光显示器件、显示装置及其制作方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 107
- 239000011159 matrix material Substances 0.000 title claims abstract description 52
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 230000008569 process Effects 0.000 claims abstract description 91
- 239000010409 thin film Substances 0.000 claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 238000002161 passivation Methods 0.000 claims abstract description 43
- 239000010410 layer Substances 0.000 claims description 191
- 238000000059 patterning Methods 0.000 claims description 42
- 229920002120 photoresistant polymer Polymers 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 27
- 238000000151 deposition Methods 0.000 claims description 23
- 239000004065 semiconductor Substances 0.000 claims description 20
- 239000002346 layers by function Substances 0.000 claims description 19
- 238000005401 electroluminescence Methods 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 7
- 238000002955 isolation Methods 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 5
- 230000014759 maintenance of location Effects 0.000 claims description 4
- 238000004380 ashing Methods 0.000 claims description 3
- 230000005525 hole transport Effects 0.000 claims description 3
- 229920001621 AMOLED Polymers 0.000 description 10
- 239000011241 protective layer Substances 0.000 description 4
- 101100214488 Solanum lycopersicum TFT2 gene Proteins 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 101100489584 Solanum lycopersicum TFT1 gene Proteins 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6731—Top-gate only TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
- H10D30/6745—Polycrystalline or microcrystalline silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/321—Inverted OLED, i.e. having cathode between substrate and anode
Definitions
- the present invention relates to the field of display technologies, and in particular, to an active matrix organic electroluminescent display device, a display device, and a method of fabricating the same. Background technique
- the current electronic display technology is showing a vigorous development trend.
- the advanced liquid crystal display (TFT-LCD) has completely replaced the traditional cathode ray tube (CRT), and is moving toward the third generation display technology - an organic electroluminescent device (OLED). transition.
- Organic electroluminescent device (OLED) as a new generation of display device, because it is thin and light (thickness of OLED device package is about 2mm), high contrast, fast response, wide viewing angle, high brightness, full color, low temperature resistance,
- the advantages of flexible display and sturdiness are very broad in mobile phones, personal electronic assistants, digital cameras, car displays, notebook computers, wall-mounted TVs, electronic papers, and military applications.
- the organic electroluminescent display device can be classified into passive driving OLED (Passive Matrix Driving, PM-OLED) and active driving OLED (Active Matrix Driving, AM-OLED) according to the driving method.
- PM-OLED Passive Matrix Driving
- AM-OLED Active Matrix Driving
- the PM-OLED has a simple structure and low manufacturing cost, and is mostly used in a general simple display with low information amount
- AM-OLED generally uses polycrystalline silicon p-Si or an oxide semiconductor (such as IGZO which is relatively popular in research and application) as a switch.
- the component is actually equivalent to forming an organic electroluminescent layer on the basis of the TFT-LCD as a pixel region, which can collect a large amount of display information and has good illumination and display effects, so that there is a possibility of replacing the TFT-LCD in the display field. .
- an organic electroluminescent layer is formed on a flexible substrate, a flexible display effect can be achieved, which will greatly change people's understanding of the display terminal and have a profound influence on the display field.
- AM-OLED has a bright future, its preparation process is more complicated than the TFT-LCD currently widely used, and the manufacturing process is more demanding.
- TFT-LCD is an electric field type device, each image Only one TFT used as an address switch can be used; and AM-OLED is a current-driven display device whose brightness is proportional to the current flowing through the organic electroluminescent layer, so that in addition to the address switch, it is necessary to be constant. Flow drive control switch. Therefore, AM-OLEDs generally use two or more TFT devices to form a pixel circuit, and two or more TFT devices respectively function as switches and drives.
- 1 is an equivalent schematic diagram of a pixel circuit composed of two TFT devices of an active matrix organic electroluminescent device.
- One of the two TFT devices is a switching thin film transistor TFT1, and the other TFT device is a driving thin film transistor TFT2.
- the gate of the switching thin film transistor TFT1 is connected to a scanning line, the source is connected to a data line, and the drain is connected to a driving thin film transistor.
- the gate of the TFT2 is driven; the source of the driving thin film transistor TFT2 is connected to the power supply voltage line, and the drain is connected to the first electrode of the organic light-emitting::::: pole tube.
- FIG. 2 is a schematic structural view of a conventional AM-OLED.
- a conventional active matrix organic electroluminescent display device is formed on a base substrate 10, and a gate electrode 20, a gate protection layer 30, and a semiconductor active layer 40 are sequentially formed on the substrate substrate 10.
- the gate electrode is formed on the base substrate by a first patterning process, and then a gate protection layer is formed to cover the surface of the gate electrode and the substrate substrate, and then, a semiconductor is formed on the »pole protective layer by the second patterning process.
- the source layer is then formed with a source and a drain on both sides of the semiconductor active layer through a third patterning process.
- the gate electrode, the gate protection layer, the semiconductor active layer, the source and the drain formed as described above constitute a thin film transistor; after the thin film transistor is formed, a protective layer and a flat layer are sequentially formed to cover the thin film transistor, and The four-time patterning process forms via holes on the protective layer and the flat layer. Then, an anode is formed on the flat layer by the fifth patterning process, and the anode is electrically connected to one end of the source/drain of the thin film transistor through the via hole. After the anode is fabricated, the organic functional layer and the cathode are formed on the surface of the anode. This completes the fabrication of the active matrix organic electroluminescent display device.
- the source, the drain and the gate of the TFT in the AM-OLED are respectively located on both sides of the semiconductor active layer. Since the active layer forms a current path on the side surface close to the gate, the source and the drain need to pass through the semiconductor active layer. The low conductivity region of the thickness is connected to the current path, and the TFT conductivity is affected.
