CN104294220B - A kind of evaporation coating device and evaporation coating method - Google Patents
A kind of evaporation coating device and evaporation coating method Download PDFInfo
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- CN104294220B CN104294220B CN201410472730.1A CN201410472730A CN104294220B CN 104294220 B CN104294220 B CN 104294220B CN 201410472730 A CN201410472730 A CN 201410472730A CN 104294220 B CN104294220 B CN 104294220B
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- evaporation
- organic steam
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- evaporation coating
- evaporation source
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
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- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Embodiments of the invention provide a kind of evaporation coating device and evaporation coating method, relate to Display Technique field, the flow direction of organic steam can be controlled, thus improve the utilization rate of organic material, can also prevent organic material from bleeding around the chamber contamination caused simultaneously, thus reduce the wash number of baffle plate, cost-effective.Described evaporation coating device includes evaporation source, electricity applying system and electromagnetic control system；Described evaporation source is used for providing organic steam；Described electricity applying system is used for making described organic steam charged；Described electromagnetic control system is for controlling speed and the flow direction of charged described organic steam, and selects to enter presumptive area and to the described organic steam deposition of predetermined direction motion to substrate surface.Manufacture for evaporation coating device.
Description
Technical field
The present invention relates to Display Technique field, particularly relate to a kind of evaporation coating device and evaporation side
Method.
Background technology
Organic electroluminescence device (Organic Light Emitting Diode is called for short OLED)
There is fast response time, lucuriant in design, good temp characteristic, wide viewing angle, low-power consumption, be applicable to
The plurality of advantages such as flexibility panel, have become as the side of giving priority to of a new generation's flat display apparatus
One of to, receive increasingly extensive concern.
The basic structure of described OLED display device mainly includes anode and negative electrode, and two
Organic material functional layer between person；Wherein, described organic material functional layer is described OLED
The core of display device, its preparation method includes inkjet printing, spin coating and evaporation etc..It is subject to
It is limited to existing equipment and technique, makes described organic material by ink-jet printing process or spin-coating method
Material functional layer cannot be applied to volume production, and the method being capable of volume production at present only has vapour deposition method.
The structure of existing evaporation coating device is as it is shown in figure 1, mainly include evaporation source 10 and injection
System 20；Wherein, described evaporation source 10 is used for providing organic steam, described spraying system 20
For by described organic vapor jet to substrate 70 surface to form organic film.But, adopt
When making described organic material functional layer with vapour deposition method, organic steaming that described evaporation source 10 produces
The whole cavity of vapour disperse, the utilization rate that so will cause material is relatively low；Meanwhile, described
The free diffusing of organic steam also can cause the severe contamination to cavity, needs to clean frequently gear
Plate, thus will cause the increase of cost.
Summary of the invention
Embodiments of the invention provide a kind of evaporation coating device and evaporation coating method, the controlled machine that is shaped with to steam
The flow direction of vapour, thus improve the utilization rate of organic material, organic material can also be prevented everywhere simultaneously
The chamber contamination that diffusion causes, thus reduce the wash number of baffle plate, cost-effective.
For reaching above-mentioned purpose, embodiments of the invention adopt the following technical scheme that
On the one hand, it is provided that a kind of evaporation coating device, including evaporation source, electricity applying system and Electromagnetic Control
System；Described evaporation source is used for providing organic steam；Described electricity applying system is used for making described organic
Steam is charged；Described electromagnetic control system for control charged described organic steam speed and
Flow to, and select entrance presumptive area the described organic steam to predetermined direction motion to deposit extremely
Substrate surface.
Preferably, described electromagnetic control system includes the electric field region near described electricity applying system side
Territory and the field region away from described electricity applying system side；Electric field side is there is at described electric field region
To the electric field for first direction, so that described organic steam is accelerated；At described field region
There is the magnetic field that magnetic direction is second direction, so that described organic steam is inclined to third direction
Turn；Wherein, described first direction is the evaporation direction of described evaporation source or described evaporation direction
Opposite direction, described second direction is mutually perpendicular to described first direction, described third direction and institute
State first direction and described second direction is the most vertical.
It is further preferred that described electromagnetic control system also includes corresponding to described field region
Screen holes；Wherein, the described organic steam of described field region is entered to described screen holes place
Side deflection.
