KR20110136950A - In-line deposition apparatus using multi-deposition type - Google Patents

Abstract

PURPOSE: An inline deposition device using a multi-deposition technique is provided to reduce a time required to deposition by continuously depositing different deposition materials emerging from a plurality of deposition sources on the surface of a substrate at a time interval. CONSTITUTION: An inline deposition device using a multi-deposition technique comprises a substrate transfer unit(100), a deposition chamber(200), a deposition source(300). A substrate(10) is loaded on the substrate transfer unit in the length direction of the substrate, and the substrate transfer unit transfers the substrate. The deposition chamber accepts the substrate transfer unit, and deposits the surface of the substrate transferred by the substrate transfer unit. The deposition source faces the surface of the substrate in the deposition chamber, at least two deposition sources are arranged at an interval in the length area of the substrate in the moving direction of the substrate.

Description

INLINE DEPOSITION DEVICE USING MULTI DEPOSITION METHOD {IN-LINE DEPOSITION APPARATUS USING MULTI-DEPOSITION TYPE}

The present invention relates to an inline deposition apparatus employing a multiple deposition method, and more particularly, to an inline deposition apparatus employing a multiple deposition method for sequentially depositing organic materials and electrodes on a plate surface of a substrate.

Recently, with the rapid development of information and communication procedures and the display industry, flat panel displays have been in the spotlight. Such flat panel display devices include liquid crystal displays, plasma display panels, and organic light emitting diodes.

Among the flat panel display devices, organic light emitting diodes are attracting attention as the next generation display devices because they have many advantages such as fast response speed and lower power consumption than liquid crystal display devices. The structure of the organic light emitting device is an organic material interposed between the anode (anode) and the cathode (cathode). Here, the organic light emitting device is manufactured by a deposition method of a cluster method or an in-ring method in which an anode, an organic material, and a cathode are sequentially stacked on a plate surface of a substrate.

Meanwhile, as shown in FIG. 1, the in-line deposition apparatus 1001 of the deposition apparatus includes a substrate transfer unit 1100 for transferring the substrate 1010 and a deposition material to deposit the deposition material on the plate surface of the substrate 1010. It includes a plurality of deposition sources 1200 for ejecting a plurality of deposition chambers 1300, each of which is individually accommodated.

In the process of manufacturing the organic light emitting device 1600 manufactured by the inline deposition apparatus 1001, as shown in FIG. 2A and FIG. 2B, the assembly of the substrate 1010 and the anode 1500 may include a plurality of deposition sources 1200. ) Passes through a plurality of deposition chambers 1300, each of which has a hole injection layer (HIL) / hole transfer layer (HOLE Transfer Layer) 1610 and an emission layer (EML) on its upper surface. 1650, an electron transfer layer (ETL) 1670, and a cathode 1700 are sequentially deposited. Of course, although omitted in FIG. 2B, an electron injection layer (EIL) may also be included.

However, the conventional inline deposition apparatus has a structure in which a plurality of deposition sources are accommodated in a 1: 1 correspondence with respect to a plurality of deposition chambers so that the above-described hole injection layers or cathodes are sequentially deposited on the plate surface of the substrate, As the size of the device increases, the time required for performing the deposition process increases.

Accordingly, an object of the present invention is to improve the number of deposition chambers in which the deposition process is performed on the plate surface of the substrate and the arrangement structure of the deposition source, thereby reducing the overall size and reducing the time required for the deposition process. It is to provide an inline deposition apparatus using a deposition method.

The objects of the present invention are not limited to the above-mentioned objects, and other objects which are not mentioned will be clearly understood by those skilled in the art from the following description.

According to the present invention, there is provided an inline deposition apparatus employing a multiple deposition method for depositing a substrate in accordance with the present invention, wherein the substrate is loaded in the longitudinal direction of the substrate plate surface and the substrate transfer unit for reciprocating the substrate, At least one deposition chamber for depositing the plate surface of the substrate to be received by the substrate transfer unit, the substrate transfer unit being opposed to the plate surface of the substrate inside the deposition chamber and within the length region of the substrate. In-line deposition using a multiple deposition method comprising: a deposition source for discharging each deposition material such that at least two deposition materials are disposed at regular intervals in the advancing direction and at least two deposition materials are simultaneously deposited in the deposition region of the substrate; Made by the device.

