CN107039384A - 一种贴片式元件 - Google Patents

一种贴片式元件 Download PDF

Info

Publication number
CN107039384A
CN107039384A CN201710297717.0A CN201710297717A CN107039384A CN 107039384 A CN107039384 A CN 107039384A CN 201710297717 A CN201710297717 A CN 201710297717A CN 107039384 A CN107039384 A CN 107039384A
Authority
CN
China
Prior art keywords
weld part
connecting plate
smd element
electrode
weld
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201710297717.0A
Other languages
English (en)
Other versions
CN107039384B (zh
Inventor
沈朝阳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN JINYANG ELECTRONIC CO Ltd
Original Assignee
SHENZHEN JINYANG ELECTRONIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=59538759&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN107039384(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by SHENZHEN JINYANG ELECTRONIC CO Ltd filed Critical SHENZHEN JINYANG ELECTRONIC CO Ltd
Priority to CN201710297717.0A priority Critical patent/CN107039384B/zh
Publication of CN107039384A publication Critical patent/CN107039384A/zh
Priority to PCT/CN2017/118998 priority patent/WO2018196425A1/zh
Priority to EP17906992.7A priority patent/EP3644357A4/en
Priority to US16/666,291 priority patent/US20200066672A1/en
Application granted granted Critical
Publication of CN107039384B publication Critical patent/CN107039384B/zh
Ceased legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
    • H01L24/92Specific sequence of method steps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54433Marks applied to semiconductor devices or parts containing identification or tracking information
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54473Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/5448Located on chip prior to dicing and remaining on chip after dicing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165Reinforcing structures
    • H01L2224/02166Collar structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04026Bonding areas specifically adapted for layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04034Bonding areas specifically adapted for strap connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601Structure
    • H01L2224/0603Bonding areas having different sizes, e.g. different heights or widths
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061Disposition
    • H01L2224/0618Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/06181On opposite sides of the body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001Core members of the layer connector
    • H01L2224/29099Material
    • H01L2224/291Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331Disposition
    • H01L2224/3318Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181On opposite sides of the body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001Core members of the connector
    • H01L2224/3701Shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001Core members of the connector
    • H01L2224/3701Shape
    • H01L2224/37012Cross-sectional shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001Core members of the connector
    • H01L2224/3701Shape
    • H01L2224/37012Cross-sectional shape
    • H01L2224/37013Cross-sectional shape being non uniform along the connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001Core members of the connector
    • H01L2224/37099Material
    • H01L2224/371Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/3716Iron [Fe] as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/3754Coating
    • H01L2224/37599Material
    • H01L2224/376Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37601Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/37611Tin [Sn] as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/4005Shape
    • H01L2224/4009Loop shape
    • H01L2224/40095Kinked
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401Disposition
    • H01L2224/40151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/40227Connecting the strap to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/404Connecting portions
    • H01L2224/40475Connecting portions connected to auxiliary connecting means on the bonding areas
    • H01L2224/40499Material of the auxiliary connecting means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73263Layer and strap connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838Bonding techniques
    • H01L2224/83801Soldering or alloying
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848Bonding techniques
    • H01L2224/84801Soldering or alloying
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92Specific sequence of method steps
    • H01L2224/922Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222Sequential connecting processes
    • H01L2224/92252Sequential connecting processes the first connecting process involving a strap connector
    • H01L2224/92255Sequential connecting processes the first connecting process involving a strap connector the second connecting process involving a layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/84Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Arc Welding In General (AREA)
  • Resistance Welding (AREA)

Abstract

本发明公开了一种贴片式元件,该贴片式元件包括片式元件和支架,所述支架包括第一焊接部、第二焊接部以及连接所述第一焊接部和所述第二焊接部的连接部,所述第一焊接部用于与所述PCB板焊接;所述片式元件包括第一电极和第二电极,所述第一电极与所述第二焊接部焊接,所述第二电极用于与PCB板焊接。本发明旨在提供一种满足自动化生产需要的贴片式元件,在保证生产效率的同时降低成本。

