CN106756807B - A kind of evaporation source, evaporation coating device and its evaporation coating method - Google Patents

A kind of evaporation source, evaporation coating device and its evaporation coating method Download PDF

Info

Publication number
CN106756807B
CN106756807B CN201710058896.2A CN201710058896A CN106756807B CN 106756807 B CN106756807 B CN 106756807B CN 201710058896 A CN201710058896 A CN 201710058896A CN 106756807 B CN106756807 B CN 106756807B
Authority
CN
China
Prior art keywords
nozzle
control structure
evaporation
crucible cover
evaporation coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710058896.2A
Other languages
Chinese (zh)
Other versions
CN106756807A (en
Inventor
贾文斌
孙力
王欣欣
彭锐
万想
任军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Hefei Xinsheng Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201710058896.2A priority Critical patent/CN106756807B/en
Publication of CN106756807A publication Critical patent/CN106756807A/en
Application granted granted Critical
Publication of CN106756807B publication Critical patent/CN106756807B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The embodiment of the present invention provides a kind of evaporation source, evaporation coating device and its evaporation coating method, is related to field of display technology, the homogeneity of vapor deposition can be improved.The evaporation source, including crucible cover, nozzle are arranged on the crucible cover, and the nozzle exceeds the outer surface of the crucible cover;It further include the first control structure, first control structure drives the nozzle to rotate relative to the crucible cover at the uniform velocity original place.

