CN107059118A - Cooling device for the polycrystalline ingot furnace of oversize silicon ingot - Google Patents
Cooling device for the polycrystalline ingot furnace of oversize silicon ingot Download PDFInfo
- Publication number
- CN107059118A CN107059118A CN201710273537.9A CN201710273537A CN107059118A CN 107059118 A CN107059118 A CN 107059118A CN 201710273537 A CN201710273537 A CN 201710273537A CN 107059118 A CN107059118 A CN 107059118A
- Authority
- CN
- China
- Prior art keywords
- cooling
- heat sink
- ingot
- cooling heat
- polycrystalline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B28/00—Production of homogeneous polycrystalline material with defined structure
- C30B28/04—Production of homogeneous polycrystalline material with defined structure from liquids
- C30B28/06—Production of homogeneous polycrystalline material with defined structure from liquids by normal freezing or freezing under temperature gradient
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Silicon Compounds (AREA)
Abstract
A kind of cooling device of polycrystalline ingot furnace for oversize silicon ingot, including the cooling heat sink being located in polycrystalline ingot furnace lower furnace body, thermometric thief hole is provided with the center of cooling heat sink, cooling pipe is paved with the lower surface of cooling heat sink, cooling pipe is provided with an import and one outlet, the protective plate I connected with lower furnace body is surrounded by the lower surface of cooling heat sink, the thermometric thief hole in cooling heat sink upper surface is surrounded by protective plate II.The present invention in polycrystalline ingot furnace lower furnace body by setting cooling heat sink, and the lower surface of cooling heat sink, which is provided with cooling pipe, cooling pipe, is passed through liquid or inert gas for cooling down, and its cooling capacity is strong, and cooling velocity is accelerated；By setting protective plate I and protective plate II to prevent that feed liquid flows out from the surrounding of warm thief hole or cooling heat sink after crucible rupture, so as to strengthen protection, improves its security.
Description
Technical field
The present invention relates to production of polysilicon equipment technical field, more particularly to a kind of polycrystalline for oversize silicon ingot is cast
The cooling device of ingot stove.
Background technology
Photovoltaic industry development is rapid, market scale sustainable growth, but Market competition simultaneously, is to realize as early as possible
Par is surfed the Net, and realizes larger range of popularization and application, and each link of the whole industry lays siege to and obtained high efficiency, inexpensive battery.
Crystal silicon link in upstream, acquisition high-quality, inexpensive crystal are extremely important, current large scale（G6）Polycrystal silicon ingot turns into row
Owner flows, and oversize silicon ingot G7 or G8 of future generation turn into current trend and postponed the only way of development, can lift silicon ingot weight
Amount, improves productivity ratio, reduction unit consumption, raising crystal quality.
Polycrystalline silicon ingot or purifying furnace is the equipment for manufacturing polycrystal silicon ingot, produces polycrystal silicon ingot using directional solidification method, first
The crucible for having installed silicon material is fitted into furnace chamber, is then evacuated, heated, melted, growing the processing steps such as brilliant, annealing, cooling.
With the continuous expansion of silicon ingot specification, voluntarily cooled down by body of heater, the long brilliant effect of influence, and the long brilliant time can also compare
It is longer, therefore, in order to solve the above technical problems, it is necessory to provide a kind of new ingot furnace cooling device, to overcome existing skill
The defect in art.
The content of the invention
The technical problems to be solved by the invention are in view of the shortcomings of the prior art, there is provided one kind is reasonable in design, to cool down effect
It is really good, the cooling device of the polycrystalline ingot furnace for oversize silicon ingot safe to use.
The technical problems to be solved by the invention are realized by following technical scheme, and the present invention is that one kind is used for
The cooling device of the polycrystalline ingot furnace of oversize silicon ingot, is characterized in, including the cooling heat sink being located in lower furnace body, cold
But the center of heat sink is provided with thermometric thief hole, is paved with cooling pipe on the lower surface of cooling heat sink, cooling pipe is set
There are an import and one outlet, the protective plate I connected with lower furnace body is surrounded by the lower surface of cooling heat sink, in cooling
The thermometric thief hole of heat sink upper surface is surrounded by protective plate II.
What the technical problems to be solved by the invention can also be realized by following technical scheme, the protective plate I
It is thermal-insulation hard felt plate, ceramic wafer, alumina plate, zirconium oxide plate or graphite cake with protective plate II, is highly 20mm-60mm.
What the technical problems to be solved by the invention can also be realized by following technical scheme, the cooling radiating
Plate is molybdenum plate or copper coin, and its thickness is 20mm-60mm.
What the technical problems to be solved by the invention can also be realized by following technical scheme, the cooling pipe
For molybdenum tube or copper pipe.
What the technical problems to be solved by the invention can also be realized by following technical scheme, cooling pipe section
Profile is triangle, square, semicircle, circular or rectangle.
What the technical problems to be solved by the invention can also be realized by following technical scheme, cooling pipe it is interior
Footpath is 20mm-60mm.
What the technical problems to be solved by the invention can also be realized by following technical scheme, the cooling pipe
In three-back-shaped setting of spiraling.
Compared with prior art, the present invention cools down heat sink by setting cooling heat sink in polycrystalline ingot furnace lower furnace body
Lower surface be provided with cooling pipe, liquid or inert gas are passed through in cooling pipe to be used to cool down, and its cooling capacity is strong, cooling
Speed is accelerated；By setting protective plate I and protective plate II to prevent that feed liquid radiates from warm thief hole or cooling after crucible rupture
The surrounding outflow of plate, so as to strengthen protection, improves its security.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention.
Fig. 2 is Fig. 1 present invention looks up structural representation.
Embodiment
Referring to the drawings, the concrete technical scheme of the present invention is further described, in order to which those skilled in the art enters
One step the present invention is understood, without constituting the limitation to its right.
Referring to Figures 1 and 2, the cooling device of a kind of polycrystalline ingot furnace for oversize silicon ingot, including be located at polycrystalline
Cooling heat sink 2 in ingot furnace lower furnace body, cooling heat sink 2 is fixed in lower furnace body by support frame, and cooling heat sink 2 is
Molybdenum plate or copper coin, are shaped as square, and its thickness is 30mm.Thermometric thief hole is provided with the center of cooling heat sink 2, cold
But cooling pipe 5 is paved with the lower surface of heat sink 2, cooling pipe 5 is arranged on cooling heat sink 2 in three-back-shaped spiral, cold
But pipeline 5 is provided with an import and one outlet.The cooling pipe 5 by with some strength, fusing point is high and thermal conductivity is good
Metal material be made, such as molybdenum tube or copper pipe, its internal diameter be 40mm, the cross-sectional shape of cooling pipe 5 can for triangle, it is square,
Semicircle, circular or rectangle.The form that is connected of cooling pipe 5 and cooling heat sink 2 is for directly welding or by outer
Portion's fastener connection, to ensure abundant contact between the two, makes conduction good.Cooling pipe 5 is connected with cooling device, in it
The medium that portion is flowed through is liquid or inert gas, and pressure is 0.1bar-6bar.
The protective plate I 3 connected with lower furnace body is surrounded by the lower surface of cooling heat sink 2, in the cooling upper table of heat sink 2
The thermometric thief hole 4 in face is surrounded by protective plate II 1.Protective plate I 3 and protective plate II 1 are thermal-insulation hard felt plate, ceramic wafer, oxidation
Aluminium sheet, zirconium oxide plate or graphite cake, the height of protective plate II 1 is 30mm, and the height of protective plate I 3 is 50mm.Use protective plate I 3
Surrounding outflow of the feed liquid from warm thief hole or cooling heat sink after crucible rupture can be prevented with protective plate II 1.
Claims (7)
1. a kind of cooling device of polycrystalline ingot furnace for oversize silicon ingot, it is characterised in that：Including being located at polycrystalline cast ingot
Cooling heat sink in stove lower furnace body, is provided with thermometric thief hole, in the following table of cooling heat sink in the center of cooling heat sink
Cooling pipe is paved with face, cooling pipe is provided with an import and one outlet, is surrounded by the lower surface of cooling heat sink
The protective plate I connected with lower furnace body, the thermometric thief hole in cooling heat sink upper surface is surrounded by protective plate II.