- the source, the drain and the gate of the TFT are respectively located on both sides of the active layer of the semiconductor, and each pixel unit in the AM-OLED has at least two TFTs, and the gate of one of the TFTs and the source and drain of the other TFT Need to be connected through vias on the passivation layer, thus active in the AM-OLED fabrication process Layer and source and drain need to be formed by two patterning processes respectively, and halftone mask cannot be used.
- An object of the present invention is to provide an active matrix organic electroluminescence display device which is capable of reducing a process process to a large extent and which can improve TFT conductivity.
- An active matrix organic electroluminescent display device comprising a substrate substrate and a plurality of pixel units formed on the base substrate, the pixel unit comprising a driving region and a light emitting region, wherein the driving region is disposed with at least Two thin film transistors; the light emitting region is disposed with an organic electroluminescent structure driven by the thin film transistor; the thin film transistor is a top gate structure, comprising: an active layer formed on the substrate;
- the organic electroluminescent structure is a top emitting structure, which comprises:
- the cathode Forming on the side of the passivation layer away from the substrate substrate, and disposed at a position corresponding to the light-emitting region, the cathode is electrically connected to the source and the drain;
- the cathode is in the same layer as the gate.
- the at least two thin film transistors include a first thin film transistor and a second thin film transistor
- the passivation layer is formed with a first via hole at a position corresponding to a source and a drain of the first thin film transistor; The source and the drain of the first thin film transistor are electrically connected to the gate of the second thin film transistor through the first via.
- the passivation layer is formed with a second via at a position corresponding to a source and a drain of the second thin film transistor; a cathode of the organic electroluminescent structure passes through the second via The source and the drain of the second thin film transistor are electrically connected.
- the organic functional layer includes:
- An electron transport layer formed on a side of the cathode away from the passivation layer
- the active matrix organic electroluminescent display device further includes a data signal line and a power line connected to the source and the drain, wherein the data signal line and the power line and the source and drain In the same - one layer.
- the present invention also provides a display device comprising the active matrix organic electroluminescence display device as described above.
- the invention also provides a method for fabricating an active matrix organic electroluminescent display device, the method comprising:
- a gate is formed on the passivation layer.
- the method specifically includes:
- a second metal layer is deposited on the passivation layer and a gate is formed by a third patterning process.
- the first patterning process adopts a halftone mask process, and specifically includes: sequentially depositing a semiconductor layer and a first metal layer on the substrate;
- the first metal layer corresponding to the semi-reserved region of the photoresist is removed by an etching process to form the active layer and the source and drain.
- the wiring area further includes a preset position of the data signal line and the power line, and the data signal line and the power line are simultaneously formed with the source and the drain through a first patterning process.
- the first::::::sub-patterning process adopts a mask process, and specifically includes:
- first insulating layer on the source and drain and covering the entire pixel unit, and processing through the mask process to obtain a passivation layer, wherein the passivation layer includes a first via and a second via
- the first via and the second via are respectively above the source and drain of the first thin film transistor and the second transistor.
- the third patterning process adopts a mask process, and specifically includes:
- the method further includes: depositing a second insulating layer on the » pole, and forming a pixel isolation layer by a fourth patterning process, specifically:
- a second insulating layer is deposited on the gate, and a light-emitting region is defined by a mask process to form a pixel insulating layer;
- An organic electroluminescent transparent anode layer is deposited on the organic functional layer, and a pixel pattern is defined by a mask process.
- the above scheme adopts a topography of a thin film transistor of an active matrix organic electroluminescence display device
- the gate structure is such that the source, the drain and the gate are located on the same side of the active layer, so that the source and the drain can be directly connected to the current channel without passing through the low conductivity region of the semiconductor thickness, thereby improving the conductivity of the thin film transistor;
- ⁇ :1 is on the same side of the active layer as the source, the drain and the gate.
- the active layer and the source and drain can be formed by one patterning process, which can greatly reduce the process.
- 1 is an equivalent schematic diagram of a pixel circuit composed of two TFT devices of an active matrix organic electroluminescent device
- FIG. 2 is a schematic structural view of a conventional active matrix organic electroluminescent device
- FIG. 3 is a schematic view showing the structure of an active matrix organic electroluminescent device of the present invention. detailed description
- the present invention provides an active matrix organic electroluminescent display device, which can reduce the process and improve the process. TFT conductivity.
- the active matrix organic electroluminescent display device includes a base substrate 100 and a plurality of pixel units formed on the base substrate 100, the pixel unit including a driving area and a light emitting area
- the driving region is disposed with at least two thin film transistors; the light emitting region is disposed with an organic electroluminescent structure driven by the thin film transistor; and the thin film transistor is a top gate structure, and the method includes:
- a source and a drain 300 formed on a side of the active layer 200 away from the substrate 100; formed on a side of the source and drain 300 away from the active layer 200, and covering the entire a driving region and a passivation layer 400 of the light emitting region; and,
- An » pole 500 is formed on the side of the passivation layer 400 away from the source and drain electrodes 300.
- the thin film transistor of the active matrix organic electroluminescent display device adopts a top gate structure such that the source, the drain 300 and the gate 500 are both located on the same side of the active layer 200, such that The active layer 200 and the source and drain electrodes 300 can be formed at one time by a patterning process to reduce the process, and the source and drain electrodes are used by using a top gate structure for the thin film transistor of the active matrix organic electroluminescent display device.
- the source and drain electrodes 300 can be directly connected to the current channel without passing through a low conductivity region of the thickness of the semiconductor active layer, thereby improving the conductivity of the thin film transistor, and Unlike the TFT-LCD, since there is no backlight unit, the structure does not suffer from the problem that the active layer 200 is affected by light.
- the active layer 200 and the source and drain electrodes 300 are formed by a first patterning process by a semiconductor layer and a first metal layer sequentially deposited on the base substrate 100; 400 is formed by a second patterning process deposited on a side of the source and drain electrodes 300 away from the active layer 200 - the gate electrode 500 is deposited on the passivation layer 400 A second metal layer remote from the source and drain 300 side is formed by a third patterning process.