Here, preferably, different deposition materials may be formed on the plate surface of the substrate at a time difference with respect to the advancing direction of the substrate to form a continuous step at the same time.

The substrate transfer unit on which the substrate is mounted is reciprocally transferred in the horizontal direction in the gravity direction, and the deposition source ejects the deposition material in the direction opposite to the gravity direction toward the plate surface of the substrate.

On the other hand, the substrate transfer unit on which the substrate is loaded is reciprocally transferred along the side of the deposition chamber in the transverse direction with respect to the bottom surface of the deposition chamber, the deposition source is deposited in the horizontal direction of the gravity direction toward the plate surface of the substrate It is preferable to eject the substance.

The deposition source may include any one of a point source, a point array source, and a linear source.

The apparatus may further include a blocking unit disposed between the substrate and the plurality of deposition sources to block mixing of different deposition materials ejected from each of the deposition sources.

Here, the blocking unit may be disposed between the substrate transfer unit and the plurality of deposition sources in the deposition chamber in a plurality of deposition source intervals along a traveling direction of the substrate, and may be ejected from the plurality of deposition sources, respectively. It may include a first blocking portion for blocking the mixing of the deposition material.

The blocking unit may further include a second blocking unit disposed in a plurality of deposition source spacing regions in a horizontal direction of the arrangement direction of the first blocking unit to block mixing of different deposition materials respectively ejected from the deposition sources. can do.

The second blocking unit may include at least one of a blocking shield disposed in the plurality of deposition source interval regions and a blocking nozzle disposed in the plurality of deposition source interval regions to eject gas such that mixing of different deposition materials is blocked. Can be.

Specific details of other embodiments are included in the detailed description and drawings.

Therefore, according to the solution of the above problem, by placing a plurality of deposition sources in the deposition chamber to reduce the size of the deposition chamber, it is possible to reduce the installation cost and space of the deposition apparatus.

In addition, by continuously depositing different deposition materials ejected from the plurality of deposition sources on the plate surface of the substrate at a time difference, the time required for the deposition processing process may be reduced.

The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 is a schematic configuration diagram of a conventional inline deposition apparatus;
2A and 2B are schematic views of manufacturing an organic light emitting device manufactured in the inline deposition apparatus shown in FIG. 1;
3 is a schematic configuration diagram of an inline deposition apparatus to which a multiple deposition method according to a first embodiment of the present invention is applied;
4A to 4D are flowcharts illustrating a manufacturing process of an organic light emitting device manufactured in an inline deposition apparatus to which the multiple deposition method illustrated in FIG. 3 is applied.
5 is a schematic configuration diagram of an inline deposition apparatus to which a multiple deposition method according to a second embodiment of the present invention is applied;
Figure 6 is a schematic configuration diagram applying a block of another structure in the in-line deposition apparatus applying a multiple deposition method according to the present invention,
7 is a schematic configuration diagram of an inline deposition apparatus to which a multiple deposition method according to a third embodiment of the present invention is applied;
8 is a schematic cross-sectional configuration diagram of the VIII-VIII line illustrated in FIG. 7.

Advantages and features of the present invention, and a configuration and method for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, only the embodiments are to make the disclosure of the present invention complete, and common knowledge in the art to which the present invention pertains. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. For reference, in describing the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted.

Prior to the description, the inline deposition apparatus using the multiple deposition method according to the preferred embodiment of the present invention will be divided and described in the first to third embodiments, it will be apparent that the same configuration of each embodiment is described with the same reference numerals.

In addition, although FIG. 6 illustrates an embodiment of a blocking unit having a different structure in an inline deposition apparatus using a multiple deposition method according to a preferred embodiment of the present invention, the same configuration herein is described with the same reference numerals. .

3 is a schematic configuration diagram of an inline deposition apparatus using a multiple deposition method according to a first preferred embodiment of the present invention, Figures 4A to 4D is an organic fabricated in the inline deposition apparatus applying the multiple deposition method shown in FIG. It is a flowchart of the manufacturing procedure of the light emitting device.