2. the cooling device of the polycrystalline ingot furnace according to claim 1 for oversize silicon ingot, it is characterised in that：
The protective plate I and protective plate II are thermal-insulation hard felt plate, ceramic wafer, alumina plate, zirconium oxide plate or graphite cake, are highly
20mm-60mm。
3. the cooling device of the polycrystalline ingot furnace according to claim 1 for oversize silicon ingot, it is characterised in that：Institute
It is molybdenum plate or copper coin to state cooling heat sink, and its thickness is 20mm-60mm.
4. the cooling device of the polycrystalline ingot furnace according to claim 1 for oversize silicon ingot, it is characterised in that：Institute
Cooling pipe is stated for molybdenum tube or copper pipe.
5. the cooling device of the polycrystalline ingot furnace according to claim 4 for oversize silicon ingot, it is characterised in that：It is cold
But pipeline section profile is triangle, square, semicircle, circular or rectangle.
6. the cooling device of the polycrystalline ingot furnace according to claim 4 for oversize silicon ingot, it is characterised in that：It is cold
But the internal diameter of pipeline is 20mm-60mm.
7. the cooling device of the polycrystalline ingot furnace according to claim 1 for oversize silicon ingot, it is characterised in that：Institute
Cooling pipe is stated in three-back-shaped setting of spiraling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710273537.9A CN107059118A (en) | 2017-04-23 | 2017-04-23 | Cooling device for the polycrystalline ingot furnace of oversize silicon ingot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710273537.9A CN107059118A (en) | 2017-04-23 | 2017-04-23 | Cooling device for the polycrystalline ingot furnace of oversize silicon ingot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107059118A true CN107059118A (en) | 2017-08-18 |
Family
ID=59605448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710273537.9A Pending CN107059118A (en) | 2017-04-23 | 2017-04-23 | Cooling device for the polycrystalline ingot furnace of oversize silicon ingot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107059118A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203795017U (en) * | 2014-03-13 | 2014-08-27 | 常州兆晶光能有限公司 | Ultrafine grain polysilicon ingot furnace |
| CN104195634A (en) * | 2014-09-10 | 2014-12-10 | 韩华新能源科技有限公司 | Novel thermal field structure of large-size silicon ingot polycrystal ingot furnace |
| CN204023000U (en) * | 2014-08-20 | 2014-12-17 | 浙江精功科技股份有限公司 | A kind of novel ingot furnace refrigerating unit |
| CN104328492A (en) * | 2014-11-27 | 2015-02-04 | 吕铁铮 | Device for moving small insulating plate at bottom of polycrystalline silicon ingot furnace and polycrystalline silicon ingot furnace |
| CN104404619A (en) * | 2014-08-18 | 2015-03-11 | 吕铁铮 | Polysilicon ingot furnace and coagulation aid block external admission air cooling device thereof |
| CN207016891U (en) * | 2017-04-23 | 2018-02-16 | 连云港清友新能源科技有限公司 | A kind of cooling device of polycrystalline ingot furnace for oversize silicon ingot |
-
2017
- 2017-04-23 CN CN201710273537.9A patent/CN107059118A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203795017U (en) * | 2014-03-13 | 2014-08-27 | 常州兆晶光能有限公司 | Ultrafine grain polysilicon ingot furnace |
| CN104404619A (en) * | 2014-08-18 | 2015-03-11 | 吕铁铮 | Polysilicon ingot furnace and coagulation aid block external admission air cooling device thereof |
| CN204023000U (en) * | 2014-08-20 | 2014-12-17 | 浙江精功科技股份有限公司 | A kind of novel ingot furnace refrigerating unit |
| CN104195634A (en) * | 2014-09-10 | 2014-12-10 | 韩华新能源科技有限公司 | Novel thermal field structure of large-size silicon ingot polycrystal ingot furnace |
| CN104328492A (en) * | 2014-11-27 | 2015-02-04 | 吕铁铮 | Device for moving small insulating plate at bottom of polycrystalline silicon ingot furnace and polycrystalline silicon ingot furnace |
| CN207016891U (en) * | 2017-04-23 | 2018-02-16 | 连云港清友新能源科技有限公司 | A kind of cooling device of polycrystalline ingot furnace for oversize silicon ingot |
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