CN107004645A - 电子设备 - Google Patents

电子设备 Download PDF

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CN107004645A
CN107004645A CN201580063717.3A CN201580063717A CN107004645A CN 107004645 A CN107004645 A CN 107004645A CN 201580063717 A CN201580063717 A CN 201580063717A CN 107004645 A CN107004645 A CN 107004645A
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conductive layer
component
metallic plate
electronic equipment
power component
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CN107004645B (zh
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森昌吾
加藤直毅
汤口洋史
岩田佳孝
川边雅彦
音部优里
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Toyota Industries Corp
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Toyoda Automatic Loom Works Ltd
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Abstract

电子设备具有散热部件、热结合于散热部件的功率元件、以及电接合着功率元件的第1导电层。另外，电子设备具有控制功率元件的开关动作的控制元件、电接合着控制元件的第2导电层、以及配置于第1导电层和第2导电层之间并埋入有功率元件的树脂层。第1导电层、树脂层和第2导电层相对于散热部件由近到远地按照该顺序层叠。

Description

电子设备
技术领域
本发明涉及电子设备。
背景技术
一般来说，车辆上搭载着专利文献1所公开那样的变换器(inverter)装置。变换器装置是将直流电压变换成交流电压的电子设备，具有安装了功率元件的第1金属板(第1导电层)、以及安装了控制元件的第2金属板(第2导电层)。控制元件控制功率元件的开关动作。
在先技术文献
专利文献
专利文献1:日本特开2010－73767号公报
发明内容
发明要解决的课题
功率元件与控制元件相比，发热量大，所以，希望高效率地冷却功率元件。另外，在这样的电子设备中，例如在第1金属板和第2金属板并列配置于一个平面上的情况下，电子设备的平面尺寸变大，从而有时存在向车辆搭载的搭载空间的制约、难以将电子设备搭载于车辆上。
本发明的目的在于，提供一种电子设备，该电子设备既能高效率地冷却功率元件又能减小平面尺寸。
用于解决课题的手段
解决上述课题的电子设备具有：散热部件；热结合于所述散热部件的功率元件；电接合着所述功率元件的第1导电层；控制所述功率元件的开关动作的控制元件；电接合着所述控制元件的第2导电层；以及树脂层，该树脂层配置于所述第1导电层和所述第2导电层之间，并埋入有所述功率元件；所述第1导电层、所述树脂层以及所述第2导电层相对于所述散热部件由近到远地按照该顺序层叠。
附图说明
图1是一实施方式中的电子设备的剖视图。
具体实施方式
以下，参照图1对电子设备10的一实施方式进行说明。本实施方式的电子设备10例如是车载用的变换器装置。
如图1所示，电子设备10具有：散热部件20、功率元件11a、作为第1导电层的第1金属板11、两个控制元件12a、12b、以及作为第2导电层的第2金属板12。在第1金属板11电接合有功率元件11a，在第2金属板12电接合有控制元件12a、12b。功率元件11a是金属氧化膜半导体场效应晶体管(MOSFET)，以裸芯片被安装于第1金属板11。各控制元件12a、12b例如是片式电阻器、电容器等。散热部件20例如是具有冷却水在内部流动的冷却水流路的铝制的壳体。第1金属板11和第2金属板12是平板状的铜板。第1金属板11的厚度H1比第2金属板12的厚度H2厚，在第1金属板11流动比在第2金属板12流动的电流大的电流。
电子设备10具有配置于第1金属板11和第2金属板12之间并埋入有功率元件11a的树脂层13。树脂层13由包括玻璃纤维等热传导率(热导率)良好的填料在内的环氧树脂构成。第1金属板11、树脂层13以及第2金属板12相对于散热部件20按照该顺序由近到远地层叠。由此，第1金属板11比第2金属板12更靠近散热部件20地配置。功率元件11a在第1金属板11、树脂层13以及第2金属板12层叠的方向(以下称为“层叠方向”。)上，与一方的控制元件12a部分地重叠。功率元件11a以埋入于树脂层13内的方式配置于第1金属板11和树脂层13之间。
在散热部件20和第1金属板11之间，介有高热传导绝缘层14。高热传导绝缘层14由包括玻璃纤维等热传导率良好的填料的环氧树脂构成。被混入到形成高热传导绝缘层14的环氧树脂中的填料的量比被混入到形成树脂层13的环氧树脂的填料的量多。由此，高热传导绝缘层14的热传导率比树脂层13的高。
功率元件11a利用板状的两个导电部件15而与第2金属板12电连接。平板状的各导电部件15以通过树脂层13的方式在相对于功率元件11a中的朝向第2金属板12的平面111a垂直的方向延伸。由此，各导电部件15被配置成其厚度方向与沿着功率元件11a的平面111a的方向一致。各导电部件15形成了在功率元件11a和控制元件12a、12b之间流动的电流的路径。在各控制元件12a、12b和功率元件11a之间，产生经由第2金属板12和各导电部件15的电流流动，从而进行功率元件11a的开关动作。由此，控制元件12a、12b控制功率元件11a的开关动作。
电子设备10具有第3金属板16，该第3金属板16具有发热量比控制元件12a、12b小的发热元件16a。第3金属板16是平板状的铜板。第3金属板16隔着第2金属板12配置在第1金属板11的相反侧。在第2金属板12和第3金属板16之间介有绝缘层17。也就是说，第3金属板16层叠于绝缘层17上。绝缘层17由包括玻璃纤维等热传导率良好的填料的环氧树脂构成。树脂层13的热传导率与绝缘层17的热传导率相同。控制元件12a、12b以埋入于绝缘层17内的方式配置于第2金属板12和绝缘层17之间。
在电子设备10中，形成有以贯通第3金属板16、绝缘层17、第2金属板12和树脂层13的方式在层叠方向延伸的贯通孔18。在贯通孔18内，收容着被安装于第1金属板11的感应设备19(例如电抗器)。感应设备19具有电接合于第1金属板11的线圈19a(在图1中用双点划线表示)、以及热接合于第1金属板11的芯19b(在图1中用双点划线表示)。感应设备19不超过第3金属板16的上面(第3金属板16中的与绝缘层17相反侧的面)地延伸。