Description

一种贴片式元件
技术领域
本发明涉及表面贴装技术领域,尤其涉及一种贴片式元件。
背景技术
已有的贴片型元件一般有着相当标准的外形尺寸,在贴片生产中不存在任何难度。但对于某些功率型贴片元件由于种种原因,价格一直高高在上。另一方面,具有相同性能的常规引线式元件价格便宜,但在某些必用的场合,用户不得不花费大量的人工手工焊接,影响效率、影响美观、影响一致性。因此,如何利用常规片式元件开发出一款满足自动化生产需要的贴片式元件,已成为本领域技术人员亟待解决的技术问题之一。
发明内容
为了克服现有技术的不足,本发明的目的之一在于提供一中满足自动化生产需要的贴片式元件,在提升生产效率的同时降低成本。
本发明的目的之一采用如下技术方案实现:
一种贴片式元件,包括片式元件和支架,所述支架包括第一焊接部、第二焊接部以及连接所述第一焊接部和所述第二焊接部的连接部,所述第一焊接部用于与所述PCB板焊接;所述片式元件包括第一电极和第二电极,所述第一电极与所述第二焊接部焊接,所述第二电极用于与PCB板焊接。
进一步地,所述第一焊接部和所述第二焊接部分设在所述连接部的两侧,且所述第一焊接部到所述第二焊接部的垂直距离与所述第一电极到所述第二电极的距离相适配。
进一步地,所述连接部包括第一连接板和与所述第一连接板连接的第二连接板,所述第一连接板与所述第一焊接部连接,所述第二连接板与所述第二焊接部连接。
进一步地,所述第一连接板与所述第一焊接部的夹角为90°-135°。
进一步地,所述第一连接板与所述第一焊接部的夹角为90°。
进一步地,所述第二连接板与所述第二焊接部的夹角为90°-135°。
进一步地,所述连接部还包括第三连接板,所述第一连接板通过所述第三连接板与所述第二连接板连接。
进一步地,所述第三连接板和所述第一焊接部分别设置于所述第一连接板的两侧。
进一步地,所述第三连接板到所述第一焊接部的垂直距离大于所述第二焊接部到所述第一焊接部的垂直距离。
进一步地,所述第二焊接部的形状为圆形或多边形。
相比现有技术,本发明的有益效果在于:
本发明实施例提供的贴片式元件,由于片式元件的第一电极与支架的所述第二焊接部焊接,在贴片式元件与PCB板焊接时,将支架的第一焊接部和片式元件的第二电极分别与PCB板焊接,因而片式元件与支架焊接后形成的贴片式元件能够利用传统的贴片式元件焊接装置或方法进行焊接;另一方面,由于片式元件与支架的原材料成本低,因而与传统的贴片式元件相比,本发明实施例提供的贴片式元件不仅能够满足自动化生产需求,还能够大大降低贴片式元件的成本,提高了市场竞争力。
附图说明
图1为本发明一实施例提供的贴片式元件的示意图;
图2是图1中贴片式元件的支架示意图。
图中:1、片式元件;11、第一电极;12、第二电极;2、支架;21、第一焊接部;22、第二焊接部;23、连接部;231、第一连接板;232、第二连接板;233、第三连接板;3、PCB板。
具体实施方式
下面,结合附图以及具体实施方式,对本发明做进一步描述,需要说明的是,在不相冲突的前提下,以下描述的各实施例之间或各技术特征之间可以任意组合形成新的实施例。
如图1-图2所示,本发明实施例提供的贴片式元件,包括片式元件1和支架2,所述支架2包括第一焊接部21、第二焊接部22以及连接所述第一焊接部21和所述第二焊接部22的连接部23,所述第一焊接部21用于与所述PCB板3焊接;所述片式元件1包括第一电极11和第二电极12,所述第一电极11与所述第二焊接部22焊接,所述第二电极12用于与PCB板3焊接。