Description

A kind of evaporation source, evaporation coating device and its evaporation coating method
Technical field
The present invention relates to field of display technology more particularly to a kind of evaporation sources, evaporation coating device and its evaporation coating method.
Background technique
Currently, OLED display device because have manufacture craft simple, Color tunable, it is low in energy consumption many advantages, such as, showing It is all the hot spot of exploitation with investment with lighting area.As the purposes of OLED display device is further extensive, manufacture craft also day Become mature.Currently, the common production method of OLED display device includes the various ways such as vapor deposition, inkjet printing, heat biography print.At this In a little production methods, vapor deposition mode is a kind of method of comparative maturity, and has applied to volume production.
But when being deposited using evaporation coating device in the prior art, organic molecule is in after spraying in evaporation source Between the few states in more peripheries it is poor so as to cause the brightness homogeneity of OLED display device so that the homogeneity of vapor deposition is poor.
Summary of the invention
The embodiment of the present invention provides a kind of evaporation source, evaporation coating device and its evaporation coating method, and the homogeneity of vapor deposition can be improved.
In order to achieve the above objectives, the embodiment of the present invention adopts the following technical scheme that
In a first aspect, providing a kind of evaporation source, including crucible cover, nozzle is arranged on the crucible cover, and the nozzle Outer surface beyond the crucible cover;It further include the first control structure, first control structure drives the nozzle with respect to institute Crucible cover at the uniform velocity original place is stated to rotate.
Preferably, first control structure and the nozzle correspond.
Preferably, the evaporation source further includes the second control structure and the dredging component for being fixed on the nozzle interior;Institute The second control structure is stated for driving the dredging component to move up and down in the nozzle.
It is further preferred that having hollow space between the inner and outer wall of the nozzle, the hollow space surrounds institute The circle setting of inner wall one is stated, second control structure is arranged in the hollow space.
It is further preferred that second control structure includes at least one electromagnet, the dredging component includes at least One spring.
It is further preferred that the spring be it is multiple, multiple springs are successively arranged from top to bottom in the nozzle.
Second aspect provides a kind of evaporation coating device, including evaporation source described in first aspect.
The third aspect provides a kind of evaporation coating method of evaporation coating device as described in second aspect, which comprises work as steaming When plating, the first control structure drives nozzle with the first preset rotation speed along the opposite crucible cover original place uniform rotation of first direction;Wherein, The first direction is clockwise or counterclockwise.
Preferably, the method also includes: when dredging nozzle, first control structure drives the nozzle with second Preset rotation speed is rotated relative to the crucible cover original place in a second direction;The second direction is opposite to the first direction;Wherein, Second preset rotation speed is more than or equal to first preset rotation speed.
Based on above-mentioned, it is preferred that the method also includes: when dredging nozzle, the second control structure drives dredging component It is moved up and down in the nozzle.
The embodiment of the present invention provides a kind of evaporation source, evaporation coating device and its evaporation coating method, by the way that is arranged in evaporation source One control structure, when evaporation process carries out, the first control structure drives nozzle to rotate relative to crucible cover at the uniform velocity original place, and such one Coming, the organic molecule wait spray is sprayed from nozzle again after being sufficiently mixed in nozzle, so that the organic molecule sprayed is more uniform, To improve the homogeneity of evaporation film-forming.On this basis, since nozzle rotates, make to spray from nozzle under the action of the centrifugal force The range of organic molecule out is wider, guarantees area's area so as to increase the film forming of evaporation source.
Further, since nozzle is in rotation status during entire vapor deposition, so that organic molecule can not be big in a certain position Amount accumulation, so as to reduce vapor deposition during spray nozzle clogging probability.Further, if nozzle blocks, the first control Structure is reversely rotated by control nozzle, and the organic material being blocked in nozzle is made to loosen under the action of reversed centrifugal force It falls, to achieve the effect that dredge nozzle.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with It obtains other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram one of evaporation source provided in an embodiment of the present invention;
Fig. 2 is a kind of structural schematic diagram two of evaporation source provided in an embodiment of the present invention;
Fig. 3 is the schematic diagram of the evaporation effect for the evaporation source that the prior art provides;
Fig. 4 is the schematic diagram of the evaporation effect of evaporation source provided in an embodiment of the present invention;
Fig. 5 is a kind of structural schematic diagram one of nozzle provided in an embodiment of the present invention;
Fig. 6 is a kind of structural schematic diagram two of nozzle provided in an embodiment of the present invention;
Fig. 7 is a kind of structural schematic diagram three of nozzle provided in an embodiment of the present invention;
Fig. 8 is a kind of structural schematic diagram four of nozzle provided in an embodiment of the present invention.
Appended drawing reference
10- crucible cover;20- nozzle;21- inner wall;22- outer wall;The first control structure of 30-;The second control structure of 40-;50- Dredge component.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
The embodiment of the present invention provides a kind of evaporation source, and as depicted in figs. 1 and 2, including crucible cover 10, nozzle 20 are arranged in earthenware On crucible lid 10, and nozzle 20 exceeds the outer surface of crucible cover 10;It further include the first control structure 30, the first control structure 30 drives Nozzle 20 is rotated relative to the at the uniform velocity original place of crucible cover 10.
It should be noted that first, the embodiment of the present invention does not limit specific location of the nozzle 20 on crucible cover 10 It is fixed, for example, as shown in Figure 1, nozzle 20 can be set if evaporation source provided in an embodiment of the present invention is point source formula evaporation source The center of crucible cover 10;As shown in Fig. 2, nozzle 20 can if evaporation source provided in an embodiment of the present invention is line source formula evaporation source Uniformly to arrange on crucible cover 10.