Optionally, described evaporation coating device also includes the recovery system being positioned at described screen holes both sides.
Optionally, described evaporation coating device also includes for driving and controlling described substrate and described sieve
Select the drive system of relative motion between hole.
Optionally, described evaporation source is linear evaporation source；Wherein, described linear evaporation source includes
Container for evaporation and linear heat source.
Further alternative, described evaporation coating device also includes the outlet being positioned at described linear evaporation source
Position or be positioned at the crystal resonator at the exit position of described screen holes.
Optionally, described evaporation coating device also include being positioned at described evaporation source and described electricity applying system it
Between spraying system；Wherein, described spraying system includes multiple identical nozzle.
On the other hand, it is provided that a kind of evaporation coating method based on above-mentioned evaporation coating device, described method
Including: heating evaporation source is to produce organic steam；Described organic steam band is made by electricity applying system
Electricity；Speed and the flow direction of charged described organic steam is controlled by electromagnetic control system, so that
Enter presumptive area and the described organic steam to predetermined direction motion deposits to substrate surface.
Preferably, the described speed being controlled charged described organic steam by electromagnetic control system
And the flow direction, so that entrance presumptive area the described organic steam to predetermined direction motion deposit extremely
Substrate surface specifically includes: charged described organic steam is first direction through direction of an electric field
Electric field is accelerated；Described organic steam after acceleration is the magnetic of second direction through magnetic direction
Field deflects to third direction；The described organic steam of screen holes is arrived from described sieve after deflection
Select hole to fly out, and deposit to substrate surface；Wherein, described first direction is described evaporation source
Evaporation direction or the opposite direction of described evaporation direction, described second direction and described first direction phase
The most vertical, described third direction is the most vertical with described first direction and described second direction.
Embodiments of the invention provide a kind of evaporation coating device and evaporation coating method, described evaporation coating device
Including evaporation source, electricity applying system and electromagnetic control system；Described evaporation source is used for providing organic steaming
Vapour；Described electricity applying system is used for making described organic steam charged；Described electromagnetic control system is used for
Control speed and the flow direction of charged described organic steam, and select to enter presumptive area and in advance
The described organic steam determining direction motion deposits to substrate surface.
Based on this, by arranging described electricity applying system and described electromagnetism control in described evaporation coating device
System processed, it is possible to achieve speed and the control of the flow direction to the organic steam that described evaporation source produces
System, so that the described organic steam with particular energy is deposited on described substrate surface, shape
Uniformly film layer.On this basis, have one due to speed and the flow direction of described organic steam
Fixed controllability, the most just can improve the utilization rate of described organic material, and can effectively prevent
That stops the organic material in described organic steam bleeds around the chamber contamination caused, thus reduces
The wash number of baffle plate, cost-effective.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below by right
In embodiment or description of the prior art, the required accompanying drawing used is briefly described, it should be apparent that,
Accompanying drawing in describing below is only some embodiments of the present invention, for those of ordinary skill in the art
From the point of view of, on the premise of not paying creative work, it is also possible to obtain the attached of other according to these accompanying drawings
Figure.
Fig. 1 is the schematic diagram of evaporation coating device of the prior art；
The schematic diagram of a kind of evaporation coating device that Fig. 2 provides for embodiments of the invention；
The structural representation of a kind of evaporation coating device that Fig. 3 provides for embodiments of the invention；
A kind of evaporation coating method flow chart that Fig. 4 provides for embodiments of the invention.
Reference:
10-evaporation source；20-spraying system；30-electricity applying system；40-electromagnetic control system；401-
Electric field region；402-field region；403-screen holes；50-recovery system；60-crystal resonator；
70-substrate.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is entered
Row clearly and completely describes, it is clear that described embodiment is only a part of embodiment of the present invention,
Rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not having
Have and make the every other embodiment obtained under creative work premise, broadly fall into present invention protection
Scope.
Embodiments of the invention provide a kind of evaporation coating device, as in figure 2 it is shown, include evaporation source
10, electricity applying system 30 and electromagnetic control system 40；Described evaporation source 10 is used for providing organic
Steam；Described electricity applying system 30 is used for making described organic steam charged；Described Electromagnetic Control system
System 40 is for controlling speed and the flow direction of charged described organic steam, and selects entrance predetermined
Region the described organic steam to predetermined direction motion deposit to substrate 70 surface.