- the active matrix organic electroluminescent display device provided by the present invention can form a thin film transistor by three patterning processes, and in the prior art, a thin pattern transistor needs to be formed through four patterning processes, which is obviously provided by the present invention.
- the source matrix organic electroluminescent display device can greatly reduce the process process.
- the first patterning process may employ a half-tone mask process; the second patterning process may employ a mask process; and the third patterning process may employ a mask process.
- the active matrix organic electroluminescent display device may further include a pixel isolation layer 600 covered on a side of the gate 500 away from the base substrate 100,
- the pixel isolation layer 600 is formed by a fourth patterning process by a second insulating layer deposited on a side of the gate 500 remote from the substrate substrate 100.
- the organic electroluminescent structure is preferably a top emitting structure. As shown in FIG. 3, the organic electroluminescent structure includes:
- a cathode 700 disposed on a side of the passivation layer 400 away from the base substrate 100 and disposed at a position corresponding to the light emitting region, the cathode 700 being electrically connected to the source and drain electrodes 300;
- the organic electroluminescent structure adopts a top-emission structure.
- the top light-emitting structure makes the light It is not necessary to pass through the TFT layer, and the light transmittance and color reproducibility can be greatly improved.
- the organic electroluminescent structure may also adopt a bottom emission structure.
- the cathode 700 and the gate 500 are in the same layer, and the cathode 700 and the gate 500 are passed by the second metal layer.
- the third patterning process is formed at one time. According to the above scheme, since the TFT adopts a top gate structure, the organic electroluminescence structure adopts a top emission structure, and when the gate 500 layer is formed, the gate 500 and the cathode 700 of the organic electroluminescence structure can be directly made of the same material. , shorten the process.
- At least two thin film transistors include a first thin film transistor and a second thin film transistor, and the passivation layer 400 passes through the second patterning process
- a first via is formed at a position corresponding to a source and a drain of a thin film transistor, and a source and a drain 300 of the first thin film transistor are electrically connected to a gate of the second thin film transistor through the first via
- the passivation layer 400 is formed with a second via hole at a position corresponding to the source and drain electrodes 300 of the second thin film transistor by the second patterning process; and the cathode of the organic electroluminescent structure
- the source and drain electrodes 300 are electrically connected to the second thin film transistor through the second via hole.
- the thin film transistor structure of the active matrix organic electroluminescent display device may also include a plurality of TFTs, and the pixel circuits composed of a plurality of TFTs may be adjusted according to actual needs.
- the organic functional layer 800 includes: an electron transport layer 801 formed on a side of the cathode 700 away from the passivation layer 400; An organic light-emitting layer 802 of the electron transport layer 801 away from the cathode 700 side; and a hole transport layer 803 formed on a side of the organic light-emitting layer 802 away from the electron transport layer 801.
- the organic functional layer 800 can be adjusted according to actual needs.
- the active matrix organic electroluminescent display device further includes a a data signal line and a power line connected to the source and the drain 300, wherein preferably, the data signal line and the power line are in the same layer as the source and drain 300, and the data signal line and the A power supply line and the source and drain electrodes 300 are formed by the first patterning process.
- Another object of the present invention is to provide a display device comprising the active matrix organic electroluminescent display device provided by the present invention. It is apparent that the display device provided by the present invention also has the advantageous effects of the active matrix organic electroluminescent display device provided by the present invention.
- the present invention provides a method for fabricating an active matrix organic electroluminescence display device provided by the present invention, the method comprising:
- a gate is formed on the passivation layer.
- the method includes:
- the semiconductor layer and the first metal layer are sequentially deposited on the base substrate 100, and the active layer 200 and the source and drain electrodes 300 on both sides of the active layer 200 are formed by a first patterning process;
- the first patterning process adopts a halftone mask process.
- the source, the drain 300, and the gate 500 may be formed on the substrate by using a three-time patterning process in the active layer 200.
- the TFT structure on the side, the specific implementation steps are as follows:
- the glue-completed retention area corresponds to a predetermined wiring area on the first metal layer, and the wiring area includes a source, a drain, and a preset position of the data signal line and the power line, the photoresist semi-reserved area
- the photoresist complete removal region corresponds to the wiring Regional and other areas outside the first-region;
- the passivation layer 400 includes a first via and a second via.
- the first via and the via are located above the source and drain 300;
- An organic functional layer ⁇ is deposited on the pixel insulating layer at a position corresponding to the light emitting region, and the organic functional layer 800 includes an electron transport layer (Electron Transfer Layer) 801, an organic light emitting layer (Emission Layer) 802, and a Hole Transfer Layer 803, and defining a pixel pattern by mask exposure;
- An organic electroluminescent transparent anode 900 layer is deposited on the organic functional layer 800, and a pixel pattern is defined by a mask process.
- a complete active matrix organic electroluminescent display device can be formed by the combination with the color film and the assembly of the driving circuit components.