3 to 4D, the inline deposition apparatus 1 using the multiple deposition method according to the first embodiment of the present invention includes a substrate transfer unit 100, a deposition chamber 200, a deposition source 300, And a cathode deposition source 400 and a blocking unit 900. The inline deposition apparatus 1 according to the present invention performs a process of depositing an organic material and an electrode on the plate surface of the substrate 10.

In one embodiment of the present invention, the substrate transfer unit 100 is loaded with the substrate 10 to be deposited, and serves to reciprocate the loaded substrate 10 in the transverse direction with respect to the gravity direction. In general, the substrate transfer unit 100 serves to guide the substrate 10 in one direction from an inflow position of the substrate 10 to an outflow position of the substrate 10 in the inline deposition apparatus 1. The substrate transfer unit 100 may be applied with various known techniques such as a conveyor belt. Here, the substrate 10 transferred by the substrate transfer part 100 includes a glass substrate and an anode 500 which is an anode stacked on a plate surface of the glass substrate.

The deposition chamber 200 accommodates the substrate transfer unit 100, and at least one is provided to deposit a plate surface of the substrate 10 transferred by the substrate transfer unit 100. Of course, the number of deposition chambers 200 for depositing the plate surface of the substrate 10 may be changed depending on the number of deposition sources accommodated. In one embodiment of the present invention, the deposition chamber 200 includes a first deposition chamber 220 and a second deposition chamber 240. Here, the deposition chamber 200 must accommodate at least two deposition sources 300 to be described later, in order to implement the spirit of the present invention.

The first deposition chamber 220 accommodates six deposition sources 300 as an embodiment of the present invention. From the six deposition sources 300 accommodated in the first deposition chamber 220, different deposition materials deposited on the plate surface of the substrate 10 are ejected.

On the other hand, the second deposition chamber 240 is continuously disposed relative to the first deposition chamber 220 with respect to the transfer direction of the substrate 10. In one embodiment of the present invention, one deposition source 300 and one cathode deposition source 400 are accommodated in the second deposition chamber 240.

Next, the deposition sources 300 are disposed in the deposition chamber 200 to face the plate surface of the substrate 10 and at least two are arranged at predetermined intervals in the traveling direction of the substrate 10 in the length region of the substrate 10. Each of the deposition materials is ejected such that at least two deposition materials are simultaneously deposited in the deposition region of the substrate 10. That is, the deposition source 300 is provided in plural to continuously deposit different deposition materials with time difference on the plate surface of the substrate 10 along the traveling direction (transfer direction) of the substrate 10.

The deposition source 300 of the present invention is the first deposition source 310, the second deposition source 320, the third deposition source 330, the fourth deposition source to eject the material constituting the organic light emitting device 600 340, a fifth deposition source 350, a sixth deposition source 360, and a seventh deposition source 370. In addition, a cathode deposition source 400 for ejecting a deposition material forming the cathode 700 is further provided. In addition, the deposition source 300 of the present invention includes any one of a point source, a point array source, and a linear source.

Deposition materials ejected from the plurality of deposition sources 300 of the present invention are formed on the plate surface of the substrate 10 in a step with time difference with respect to the advancing direction of the substrate 10. That is, different deposition materials ejected from the plurality of deposition sources 300 are formed on the plate surface of the substrate 10 in a stepwise manner to form a step with each other. Detailed description thereof will be described in detail in the manufacturing process of the organic light emitting diode 600 with reference to FIGS. 4A to 4D.

The first deposition source 310 is a deposition material forming a hole injection layer (HIL: 610) of the organic light emitting device 600 is ejected, the second deposition source 320 is a hole transport layer (HTL: The deposition material forming the hole transfer layer (630) is ejected.

