KR20150113742A - Evaporation source and deposition apparatus including the same - Google Patents

Abstract

The present invention relates to evaporation sources and a deposition apparatus including the same. Each of the multiple evaporation sources stores an evaporation material. The evaporation sources comprises four evaporation sources of a first evaporation source, a second evaporation source, a third evaporation source, and a fourth evaporation source which are arranged in a horizontal direction. The first evaporation source and the second evaporation source may be host evaporation sources arranged on the center. The third evaporation source and the fourth evaporation source may be dopant evaporation source arranged on both sides. According to the present invention, influence of heat generation on a substrate can be minimized and efficiency of deposition can be increased by optimally arranging the four evaporation sources.

Description

[0001] The present invention relates to an evaporation source and a deposition apparatus including the evaporation source,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an evaporation source and a deposition apparatus including the evaporation source, and more particularly, to an evaporation source and an evaporation apparatus including the evaporation source that minimize the influence of heat generation on a substrate by optimally arranging four evaporation sources, will be.

BACKGROUND ART Organic light emitting diodes (OLEDs) are self-light emitting devices that emit light by using an electroluminescent phenomenon that emits light when a current flows through a fluorescent organic compound. A backlight for applying light to a non- Therefore, a lightweight thin flat panel display device can be manufactured.

A flat panel display device using such an organic electroluminescent device has a fast response speed and a wide viewing angle, and is emerging as a next generation display device. Particularly, since the manufacturing process is simple, it is advantageous in that the production cost can be saved more than the conventional liquid crystal display device.

The organic electroluminescent device comprises an organic thin film such as a hole injecting layer, a hole transporting layer, a light emitting layer, an electron transporting layer, and an electron injecting layer which are the remaining constituent layers except for the anode and the cathode. / RTI >

In the vacuum thermal deposition method, a substrate is disposed in a vacuum chamber, a shadow mask having a predetermined pattern is aligned on a substrate, heat is applied to an evaporation source containing the evaporation material, Evaporation.

Generally, the evaporation source is composed of a crucible containing an evaporation material and a heater installed to surround the crucible to supply heat. At this time, when the heat generated in the heater is transferred to the crucible, the temperature of the crucible is increased and the evaporation material stored in the crucible is evaporated. In order to evaporate the evaporation material, the evaporation source must generate heat at a high temperature.

As the evaporation source, a host evaporation source having a relatively high evaporation source temperature and a dopant evaporation source having a relatively low evaporation source temperature are mainly used. The deposition rates of the host evaporation source and the dopant evaporation source are different due to the temperature difference. That is, the deposition rate of the host evaporation source having a relatively high evaporation source temperature is higher. In order to manufacture an organic electroluminescent device having various performances, it is necessary to appropriately arrange the host evaporation source and the dopant evaporation source.

Korean Patent Publication No. 10-2012-0124889 (published on November 14, 2012)

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to solve the problems of the prior art as described above, and an object of the present invention is to provide an evaporation source capable of minimizing the influence of heat generation on a substrate by optimally arranging four evaporation sources, Device.

According to an embodiment of the present invention, an evaporation source according to the present invention includes a plurality of evaporation sources in which evaporation materials are stored, wherein the evaporation source is composed of four evaporation sources, The first evaporation source, the second evaporation source, the third evaporation source and the fourth evaporation source are arranged in a horizontal direction, the first evaporation source and the second evaporation source are host evaporation sources disposed at a central portion, And may be a dopant evaporating source disposed.

The first and second injection nozzles provided in the first evaporation source and the second evaporation source are inclined toward the center of the substrate, and the third and fourth injection nozzles provided in the third evaporation source and the fourth evaporation source, May be formed to be inclined toward the center of the substrate.

The first injection nozzle and the second injection nozzle may be formed symmetrically with respect to each other, and the third injection nozzle and the fourth injection nozzle may be formed symmetrically with respect to each other.

The inclination angle of the first injection nozzle and the second injection nozzle may be relatively smaller than the inclination angle of the third injection nozzle and the fourth injection nozzle.

