CN107082640A - 一种电子陶瓷材料及其制备方法 - Google Patents

一种电子陶瓷材料及其制备方法 Download PDF

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CN107082640A
CN107082640A CN201710467280.0A CN201710467280A CN107082640A CN 107082640 A CN107082640 A CN 107082640A CN 201710467280 A CN201710467280 A CN 201710467280A CN 107082640 A CN107082640 A CN 107082640A
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parts
ceramic material
mixed
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powder
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王飞
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Hefei Bo Tai Tai Electronic Technology Co Ltd
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Hefei Bo Tai Tai Electronic Technology Co Ltd
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Abstract

本发明公开了一种电子陶瓷材料及其制备方法，该材料包括以下原料：BaTiO3、ZnO、MnCO3、Nd2O3、CaSnO3、Mg2TiO4、WO3、ZrSiO4、Al2O3、Li2O、SrO、改性凹凸粉、有机硅乳液和羟乙基纤维素醚。其制备方法先将所有原料混合制成粉料；再向所述粉料中加水，搅拌得浆料；之后将浆料注入模具中固化处理，固化后脱模得到湿坯，将湿坯干燥后得素坯；接着将素坯加热、冷却至室温；然后将素坯置于烧结炉中进行烧结处理，最后空冷至室温即可。该种电子陶瓷材料耐高温、力学强度高、耐腐蚀，性能优良，经久耐用，且其制备简单，生产成本低廉，适宜大规模量产。

Description

一种电子陶瓷材料及其制备方法
技术领域
本发明属于电子陶瓷材料领域，具体涉及一种电子陶瓷材料及其制备方法。
背景技术
电子陶瓷材料主要是指的一类具有电磁等功能的陶瓷，它的介电性能和导电性能调节范围较宽，是特种陶瓷材料中最具活力的材料之一，被人们广为关注。它可以应用在电子、通讯、自动控制、信息计算机、汽车、航空等众多领域当中，具有显著的社会效益和经济效益。当前电子信息的发展越来越迅速，对电子元器件的要求也越来越高，微型化、薄膜化、多功能等成为未来发展的方向，而目前电子陶瓷材料存在耐高温性能差、力学强度低、成本高、制备流程繁琐等缺点，无法满足市场及实际生产过程中的要求。
发明内容
针对现有技术中存在的问题，本发明提供了一种电子陶瓷材料及其制备方法，该种电子陶瓷材料耐高温、力学强度高、耐腐蚀，性能优良，经久耐用，且其制备简单，生产成本低廉，适宜大规模量产。
为了达到上述目的，本发明通过以下技术方案来实现的：
一种电子陶瓷材料，包括以下按重量份计的原料：BaTiO310-20份、ZnO10-20份、MnCO310-20份、Nd2O37-9份、CaSnO38-16份、Mg2TiO46-10份、WO36-8份、ZrSiO410-20份、Al2O310-20份、Li2O4-8份、SrO3-7份、改性凹凸粉4-6份、有机硅乳液15-25份和羟乙基纤维素醚10-20份；