在本发明实施例中,片式元件1为芯片。
上述技术方案提供的贴片式元件,由于片式元件1的第一电极11与支架2的所述第二焊接部22焊接,在贴片式元件与PCB板3焊接时,支架2的第一焊接部21和片式元件的第二电极12分别与PCB板3焊接,因而片式元件1与支架2焊接后形成的贴片式元件能够利用传统的贴片式元件焊接装置或方法进行焊接;另一方面,由于片式元件1与支架2的原材料成本低,因而与传统的贴片式元件相比,本发明实施例提供的贴片式元件不仅能够满足自动化生产需求,还能够大大降低贴片式元件的成本,提高了市场竞争力。
进一步地,所述第一焊接部21和所述第二焊接部22分设在所述连接部23的两侧,且所述第一焊接部21到所述第二焊接部22的垂直距离与所述第一电极11到所述第二电极12的距离相适配,在贴片式元件与PCB板3焊接时,这种结构简单合理,并能够保证第一焊接部21与第二电极12处于同一水平面,从而能够利用传统的贴片式元件焊接装置或方法进行焊接,进而满足自动化生产需求。
进一步地,所述连接部23包括第一连接板231和与所述第一连接板231连接的第二连接板232,所述第一连接板231与所述第一焊接部21连接,所述第二连接板232与所述第二焊接部22连接。
进一步地,所述第一连接板231与所述第一焊接部21的夹角为α,α的角度范围为90°-135°。在本实施例中,优选的,所述第一连接板与所述第一焊接部的夹角α为90°,如此既美观又能节省原材料,降低贴片式元件的成本。
进一步地,所述第二连接板232与所述第二焊接部22的夹角为β,β的角度范围为90°-135°,这种结构既美观又能节省原材料,进一步降低贴片式元件的成本。
进一步地,所述连接部23还包括第三连接板233,所述第一连接板231通过所述第三连接板233与所述第二连接板232连接。进一步地,所述第三连接板233和所述第一焊接部21分别设置于所述第一连接板231的两侧。
进一步地,所述第三连接板233与所述第一连接板231的夹角为90°,如此能够节省原材料,进而降低贴片式元件的成本。可以理解的,所述第三连接板233与所述第二连接板232的夹角为90°-135°。
进一步地,所述第三连接板233到所述第一焊接部21的垂直距离大于所述第二焊接部22到所述第一焊接部21的垂直距离,以节省原材料,降低贴片式元件的原材料成本。
进一步地,第二焊接部22的形状为圆形或多边形,第二焊接部22的尺寸可根据芯片尺寸大小而变化,以满足不同形状和规格的芯片。
综上,本发明实施例提供的贴片式元件,由于片式元件1的第一电极11与支架2的所述第二焊接部22焊接,在贴片式元件与PCB板3焊接时,支架2的第一焊接部21和片式元件的第二电极12分别与PCB板3焊接,因而片式元件1与支架2焊接后形成的贴片式元件能够利用传统的贴片式元件焊接装置或方法进行焊接;另一方面,由于片式元件1与支架2的原材料成本低,因而与传统的贴片式元件相比,本发明实施例提供的贴片式元件不仅能够满足自动化生产需求,还能够大大降低贴片式元件的成本,提高了市场竞争力。
上述实施方式仅为本发明的优选实施方式,不能以此来限定本发明保护的范围,本领域的技术人员在本发明的基础上所做的任何非实质性的变化及替换均属于本发明所要求保护的范围。

Claims (10)

1.一种贴片式元件,其特征在于,包括片式元件和支架,所述支架包括第一焊接部、第二焊接部以及连接所述第一焊接部和所述第二焊接部的连接部,所述第一焊接部用于与所述PCB板焊接;所述片式元件包括第一电极和第二电极,所述第一电极与所述第二焊接部焊接,所述第二电极用于与PCB板焊接。
2.如权利要求1所述的贴片式元件,其特征在于,所述第一焊接部和所述第二焊接部分设在所述连接部的两侧,且所述第一焊接部到所述第二焊接部的垂直距离与所述第一电极到所述第二电极的距离相适配。
3.如权利要求1所述的贴片式元件,其特征在于,所述连接部包括第一连接板和与所述第一连接板连接的第二连接板,所述第一连接板与所述第一焊接部连接,所述第二连接板与所述第二焊接部连接。
4.如权利要求3所述的贴片式元件,其特征在于,所述第一连接板与所述第一焊接部的夹角为90°-135°。
5.如权利要求4所述的贴片式元件,其特征在于,所述第一连接板与所述第一焊接部的夹角为90°。
6.如权利要求3所述的贴片式元件,其特征在于,所述第二连接板与所述第二焊接部的夹角为90°-135°。
7.如权利要求3所述的贴片式元件,其特征在于,所述连接部还包括第三连接板,所述第一连接板通过所述第三连接板与所述第二连接板连接。
8.如权利要求7所述的贴片式元件,其特征在于,所述第三连接板和所述第一焊接部分别设置于所述第一连接板的两侧。
9.如权利要求7所述的贴片式元件,其特征在于,所述第三连接板到所述第一焊接部的垂直距离大于所述第二焊接部到所述第一焊接部的垂直距离。
10.如权利要求3所述的贴片式元件,其特征在于,所述第二焊接部的形状为圆形或多边形。
CN201710297717.0A 2017-04-29 2017-04-29 一种贴片式元件 Ceased CN107039384B (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201710297717.0A CN107039384B (zh) 2017-04-29 2017-04-29 一种贴片式元件
PCT/CN2017/118998 WO2018196425A1 (zh) 2017-04-29 2017-12-27 一种贴片式元件
EP17906992.7A EP3644357A4 (en) 2017-04-29 2017-12-27 SURFACE MOUNTED ELEMENT
US16/666,291 US20200066672A1 (en) 2017-04-29 2019-10-28 Chip component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710297717.0A CN107039384B (zh) 2017-04-29 2017-04-29 一种贴片式元件

Publications (2)

Publication Number Publication Date
CN107039384A true CN107039384A (zh) 2017-08-11
CN107039384B CN107039384B (zh) 2020-07-24

Family

ID=59538759

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710297717.0A Ceased CN107039384B (zh) 2017-04-29 2017-04-29 一种贴片式元件

Country Status (4)

Country Link
US (1) US20200066672A1 (zh)
EP (1) EP3644357A4 (zh)
CN (1) CN107039384B (zh)
WO (1) WO2018196425A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018196425A1 (zh) * 2017-04-29 2018-11-01 深圳市劲阳电子有限公司 一种贴片式元件

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993017049A1 (de) * 1992-02-21 1993-09-02 Bosch Gmbh Robert Anschlussteil
CN201075387Y (zh) * 2007-07-09 2008-06-18 扬州扬杰电子科技有限公司 贴片式功率二极管
CN201267057Y (zh) * 2008-09-09 2009-07-01 捷考奥电子(上海)有限公司 表面贴片式环行器
CN102208369A (zh) * 2010-03-31 2011-10-05 罗姆股份有限公司 半导体装置的引线焊接结构及引线焊接方法
CN203521446U (zh) * 2013-09-13 2014-04-02 绿尚太阳能科技(上海)有限公司 双面电极太阳能电池片smt贴片用极片
CN203617270U (zh) * 2013-12-11 2014-05-28 扬州虹扬科技发展有限公司 一种肖特基二极管的跳线
CN204809212U (zh) * 2015-06-30 2015-11-25 南通富士通微电子股份有限公司 一种半导体封装结构
CN204966489U (zh) * 2015-10-08 2016-01-13 苏州固锝电子股份有限公司 超薄型贴片式整流器
CN205817029U (zh) * 2016-06-07 2016-12-21 珠海瑞德电子科技有限公司 波峰焊治具
CN207097811U (zh) * 2017-04-29 2018-03-13 深圳市劲阳电子有限公司 一种贴片式元件