It should be noted that first, the organic steam that described evaporation source 10 produces has specific
Speed and direction；Wherein, the evaporation direction of described organic steam points to described electricity applying system
30, the evaporation rate of described organic steam can be entered by the parts within described evaporation source 10
Row regulation, to be obtained in that the speed of uniformity is preferred.
Second, described electricity applying system 30 is used for making described organic steam charged, in order to pass through
Described electromagnetic control system 40 realizes the speed to described organic steam and the control of the flow direction；Its
In, described organic steam can be not specifically limited here with positively charged or electronegative, but needs
Ensure that the control mode type charged with described organic steam of described electromagnetic control system 40 is mutual
Adapt to.
3rd, described electromagnetic control system 40 selects enter presumptive area and transport to predetermined direction
The surface of dynamic described organic steam deposition extremely described substrate 70 is primarily to select have phase
The described organic steam of nearly particular energy is deposited on the surface of described substrate 70, the most described base
Plate 70 needs the region sprayed through described organic steam at the uniform velocity, thus ensures the equal of film forming
Even property and the stability of bond strength.
Embodiments of the invention provide a kind of evaporation coating device, including evaporation source 10, electricity applying system
30 and electromagnetic control system 40；Described evaporation source 10 is used for providing organic steam；Described power up
System 30 is used for making described organic steam charged；Described electromagnetic control system 40 is used for controlling band
The speed of the described organic steam of electricity and the flow direction, and select to enter presumptive area and to predetermined direction
The described organic steam of motion deposits to substrate 70 surface.
Based on this, by arranging described electricity applying system 30 and described electricity in described evaporation coating device
Magnetic control system 40, it is possible to achieve to described evaporation source 10 produce organic steam speed and
The control flowed to, so that the described organic steam with particular energy is deposited on described substrate
70 surfaces, form uniform film layer.On this basis, due to the speed of described organic steam
With the flow direction, there is certain controllability, the most just can improve the utilization rate of described organic material,
And can effectively prevent organic material in described organic steam bleed around the chamber caused
Pollute, thus reduce the wash number of baffle plate, cost-effective.
Based on above-mentioned, it is preferred that with reference to shown in Fig. 2, described electromagnetic control system 40 is permissible
Including the electric field region 401 near described electricity applying system 30 side with away from described electricity applying system
The field region 402 of 30 sides；There is direction of an electric field at described electric field region 401 is first party
To electric field so that described organic steam is accelerated；Magnetic is there is at described field region 402
Field direction is the magnetic field of second direction, so that described organic steam deflects to third direction.
Wherein, described first direction can be the evaporation direction of described evaporation source 10 or described
The opposite direction of evaporation direction, described second direction is mutually perpendicular to described first direction, and described
Three directions are the most vertical with described first direction and described second direction.
Concrete, on the one hand, described electric field region 401 can be by two electrodes being oppositely arranged
Produce, by applying different voltage respectively to said two electrode, just can produce by one
Electrode points to the electric field of another electrode；Wherein, the direction of an electric field formed can be according to described
Depending on the charged type of organic steam, such as when described organic steam positively charged, described electric field
Direction can be the evaporation direction of described evaporation source 10, when described organic steam is electronegative,
Described direction of an electric field can be the opposite direction of the evaporation direction of described evaporation source 10.On the other hand,
Described field region 402 can be produced by coil；On this basis, described organic steam is just
Can occur corresponding according to the direction in described magnetic field and the charged type of described organic steam
Deflection, its yawing moment is described third direction.
Here, the yawing moment of described organic steam can judge according to left hand rule；That is,
Magnetic induction line passes perpendicularly through the centre of the palm, and four point to the direction of motion or the motion of negative electrical charge of positive charge
The opposite direction in direction, the direction of thumb is electric charge deflection side under described magnetic fields
To.It follows that after described first direction and described second direction determine, the described 3rd
Direction determines the most therewith.
It should be noted that in the above-described embodiments, described electric field region 401 near described in add
Electricity system 30, described field region 402 is away from described electricity applying system 30, in the case,
Described organic steam can first be accelerated realizing deflection afterwards；But embodiments of the invention do not limit
In this, it can also be that described field region 402 is near described electricity applying system 30, described electricity
Field areas 401 is away from described electricity applying system 30, and in the case, described organic steam is permissible
It is accelerated after first realizing deflection.
On this basis, with reference to shown in Fig. 2, described electromagnetic control system 40 can also include
Screen holes 403 corresponding to described field region；Wherein, described field region 402 is entered
Described organic steam deflects to the side at described screen holes 403 place.
Provide below a specific embodiment moving line of described organic steam is said
Bright；As it is shown on figure 3, at described organic steam positively charged after described electricity applying system 30
In the case of, the direction of an electric field (the most described first direction) of described electric field region 401 is by cavity
Downside point on the upside of, the magnetic direction (the most described second direction) of described field region 402
On front side of such as by the rear side sensing of cavity, described screen holes 403 is positioned at described field region 402
The corresponding position on right side；Now, after described organic steam enters described electric field region 401,
Will be accelerated under the effect of electric field, subsequently into described field region 402, in magnetic field
Effect under deflect to the right side of cavity, finally fly out from described screen holes 403, thus heavy
Amass the surface at described substrate 70.At described organic steam after described electricity applying system 30
In the case of electronegative, thus it is possible to vary direction of an electric field (the most described first party of described electric field region
To) make on the downside of it points to by the upside of cavity, described screen holes 403 to be arranged on described simultaneously
Corresponding position on the left of field region, repeats no more here.
Further, described evaporation coating device can also include being positioned at described screen holes 403 both sides
Recovery system 50.
Owing to the speed of the described organic steam of described evaporation source 10 generation is incomplete same, because of
This described organic steam being powered up by described electricity applying system 30 through electric field acceleration it
After speed also differ, the described organic steam with different rates occurs after magnetic field
The angle of deflection is inevitable different therewith.On this basis, the position with described screen holes 403 is only had
Put correspondence and there is the described organic steam of particular energy can be ejected to described substrate 70
Surface, other described organic steam then can occur deflection in various degree, wherein deflection angle
Not enough described organic steam may adhere on the baffle plate of inside cavity, and deflection angle is excessive
Described organic steam may reenter electric field region.Based on this, owing to described organic steam is big
Focus mostly on can from the areas adjacent of described screen holes 403 ejection, its exist one close
Energy, the described organic steam thus failing to spray will be concentrated and fall into described screen holes 403 liang
The region of side；By described recovery system 50 is arranged on this region, just can be at utmost
The organic material reclaimed in described organic steam, it is possible to purify further and again with,
Thus improve the utilization rate of described organic material, cost-effective.
Further, described evaporation coating device could be included for driving and controlling described substrate
The drive system of the relative motion between 70 and described screen holes 403.
Here, movement velocity and the side of described substrate 70 can be controlled by described drive system
To, so that the region through described screen holes 403 correspondence that described substrate 70 is at the uniform velocity, thus
Uniform film layer is formed on the surface of described substrate 70.
On this basis, owing to only needing mobile described substrate 70 to control during whole evaporation
Relative motion between described substrate 70 and described screen holes 403, can realize described organic
The evaporation of material, therefore in the case of the given volume of described evaporation source 10, it is not necessary to arranges
The space identical with described substrate 70 area accommodates described substrate 70, such that it is able to significantly
Reduce taking up room of described evaporation coating device.Additionally, due to described substrate 70 is positioned at described sieve
Select at the exit position of hole 403 correspondence, rather than be set directly at the top of described evaporation source 10,
Therefore heat radiation can also be effectively reduced.
In order to improve evaporation efficiency and the utilization rate to described organic material, the enforcement of the present invention
In example, described evaporation source 10 preferably employs linear evaporation source；Wherein, described linear evaporation source
Container for evaporation and linear heat source can be included.
Here, so-called linear i.e. described container for evaporation provides the feelings of heat energy in described linear heat source
Produce linear organic steam under condition, thus realize the linear evaporation of described organic material.
Concrete, described container for evaporation can use the crucible that stainless steel material makes, within it
Portion can accommodate required organic material；Described linear heat source can be made up of some coils,
Utilize and be arranged on the AC power outside described container for evaporation to described coil applying preset frequency
Alternating voltage, thus control heating-up temperature exactly, it is ensured that described organic material thermally equivalent.
On this basis, described evaporation coating device can also include being positioned at going out of described evaporation source 10
Mouthful position or be positioned at the crystal resonator 60 at the exit position of described screen holes 403.