Wherein, the concrete shape of nozzle 20 is not defined, the shape of nozzle 20 is only to illustrate in Fig. 1 and Fig. 2.
In addition, it will be understood by those skilled in the art that the first control structure 30 drives nozzle 20 with respect to 10 original place of crucible cover When rotation, it should keep inside evaporation source in sealing state.
Second, nozzle 20 exceeds the outer surface of crucible cover 10, that is, as depicted in figs. 1 and 2, the upper surface of nozzle 20 is higher by The upper surface of crucible cover 10.
Wherein, it will be understood by those skilled in the art that material to be deposited will be sprayed from nozzle 20, crucible cover 10 and nozzle 20 Corresponding position should be provided with through-hole, and nozzle 20 is the hollow structure of both ends open, and nozzle 20 can be out of crucible cover 10 Surface side passes through through-hole and extends to the outer surface beyond crucible cover 10, also can be arranged directly on the outer surface of crucible cover 10, The hollow space of nozzle 20 is corresponding with through-hole, can also be other set-up modes certainly.
Third, the embodiment of the present invention do not limit the first control structure 30 specifically, such as can be, but not limited to be electricity Machine.
Wherein, the first control structure 30 and the on-link mode (OLM) of nozzle 20 are not defined, are able to drive the progress of nozzle 20 Rotation, such as can be, but not limited to be directly nozzle 20 to be driven to be rotated by the shaft of motor.
In addition, be not defined to the specific setting position of the first control structure 30, as depicted in figs. 1 and 2, can with but not It is limited to be arranged on crucible cover 10.
Furthermore the first control structure 30 and the corresponding relationship of nozzle 20 are not defined, with the first control structure in Fig. 2 30 are illustrated with the one-to-one correspondence of nozzle 20, it is of course also possible to be a control structure 30 while controlling multiple nozzles 20.
4th, the first control structure 30 drives nozzle 20 to rotate relative to the at the uniform velocity original place of crucible cover 10, the rotation of 20 original place of nozzle Refer to, under the visual angle of Fig. 1 and evaporation source shown in Fig. 2, nozzle 20 will not occur left and right with respect to crucible cover 10 and move in rotation Dynamic or back-and-forth motion, can only rotate clockwise or counterclockwise along the plane for being parallel to crucible cover 10.
20 uniform rotation of nozzle refers to that nozzle 20 is with the rotation of same speed when rotating in the same direction.That is, nozzle 20 During rotating clockwise, rotated with First Speed;During nozzle 20 rotates counterclockwise, rotated with second speed.First speed Degree can be equal with second speed, can also be unequal.The revolving speed of nozzle 20 is controlled by the first control structure 30.
5th, as shown in figure 3, nozzle 20 does not rotate when evaporation process carries out, the film forming being ejected on substrate guarantees area Area is substantially equal to the area of the hollow space of nozzle 20.As shown in figure 4, when evaporation process carries out, the control of the first control structure 30 Nozzle 20 processed rotates, then under the action of the centrifugal force, the film forming being ejected on substrate guarantees that the area in area can be significantly greater than nozzle 20 Hollow space area.
The embodiment of the present invention provides a kind of evaporation source, by the way that the first control structure 30 is arranged in evaporation source, when vapor deposition work When skill carries out, the first control structure 30 drives nozzle 20 to rotate relative to the at the uniform velocity original place of crucible cover 10, and so, to be sprayed has Machine molecule is sprayed from nozzle 20 again after being sufficiently mixed in nozzle 20, so that the organic molecule sprayed is more uniform, to improve The homogeneity of evaporation film-forming.On this basis, since nozzle 20 rotates, make under the action of the centrifugal force from the ejection of nozzle 20 The range of organic molecule is wider, guarantees area's area so as to increase the film forming of evaporation source.
Further, since nozzle 20 is in rotation status during entire vapor deposition, so that organic molecule can not be in a certain position A large amount of accumulation, so as to reduce the probability that nozzle 20 during vapor deposition blocks.Further, if nozzle 20 blocks, the One control structure 30 is reversely rotated by control nozzle 20, makes the organic material being blocked in nozzle 20 in the work of reversed centrifugal force It is fallen with lower loosening, to achieve the effect that dredge nozzle 20.
Preferably, as shown in Fig. 2, the first control structure 30 is corresponded with nozzle 20.
It is carried out clockwise or counterclockwise that is, first control structure 30 controls a nozzle 20.
The embodiment of the present invention is by corresponding the first control structure 30 and nozzle 20, it can be achieved that each nozzle 20 Individually control, when evaporation process carries out, all the first control structure 30 controls whole nozzles 20 and rotates, and in dredging nozzle rank Section, the starting of the first control structure 30 corresponding to the nozzle 20 for needing to dredge does not need first corresponding to the nozzle 20 of dredging Control structure 30 then without starting, so, can not only reduce power consumption, but also can extend nozzle 20 and the first control structure 30 Service life.
Preferably, as shown in figure 5, the evaporation source further includes the second control structure 40 and is fixed on thin inside nozzle 20 Logical component 50;Second control structure 40 is for driving dredging component 50 to move up and down in nozzle 20.
It should be noted that first, the embodiment of the present invention does not limit the specific setting position of the second control structure 40 It is fixed, such as can be set as shown in Figure 5 in the outside of nozzle 20, it also can be set on crucible cover 10, can also be arranged certainly In other positions.
In addition, the number of the second control structure 40 is not defined, it can be according to the structure and nozzle 20 of dredging component 50 Size reasonable setting.
Second, the specific structure to dredging component 50 and the fixed form in nozzle 20 do not carry out the embodiment of the present invention It limits, does not influence the ejection of material to be deposited as far as possible.For example, as shown in fig. 6, dredging component 50 is the hollow of both ends open Structure, cross-sectional area are slightly less than the cross-sectional area of nozzle 20, and the second control structure 40 controls dredging component 50 by magnetic force and exists It is moved up and down in nozzle 20.
Wherein, the material of dredging component 50 is not defined, meets high temperature resistant, good heat conductivity, is not easy deformation and not It reacts with material to be deposited.Such as the metals such as titanium, copper, aluminium can be selected in the material of dredging component 50, can also select The materials such as quartz, ceramics.
The embodiment of the present invention inside nozzle 20 by being arranged dredging component 50, when nozzle 20 blocks, the second control knot The control dredging component 50 of structure 40 moves up and down in nozzle 20, can further improve the dredging effect of nozzle 20.