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Abstract
一种有源矩阵有机电致发光显示器件、显示装置及其制作方法。有源矩阵有机电致发光显示器件包括衬底基板(100)和形成于衬底基板(100)上的多个像素单元。像素单元包括驱动区域和发光区域。驱动区域布置有至少两个薄膜晶体管,发光区域布置有通过薄膜晶体管驱动的有机电致发光结构。薄膜晶体管为顶栅极结构,包括:形成于衬底基板(100)上的有源层(200);形成于有源层(200)的远离衬底基板(100)一侧的源、漏极(300);形成于源、漏极(300)的远离有源层(200)一侧,并覆盖整个驱动区域和发光区域的钝化层(400);形成于钝化层(400)的远离源、漏极(300)一侧的栅极(500)。该有源矩阵有机电致发光显示器件提高薄膜晶体管导电性能,减少工艺制程。
Description
有源矩阵有机电致发光显示器件、 显示装置及其制作方法 相关申请的交叉引用
本申请主张在 2013 年 10 月 9 日在中国提交的中国专利申请号 No. 201310468481.4的优先权, 其全部内容通过引用包含于此。 技术领域
本发明涉及显示技术领域, 尤其涉及一种有源矩阵有机电致发光显示器 件、 显示装置及其制作方法。 背景技术
当前电子显示技术正显现蓬勃的发展态势, 先进的液晶显示器 (TFT-LCD)基本全面取代了传统的阴极射线管 (CRT), 并正向第三代显示 技术一有机电致发光器件(OLED) 过渡。 有机电致发光器件 (OLED) 作为 新一代显示器件, 因其具有薄而轻 (OLED器件封装后厚度约为 2mm)、 高 对比度、 快速响应、 宽视角、 高亮度、 全彩色、 耐低温、 可以实现柔性显示、 坚固等优点, 在手机、 个人电子助理、 数码相机、 车载显示、 笔记本电脑、 壁挂电视、 电子纸以及军事领域的应用前景十分广阔。
有机电致发光显示器件按驱动方式可以分为无源驱动 OLED ( Passive Matrix Driving , PM-OLED ) 和有源驱动 OLED ( Active Matrix Driving, AM-OLED)两种。 其中 PM-OLED结构简单、 制造成本低廉, 多用于信息量 低的一般简单显示中; 而 AM-OLED—般采用多晶硅 p-Si或者氧化物半导体 (如研究和应用较为普遍的 IGZO) TFT作为开关元器件, 实际上相当于在 TFT-LCD的基础上形成有机电致发光层作为像素区, 能够集合大量的显示信 息并具备良好的发光和显示效果, 因而在显示领域有取代 TFT-LCD的可能。 特别地, 如果在柔性基板上形成有机电致发光层, 还能实现柔性显示效果, 将会极大改变人们对显示终端的认识, 对显示领域产生深远影响。
AM-OLED虽然具有美好的前景, 但相比当前普遍应用到的 TFT-LCD, 其制备过程更复杂, 对制作工艺要求更高。 TFT-LCD是电场型器件, 每个像
素只需一个用作寻址开关的 TFT即可;而 AM-OLED是电流驱动的显示器件, 其亮度与流过有机电致发光层的电流成正比, 因而除寻址开关外, 还需要恒 流驱动控制开关。 所以, AM-OLED ········般采用两个及两个以上的 TFT器件构 成像素电路, 两个及两个以上 TFT器件分别起开关和驱动作用。 图 1是有源 矩阵有机电致发光器件的一种由两个 TFT 器件构成的像素电路的等效示意 图。 两个 TFT器件中的一个 TFT器件为开关薄膜晶体管 TFT1 , 另一个 TFT 器件为驱动薄膜晶体管 TFT2,所述开关薄膜晶体管 TFT1的栅极连接扫描线, 源极连接数据线, 漏极连接驱动薄膜晶体管 TFT2 的栅极; 驱动薄膜晶体管 TFT2的源极连接电源电压线, 漏极连接有机发光:::::极管的第一电极。
图 2为传统的 AM-OLED的结构示意图。 如图 2所示, 传统的有源矩阵 有机电致发光显示器件形成于衬底基板 10上, 并于衬底基板 10上顺序形成 栅极 20、 栅极保护层 30、 半导体有源层 40、 源极 /漏极 50、 保护层 60、 平坦 层 70、 阳极 81、 有机功能层 82以及阴极 83。 其中, 栅极经第一次构图工艺 形成于衬底基板上, 然后制作栅极保护层覆盖栅极和衬底基板的表面, 接着, 经第二次构图工艺在 »极保护层上形成半导体有源层, 之后, 经第三次构图 工艺在半导体有源层的两侧形成源极和漏极。 上述制作出的栅极、 栅极保护 层、 半导体有源层、 源极和漏极即构成薄膜晶体管; 在制成薄膜晶体管之后, 顺序制作保护层和平坦层覆盖于薄膜晶体管上, 并经第四次构图工艺在保护 层和平坦层上形成过孔。 接着, 经第五次构图工艺在平坦层上制作阳极, 阳 极经过过孔与薄膜晶体管的源极 /漏极其中一端电性连接, 在阳极制作完成 后, 在阳极表面制作有机功能层和阴极, 这样即完成有源矩阵有机电致发光 显示器件的制作。
现有技术中所存在的问题主要有:
AM-OLED中 TFT的源、 漏极和栅极分别位于半导体有源层的两侧, 由 于有源层在靠近栅极的一侧表面形成电流通道, 因此源、 漏极需要经过半导 体有源层厚度这一低导电性区域与电流通道相连, TFT导电性能受到影响。
TFT的源、 漏极和栅极分别位于半导体有源层的两侧, 而 AM-OLED中 每一像素单元至少有两个 TFT, 且其中一个 TFT的栅极与另一个 TFT的源、 漏极需要通过钝化层上的过孔进行连接, 因而在 AM-OLED制作过程中有源
层和源、 漏极需要分别经过两次构图工艺形成, 不能采用半色调掩膜
(Half-tone Mask) 工艺一次形成, 导致 AM-OLED的工艺制程增加。 此外, 有机致电发光层需要在完成 TFT制程后再经过多次工艺形成, 增加了工艺制 程复杂性。 发明内容
本发明的目的是提供一种有源矩阵有机电致发光显示器件, 其能够在很 大程度上减少工艺制程, 并能够提高 TFT导电性能。
本发明所提供的技术方案如― F:
一种有源矩阵有机电致发光显示器件, 包括衬底基板和形成于所述衬底 基板上的多个像素单元, 所述像素单元包括驱动区域和发光区域, 其中所述 驱动区域布置有至少两个薄膜晶体管; 所述发光区域布置有通过所述薄膜晶 体管驱动的有机电致发光结构; 所述薄膜晶体管为顶栅极结构, 其包括: 形成于所述衬底基板上的有源层;
形成于所述有源层的远离所述衬底基板一侧的源、 漏极;
形成于所述源、 漏极的远离所述有源层一侧, 并覆盖整个所述驱动区域 和所述发光区域的钝化层; 以及,
形成于所述钝化层的远离所述源、 漏极一侧的栅极。
进一歩的,在所述栅极的远离所述衬底基板的一侧还覆盖有像素隔离层。 进一歩的, 所述有机电致发光结构为顶部发光结构, 其包括:
形成于所述钝化层的远离所述衬底基板一侧, 并设置于与所述发光区域 相对应位置的阴极, 所述阴极与所述源、 漏极电性连接;
形成于所述阴极的远离所述衬底基板一侧的有机功能层;
以及, 形成于所述有机功能层的远离所述阴极一侧的阳极。
进一歩的, 所述阴极与所述栅极处于同一层。
进一歩的,至少两个薄膜晶体管包括第一薄膜晶体管和第二薄膜晶体管, 所述钝化层在与所述第一薄膜晶体管的源、漏极对应的位置形成有第一过孔; 其中所述第一薄膜晶体管的源、 漏极通过所述第一过孔与所述第二薄膜晶体 管的栅极电性连接。
进- 步的, 所述钝化层在与所述第二薄膜晶体管的源、 漏极对应的位置 形成有第二过孔; 所述有机电致发光结构的阴极通过所述第二过孔与所述第 二薄膜晶体管的源、 漏极电性连接。
进一步的, 所述有机功能层包括:
形成于所述阴极的远离所述钝化层-一侧的电子传输层;
形成于所述电子传输层的远离所述阴极- 侧的有机发光层;
以及,形成于所述有机发光层的远离所述电子传输层一侧的空穴传输层。 进一步的, 所述有源矩阵有机电致发光显示器件还包括与所述源、 漏极 连接的数据信号线和电源线, 其中所述数据信号线和所述电源线与所述源、 漏极处于同-一层。
本发明还提供了一种显示装置, 其包括如上所述的有源矩阵有机电致发 光显示器件。
本发明还提供了一种有源矩阵有机电致发光显示器件的制作方法, 所述 方法包括:
在衬底基板上形成有源层及位于所述有源层两侧的源、 漏极;
在所述源、 漏极上形成钝化层;
在所述钝化层上形成栅极。
进一歩的, 所述方法具体包括:
在衬底基板上依次沉积半导体层和第一金属层, 通过第一次构图工艺形 成有源层和位于所述有源层两侧的源、 漏极;
在所述源、 漏极上覆盖整个像素单元沉积第一绝缘层, 并通过第二次构 图工艺形成钝化层;
在所述钝化层上沉积第二金属层, 并通过第三次构图工艺形成栅极。 进一歩的, 所述第一次构图工艺采用半色调掩膜工艺, 具体包括: 在所述衬底基板上依次沉积半导体层和第一金属层;
在所述第一金属层上, 沉积光刻胶;
通过半色调或灰色掩膜板对所述光刻胶进行曝光, 形成光刻胶完全保留 区、 光刻胶半保留区和光刻胶完全去除区, 其中, 在所述像素单元中所述光 刻胶完全保留区对应所述第一金属层上的预设的布线区域, 所述布线区域包
括源极和漏极预设位置, 所述光刻胶半保留区对应所述源极和漏极之间的第 一区域, 所述光刻胶完全去除区对应除所述布线区域和第- 区域之外的其他 区域;
利用刻蚀工艺去除所述光刻胶完全去除区对应的第一金属层和半导体 层;
利用灰化工艺去除所述光刻胶半保留区的光刻胶;
利用刻蚀工艺去除所述光刻胶半保留区所对应的第一金属层, 形成所述 有源层和所述源、 漏极。
进- 步的, 所述布线区域还包括数据信号线和电源线的预设位置, 所述 数据信号线和所述电源线通过第一次构图工艺与所述源、 漏极同时形成。
进-一步的, 所述第:::::次构图工艺采用掩模工艺, 具体包括:
在所述源、 漏极上并覆盖整个像素单元沉积第- 绝缘层, 并通过所述掩 膜工艺处理得到钝化层, 其中所述钝化层包括第一过孔和第二过孔, 所述第 一过孔和所述第二过孔分别位于所述第一薄膜晶体管和所述第二晶体管的 源、 漏极的上方。
进一歩的, 所述第三次构图工艺采用掩模工艺, 具体包括:
在所述钝化层上沉积第二金属层, 并通过所述掩膜工艺处理得到栅极和 阴极, 且所述 »极通过所述第一过孔与所述源、 漏极电性连接, 所述阴极通 过所述第二过孔与所述源、 漏极电性连接。
进一歩的, 所述方法还包括: 在所述 »极上沉积第二绝缘层, 通过第四 次构图工艺形成像素隔离层, 具体为:
在形成所述栅极后, 在所述栅极上沉积第二绝缘层, 并通过掩膜工艺刻 蚀定义出发光区域, 形成像素绝缘层;
在所述像素绝缘层上与所述发光区域对应的位置沉积有机功能层, 并通 过掩膜曝光定义出像素图形;
在所述有机功能层上沉积有机电致发光的透明阳极层, 并通过掩膜工艺 定义出像素图形。
本发明的有益效果如下:
以上方案, 通过将有源矩阵有机电致发光显示器件的薄膜晶体管采用顶