Wherein, described crystal resonator 60 is for stablizing the evaporation rate of described organic steam.
Optionally, described evaporation coating device can also include being positioned at described evaporation source 10 and described add
Spraying system 20 between electricity system 30；Wherein, described spraying system 20 can include many
Individual identical nozzle.
So, by arranging described spray between described evaporation source 10 and described electricity applying system 30
Penetrate system 20, formed organic steam can be made to power up described in the entrance in stable set
Device 30, and also can be by regulating the pressure of each described nozzle so that described organic steaming
The described electricity applying system of vapour entrance at the uniform velocity 30.
Embodiments of the invention also provide for a kind of evaporation coating method based on above-mentioned evaporation coating device, such as figure
Shown in 4, described method may include that
S1, heat described evaporation source 10 so that its produce organic steam.
Here the speed of described organic steam can be stablized by crystal-vibration-chip 60.
S2, make described organic steam charged by described electricity applying system 30.
Wherein, described organic steam can be with positively charged or electronegative.
S3, controlled the speed of charged described organic steam by described electromagnetic control system 40
And the flow direction, so that entrance presumptive area the described organic steam to predetermined direction motion deposit extremely
The surface of described substrate 70.
Concrete, charged described organic steam can be the electricity of first direction through direction of an electric field
Field is accelerated；Described organic steam after acceleration can be second direction through magnetic direction
Magnetic field deflects to third direction；Described organic steaming of described screen holes 403 is arrived after deflection
Vapour flies out from described screen holes 403, and deposits to described substrate 70 surface.
Wherein, described first direction is the evaporation direction of described evaporation source 10 or described evaporation side
To opposite direction, described second direction is mutually perpendicular to described first direction, described third direction
The most vertical with described first direction and described second direction.
Carry out it should be noted that described organic steam can first pass through electric field after powering up
Accelerate, rear by magnetic field realization deflection；Magnetic field can also be first passed through and realize deflection, rear by electricity
Field is accelerated, and is not specifically limited here.
By above-mentioned steps S1-S3, can realize based on described in embodiments of the invention offer
The evaporation coating method of evaporation coating device；Due to the speed and flowing to of described organic steam have certain can
Control property, the most just can effectively prevent the expansion everywhere of organic material in described organic steam
Dissipate, thus improve the utilization rate of described organic material, reduce described organic steam to evaporation simultaneously
The pollution of chamber, reduces the wash number of baffle plate, cost-effective；Further, in whole steaming
Only need mobile described substrate 70 to control described substrate 70 and described screen holes 403 during plating
Between relative motion, the evaporation of described organic material can be realized, so can significantly drop
Taking up room of low described evaporation coating device；On this basis, described evaporation source 10 is the most direct
In the face of described substrate 70, radiation so can also be effectively reduced.
The above, the only detailed description of the invention of the present invention, but protection scope of the present invention is also
Being not limited to this, any those familiar with the art is at the technology model that the invention discloses
In enclosing, change can be readily occurred in or replace, all should contain within protection scope of the present invention.
Therefore, protection scope of the present invention should be as the criterion with described scope of the claims.
Claims (8)
1. an evaporation coating device, it is characterised in that include evaporation source, electricity applying system and electromagnetism control
System processed；
Described evaporation source is used for providing organic steam；
Described electricity applying system is used for making described organic steam charged；
Described electromagnetic control system is used for controlling speed and the flow direction of charged described organic steam,
And select to enter presumptive area and to the described organic steam deposition of predetermined direction motion to substrate table
Face；
Described electromagnetic control system include near described electricity applying system side electric field region and away from
The field region of described electricity applying system side；
The electric field that direction of an electric field is first direction is there is at described electric field region, so that described organic
Steam is accelerated；
The magnetic field that magnetic direction is second direction is there is at described field region, so that described organic
Steam deflects to third direction；
Wherein, described first direction is the evaporation direction of described evaporation source or described evaporation direction
Opposite direction, described second direction is mutually perpendicular to described first direction, described third direction and institute
State first direction and described second direction is the most vertical.
Evaporation coating device the most according to claim 1, it is characterised in that described Electromagnetic Control
System also includes the screen holes corresponding to described field region；
Wherein, the described organic steam of described field region is entered to the one of described screen holes place
Lateral deviation turns.