It is further preferred that as shown in fig. 6, between the inner wall 21 and outer wall 22 of nozzle 20 have hollow space, it is described in Empty part is arranged around the circle setting of inner wall 21 1, the second control structure 40 in the hollow space.
Wherein, it will be understood by those skilled in the art that having hollow space between inner wall 21 and outer wall 22, and 21 He of inner wall Wall of the outer wall 22 as nozzle 20 necessarily has coupling part to connect inner wall 21 and outer wall 22 between the two.In order to avoid Material to be deposited enters hollow space and has an impact to the second control structure 40, and the embodiment of the present invention is preferred, inner wall 21 and outer Wall 22 is all connected in the top end and bottom end of nozzle 20.
In addition, the second control structure 40 can be fixed on as shown in Figure 7 on inner wall 21, can also be fixed on outer wall 22.
The embodiment of the present invention is surrounded by being arranged in the second control structure 40 by the inner wall 21 and outer wall 22 of nozzle 20 In hollow space, on the basis of realizing that controlling dredging component 50 moves up and down, it can both be controlled to avoid material to be deposited to second Structure 40 processed damages, and the ejection that can treat evaporation material to avoid the second control structure 40 impacts.
It is further preferred that as shown in Figure 7 and Figure 8, the second control structure 40 includes at least one electromagnet, component is dredged 50 include at least one spring.
I.e., it is possible to be that one spring of multiple magnet controls carries out elastic shrinkage, it is more to be also possible to multiple magnet controls A spring carries out elastic shrinkage, can also be that the multiple springs of a magnet control carry out elastic shrinkage certainly.
Wherein, electromagnet is that the device that magnetic force can be generated with galvanization can generate electromagnetic field, such as after electromagnet is powered Shown in Fig. 7, spring is shunk under the action of the magnetic force that electromagnet generates;After changing current direction or closing energization, electromagnetism Iron generates reversed magnetic force or magnetic force disappears, at this point, as shown in figure 8, spring stretches naturally.For the number of electromagnet and spring, Can rationally it be arranged as the case may be, it is ensured that spring is arranged within the scope of the magnetic force of electromagnet generation.
In addition, in order to reduce the influence that spring treats the ejection of evaporation material, spring should be as far as possible close to the inner wall of nozzle 20 21 settings.
Furthermore can when inner wall 21 is arranged tiny protrusion or groove or otherwise prevents electromagnet from powering off, Spring is fallen to inside crucible body.
The embodiment of the present invention dredges nozzle 20 by using the mode of magnet control spring, that is, saves dredging The installation space of component 50 and the second control structure 40, and reduce the influence for treating the ejection of evaporation material.
It is further preferred that the multiple springs of setting in nozzle 20, multiple springs in nozzle 20 from top to bottom successively Arrangement.
That is, multiple springs should successively arrange, do not overlapped between spring.
The embodiment of the present invention can both reduce the requirement of the magnetic force generated to electromagnet by setting multiple for spring, The dredging effect of nozzle 20 can be promoted again.
The embodiment of the present invention also provides a kind of evaporation coating device, including above-mentioned evaporation source.
Evaporation coating device provided in an embodiment of the present invention includes above-mentioned evaporation source, the beneficial effect of beneficial effect and above-mentioned evaporation source Fruit is identical, and details are not described herein again.
The embodiment of the present invention also provides a kind of evaporation coating method of above-mentioned evaporation coating device, which comprises
When vapor deposition, the first control structure 30 drives nozzle 20 with the first preset rotation speed along the opposite crucible cover 10 of first direction Original place uniform rotation;Wherein, the first direction is clockwise or counterclockwise.
Herein, the size of the first preset rotation speed is not defined, can be configured according to specific applicable cases.
The embodiment of the present invention provides a kind of evaporation coating method of evaporation coating device, when evaporation process carries out, passes through the first control Structure 30 drives nozzle 20 to rotate relative to the at the uniform velocity original place of crucible cover 10, and so, organic molecule to be sprayed is in nozzle 20 It is sprayed again from nozzle 20 after being sufficiently mixed, so that the organic molecule sprayed is more uniform, to improve the uniform of evaporation film-forming Property.On this basis, since nozzle 20 rotates, make the range of the organic molecule sprayed from nozzle 20 under the action of the centrifugal force more Extensively, guarantee area's area so as to increase the film forming of evaporation source.
Further, since nozzle 20 is in rotation status during entire vapor deposition, so that organic molecule can not be in a certain position A large amount of accumulation, so as to reduce the probability that nozzle 20 during vapor deposition blocks.
Preferably, the method also includes:
When dredging nozzle 20, the first control structure 30 drives nozzle 20 with the second preset rotation speed in a second direction with respect to earthenware Crucible lid 10 rotates;The second direction is opposite to the first direction.
Herein, the first control structure 30 drives nozzle 20 to rotate in a second direction relative to crucible cover 10 with the second preset rotation speed When, it can be uniform rotation, or speed change rotation.
In addition, second direction is opposite with first direction, that is, when first direction is clockwise direction, second direction is then inverse Clockwise;Correspondingly, second direction is then clockwise when first direction is counter clockwise direction.
Preferably, second preset rotation speed is more than or equal to first preset rotation speed.
The evaporation coating method of evaporation coating device provided in an embodiment of the present invention, when needing to dredge nozzle, the first control structure 30 It drives nozzle 20 to reversely rotate, the solid-state material falls back to be deposited being sticked on nozzle 20 can be made under the action of reversed centrifugal force, To achieve the purpose that dredge nozzle 20, on this basis, by making the second preset rotation speed be greater than the first preset rotation speed, Ke Yijin One step improves the dredging effect of nozzle 20, shortens the dredging time of nozzle 20.
In order to further increase the dredging effect to nozzle 20, the embodiment of the present invention is preferred, the method also includes:
When dredging nozzle 20, the second control structure 40 drives dredging component 50 to move up and down in nozzle 20.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.

