CN107039384A - 一种贴片式元件 - Google Patents

一种贴片式元件 Download PDF

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Publication number
CN107039384A
CN107039384A CN201710297717.0A CN201710297717A CN107039384A CN 107039384 A CN107039384 A CN 107039384A CN 201710297717 A CN201710297717 A CN 201710297717A CN 107039384 A CN107039384 A CN 107039384A
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CN
China
Prior art keywords
weld part
connecting plate
smd element
electrode
weld
Prior art date
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Granted
Application number
CN201710297717.0A
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English (en)
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CN107039384B (zh
Inventor
沈朝阳
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SHENZHEN JINYANG ELECTRONIC CO Ltd
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SHENZHEN JINYANG ELECTRONIC CO Ltd
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Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=59538759&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN107039384(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by SHENZHEN JINYANG ELECTRONIC CO Ltd filed Critical SHENZHEN JINYANG ELECTRONIC CO Ltd
Priority to CN201710297717.0A priority Critical patent/CN107039384B/zh
Publication of CN107039384A publication Critical patent/CN107039384A/zh
Priority to PCT/CN2017/118998 priority patent/WO2018196425A1/zh
Priority to EP17906992.7A priority patent/EP3644357A4/en
Priority to US16/666,291 priority patent/US20200066672A1/en
Application granted granted Critical
Publication of CN107039384B publication Critical patent/CN107039384B/zh
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    • H01L23/49Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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Abstract

本发明公开了一种贴片式元件,该贴片式元件包括片式元件和支架,所述支架包括第一焊接部、第二焊接部以及连接所述第一焊接部和所述第二焊接部的连接部,所述第一焊接部用于与所述PCB板焊接;所述片式元件包括第一电极和第二电极,所述第一电极与所述第二焊接部焊接,所述第二电极用于与PCB板焊接。本发明旨在提供一种满足自动化生产需要的贴片式元件,在保证生产效率的同时降低成本。