栅极结构, 使得源、 漏极和栅极位于有源层的同侧, 从而源、 漏极可以无需 经过半导体厚度这 低导电性区域, 而直接与电流通道相连, 从而提高薄膜 晶体管导电性能; 并且 Εί:1于将源、 漏极和栅极位于有源层的同侧, 可以采用 一次构图工艺形成有源层和源、 漏极, 能够很大程度上减少工艺制程。 附图说明
图 1为有源矩阵有机电致发光器件的-一种由两个 TFT器件构成的像素电 路的等效示意图;
图 2为传统的有源矩阵有机电致发光器件的结构示意图;
图 3为本发明的有源矩阵有机电致发光器件的结构示意图。 具体实施方式
以下结合附图对本发明的原理和特征进行描述, 所举实例只用于解释本 发明, 并非用于限定本发明的范围。
为了解决现有技术中有源矩阵有机电致发光显示器件工艺制程复杂, TFT 导电性能不良的问题, 本发明提供了一种有源矩阵有机电致发光显示器件, 能够减少工艺制程, 并能提高 TFT导电性能。
如图 3所示, 本发明提供的有源矩阵有机电致发光显示器件包括衬底基 板 100和形成于所述衬底基板 100上的多个像素单元, 所述像素单元包括驱 动区域和发光区域, 其中, 所述驱动区域至少布置有两个薄膜晶体管; 所述 发光区域布置有通过所述薄膜晶体管驱动的有机电致发光结构; 所述薄膜晶 体管为顶栅极结构, 其包括:
形成于所述衬底基板 100上的有源层 200;
形成于所述有源层 200的远离所述衬底基板 100—侧的源、 漏极 300; 形成于所述源、 漏极 300的远离所述有源层 200—侧, 并覆盖整个所述 驱动区域和所述发光区域的钝化层 400; 以及,
形成于所述钝化层 400的远离所述源、 漏极 300—侧的 »极 500。
在上述方案中, 有源矩阵有机电致发光显示器件的薄膜晶体管采用顶栅 极结构, 使得源、 漏极 300和栅极 500均位于有源层 200的同一侧, 这样,
有源层 200和源、 漏极 300就可以通过构图工艺一次形成, 减少工艺制程, 并且,通过对有源矩阵有机电致发光显示器件的薄膜晶体管采用顶栅极结构, 从而使得源、漏极 300和栅极 500位于有源层 200的同侧, 从而源、漏极 300 可以无需经过半导体有源层厚度这一低导电性区域,而直接与电流通道相连, 从而提高薄膜晶体管导电性能, 并且不同于 TFT- LCD, 由于没有背光单元, 该结构也不会出现有源层 200受光照影响的问题。
本发明中, 所述有源层 200和所述源、 漏极 300由依次沉积于所述衬底 基板 100上的半导体层和第一金属层通过第一次构图工艺形成; 所述钝化层 400由沉积于所述源、 漏极 300的远离所述有源层 200 -一侧的第一绝缘层通 过第二次构图工艺形成; 所述栅极 500由沉积于所述钝化层 400的远离所述 源、 漏极 300—侧的第二金属层通过第三次构图工艺形成。 I由此可见, 本发 明所提供的有源矩阵有机电致发光显示器件可以通过三次构图工艺形成薄膜 晶体管, 而现有技术中需要经过四次构图工艺形成薄膜晶体管, 显然本发明 所提供的有源矩阵有机电致发光显示器件可以很大程度减少工艺制程。
优选的, 所述第一次构图工艺可以采用半色调掩膜 (Half- tone Mask) 工艺; 所述第二次构图工艺可以采用掩膜工艺; 第三次构图工艺可以采用掩 膜工艺。
此外, 本发明中, 如图 3所示, 所述有源矩阵有机电致发光显示器件还 可以包括在所述栅极 500的远离所述衬底基板 100的一侧覆盖的像素隔离层 600,所述像素隔离层 600由沉积于所述栅极 500的远离所述衬底基板 100的 一侧的第二绝缘层通过第四次构图工艺形成。
此外, 在本实施例中, 所述有机电致发光结构优选为顶部发光结构, 如 图 3所示, 所述有机电致发光结构包括:
形成于所述钝化层 400的远离所述衬底基板 100一侧, 并设置于与所述 发光区域相对应位置的阴极 700, 所述阴极 700与所述源、 漏极 300电性连 接;
形成于所述阴极 700的远离所述衬底基板 100—侧的有机功能层 800; 以及, 形成于所述有机功能层 800的远离所述阴极 700一侧的阳极 900。 采用上述方案, 有机电致发光结构采用顶部发光(Top- Emission) 结构,
相比现有技术中的底部发光(Bottom- Emi ssi on)结构(如图 2所示的现有技 术中 AM- 0LED的有机电致发光结构采用底部发光结构),这种顶部发光结构使 得光线不需要穿过 TFT层, 透光率和色彩还原性能够大幅提高。
需要说明的是, 在实际应用中, 有机电致发光结构也可以采用底部发光 结构。
此外, 本实施例中, 为了进一歩缩短工艺制程, 使所述阴极 700与所述 栅极 500处于同一层, 且所述阴极 700与所述栅极 500由所述第二金属层通 过所述第三次构图工艺一次形成。采用上述方案, 由于 TFT采用顶栅极结构, 有机电致发光结构采用顶部发光结构, 在制作栅极 500层时, 可以直接将栅 极 500和有机电致发光结构的阴极 700同层同材质制作, 缩短制程。
此外, 如图 3所示, 本实施例中, 优选的, 至少两个薄膜晶体管包括第 一薄膜晶体管和第二薄膜晶体管, 所述钝化层 400通过所述第二构图工艺在 与所述第一薄膜晶体管的源、 漏极 300对应的位置形成有第一过孔, 并且所 述第一薄膜晶体管的源、 漏极 300通过所述第一过孔与所述第二薄膜晶体管 的栅极电性连接; 所述钝化层 400通过所述第二构图工艺在与所述第二薄膜 晶体管的源、 漏极 300对应的位置形成有第二过孔; 且所述有机电致发光结 构的阴极 700通过所述第二过孔与所述第二薄膜晶体管得源、 漏极 300电性 连接。