Claims (6)

1. a kind of evaporation source, including crucible cover, nozzle is arranged on the crucible cover, and the nozzle is beyond the crucible cover Outer surface;It is characterized in that, further including the first control structure, first control structure drives the relatively described crucible of nozzle Lid at the uniform velocity original place rotates;
Wherein, first control structure and the nozzle correspond;
It further include the second control structure and the dredging component for being fixed on the nozzle interior;Second control structure is for driving The dredging component moves up and down in the nozzle;
There is hollow space, the hollow space is around the inner wall one circle setting, institute between the inner and outer wall of the nozzle The second control structure is stated to be arranged in the hollow space;
Second control structure includes at least one electromagnet, and the dredging component includes at least one spring.
2. evaporation source according to claim 1, which is characterized in that the spring be it is multiple, multiple springs are described It successively arranges from top to bottom in nozzle.
3. a kind of evaporation coating device, which is characterized in that including the described in any item evaporation sources of claim 1-2.
4. a kind of evaporation coating method of evaporation coating device as claimed in claim 3, which is characterized in that the described method includes:
When vapor deposition, the first control structure drives nozzle at the uniform velocity to turn along first direction with respect to crucible cover original place with the first preset rotation speed It is dynamic;
Wherein, the first direction is clockwise or counterclockwise.
5. the evaporation coating method of evaporation coating device according to claim 4, which is characterized in that the method also includes:
When dredging nozzle, first control structure drives the nozzle relatively described in a second direction with the second preset rotation speed The rotation of crucible cover original place;
The second direction is opposite to the first direction;
Wherein, second preset rotation speed is more than or equal to first preset rotation speed.
6. the evaporation coating method of evaporation coating device according to claim 4 or 5, which is characterized in that the method also includes:
When dredging nozzle, the second control structure drives dredging component to move up and down in the nozzle.
CN201710058896.2A 2017-01-23 2017-01-23 A kind of evaporation source, evaporation coating device and its evaporation coating method Active CN106756807B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710058896.2A CN106756807B (en) 2017-01-23 2017-01-23 A kind of evaporation source, evaporation coating device and its evaporation coating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710058896.2A CN106756807B (en) 2017-01-23 2017-01-23 A kind of evaporation source, evaporation coating device and its evaporation coating method

Publications (2)

Publication Number Publication Date
CN106756807A CN106756807A (en) 2017-05-31
CN106756807B true CN106756807B (en) 2019-07-05