Description

一种贴片式元件
技术领域
本发明涉及表面贴装技术领域,尤其涉及一种贴片式元件。
背景技术
已有的贴片型元件一般有着相当标准的外形尺寸,在贴片生产中不存在任何难度。但对于某些功率型贴片元件由于种种原因,价格一直高高在上。另一方面,具有相同性能的常规引线式元件价格便宜,但在某些必用的场合,用户不得不花费大量的人工手工焊接,影响效率、影响美观、影响一致性。因此,如何利用常规片式元件开发出一款满足自动化生产需要的贴片式元件,已成为本领域技术人员亟待解决的技术问题之一。
发明内容
为了克服现有技术的不足,本发明的目的之一在于提供一中满足自动化生产需要的贴片式元件,在提升生产效率的同时降低成本。
本发明的目的之一采用如下技术方案实现:
一种贴片式元件,包括片式元件和支架,所述支架包括第一焊接部、第二焊接部以及连接所述第一焊接部和所述第二焊接部的连接部,所述第一焊接部用于与所述PCB板焊接;所述片式元件包括第一电极和第二电极,所述第一电极与所述第二焊接部焊接,所述第二电极用于与PCB板焊接。
进一步地,所述第一焊接部和所述第二焊接部分设在所述连接部的两侧,且所述第一焊接部到所述第二焊接部的垂直距离与所述第一电极到所述第二电极的距离相适配。
进一步地,所述连接部包括第一连接板和与所述第一连接板连接的第二连接板,所述第一连接板与所述第一焊接部连接,所述第二连接板与所述第二焊接部连接。
进一步地,所述第一连接板与所述第一焊接部的夹角为90°-135°。
进一步地,所述第一连接板与所述第一焊接部的夹角为90°。
进一步地,所述第二连接板与所述第二焊接部的夹角为90°-135°。
进一步地,所述连接部还包括第三连接板,所述第一连接板通过所述第三连接板与所述第二连接板连接。
进一步地,所述第三连接板和所述第一焊接部分别设置于所述第一连接板的两侧。
进一步地,所述第三连接板到所述第一焊接部的垂直距离大于所述第二焊接部到所述第一焊接部的垂直距离。
进一步地,所述第二焊接部的形状为圆形或多边形。
相比现有技术,本发明的有益效果在于:
本发明实施例提供的贴片式元件,由于片式元件的第一电极与支架的所述第二焊接部焊接,在贴片式元件与PCB板焊接时,将支架的第一焊接部和片式元件的第二电极分别与PCB板焊接,因而片式元件与支架焊接后形成的贴片式元件能够利用传统的贴片式元件焊接装置或方法进行焊接;另一方面,由于片式元件与支架的原材料成本低,因而与传统的贴片式元件相比,本发明实施例提供的贴片式元件不仅能够满足自动化生产需求,还能够大大降低贴片式元件的成本,提高了市场竞争力。
附图说明
图1为本发明一实施例提供的贴片式元件的示意图;
图2是图1中贴片式元件的支架示意图。
图中:1、片式元件;11、第一电极;12、第二电极;2、支架;21、第一焊接部;22、第二焊接部;23、连接部;231、第一连接板;232、第二连接板;233、第三连接板;3、PCB板。
具体实施方式
下面,结合附图以及具体实施方式,对本发明做进一步描述,需要说明的是,在不相冲突的前提下,以下描述的各实施例之间或各技术特征之间可以任意组合形成新的实施例。
如图1-图2所示,本发明实施例提供的贴片式元件,包括片式元件1和支架2,所述支架2包括第一焊接部21、第二焊接部22以及连接所述第一焊接部21和所述第二焊接部22的连接部23,所述第一焊接部21用于与所述PCB板3焊接;所述片式元件1包括第一电极11和第二电极12,所述第一电极11与所述第二焊接部22焊接,所述第二电极12用于与PCB板3焊接。
在本发明实施例中,片式元件1为芯片。
上述技术方案提供的贴片式元件,由于片式元件1的第一电极11与支架2的所述第二焊接部22焊接,在贴片式元件与PCB板3焊接时,支架2的第一焊接部21和片式元件的第二电极12分别与PCB板3焊接,因而片式元件1与支架2焊接后形成的贴片式元件能够利用传统的贴片式元件焊接装置或方法进行焊接;另一方面,由于片式元件1与支架2的原材料成本低,因而与传统的贴片式元件相比,本发明实施例提供的贴片式元件不仅能够满足自动化生产需求,还能够大大降低贴片式元件的成本,提高了市场竞争力。
进一步地,所述第一焊接部21和所述第二焊接部22分设在所述连接部23的两侧,且所述第一焊接部21到所述第二焊接部22的垂直距离与所述第一电极11到所述第二电极12的距离相适配,在贴片式元件与PCB板3焊接时,这种结构简单合理,并能够保证第一焊接部21与第二电极12处于同一水平面,从而能够利用传统的贴片式元件焊接装置或方法进行焊接,进而满足自动化生产需求。
进一步地,所述连接部23包括第一连接板231和与所述第一连接板231连接的第二连接板232,所述第一连接板231与所述第一焊接部21连接,所述第二连接板232与所述第二焊接部22连接。
进一步地,所述第一连接板231与所述第一焊接部21的夹角为α,α的角度范围为90°-135°。在本实施例中,优选的,所述第一连接板与所述第一焊接部的夹角α为90°,如此既美观又能节省原材料,降低贴片式元件的成本。
进一步地,所述第二连接板232与所述第二焊接部22的夹角为β,β的角度范围为90°-135°,这种结构既美观又能节省原材料,进一步降低贴片式元件的成本。
进一步地,所述连接部23还包括第三连接板233,所述第一连接板231通过所述第三连接板233与所述第二连接板232连接。进一步地,所述第三连接板233和所述第一焊接部21分别设置于所述第一连接板231的两侧。
进一步地,所述第三连接板233与所述第一连接板231的夹角为90°,如此能够节省原材料,进而降低贴片式元件的成本。可以理解的,所述第三连接板233与所述第二连接板232的夹角为90°-135°。
进一步地,所述第三连接板233到所述第一焊接部21的垂直距离大于所述第二焊接部22到所述第一焊接部21的垂直距离,以节省原材料,降低贴片式元件的原材料成本。
进一步地,第二焊接部22的形状为圆形或多边形,第二焊接部22的尺寸可根据芯片尺寸大小而变化,以满足不同形状和规格的芯片。
综上,本发明实施例提供的贴片式元件,由于片式元件1的第一电极11与支架2的所述第二焊接部22焊接,在贴片式元件与PCB板3焊接时,支架2的第一焊接部21和片式元件的第二电极12分别与PCB板3焊接,因而片式元件1与支架2焊接后形成的贴片式元件能够利用传统的贴片式元件焊接装置或方法进行焊接;另一方面,由于片式元件1与支架2的原材料成本低,因而与传统的贴片式元件相比,本发明实施例提供的贴片式元件不仅能够满足自动化生产需求,还能够大大降低贴片式元件的成本,提高了市场竞争力。
上述实施方式仅为本发明的优选实施方式,不能以此来限定本发明保护的范围,本领域的技术人员在本发明的基础上所做的任何非实质性的变化及替换均属于本发明所要求保护的范围。

Claims (10)

1.一种贴片式元件,其特征在于,包括片式元件和支架,所述支架包括第一焊接部、第二焊接部以及连接所述第一焊接部和所述第二焊接部的连接部,所述第一焊接部用于与所述PCB板焊接;所述片式元件包括第一电极和第二电极,所述第一电极与所述第二焊接部焊接,所述第二电极用于与PCB板焊接。
2.如权利要求1所述的贴片式元件,其特征在于,所述第一焊接部和所述第二焊接部分设在所述连接部的两侧,且所述第一焊接部到所述第二焊接部的垂直距离与所述第一电极到所述第二电极的距离相适配。
3.如权利要求1所述的贴片式元件,其特征在于,所述连接部包括第一连接板和与所述第一连接板连接的第二连接板,所述第一连接板与所述第一焊接部连接,所述第二连接板与所述第二焊接部连接。
4.如权利要求3所述的贴片式元件,其特征在于,所述第一连接板与所述第一焊接部的夹角为90°-135°。
5.如权利要求4所述的贴片式元件,其特征在于,所述第一连接板与所述第一焊接部的夹角为90°。
6.如权利要求3所述的贴片式元件,其特征在于,所述第二连接板与所述第二焊接部的夹角为90°-135°。
7.如权利要求3所述的贴片式元件,其特征在于,所述连接部还包括第三连接板,所述第一连接板通过所述第三连接板与所述第二连接板连接。
8.如权利要求7所述的贴片式元件,其特征在于,所述第三连接板和所述第一焊接部分别设置于所述第一连接板的两侧。
9.如权利要求7所述的贴片式元件,其特征在于,所述第三连接板到所述第一焊接部的垂直距离大于所述第二焊接部到所述第一焊接部的垂直距离。
10.如权利要求3所述的贴片式元件,其特征在于,所述第二焊接部的形状为圆形或多边形。
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