当然可以理解的是, 在实际应用中, 有源矩阵有机电致发光显示器件的 薄膜晶体管结构也可以包括多个 TFT, 且由多个 TFT构成的像素电路可以根 据实际需要进行调整。
此外, 本实施例中, 优选的, 如图 3所示, 所述有机功能层 800包括: 形成于所述阴极 700的远离所述钝化层 400—侧的电子传输层 801 ; 形成于所述电子传输层 801的远离所述阴极 700—侧的有机发光层 802; 以及, 形成于所述有机发光层 802的远离所述电子传输层 801—侧的空 穴传输层 803。
当然可以理解的是, 在实际应用中, 有机功能层 800可以根据实际需要 进行调整。
此外, 在本实施例中, 所述有源矩阵有机电致发光显示器件还包括与所
述源、 漏极 300连接的数据信号线和电源线, 其中优选的, 所述数据信号线 和所述电源线与所述源、 漏极 300处于同一层, 且所述数据信号线和所述电 源线与所述源、 漏极 300通过所述第一次构图工艺形成。
本发明的另一个目的是提供一种显示装置, 其包括本发明所提供的有源 矩阵有机电致发光显示器件。 显然, 本发明所提供的显示装置也具有本发明 所提供的有源矩阵有机电致发光显示器件所带来的有益效果。
此外, 本发明的还提供了-一种本发明所提供的有源矩阵有机电致发光显 示器件的制作方法, 所述方法包括:
在衬底基板上形成有源层及位于所述有源层两侧的源、 漏极;
在所述源、 漏极上形成钝化层;
在所述钝化层上形成栅极。
具体地, 所述方法包括:
在衬底基板 100上依次沉积半导体层和第一金属层, 通过第一次构图工 艺形成有源层 200和位于所述有源层 200两侧的源、 漏极 300;
在所述源、 漏极 300上并覆盖整个像素单元沉积第一绝缘层, 并通过第 二次构图工艺形成钝化层 400;
在所述钝化层 400上沉积第二金属层, 并通过第三次构图工艺形成栅极
500。
优选的, 所述第一次构图工艺采用半色调掩膜工艺。
具体地, 针对本发明所提供的优选实施例中的有源矩阵有机电致发光显 示器件, 首先可以采用 3次构图工艺在基板上形成源、 漏极 300和栅极 500 在有源层 200同侧的 TFT结构, 具体实施歩骤如下:
在所述衬底基板 100上依次沉积半导体层和第一金属层;
在所述第一金属层上, 沉积光刻胶;
通过半色调或灰色掩膜板对所述光刻胶进行曝光, 形成光刻胶完全保留 区、 光刻胶半保留区和光刻胶完全去除区, 其中, 在所述像素单元中所述光 刻胶完全保留区对应所述第一金属层上的预设的布线区域, 所述布线区域包 括源极、 漏极以及数据信号线和电源线的预设位置, 所述光刻胶半保留区对 应所述源极和漏极之间的第一区域, 所述光刻胶完全去除区对应除所述布线
区域和第 -一区域之外的其他区域;
利用刻蚀工艺去除所述光刻胶完全去除区对应的第一金属层和半导体 层;
利用灰化工艺去除所述光刻胶半保留区的光刻胶;
利用刻蚀工艺去除所述光刻胶半保留区所对应的第一金属层, 形成所述 有源层 200、 所述源、 漏极 300、 数据信号新以及电源线;
在所述源、 漏极 300上并覆盖整个像素单元沉积第一绝缘层, 并通过掩 膜工艺处理得到钝化层 400, 其中所述钝化层 400包括第一过孔和第二过孔, 所述第-一过孔和所述第 过孔位于所述源、 漏极 300的上方;
在所述钝化层 400上沉积第二金属层, 并通过掩膜工艺形成栅极 500和 阴极 700, 且所述栅极 500通过所述第- 过孔与所述源、 漏极 300电性连接, 所述阴极 700通过所述第二过孔与所述源、 漏极 300电性连接。
之后, 在上述形成的 TFT结构基础上进行有机电致发光结构的制程, 具 体歩骤为:
在所述栅极 500上沉积第二绝缘层, 并通过掩膜工艺刻蚀定义出发光区 域, 形成像素绝缘层;
在所述像素绝缘层上与所述发光区域对应的位置沉积有机功能层 ■, 所述有机功能层 800包括依次沉积的电子传输层 (Electron Transfer Layer) 801、有机发光层(Emission Layer) 802和空穴传输层(Hole Transfer layer) 803, 并通过掩膜曝光定义出像素图形;
在所述有机功能层 800上沉积有机电致发光的透明阳极 900层, 并通过 掩膜工艺定义出像素图形。
上述歩骤完成后, 通过与彩膜片的结合以及驱动电路组件的组装, 即可 形成完整的有源矩阵有机电致发光显示器件。
以上所述是本发明的优选实施方式, 应当指出, 对于本技术领域的普通 技术人员来说, 在不脱离本发明所述原理的前提下, 还可以作出若千改进和 润饰, 这些改进和润饰也应视为本发明的保护范围。
Claims
1. 一种有源矩阵有机电致发光显示器件,包括衬底基板和形成于所述衬 底基板上的多个像素单元, 所述像素单元包括驱动区域和发光区域, 其中所 述驱动区域布置有至少两个薄膜晶体管; 所述发光区域布置有通过所述薄膜 晶体管驱动的有机电致发光结构, 所述薄膜晶体管为顶栅极结构, 其包括: 形成于所述衬底基板上的有源层;
形成于所述有源层的远离所述衬底基板- 侧的源、 漏极;