Family

ID=58941819

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710058896.2A Active CN106756807B (en) 2017-01-23 2017-01-23 A kind of evaporation source, evaporation coating device and its evaporation coating method

Country Status (1)

Country Link
CN (1) CN106756807B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110195210B (en) * 2019-07-03 2022-02-22 京东方科技集团股份有限公司 Crucible, evaporation source and evaporation equipment
CN111424240B (en) * 2020-05-29 2022-06-03 云谷(固安)科技有限公司 Evaporation crucible
CN112680698B (en) * 2021-03-15 2021-06-29 苏州盟萤电子科技有限公司 Heating crucible for vacuum evaporation and vacuum evaporation device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103074578A (en) * 2011-10-26 2013-05-01 塔工程有限公司 Rotary deposition apparatus
CN103741096A (en) * 2013-12-27 2014-04-23 深圳市华星光电技术有限公司 Evaporation source assembly of organic light-emitting diode (OLED) evaporator
KR20150030970A (en) * 2013-09-13 2015-03-23 주식회사 선익시스템 Evaporation unit and Apparatus for deposition including the same
CN104947041A (en) * 2015-07-07 2015-09-30 深圳市华星光电技术有限公司 Evaporation crucible and OLED material evaporation device
CN105112856A (en) * 2015-04-30 2015-12-02 京东方科技集团股份有限公司 Evaporation source, evaporation device and evaporation method
CN205662589U (en) * 2016-05-16 2016-10-26 鄂尔多斯市源盛光电有限责任公司 Coating by vaporization source and coating by vaporization device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103074578A (en) * 2011-10-26 2013-05-01 塔工程有限公司 Rotary deposition apparatus
KR20150030970A (en) * 2013-09-13 2015-03-23 주식회사 선익시스템 Evaporation unit and Apparatus for deposition including the same
CN103741096A (en) * 2013-12-27 2014-04-23 深圳市华星光电技术有限公司 Evaporation source assembly of organic light-emitting diode (OLED) evaporator
CN105112856A (en) * 2015-04-30 2015-12-02 京东方科技集团股份有限公司 Evaporation source, evaporation device and evaporation method
CN104947041A (en) * 2015-07-07 2015-09-30 深圳市华星光电技术有限公司 Evaporation crucible and OLED material evaporation device
CN205662589U (en) * 2016-05-16 2016-10-26 鄂尔多斯市源盛光电有限责任公司 Coating by vaporization source and coating by vaporization device

Also Published As

Publication number Publication date
CN106756807A (en) 2017-05-31

Similar Documents

Publication Publication Date Title
CN106756807B (en) A kind of evaporation source, evaporation coating device and its evaporation coating method
CN104488067B (en) Apparatus for atomic layer deposition
CN101939466A (en) Plasma CVD apparatus, plasma CVD method, and agitating device
CN204563995U (en) A kind of glue mixing machine
CN104294220B (en) A kind of evaporation coating device and evaporation coating method
JP2009512788A (en) Cathodes and applications incorporating rotating targets in combination with fixed or moving magnet assemblies
CN109652953A (en) Clothes treatment device and its control method
CN102534529B (en) Magnetron sputtering source and magnetron sputtering equipment
CN109440391A (en) Clothes treatment device and its control method
CN102513301A (en) Megasonic cleaning device for wafer
CN101760720A (en) Shielding device with vacuum cavity body
CN101942641B (en) Evaporation source device of OLED (Organic Light Emitting Diode) evaporator
CN103061083A (en) Washing machine
CN104213080A (en) Evaporator source device and evaporation equipment
CN102560395A (en) Magnetic source, magnetic control sputtering device and magnetic control sputtering method
CN101956174A (en) Circulating evaporation device
CN208493635U (en) A kind of air-assisted type spraying machine
CN103510034B (en) The method of polynary electric arc spraying processing multiple layer metal based composites and device
CN215968276U (en) Electromagnetic shot blasting device
CN107151783A (en) It can keep mum and clean the magnetic control sputtering device and clean method of anode cap
CN106086783A (en) A kind of radical occlusion device and occlusion method thereof and deposition system
CN109965710A (en) Material cleaning device and cooking apparatus
JP7196338B2 (en) ELECTROPLATING APPARATUS AND PLATED PRODUCT MANUFACTURING METHOD
CN206255174U (en) A kind of jellyfish robot
CN108954450A (en) Cleaning systems and its control method and smoke machine for smoke machine

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant