CN107076894B - 红外线遮蔽性组合物、固化膜及固体摄像装置 - Google Patents

红外线遮蔽性组合物、固化膜及固体摄像装置 Download PDF

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CN107076894B
CN107076894B CN201580053503.8A CN201580053503A CN107076894B CN 107076894 B CN107076894 B CN 107076894B CN 201580053503 A CN201580053503 A CN 201580053503A CN 107076894 B CN107076894 B CN 107076894B
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compounds
infrared
group
light
solid
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CN107076894A (zh
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畠山耕治
嶋田遵生子
河合孝广
若林隆太郎
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JSR Corp
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/014Stabilisers against oxidation, heat, light or ozone
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005Stabilisers against oxidation, heat, light, ozone
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • G02B5/22Absorbing filters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14625Optical elements or arrangements associated with the device
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof

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  • Chemical & Material Sciences (AREA)
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  • Organic Chemistry (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Optical Filters (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
CN201580053503.8A 2014-12-26 2015-12-22 红外线遮蔽性组合物、固化膜及固体摄像装置 Active CN107076894B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014265729 2014-12-26
JP2014-265729 2014-12-26
PCT/JP2015/085808 WO2016104491A1 (ja) 2014-12-26 2015-12-22 赤外線遮蔽性組成物、硬化膜及び固体撮像装置

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CN107076894A CN107076894A (zh) 2017-08-18
CN107076894B true CN107076894B (zh) 2020-01-31

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JP (1) JP6702197B2 (ja)
KR (2) KR20220146660A (ja)
CN (1) CN107076894B (ja)
TW (1) TWI701304B (ja)
WO (1) WO2016104491A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI675907B (zh) * 2015-01-21 2019-11-01 日商Jsr股份有限公司 固體攝像裝置
JP6788444B2 (ja) * 2016-09-07 2020-11-25 株式会社日本触媒 樹脂組成物および光学フィルター
JP6726317B2 (ja) 2017-02-09 2020-07-22 富士フイルム株式会社 感光性組成物、硬化膜、光学フィルタ、固体撮像素子、画像表示装置および赤外線センサ
JP6922361B2 (ja) * 2017-04-07 2021-08-18 Jsr株式会社 固体撮像素子用組成物、赤外線遮蔽膜及び固体撮像素子
JP7326152B2 (ja) * 2017-04-07 2023-08-15 Jsr株式会社 固体撮像素子用組成物及び固体撮像素子用赤外線遮蔽膜の形成方法
KR101862533B1 (ko) 2018-04-12 2018-05-29 주식회사 엘엠에스 카메라 모듈에 포함되는 근적외선 컷-오프 필터용 광학물품 및 이를 포함하는 카메라 모듈용 근적외선 컷-오프 필터
JP2020042235A (ja) * 2018-09-13 2020-03-19 Jsr株式会社 撮像装置、および赤外吸収膜

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101530018A (zh) * 2006-10-25 2009-09-09 Lg化学株式会社 具有近红外屏蔽功能和透明性的电磁波屏蔽膜、包括该电磁波屏蔽膜的滤光片和等离子显示面板
JP2011191391A (ja) * 2010-03-12 2011-09-29 Sumitomo Chemical Co Ltd 硬化されたパターンの製造方法
JP2013137337A (ja) * 2011-12-27 2013-07-11 Fujifilm Corp 赤外線カットフィルタの製造方法、該製造方法に用いられる赤外線吸収性液状組成物、赤外線カットフィルタ、並びに、カメラモジュール及びその製造方法
JP2013151675A (ja) * 2011-12-27 2013-08-08 Fujifilm Corp 赤外線吸収性組成物、これを用いた赤外線カットフィルタ及びその製造方法、並びに、カメラモジュール及びその製造方法
CN103839952A (zh) * 2012-11-20 2014-06-04 采钰科技股份有限公司 影像感测装置
CN103858028A (zh) * 2011-10-14 2014-06-11 Jsr株式会社 滤光器及使用该滤光器的固体摄影装置及照相机模块
JP2014214262A (ja) * 2013-04-26 2014-11-17 日本化薬株式会社 熱硬化性樹脂組成物及び近赤外線カットフィルタ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014203044A (ja) * 2013-04-09 2014-10-27 日本板硝子株式会社 赤外線カットフィルタおよび撮像装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101530018A (zh) * 2006-10-25 2009-09-09 Lg化学株式会社 具有近红外屏蔽功能和透明性的电磁波屏蔽膜、包括该电磁波屏蔽膜的滤光片和等离子显示面板
JP2011191391A (ja) * 2010-03-12 2011-09-29 Sumitomo Chemical Co Ltd 硬化されたパターンの製造方法
CN103858028A (zh) * 2011-10-14 2014-06-11 Jsr株式会社 滤光器及使用该滤光器的固体摄影装置及照相机模块
JP2013137337A (ja) * 2011-12-27 2013-07-11 Fujifilm Corp 赤外線カットフィルタの製造方法、該製造方法に用いられる赤外線吸収性液状組成物、赤外線カットフィルタ、並びに、カメラモジュール及びその製造方法
JP2013151675A (ja) * 2011-12-27 2013-08-08 Fujifilm Corp 赤外線吸収性組成物、これを用いた赤外線カットフィルタ及びその製造方法、並びに、カメラモジュール及びその製造方法
CN103839952A (zh) * 2012-11-20 2014-06-04 采钰科技股份有限公司 影像感测装置
JP2014214262A (ja) * 2013-04-26 2014-11-17 日本化薬株式会社 熱硬化性樹脂組成物及び近赤外線カットフィルタ

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KR20220146660A (ko) 2022-11-01
KR20170099845A (ko) 2017-09-01
WO2016104491A1 (ja) 2016-06-30
TW201631058A (zh) 2016-09-01
JP6702197B2 (ja) 2020-05-27
TWI701304B (zh) 2020-08-11
CN107076894A (zh) 2017-08-18
JPWO2016104491A1 (ja) 2017-11-24

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