形成于所述源、 漏极的远离所述有源层一侧, 并覆盖整个所述驱动区域 和所述发光区域的钝化层; 以及,
形成于所述钝化层的远离所述源、 漏极一侧的栅极。
2. 根据权利要求 1所述的有源矩阵有机电致发光显示器件, 其中, 在所 述栅极的远离所述衬底基板的一侧还覆盖有像素隔离层。
3. 根据权利要求 1所述的有源矩阵有机电致发光显示器件, 其中, 所述 有机电致发光结构为顶部发光结构, 其包括:
形成于所述钝化层的远离所述衬底基板一侧, 并设置于与所述发光区域 相对应的位置的阴极, 所述阴极与所述源、 漏极电性连接;
形成于所述阴极的远离所述衬底基板一侧的有机功能层;
以及, 形成于所述有机功能层的远离所述阴极一侧的阳极。
4.根据权利要求 3所述的有源矩阵有机电致发光显示器件, 其中, 所述 阴极与所述栅极处于同一层。
5. 根据权利要求 3所述的有源矩阵有机电致发光显示器件, 其中, 至少 两个薄膜晶体管包括第一薄膜晶体管和第二薄膜晶体管, 所述钝化层在与所 述第一薄膜晶体管的源、 漏极对应的位置形成有第一过孔; 其中所述第一薄 膜晶体管的源、 漏极通过所述第一过孔与所述第二薄膜晶体管的栅极电性连 接。
6. 根据权利要求 5所述的有源矩阵有机电致发光显示器件, 其中, 所述 钝化层在与所述第二薄膜晶体管的源、 漏极对应的位置形成有第二过孔; 所 述有机电致发光结构的阴极通过所述第二过孔与所述第二薄膜晶体管的源、
漏极电性连接。
7. 根据权利要求 3所述的有源矩阵有机电致发光显示器件, 其中, 所述 有机功能层包括:
形成于所述阴极的远离所述钝化层一侧的电子传输层;
形成于所述电子传输层的远离所述阴极一侧的有机发光层;
以及,形成于所述有机发光层的远离所述电子传输层一侧的空穴传输层。
8. 根据权利要求 1所述的有源矩阵有机电致发光显示器件, 其中, 所述 有源矩阵有机电致发光显示器件还包括与所述源、 漏极连接的数据信号线和 电源线, 其中所述数据信号线和所述电源线与所述源、 漏极处于同一层。
9. 一种显示装置,包括如权利要求 1至 8中任意一项所述的有源矩阵有 机电致发光显示器件。
10. 一种有源矩阵有机电致发光显示器件的制作方法, 所述方法包括: 在衬底基板上形成有源层及位于所述有源层两侧的源、 漏极;
在所述源、 漏极上形成钝化层;
在所述钝化层上形成栅极。
11. 根据权利要求 10 所述的有源矩阵有机电致发光显示器件的制作方 法, 其中, 所述方法具体包括:
在衬底基板上依次沉积半导体层和第一金属层, 通过第一次构图工艺形 成有源层和位于所述有源层两侧的源、 漏极;
在所述源、 漏极上覆盖整个像素单元沉积第一绝缘层, 并通过第二次构 图工艺形成钝化层;
在所述钝化层上沉积第二金属层, 并通过第三次构图工艺形成栅极。
12. 根据权利要求 11 所述的有源矩阵有机电致发光显示器件的制作方 法, 其中, 所述第一次构图工艺采用半色调掩膜工艺, 具体包括:
在所述衬底基板上依次沉积半导体层和第一金属层;
在所述第一金属层上, 沉积光刻胶;
通过半色调或灰色掩膜板对所述光刻胶进行曝光, 形成光刻胶完全保留 区、 光刻胶半保留区和光刻胶完全去除区, 其中, 在所述像素单元中所述光 刻胶完全保留区对应所述第一金属层上的预设的布线区域, 所述布线区域包
括源极和漏极预设位置, 所述光刻胶半保留区对应所述源极和漏极之间的第 一区域, 所述光刻胶完全去除区对应除所述布线区域和第- 区域之外的其他 区域;
利用刻蚀工艺去除所述光刻胶完全去除区对应的第一金属层和半导体 层;
利用灰化工艺去除所述光刻胶半保留区的光刻胶;
利用刻蚀工艺去除所述光刻胶半保留区所对应的第一金属层, 形成所述 有源层和所述源、 漏极。
13. 根据权利要求 12 所述的有源矩阵有机电致发光显示器件的制作方 法, 其中, 所述布线区域还包括数据信号线和电源线的预设位置, 所述数据 信号线和所述电源线通过第-一次构图工艺与所述源、 漏极同时形成。
14. 根据权利要求 1 1 所述的有源矩阵有机电致发光显示器件的制作方 法, 其中, 所述第:二次构图工艺采用掩模工艺, 具体包括:
在所述源、 漏极上并覆盖整个像素单元沉积第- 绝缘层, 并通过所述掩 膜工艺处理得到钝化层, 其中所述钝化层包括第一过孔和第二过孔, 所述第 一过孔和所述第二过孔分别位于所述第一薄膜晶体管和所述第二晶体管的 源、 漏极的上方。
15. 根据权利要求 14 所述的有源矩阵有机电致发光显示器件的制作方 法, 其中, 所述第三次构图工艺采用掩模工艺, 具体包括:
在所述钝化层上沉积第二金属层, 并通过所述掩膜工艺处理得到栅极和 阴极, 且所述栅极通过所述第一过孔与所述源、 漏极电性连接, 所述阴极通 过所述第二过孔与所述源、 漏极电性连接。
16. 根据权利要求 15 所述的有源矩阵有机电致发光显示器件的制作方 法, 其中, 所述方法还包括: 在所述栅极上沉积第二绝缘层, 通过第四次构 图工艺形成像素隔离层, 具体为:
在形成所述栅极后, 在所述栅极上沉积第二绝缘层, 并通过掩膜工艺刻 蚀定义出发光区域, 形成像素绝缘层;
在所述像素绝缘层上与所述发光区域对应的位置沉积有机功能层, 并通 过掩膜曝光定义出像素图形;
在所述有机功能层上沉积有机电致发光的透明阳极层, 并通过掩膜工艺 定义出像素图形。
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