所述改性凹凸粉由下列重量份的原料制成：凹凸棒粘土30份、钛白粉8份、锌钡白4份、木质素3份、膨胀珍珠岩10份、三氯化铁6份、正丁醛-苯胺缩合物3份、氧化镨3份、蜜蜡6份、10,10’-氧代双吩恶砒3份、2，2’-硫代双(4-叔辛基酚氧基)镍3份；其制备方法是先将凹凸棒粘土置于5％-10％的盐酸溶液中浸泡40-60min，抽滤后将所得物料烘干，再与膨胀珍珠岩混合，在750-800℃下进行高温煅烧1-2h，取出冷却到室温后再与蜜蜡混合，通过研磨机研磨成120-160目的细粉，最后与剩余材料混合，通过球磨使所有原料粉末充分分散混合均匀即可。
进一步地，所述电子陶瓷材料包括以下按重量份计的原料：BaTiO315份、ZnO15份、MnCO315份、Nd2O38份、CaSnO312份、Mg2TiO48份、WO37份、ZrSiO415份、Al2O315份、Li2O6份、SrO5份、改性凹凸粉5份、有机硅乳液20份和羟乙基纤维素醚15份。
进一步地，所述改性凹凸粉由下列重量份的原料制成：凹凸棒粘土30份、钛白粉8份、锌钡白4份、木质素3份、膨胀珍珠岩10份、三氯化铁6份、正丁醛-苯胺缩合物3份、氧化镨3份、蜜蜡6份、10,10’-氧代双吩恶砒3份、2，2’-硫代双(4-叔辛基酚氧基)镍3份；其制备方法是先将凹凸棒粘土置于8％的盐酸溶液中浸泡50min，抽滤后将所得物料烘干，再与膨胀珍珠岩混合，在780℃下进行高温煅烧1.5h，取出冷却到室温后再与蜜蜡混合，通过研磨机研磨成140目的细粉，最后与剩余材料混合，通过球磨使所有原料粉末充分分散混合均匀即可。
上述的一种电子陶瓷材料的制备方法，按照以下步骤进行:
(1)按重量份配比称取原料；
(2)将所有原料混合制成粉料；
(3)在所述粉料中加入其重量20-30％的去离子水，搅拌混匀得粘度小于80mPa·s的高流动性浆料；
(4)将浆料注入模具中，随后将模具放置于空气干燥箱中固化处理，固化后脱模得到湿坯，将湿坯置于真空干燥箱中进行干燥以得到素坯；
(5)将素坯在流通空气炉中进行加热处理，之后随空气炉冷却至室温；
(6)将经步骤(5)处理后的素坯置于烧结炉中进行烧结处理，最后空冷至室温即可。
进一步地，在步骤(2)中，所述原料是通过球磨研磨至粒径≤1mm，得粉料。
进一步地，在步骤(4)中，所述固化处理是以6℃/min升温速度加热至360-420℃固化。
进一步地，在步骤(5)中，所述加热处理是先将炉温升至180℃～240℃，保温20-30min，再次升温至380℃～460℃，保温30-40min。
进一步地，在步骤(6)中，所述烧结处理是先将炉温升至580℃～720℃，保温25-35min，再升温至740℃～980℃，保温40-60min。
本发明的有益效果：
(1)本发明的电子陶瓷材料耐高温性能好、力学强度高(包括抗压强度和抗拉强度)、耐腐蚀性能强，解决了现如今电子陶瓷材料因性能不足导致的使用寿命短的问题；
(2)本发明的电子陶瓷材料制备简单，其加工原料来源广泛，生产成本低廉，适宜大规模量产，且该种电子陶瓷材料应用领域广泛，具有广阔的市场前景。
具体实施方式
下面结合实施例对本发明的具体实施方式作进一步描述，以下实施例仅用于更加清楚地说明本发明的技术方案，而不能以此来限制本发明的保护范围。
实施例1
一种电子陶瓷材料，包括以下原料：BaTiO310kg、ZnO10kg、MnCO310kg、Nd2O37kg、CaSnO38kg、Mg2TiO46kg、WO36kg、ZrSiO410kg、Al2O310kg、Li2O4kg、SrO3kg、改性凹凸粉4kg、有机硅乳液15kg和羟乙基纤维素醚10kg；
所述改性凹凸粉由下列重量份的原料制成：凹凸棒粘土30kg、钛白粉8kg、锌钡白4kg、木质素3kg、膨胀珍珠岩10kg、三氯化铁6kg、正丁醛-苯胺缩合物3kg、氧化镨3kg、蜜蜡6kg、10,10’-氧代双吩恶砒3kg、2，2’-硫代双(4-叔辛基酚氧基)镍3kg；其制备方法是先将凹凸棒粘土置于5％的盐酸溶液中浸泡40min，抽滤后将所得物料烘干，再与膨胀珍珠岩混合，在750℃下进行高温煅烧1h，取出冷却到室温后再与蜜蜡混合，通过研磨机研磨成120目的细粉，最后与剩余材料混合，通过球磨使所有原料粉末充分分散混合均匀即可。
上述的一种电子陶瓷材料的制备方法，按照以下步骤进行:
(1)先将上述的所有原料混合通过球磨机研磨至粒径≤1mm，得粉料；
(2)在所述粉料中加入其重量20％的去离子水，搅拌混匀得粘度为75mPa·s的高流动性浆料；
(3)将浆料注入模具中，随后将模具放置于空气干燥箱中固化处理，具体的是以6℃/min升温速度加热至360℃固化，固化后脱模得到湿坯，将湿坯置于真空干燥箱中进行干燥以得到素坯；
(4)将素坯在流通空气炉中进行加热处理，具体的是先将炉温升至180℃，保温20min，再次升温至380℃，保温30min，之后随空气炉冷却至室温；
(5)将经步骤(4)处理后的素坯置于烧结炉中进行烧结处理，具体的是先将炉温升至580℃，保温25min，再升温至740℃，保温40min，最后空冷至室温即制得本发明的电子陶瓷材料。
实施例2
一种电子陶瓷材料，包括以下原料：BaTiO315kg、ZnO15kg、MnCO315kg、Nd2O38kg、CaSnO312kg、Mg2TiO48kg、WO37kg、ZrSiO415kg、Al2O315kg、Li2O6kg、SrO5kg、改性凹凸粉5kg、有机硅乳液20kg和羟乙基纤维素醚15kg；
所述改性凹凸粉由下列重量份的原料制成：凹凸棒粘土30kg、钛白粉8kg、锌钡白4kg、木质素3kg、膨胀珍珠岩10kg、三氯化铁6kg、正丁醛-苯胺缩合物3kg、氧化镨3kg、蜜蜡6kg、10,10’-氧代双吩恶砒3kg、2，2’-硫代双(4-叔辛基酚氧基)镍3kg；其制备方法是先将凹凸棒粘土置于8％的盐酸溶液中浸泡50min，抽滤后将所得物料烘干，再与膨胀珍珠岩混合，在780℃下进行高温煅烧1.5h，取出冷却到室温后再与蜜蜡混合，通过研磨机研磨成140目的细粉，最后与剩余材料混合，通过球磨使所有原料粉末充分分散混合均匀即可。
上述的一种电子陶瓷材料的制备方法，按照以下步骤进行:
(1)先将上述的所有原料混合通过球磨机研磨至粒径≤1mm，得粉料；
(2)在所述粉料中加入其重量25％的去离子水，搅拌混匀得粘度为70mPa·s的高流动性浆料；
(3)将浆料注入模具中，随后将模具放置于空气干燥箱中固化处理，具体的是以6℃/min升温速度加热至390℃固化，固化后脱模得到湿坯，将湿坯置于真空干燥箱中进行干燥以得到素坯；
(4)将素坯在流通空气炉中进行加热处理，具体的是先将炉温升至210℃，保温25min，再次升温至420℃，保温35min，之后随空气炉冷却至室温；
(5)将经步骤(4)处理后的素坯置于烧结炉中进行烧结处理，具体的是先将炉温升至650℃，保温30min，再升温至860℃，保温50min，最后空冷至室温即制得本发明的电子陶瓷材料。
实施例3
一种电子陶瓷材料，包括以下原料：BaTiO320kg、ZnO20kg、MnCO320kg、Nd2O39kg、CaSnO316kg、Mg2TiO410kg、WO38kg、ZrSiO420kg、Al2O320kg、Li2O8kg、SrO7kg、改性凹凸粉kg、有机硅乳液25kg和羟乙基纤维素醚20kg；
所述改性凹凸粉由下列重量份的原料制成：凹凸棒粘土30kg、钛白粉8kg、锌钡白4kg、木质素3kg、膨胀珍珠岩10kg、三氯化铁6kg、正丁醛-苯胺缩合物3kg、氧化镨3kg、蜜蜡6kg、10,10’-氧代双吩恶砒3kg、2，2’-硫代双(4-叔辛基酚氧基)镍3kg；其制备方法是先将凹凸棒粘土置于10％的盐酸溶液中浸泡60min，抽滤后将所得物料烘干，再与膨胀珍珠岩混合，在800℃下进行高温煅烧2h，取出冷却到室温后再与蜜蜡混合，通过研磨机研磨成160目的细粉，最后与剩余材料混合，通过球磨使所有原料粉末充分分散混合均匀即可。
上述的一种电子陶瓷材料的制备方法，按照以下步骤进行:
(1)先将上述的所有原料混合通过球磨机研磨至粒径≤1mm，得粉料；
(2)在所述粉料中加入其重量30％的去离子水，搅拌混匀得粘度为60mPa·s的高流动性浆料；
(3)将浆料注入模具中，随后将模具放置于空气干燥箱中固化处理，具体的是以6℃/min升温速度加热至420℃固化，固化后脱模得到湿坯，将湿坯置于真空干燥箱中进行干燥以得到素坯；
(4)将素坯在流通空气炉中进行加热处理，具体的是先将炉温升至240℃，保温30min，再次升温至460℃，保温40min，之后随空气炉冷却至室温；