In addition, the third deposition source 330, the fourth deposition source 340, and the fifth deposition source 350 are formed by evaporation materials forming an emission layer (EML) 650 of the organic light emitting diode 600. do. Here, the deposition materials having wavelengths of blue, green, and red, respectively, emitted from the third deposition source 330, the fourth deposition source 340, and the fifth deposition source 350, may be formed on the plate surface of the substrate 10. The light emitting layer 652, the second light emitting layer 654, and the third light emitting layer 656 are formed. The sixth deposition source 360 is a deposition material forming an electron transfer layer (ETL) 670 of the organic light emitting device 600 is ejected, the seventh deposition source 370 is an electron injection layer (EIL: The deposition material forming the Electron Injection Layer 690 is ejected.

The first deposition source 310, the second deposition source 320, the third deposition source 330, the fourth deposition source 340, the fifth deposition source 350 and the sixth deposition source 360 is In one embodiment of the invention, the first deposition chamber 220 is accommodated. In contrast, the sixth deposition source 360 and the cathode deposition source 400 are accommodated in the second deposition chamber 240.

Meanwhile, in one embodiment of the present invention, the substrate is transferred to the plurality of deposition sources 300 accommodated in the deposition chamber 200 by providing the substrate transfer part 100, but on the contrary, the substrate 10 is fixed and the plurality of deposition sources are provided. The deposition treatment process may proceed while the 300 is transferred.

The manufacturing process of the organic light emitting device 600 manufactured by the inline deposition apparatus 1 having the above-described configuration is as follows.

First, the substrate 10 is loaded and transported by the substrate transfer unit 100. The substrate 10 is transferred to the cathode deposition source 400 via the first deposition source 310 by the substrate transfer unit 100. Then, different deposition materials ejected from the plurality of deposition sources 300 are stacked on the plate surface of the substrate 10.

Referring to the drawings, as shown in FIG. 4A, the hole injection layer in which the deposition material from the first deposition source 310 is deposited on the plate surface of the substrate 10 transferred to the second deposition source 320 ( The deposition region of 610 has a larger deposition region than that of the hole transport layer 630 on which the deposition material from the second deposition source 320 is deposited.

Looking at the plate surface of the substrate 10 transferred to the fourth deposition source 340 with reference to Figure 4B, respectively, the deposition region of the hole injection layer 610, the deposition region of the hole transport layer 630, the first light emitting layer 652 In order to have a larger deposition region in the order of the deposition region of the second emission layer 654 and the deposition region of the second light emitting layer 654 is deposited with a step.

4C, the deposition region of the hole injection layer 610, the deposition region of the hole transport layer 630, and the first light emitting layer may be formed on the plate surface of the substrate 10 transferred to the seventh deposition source 370. The deposition region of 652, the deposition region of the second light emitting layer 654, the deposition region of the electron transport layer 670, and the deposition region of the electron injection layer 690 are deposited at a step to have a larger deposition region. Finally, when the substrate 10 passes through the cathode deposition source 400, the organic light emitting device 600 deposited up to the cathode 700 is completed.

As described above, the inline deposition apparatus 1 applying the multiple deposition method according to the present invention simultaneously deposits deposition materials between a plurality of deposition sources 300, thereby reducing the time required for the deposition process and simultaneously reducing the number of deposition chambers 200. There is an advantage that can be reduced.

Meanwhile, the inline deposition apparatus 1 using the multiple deposition method according to the first embodiment of the present invention further includes a blocking unit 900. The blocking unit 900 is disposed between the substrate 10 transferred by the substrate transfer unit 100 and the plurality of deposition sources 300 to block mixing of different deposition materials ejected from each deposition source 300. do.

As an embodiment of the present disclosure, the blocking unit 900 may include a plurality of deposition sources along the advancing direction of the substrate 10 between the substrate transfer unit 100 and the plurality of deposition sources 300 in the deposition chamber 200. 300) disposed in the interval region to block mixing of different deposition materials ejected from the plurality of deposition sources 300, respectively. That is, the inline deposition apparatus 1 according to the present invention blocks the mixing of different deposition materials so that different deposition materials simultaneously ejected between the deposition sources 300 are deposited on the plate surface of the substrate 10. It is provided to maintain the interface. Here, the blocking unit 900 may be provided integrally with the deposition chamber 200, or may be detachably provided with respect to the deposition chamber 200.

5 is a schematic configuration diagram of an inline deposition apparatus to which a multiple deposition method according to a second exemplary embodiment of the present invention is applied.