According to another embodiment of the present invention, there is provided a deposition apparatus for forming an organic thin film on a substrate, the deposition apparatus comprising: a vacuum chamber in which the substrate is placed; And an evaporation source disposed inside the vacuum chamber to face the substrate, the evaporation source supplying evaporation material for forming the organic thin film.

The present invention relates to an evaporation source and an evaporation apparatus including the evaporation source, in which four evaporation sources are optimally arranged to minimize the influence of heat generation on the substrate and increase the deposition efficiency.

1 is a configuration diagram of a deposition apparatus according to an embodiment of the present invention;
Figure 2 schematically illustrates deposition of a substrate in accordance with one embodiment of the present invention.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, embodiments of an evaporation source and a deposition apparatus including the evaporation source according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a configuration diagram of a deposition apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic view illustrating deposition of a substrate according to an embodiment of the present invention.

The evaporation source includes a first evaporation source 20, a second evaporation source 30, a second evaporation source 30, and a second evaporation source 30. The first evaporation source 20, The third evaporation source 40 and the fourth evaporation source 50 are arranged in a horizontal direction and the first evaporation source 20 and the second evaporation source 30 are host evaporation sources disposed at the center, 40 and the fourth evaporation source 50 may be a dopant evaporation source disposed on both sides.

In addition, the deposition apparatus according to the present invention is a deposition apparatus for forming an organic thin film on a substrate, comprising: a vacuum chamber 1 in which the substrate 10 is placed; And an evaporation source (20, 30, 40, 50) disposed inside the vacuum chamber (1) so as to face the substrate (10) and supplying evaporation material for forming the organic thin film.

The vacuum chamber 1 is a means for providing a reaction space in which a deposition process in which an organic thin film is formed on the surface of the substrate 10 is performed, in which a vacuum atmosphere is maintained for deposition of evaporated particles. The vacuum chamber 1 is provided with a substrate seating part 12 supported by a separate supporting means. The substrate 10 can be supported by the bottom of the substrate seating part 12.

A metal mask 14 having a predetermined pattern formed thereon is fixed to the lower portion of the substrate seating portion 12 and the substrate 10 is fixed thereon via another fixing jig or the like. A separate magnet (not shown) or the like is provided on the substrate 10 to closely contact the mask 14 and the substrate 10. Through this structure, only a part of the bottom surface of the substrate 10 is selectively exposed through the pattern formed on the mask 14.

On the other hand, evaporation sources 20, 30, 40 and 50 are disposed at positions facing the substrate 10 with the mask 14 as a center. The evaporation materials contained in the crucibles 22, 32, 42 and 52 are heated Deformed into evaporation particles, and then moved and deposited on the surface of the substrate 10 through the mask 14.

As shown in FIG. 1, four evaporation sources 20, 30, 40, and 50 are installed in the horizontal direction. 1, the third evaporation source 40, the first evaporation source 20, the second evaporation source 30, and the fourth evaporation source 50 may be installed in order from the left side. Here, the first evaporation source 20 and the second evaporation source 30 are host evaporation sources disposed at the center, and the third evaporation source 40 and the fourth evaporation source 50 are dopant evaporation materials disposed on both sides, Cause is preferable.

In this embodiment, the reason why the evaporation sources 20 and 30 disposed at the center are used as the host evaporation source and the evaporation sources 40 and 50 disposed at both sides are used as the dopant evaporation source are as follows.

In general, when an organic electroluminescent device is fabricated, three evaporation sources may be used for deposition. At this time, a host evaporation source and a dopant evaporation source are mainly used as an evaporation source. The host evaporation source has a high deposition rate due to the high temperature in the evaporation source and the evaporation source has a low deposition rate due to the low temperature in the evaporation source. In this case, the temperature inside the vacuum chamber 1 is increased due to the evaporation temperature of the host evaporation source, which causes the substrate 10 to generate heat . ≪ / RTI >

Accordingly, in this embodiment, in order to solve this problem, a host evaporation source is further added to relatively reduce evaporation material evaporated in each host evaporation source. As a result, since the deposition amount of the evaporation material evaporated in one host evaporation source is divided in half to be formed in two host evaporation sources, the temperature inside the vacuum chamber 1 can be relatively lowered, thereby minimizing the influence of heat generation on the substrate .