以下，对本实施方式的作用进行说明。
功率元件11a的发热量比控制元件12a、12b的大。第1金属板11比第2金属板12更靠近散热部件20地配置，所以，与控制元件12a、12b发出的热相比，功率元件11a发出的热更优先地由散热部件20来散热。另外，高热传导绝缘层14的热传导率比树脂层13的高，所以，与树脂层13相比，功率元件11a发出的热更容易被传递到高热传导绝缘层14。由此，功率元件11a发出的热经由第1金属板11和高热传导绝缘层14被传递到散热部件20，由散热部件20来散热。而且，感应设备19的线圈19a和芯19b发出的热也经由第1金属板11和高热传导绝缘层14被传递到散热部件20，由散热部件20来散热。
在上述实施方式中能够获得如下的效果。
(1)第1金属板11、树脂层13和第2金属板12相对于散热部件20按照该顺序由近到远地层叠。据此，第1金属板11比第2金属板12更靠近散热部件20地配置，所以，与控制元件12a、12b发出的热相比，功率元件11a发出的热更优先地由散热部件20来散热。而且，第1金属板11、树脂层13和第2金属板12层叠，所以，与第1金属板11和第2金属板12并列配置于一个平面上的情况相比，既能高效率地冷却功率元件11a又能减小电子设备10的平面尺寸。
(2)在散热部件20和第1金属板11之间，介有热传导率比树脂层13高的高热传导绝缘层14。据此，即使是必须要将散热部件20与第1金属板11绝缘的结构，由于介于散热部件20和第1金属板11之间的高热传导绝缘层14的热传导率比树脂层13的高，所以，与树脂层13相比，功率元件11a发出的热更容易被传递到高热传导绝缘层14。由此，传递到高热传导绝缘层14的热被传递到散热部件20，由散热部件20来散热，所以，即使是必须要将散热部件20与第1金属板11绝缘的结构，也能够高效率地冷却功率元件11a。
(3)功率元件11a通过导电部件15而与第2金属板12连接。导电部件15以通过树脂层13的内部的方式在相对于功率元件11a中的朝向第2金属板12的平面垂直的方向延伸。据此，与功率元件11a和第2金属板12并列配置于一个平面上且将功率元件11a通过引线接合而与第2金属板12连接的情况相比，能够减小电子设备10的平面尺寸。
(4)导电部件15是板状。据此，与将功率元件11a通过通孔而与第2金属板12电连接的情况相比，能够使功率元件11a和第2金属板12的电连接状态良好。
(5)功率元件11a与控制元件12a在层叠方向上重叠。据此，与功率元件11a与控制元件12a在层叠方向上不重叠的情况相比，能够减小电子设备10的平面尺寸。
(6)在第1金属板11电接合着线圈19a且热接合着芯19b。据此，线圈19a和芯19b发出的热经由第1金属板11和高热传导绝缘层14而传递到散热部件20，由散热部件20来散热。由此，能够高效率地冷却发热量大的线圈19a和芯19b。
(7)功率元件11a是MOSFET，以裸芯片被安装于第1金属板11。据此，与将封装的功率元件安装于第1金属板11的情况相比，能够使电子设备10小型化。
(8)第1金属板11的厚度H1比第2金属板12的厚度H2厚。据此，与使第1金属板11平面大型化的情况相比，能够减小电子设备10的平面尺寸。
(9)感应设备19被收容于贯通孔18内且不超过第3金属板16的上面地延伸。据此，与感应设备19超过第3金属板16的上面地延伸的情况相比，能够使电子设备10小型化。
(10)功率元件11a发出的热经由第1金属板11和高热传导绝缘层14被传递到散热部件20，由散热部件20来散热，所以，能够抑制功率元件11a发出的热经由导电部件15和第2金属板12传递到控制元件12a、12b的问题。
此外，上述实施方式可以如下变更。
○在实施方式中，也可以是功率元件11a与控制元件12a在层叠方向上不重叠。
○在实施方式中，导电部件15的形状没有特别的限定，例如也可以是销状。
○在实施方式中，功率元件11a可以通过通孔与第2金属板12电连接。
○在实施方式中，在散热部件20和第1金属板11之间，也可以介有具有与树脂层13相同的热传导率的绝缘层。
○在实施方式中，高热传导绝缘层14也可以由陶瓷形成。
○在实施方式中，若是散热部件20可不与第1金属板11绝缘的结构，则也可以省略高热传导绝缘层14。第1金属板11也可以粘结于散热部件20。
○在实施方式中，功率元件11a、控制元件12a、12b的数量没有特别的限定。
○在实施方式中，第1金属板11的厚度H1也可以与第2金属板12的厚度H2相同。
○在实施方式中，也可以在高热传导绝缘层14和散热部件20之间介有金属板。
○在实施方式中，也可以在第3金属板16和绝缘层17之间介有新的金属板。在此情况下，需要追加将第3金属板16与新的金属板绝缘的绝缘层。
○在实施方式中，散热部件20可以是例如构成为为了冷却而在内部流动空气的壳体。
○在实施方式中，电子设备10可以是车载用以外的设备。另外，本发明不限于变换器装置，也可以适用于DCDC转换器(convertor)装置。
权利要求书(按照条约第19条的修改)
1.[2016年2月23日(23.02.2016)国际事务局受理]
(修改后)一种电子设备，具有：
散热部件；
热结合于所述散热部件的功率元件；
电接合着所述功率元件的第1导电层；
控制所述功率元件的开关动作的控制元件；
电接合着所述控制元件的第2导电层；以及
树脂层，该树脂层配置于所述第1导电层和所述第2导电层之间，并埋入有所述功率元件；
所述第1导电层、所述树脂层以及所述第2导电层相对于所述散热部件由近到远地按照该顺序层叠；
在所述散热部件和所述第1导电层之间，介有具有比所述树脂层高的热传导率的高热传导绝缘层。
2.(修改后)如权利要求1所述的电子设备，
还具有用于将所述功率元件连接于所述第2导电层的多个导电部件，所述导电部件以通过所述树脂层的方式在相对于所述功率元件中的朝向所述第2导电层的平面垂直的方向延伸。
3.(修改后)如权利要求2所述的电子设备，
所述导电部件是板状。
4.(修改后)如权利要求1至3中任一项所述的电子设备，
所述功率元件在所述第1导电层、所述树脂层和所述第2导电层层叠的方向即层叠方向上与所述控制元件重叠。
5.(修改后)一种电子设备，具有：
散热部件；
热结合于所述散热部件的功率元件；
电接合着所述功率元件的第1导电层；
控制所述功率元件的开关动作的控制元件；
电接合着所述控制元件的第2导电层；以及
树脂层，该树脂层配置于所述第1导电层和所述第2导电层之间，并埋入有所述功率元件；
所述第1导电层、所述树脂层以及所述第2导电层相对于所述散热部件由近到远地按照该顺序层叠；
在所述树脂层和所述第2导电层形成有贯通孔；
在所述贯通孔设有线圈和芯；
在所述第1导电层电接合着所述线圈且热接合着所述芯。
6.(修改后)如权利要求1至5中任一项所述的电子设备，
所述功率元件是MOSFET，以裸芯片被安装于所述第1导电层。
7.(修改后)如权利要求1至6中任一项所述的电子设备，
所述第1导电层的厚度比所述第2导电层的厚度厚。
8.(删除)