(5)将经步骤(4)处理后的素坯置于烧结炉中进行烧结处理，具体的是先将炉温升至720℃，保温35min，再升温至980℃，保温60min，最后空冷至室温即制得本发明的电子陶瓷材料。
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，尽管参照前述实施例对本发明进行了详细的说明，对于本领域的技术人员来说，其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (8)

1.一种电子陶瓷材料，其特征在于，包括以下按重量份计的原料：BaTiO3 10-20份、ZnO10-20份、MnCO3 10-20份、Nd2O3 7-9份、CaSnO3 8-16份、Mg2 TiO46-10份、WO3 6-8份、ZrSiO4 10-20份、Al2O3 10-20份、Li2 O4-8份、SrO3-7份、改性凹凸粉4-6份、有机硅乳液15-25份和羟乙基纤维素醚10-20份；
所述改性凹凸粉由下列重量份的原料制成：凹凸棒粘土30份、钛白粉8份、锌钡白4份、木质素3份、膨胀珍珠岩10份、三氯化铁6份、正丁醛-苯胺缩合物3份、氧化镨3份、蜜蜡6份、10,10’-氧代双吩恶砒3份、2，2’-硫代双(4-叔辛基酚氧基)镍3份；其制备方法是先将凹凸棒粘土置于5％-10％的盐酸溶液中浸泡40-60min，抽滤后将所得物料烘干，再与膨胀珍珠岩混合，在750-800℃下进行高温煅烧1-2h，取出冷却到室温后再与蜜蜡混合，通过研磨机研磨成120-160目的细粉，最后与剩余材料混合，通过球磨使所有原料粉末充分分散混合均匀即可。
2.根据权利要求1所述的一种电子陶瓷材料，其特征在于，包括以下按重量份计的原料：BaTiO3 15份、ZnO15份、MnCO3 15份、Nd2O3 8份、CaSnO3 12份、Mg2TiO4 8份、WO3 7份、ZrSiO4 15份、Al2O3 15份、Li2 O6份、SrO5份、改性凹凸粉5份、有机硅乳液20份和羟乙基纤维素醚15份。
3.根据权利要求1所述的一种电子陶瓷材料，其特征在于，所述改性凹凸粉由下列重量份的原料制成：凹凸棒粘土30份、钛白粉8份、锌钡白4份、木质素3份、膨胀珍珠岩10份、三氯化铁6份、正丁醛-苯胺缩合物3份、氧化镨3份、蜜蜡6份、10,10’-氧代双吩恶砒3份、2，2’-硫代双(4-叔辛基酚氧基)镍3份；其制备方法是先将凹凸棒粘土置于8％的盐酸溶液中浸泡50min，抽滤后将所得物料烘干，再与膨胀珍珠岩混合，在780℃下进行高温煅烧1.5h，取出冷却到室温后再与蜜蜡混合，通过研磨机研磨成140目的细粉，最后与剩余材料混合，通过球磨使所有原料粉末充分分散混合均匀即可。
4.一种如权利要求1-6任意一项所述的电子陶瓷材料的制备方法，其特征在于，包括以下步骤:
(1)按重量份配比称取原料；
(2)将所有原料混合制成粉料；
(3)在所述粉料中加入其重量20-30％的去离子水，搅拌混匀得粘度小于80mPa·s的高流动性浆料；
(4)将浆料注入模具中，随后将模具放置于空气干燥箱中固化处理，固化后脱模得到湿坯，将湿坯置于真空干燥箱中进行干燥以得到素坯；
(5)将素坯在流通空气炉中进行加热处理，之后随空气炉冷却至室温；
(6)将经步骤(5)处理后的素坯置于烧结炉中进行烧结处理，最后空冷至室温即可。
5.根据权利要求4所述的一种电子陶瓷材料的制备方法，其特征在于，在步骤(2)中，所述原料是通过球磨研磨至粒径≤1mm，得粉料。
6.根据权利要求4所述的一种电子陶瓷材料的制备方法，其特征在于，在步骤(4)中，所述固化处理是以6℃/min升温速度加热至360-420℃固化。
7.根据权利要求4所述的一种电子陶瓷材料的制备方法，其特征在于，在步骤(5)中，所述加热处理是先将炉温升至180℃～240℃，保温20-30min，再次升温至380℃～460℃，保温30-40min。
8.根据权利要求4所述的一种电子陶瓷材料的制备方法，其特征在于，在步骤(6)中，所述烧结处理是先将炉温升至580℃～720℃，保温25-35min，再升温至740℃～980℃，保温40-60min。
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