In addition, since the host evaporation source has a higher deposition rate than the dopant evaporation source, the evaporation source evaporated from the host evaporation source is deposited on the entire surface of the substrate 10 at a central portion. By disposing the host evaporation source at the center and the dopant evaporation sources at both sides, the uniformity of the deposition of the substrate 10 can be improved and the quality of the device can be improved.

The first injection nozzle 24 and the second injection nozzle 34 provided in the first evaporation source 20 and the second evaporation source 30 are formed to be inclined toward the center of the substrate 10, The third injection nozzle 44 and the fourth injection nozzle 54 provided in the first evaporation source 40 and the fourth evaporation source 50 are formed to be inclined toward the center of the substrate 10.

It is preferable that the first injection nozzle 24 and the second injection nozzle 34 are formed symmetrically with respect to each other and the third injection nozzle 44 and the fourth injection nozzle 54 are formed symmetrically with respect to each other. This is for the purpose of uniformly depositing the evaporation material sprayed from each of the evaporation sources 20, 30, 40, and 50 over the entire surface of the substrate 10. Since two evaporation sources 20, 30, 40, and 50 are disposed on both sides of the center of the substrate 10 because the evaporation sources 20, 30, 40, and 50 are four in total, (24, 34, 44, 54) are not formed perpendicularly to the substrate 10 but are formed obliquely. Referring to FIG. 2, deposition is uniformly performed on the entire surface of the substrate 10 through the spray nozzles 24, 34, 44, and 54 formed obliquely. The first evaporation source 20 and the second evaporation source 30 disposed at the center are paired with each other and the third evaporation source 40 and the fourth evaporation source 50 disposed at both sides are paired with each other.

Since the first injection nozzle 24 and the second injection nozzle 34 are disposed at the center of the third injection nozzle 44 and the fourth injection nozzle 54, it is preferable that the first injection nozzle 24 and the second injection nozzle 34 have relatively small inclination angles. That is, the inclination angle [theta] 1 formed by the first injection nozzle 24 and the second injection nozzle 34 with the surface of the substrate 10 is set so that the third injection nozzle 44 and the fourth injection nozzle 54 contact the substrate 10 2 ", which is the angle between the surface of the substrate 1 and the surface of the substrate 1.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It belongs to the scope of right.

1: vacuum chamber 10: substrate
12: substrate mounting part 14: mask
20: first evaporation source 22: first crucible
24: first injection nozzle 30: second evaporation source
32: second crucible 34: second injection nozzle
40: Third evaporation source 42: Third crucible
44: third injection nozzle 50: fourth evaporation source
52: fourth crucible 54: fourth injection nozzle

Claims (5)

A plurality of evaporation sources in which evaporation materials are stored, respectively,
The evaporation source is composed of four evaporation sources, and the first evaporation source, the second evaporation source, the third evaporation source and the fourth evaporation source are arranged in the horizontal direction,
Wherein the first evaporation source and the second evaporation source are host evaporation sources disposed at a central portion, and the third evaporation source and the fourth evaporation source cause evaporation of dopants disposed on both sides. The method according to claim 1,
The first and second injection nozzles provided in the first evaporation source and the second evaporation source are inclined toward the center of the substrate,
And the third and fourth injection nozzles provided in the third evaporation source and the fourth evaporation source are inclined toward the center of the substrate. 3. The method of claim 2,
Wherein the first injection nozzle and the second injection nozzle are formed symmetrically with respect to each other,
Wherein the third injection nozzle and the fourth injection nozzle are formed symmetrically with respect to each other. The method of claim 3,
Wherein the inclination angle of the first injection nozzle and the second injection nozzle is smaller than the inclination angle of the third injection nozzle and the fourth injection nozzle. A deposition apparatus for forming an organic thin film on a substrate,
A vacuum chamber in which the substrate is seated; And
The evaporation apparatus according to any one of claims 1 to 4, which is disposed inside the vacuum chamber so as to face the substrate, and supplies the evaporation material for forming the organic thin film.

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