Evaporation coating device the most according to claim 2, it is characterised in that described evaporation coating device
Also include the recovery system being positioned at described screen holes both sides.
Evaporation coating device the most according to claim 2, it is characterised in that described evaporation coating device
Also include the driving for the relative motion driven and control between described substrate and described screen holes
System.
Evaporation coating device the most according to claim 2, it is characterised in that described evaporation source is
Linear evaporation source；
Wherein, described linear evaporation source includes container for evaporation and linear heat source.
Evaporation coating device the most according to claim 5, it is characterised in that described evaporation coating device
Also include the exit position being positioned at the exit position of described evaporation source or being positioned at described screen holes
The crystal resonator at place.
Evaporation coating device the most according to claim 1, it is characterised in that described evaporation coating device
Also include the spraying system between described evaporation source and described electricity applying system；
Wherein, described spraying system includes multiple identical nozzle.
8. an evaporation coating method based on the evaporation coating device described in any one of claim 1-7, its
Being characterised by, described method includes:
Heating evaporation source is to produce organic steam；
Make described organic steam charged by electricity applying system；
Speed and the flow direction of charged described organic steam is controlled by electromagnetic control system, so that
Enter presumptive area and the described organic steam to predetermined direction motion deposits to substrate surface；
The described speed being controlled charged described organic steam by electromagnetic control system and the flow direction,
So that entering presumptive area and to the described organic steam deposition of predetermined direction motion to substrate surface
Specifically include:
Charged described organic steam is accelerated through the electric field that direction of an electric field is first direction；
Described organic steam after acceleration through magnetic field that magnetic direction is second direction to third party
To deflecting；
The described organic steam arriving screen holes after deflection flies out from described screen holes, and deposits extremely
Substrate surface；
Wherein, described first direction is the evaporation direction of described evaporation source or described evaporation direction
Opposite direction, described second direction is mutually perpendicular to described first direction, described third direction and institute
State first direction and described second direction is the most vertical.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410472730.1A CN104294220B (en) | 2014-09-16 | 2014-09-16 | A kind of evaporation coating device and evaporation coating method |
| PCT/CN2014/094061 WO2016041279A1 (en) | 2014-09-16 | 2014-12-17 | Vapour deposition device and vapour deposition method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410472730.1A CN104294220B (en) | 2014-09-16 | 2014-09-16 | A kind of evaporation coating device and evaporation coating method |
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| CN104294220A CN104294220A (en) | 2015-01-21 |
| CN104294220B true CN104294220B (en) | 2016-08-17 |
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| CN106148893B (en) * | 2016-08-11 | 2019-04-05 | 京东方科技集团股份有限公司 | A kind of evaporation coating device and evaporation coating method, substrate |
| CN108165932A (en) * | 2017-12-29 | 2018-06-15 | 深圳市华星光电技术有限公司 | Evaporation coating method and device |
| CN108365117A (en) * | 2018-01-31 | 2018-08-03 | 昆山国显光电有限公司 | Encapsulating structure and encapsulating method and structure preparation facilities |
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| CN110423986B (en) * | 2019-07-24 | 2024-04-16 | 福建华佳彩有限公司 | Evaporation source baffle |
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| CA2305938C (en) * | 2000-04-10 | 2007-07-03 | Vladimir I. Gorokhovsky | Filtered cathodic arc deposition method and apparatus |
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| CN1458811A (en) * | 2002-05-17 | 2003-11-26 | 株式会社半导体能源研究所 | Evaporating method, evaporating device and method for producing light-emitting device |
| CN1605652A (en) * | 2004-09-09 | 2005-04-13 | 复旦大学 | Vacuum thermal evaporation film-forming method using strong electric field |
| CN102808155A (en) * | 2012-08-01 | 2012-12-05 | 东莞宏威数码机械有限公司 | Electron bombardment type evaporation source system |
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| CN107338419A (en) * | 2017-07-31 | 2017-11-10 | 京东方科技集团股份有限公司 | A kind of evaporation rate monitoring device and evaporated device |
| CN107338419B (en) * | 2017-07-31 | 2019-07-16 | 京东方科技集团股份有限公司 | A kind of evaporation rate monitoring device and evaporated device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104294220A (en) | 2015-01-21 |
| WO2016041279A1 (en) | 2016-03-24 |
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