Claims (8)

1.一种电子设备，具有：
散热部件；
热结合于所述散热部件的功率元件；
电接合着所述功率元件的第1导电层；
控制所述功率元件的开关动作的控制元件；
电接合着所述控制元件的第2导电层；以及
树脂层，该树脂层配置于所述第1导电层和所述第2导电层之间，并埋入有所述功率元件；
所述第1导电层、所述树脂层以及所述第2导电层相对于所述散热部件由近到远地按照该顺序层叠。
2.如权利要求1所述的电子设备，
在所述散热部件和所述第1导电层之间，介有具有比所述树脂层高的热传导率的高热传导绝缘层。
3.如权利要求1或2所述的电子设备，
还具有用于将所述功率元件连接于所述第2导电层的多个导电部件，所述导电部件以通过所述树脂层的方式在相对于所述功率元件中的朝向所述第2导电层的平面垂直的方向延伸。
4.如权利要求3所述的电子设备，
所述导电部件是板状。
5.如权利要求1至4中任一项所述的电子设备，
所述功率元件在所述第1导电层、所述树脂层和所述第2导电层层叠的方向即层叠方向上与所述控制元件重叠。
6.如权利要求1至5中任一项所述的电子设备，
在所述树脂层和所述第2导电层形成有贯通孔；
在所述贯通孔设有线圈和芯；
在所述第1导电层电接合着所述线圈且热接合着所述芯。
7.如权利要求1至6中任一项所述的电子设备，
所述功率元件是MOSFET，以裸芯片被安装于所述第1导电层。
8.如权利要求1至7中任一项所述的电子设备，
所述第1导电层的厚度比所述第2导电层的厚度厚。
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