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4940743B2 (ja) * 2006-04-20 2012-05-30 富士電機株式会社 半導体装置
JP5542627B2 (ja) * 2010-11-11 2014-07-09 新電元工業株式会社 接続板、接合構造及び半導体装置
CN108565254B (zh) * 2013-10-21 2021-08-24 日本精工株式会社 半导体模块
CN107039384B (zh) * 2017-04-29 2020-07-24 深圳市劲阳电子有限公司 一种贴片式元件

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993017049A1 (de) * 1992-02-21 1993-09-02 Bosch Gmbh Robert Anschlussteil
CN201075387Y (zh) * 2007-07-09 2008-06-18 扬州扬杰电子科技有限公司 贴片式功率二极管
CN201267057Y (zh) * 2008-09-09 2009-07-01 捷考奥电子(上海)有限公司 表面贴片式环行器
CN102208369A (zh) * 2010-03-31 2011-10-05 罗姆股份有限公司 半导体装置的引线焊接结构及引线焊接方法
CN203521446U (zh) * 2013-09-13 2014-04-02 绿尚太阳能科技(上海)有限公司 双面电极太阳能电池片smt贴片用极片
CN203617270U (zh) * 2013-12-11 2014-05-28 扬州虹扬科技发展有限公司 一种肖特基二极管的跳线
CN204809212U (zh) * 2015-06-30 2015-11-25 南通富士通微电子股份有限公司 一种半导体封装结构
CN204966489U (zh) * 2015-10-08 2016-01-13 苏州固锝电子股份有限公司 超薄型贴片式整流器
CN205817029U (zh) * 2016-06-07 2016-12-21 珠海瑞德电子科技有限公司 波峰焊治具
CN207097811U (zh) * 2017-04-29 2018-03-13 深圳市劲阳电子有限公司 一种贴片式元件

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018196425A1 (zh) * 2017-04-29 2018-11-01 深圳市劲阳电子有限公司 一种贴片式元件

Also Published As

Publication number Publication date
CN107039384B (zh) 2020-07-24
EP3644357A4 (en) 2021-03-10
WO2018196425A1 (zh) 2018-11-01
US20200066672A1 (en) 2020-02-27
EP3644357A1 (en) 2020-04-29

Similar Documents

Publication Publication Date Title
CN107039384A (zh) 一种贴片式元件
CN207097811U (zh) 一种贴片式元件
CN207368073U (zh) 一种具有防反极功能的焊片及其电池组
CN203467081U (zh) 电路板贴片工艺辅助工装
CN202014438U (zh) 一种smt印刷模板结构
CN204885149U (zh) 整流桥的引线框架结构
CN206877800U (zh) 一种小型变压器
CN202678303U (zh) 一种引线框架
CN204834299U (zh) 一种电感变压器表面插装引脚焊接结构
CN201820592U (zh) 全密封变压器用油箱
CN204350460U (zh) 一种pcb板表面组装结构
CN207720518U (zh) 一种pcb焊盘组件
CN208713236U (zh) 一种复合板贴条固定装置
CN206834176U (zh) 一种低热阻大功率贴片整流桥
CN207119473U (zh) 电除尘芒刺线
CN206878033U (zh) 一种垂直led芯片的正反面共晶焊接结构
CN201726374U (zh) 一种压电陶瓷10.7MHz系列滤波器
CN207068669U (zh) 一种电容器的引线结构
CN204156157U (zh) 一种汽车连接端子
CN203151241U (zh) 定子压圈
CN207990259U (zh) Led灯条的fpc结构
CN204155728U (zh) 一种带接线柱焊接加固的电感器
CN203871317U (zh) 桥式整流器的结构
CN204597224U (zh) 一种新型配电柜横梁
CN207219179U (zh) 线路板铜柱焊接结构

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
IW01 Full invalidation of patent right
IW01 Full invalidation of patent right

Decision date of declaring invalidation: 20210825

Decision number of declaring invalidation: 51471

Granted publication date: 20200724