CN107035667B - 包括多边形压电薄膜传感器的泵 - Google Patents

包括多边形压电薄膜传感器的泵 Download PDF

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Publication number
CN107035667B
CN107035667B CN201710064243.5A CN201710064243A CN107035667B CN 107035667 B CN107035667 B CN 107035667B CN 201710064243 A CN201710064243 A CN 201710064243A CN 107035667 B CN107035667 B CN 107035667B
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China
Prior art keywords
pump
piezoelectric element
membrane
piezoelectric
pump body
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CN201710064243.5A
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English (en)
Chinese (zh)
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CN107035667A (zh
Inventor
马丁·里希特
约瑟·库格尔
克劳斯·海因里希
瓦尔特劳德·希尔
马丁·瓦克勒
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Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
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Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
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Publication of CN107035667A publication Critical patent/CN107035667A/zh
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00—Machines, pumps, or pumping installations having flexible working members
    • F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
    • F04B43/04—Pumps having electric drive
    • F04B43/043—Micropumps
    • F04B43/046—Micropumps with piezoelectric drive
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B45/00—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids
    • F04B45/04—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
    • F04B45/047—Pumps having electric drive
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
    • F04B53/16—Casings; Cylinders; Cylinder liners or heads; Fluid connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/0005—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing non-specific motion; Details common to machines covered by H02N2/02 - H02N2/16
    • H02N2/005—Mechanical details, e.g. housings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/071—Mounting of piezoelectric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type
    • H10N30/2048—Membrane type having non-planar shape

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Reciprocating Pumps (AREA)
CN201710064243.5A 2016-02-04 2017-02-04 包括多边形压电薄膜传感器的泵 Active CN107035667B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016201718.7A DE102016201718B4 (de) 2016-02-04 2016-02-04 Pumpe mit polygonförmigem Piezo-Membranwandler
DE102016201718.7 2016-02-04

Publications (2)

Publication Number Publication Date
CN107035667A CN107035667A (zh) 2017-08-11
CN107035667B true CN107035667B (zh) 2021-08-03

Family

ID=59382470

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710064243.5A Active CN107035667B (zh) 2016-02-04 2017-02-04 包括多边形压电薄膜传感器的泵

Country Status (4)

Country Link
US (1) US11131299B2 (https=)
JP (2) JP6797703B2 (https=)
CN (1) CN107035667B (https=)
DE (1) DE102016201718B4 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10231364B2 (en) * 2016-10-24 2019-03-12 Toyota Motor Engineering & Manufacturing North America, Inc. Fluidly cooled power electronics assemblies having a thermo-electric generator
DE102018207858B4 (de) 2018-05-18 2021-06-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Haltevorrichtung zum Herstellen einer Mikropumpe mit mechanisch vorgespanntem Membranaktor
JP7200535B2 (ja) * 2018-08-17 2023-01-10 セイコーエプソン株式会社 構造体、ダイヤフラム式圧縮機、冷却機、プロジェクター及び構造体の製造方法
JP7072492B2 (ja) * 2018-11-22 2022-05-20 京セラ株式会社 アクチュエータ及び触感呈示装置
CN109985796A (zh) * 2019-03-25 2019-07-09 中国船舶重工集团公司第七一五研究所 一种多边形阵元压电复合材料换能器制备方法
DE102019211941B3 (de) * 2019-08-08 2020-10-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikrostrukturierte fluidflussregelvorrichtung
WO2021108421A1 (en) 2019-11-25 2021-06-03 Aita Bio Inc. Micropump and method of fabricating the same
DE102020209594B3 (de) 2020-07-30 2021-12-30 Festo Se & Co. Kg Fluidgerät
DE102020209593B4 (de) * 2020-07-30 2022-02-17 Festo Se & Co. Kg Fluidgerät
TWI806068B (zh) * 2021-06-11 2023-06-21 研能科技股份有限公司 微機電泵浦
EP4466460A4 (en) * 2022-01-19 2025-09-03 Aita Bio Inc MULTI-CHAMBER MEMS MICROPUMP FOR AN INSULIN DELIVERY DEVICE
CN114640269B (zh) * 2022-04-12 2024-04-30 合肥工业大学 一种基于菱形环和对称同相放大杆的二级驱动压电堆栈泵
US20250109742A1 (en) * 2023-09-28 2025-04-03 Boston Scientific Scimed, Inc. Surface enhancement of a bonding surface in a piezo electric pump/valve
US20250177182A1 (en) * 2023-12-04 2025-06-05 Boston Scientific Scimed, Inc. Formation of a chamber for a fluidic device

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FR2557732B1 (fr) * 1983-12-28 1986-04-11 Lefevre Rene Procede de realisation de dispositifs piezoelectriques miniatures utilisant un usinage par laser et dispositifs obtenus par ce procede
JPH05272457A (ja) * 1992-01-30 1993-10-19 Terumo Corp マイクロポンプおよびその製造方法
IL106803A (en) * 1993-08-25 1998-02-08 Scitex Corp Ltd Printable inkjet head
JP3320596B2 (ja) 1995-09-27 2002-09-03 日本碍子株式会社 圧電／電歪膜型素子及びその製造方法
DE19834461C2 (de) * 1998-07-30 2000-09-28 Siemens Ag Vielschicht-Piezoaktor
US6334761B1 (en) * 2000-03-02 2002-01-01 California Institute Of Technology Check-valved silicon diaphragm pump and method of fabricating the same
JP3629405B2 (ja) * 2000-05-16 2005-03-16 コニカミノルタホールディングス株式会社 マイクロポンプ
EP1435664A1 (en) * 2002-01-21 2004-07-07 Matsushita Electric Industrial Co., Ltd. Semiconductor device
DE10238600A1 (de) 2002-08-22 2004-03-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Peristaltische Mikropumpe
CA2654688C (en) * 2006-12-09 2011-07-26 Murata Manufacturing Co., Ltd. Piezoelectric pump
US8821134B2 (en) * 2009-06-03 2014-09-02 The Technology Partnership Plc Fluid disc pump
EP2542809A1 (en) * 2010-03-05 2013-01-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Valve, layer structure comprising a first and a second valve, micropump and method of producing a valve
CN102884352B (zh) * 2010-03-05 2014-06-18 弗兰霍菲尔运输应用研究公司 弯曲换能器、微型泵和微型阀的制造方法以及微型泵和微型阀
JP2013527751A (ja) * 2010-03-15 2013-07-04 ザ ジョンズ ホプキンズ ユニヴァーシティー 物質の非毒性を決定する方法
CN101846653B (zh) * 2010-04-30 2011-09-14 湖北大学 一种多边形电极的压电薄膜体声波传感器

Also Published As

Publication number Publication date
US20170226994A1 (en) 2017-08-10
JP2019132278A (ja) 2019-08-08
JP6797703B2 (ja) 2020-12-09
DE102016201718B4 (de) 2022-02-17
JP2017141824A (ja) 2017-08-17
CN107035667A (zh) 2017-08-11
US11131299B2 (en) 2021-09-28
DE102016201718A1 (de) 2017-08-10

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