As shown in FIG. 5, the inline deposition apparatus 1 using the multiple deposition method according to the second exemplary embodiment of the present invention includes the components according to the first embodiment of the present invention, but the blocking unit 900 is not limited thereto. The configuration of is different. Of course, the role of the blocking unit 900 is the same in the inline deposition apparatus 1 applying the multiple deposition method according to the first and second embodiments.

The blocking unit 900 of the inline deposition apparatus 1 using the multiple deposition method according to the second exemplary embodiment of the present invention includes a first blocking unit 920 and a second blocking unit 940.

The first blocking unit 920 is disposed in the deposition area of the plurality of deposition sources 300 along the advancing direction of the substrate 10 between the substrate transfer unit 100 and the plurality of deposition sources 300 in the deposition chamber 200. Thus, the mixing of different deposition materials ejected from the plurality of deposition sources 300 is blocked. That is, it performs the same role as the blocking unit 900 of the first embodiment.

On the other hand, the second blocking portion 940 is disposed in the interval region of the plurality of deposition sources 300 in the horizontal direction of the arrangement direction of the first blocking portion 920, and different depositions respectively ejected from the plurality of deposition sources 300. Block the mixing of materials. The second blocking unit 940 together with the first blocking unit 920 may prevent mixing of different deposition materials ejected from each deposition source 300 to form a more accurate interface in manufacturing the organic light emitting device 600. Can be.

6 is a schematic block diagram of a block of another structure in the inline deposition apparatus to which the multiple deposition method according to the present invention is applied.

As shown in FIG. 6, the inline deposition apparatus 1 using the multiple deposition method according to the present invention may be provided with a blocking unit 900 having a structure different from that of the blocking unit 900 described above. Here, although the blocking unit 900 is described as being limited to the structure of the second blocking unit 940, it can of course be applied to the first blocking unit 920.

The second blocking part 940 illustrated in FIG. 6 includes a blocking shield 942 and a blocking nozzle 944. The blocking shield 942 may have substantially the same shape and material as the second blocking portion 940 shown in the second embodiment. That is, the blocking shield 942 may be provided in a wall shape inside the deposition chamber.

On the other hand, the blocking nozzle 944 ejects gas between the plurality of deposition sources 300 to block mixing of different deposition materials respectively ejected from the plurality of deposition sources 300. In order to use the blocking nozzle 944, unlike the structure of the inline deposition apparatus 1 to which the multiple deposition method according to the first and second embodiments of the present invention is applied in consideration of the gravity of the gas ejected from the blocking nozzle 944. The deposition source 300 is disposed above the deposition chamber 200 and the substrate transfer unit 100 is preferably disposed below.

Finally, FIG. 7 is a schematic configuration diagram of an inline deposition apparatus to which a multiple deposition method according to a third exemplary embodiment of the present invention is applied, and FIG.

As shown in FIG. 7 and FIG. 8, the inline deposition apparatus 1 using the multiple deposition method according to the third exemplary embodiment of the present invention includes the substrates according to the second embodiment of the present invention. The transfer position of the substrate transfer unit 100 for transferring 10) is different and the structure of the deposition source 300 is different.

In one embodiment of the present invention, the substrate transfer unit 100 is transferred along the side of the deposition chamber 200 in the transverse direction with respect to the bottom surface of the deposition chamber 200, unlike the first and second embodiments of the present invention do. In other words, the substrate transfer part 100 may be arranged so that the substrate surface of the substrate 100 faces the side of the deposition chamber 200 instead of the bottom surface of the deposition chamber 200 as compared with the substrate transfer part 100 of the first and second embodiments of the present invention. 10) Transfer.

The substrate transfer part 100 is generally applied when the size of the substrate 10 loaded on the substrate transfer part 100 of the first and second embodiments of the present invention is enlarged to prevent sagging due to the weight of the substrate 10. There is an advantage to this.

Unlike the deposition sources 300 of the first and second embodiments of the present invention, the deposition source 300 ejects the deposition material in the horizontal direction of the gravity direction with respect to the plate surface of the substrate 10. Although the deposition material ejected from the deposition sources 300 of the first and second embodiments of the present invention uses the principle of evaporation by a heat source, the deposition source 300 of the third embodiment of the present invention may be formed by the deposition chamber 200. Since the deposition material must be ejected in the lateral direction, a direct nozzle method is applied.

On the other hand, the inline deposition apparatus 1 applying the multiple deposition method according to the third embodiment of the present invention, like the inline deposition apparatus 1 applying the multiple deposition method according to the second embodiment of the present invention, 900 includes a first blocking portion 920 and a second blocking portion 940.

However, the blocking unit 900 applied to the inline deposition apparatus 1 using the multiple deposition method according to the third embodiment of the present invention is the same as the first embodiment, in addition to the second embodiment, the first blocking unit 920. Note that it can only include

Of course, when the second blocking portion 940 is included, the second blocking portion 940 may include at least one of the blocking shield 942 and the blocking nozzle 944.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, . Therefore, it should be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

10: substrate 100: substrate transfer portion
200: deposition chamber 220: first deposition chamber
240: second deposition chamber 300: deposition source
310: first deposition source 320: second deposition source
330: third evaporation source 340; 4th deposition source
350: fifth deposition source 360: sixth deposition source
370: seventh deposition source 400; Cathode deposition source
900: blocking unit 920: first blocking unit
940: second blocking portion 942: blocking shield
944: blocking nozzle

Claims (9)

An inline deposition apparatus using a multiple deposition method for depositing a substrate,
A substrate transfer unit configured to load the substrate in a longitudinal direction of the substrate plate surface and to reciprocally transfer the substrate;
At least one deposition chamber accommodating the substrate transfer part and depositing a plate surface of the substrate transferred by the substrate transfer part;
At least two substrates are disposed in the deposition chamber to face the plate surface of the substrate and are spaced apart from each other in the length direction of the substrate in a direction of travel of the substrate to simultaneously deposit at least two deposition materials in the deposition region of the substrate. An inline deposition apparatus using a multiple deposition method comprising a deposition source for ejecting each deposition material. The method of claim 1,
An inline deposition apparatus using a multiple deposition method, wherein different deposition materials are successively stepped on the plate surface of the substrate at a time difference with respect to the advancing direction of the substrate. The method of claim 1,
The substrate transfer portion on which the substrate is loaded is reciprocally transferred in the horizontal direction of the gravity direction,
The deposition source is an in-line deposition apparatus using a multiple deposition method, characterized in that for ejecting the deposition material in a direction opposite to the gravity direction toward the plate surface of the substrate. The method of claim 1,
The substrate transfer unit on which the substrate is loaded is reciprocated along the side of the deposition chamber in a transverse direction with respect to the bottom surface of the deposition chamber,
The deposition source is an in-line deposition apparatus using a multiple deposition method, characterized in that for ejecting the deposition material in the horizontal direction of the gravity direction toward the plate surface of the substrate. The method of claim 1,
The deposition source may be any one of a point source (point source), a point array source (point array source) and a linear source (linear source). The method of claim 1,
And a blocking unit disposed between the substrate and the plurality of deposition sources to block mixing of different deposition materials ejected from each of the deposition sources. The method of claim 6,
The blocking unit,
Between the substrate transfer part in the deposition chamber and the plurality of deposition sources is disposed in a plurality of intervals of the deposition sources along the advancing direction of the substrate, the mixture of different deposition materials ejected from the plurality of deposition sources respectively; In-line deposition apparatus applying a multiple deposition method comprising a first blocking portion for blocking. The method of claim 7, wherein
The blocking unit,
And a second blocking portion disposed in the plurality of deposition source interval regions in a horizontal direction of the arrangement direction of the first blocking portion to block mixing of different deposition materials respectively ejected from the plurality of deposition sources. Inline deposition apparatus using multiple deposition method. The method of claim 8,
The second blocking portion,
And at least one of a shielding shield disposed in a plurality of deposition source interval regions and a blocking nozzle disposed in the plurality of deposition source interval regions to eject a gas so that a mixture of different deposition materials is blocked. In-line deposition apparatus using the method.

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