CN108365117A - Encapsulating structure and encapsulating method and structure preparation facilities - Google Patents
Encapsulating structure and encapsulating method and structure preparation facilities Download PDFInfo
- Publication number
- CN108365117A CN108365117A CN201810099465.5A CN201810099465A CN108365117A CN 108365117 A CN108365117 A CN 108365117A CN 201810099465 A CN201810099465 A CN 201810099465A CN 108365117 A CN108365117 A CN 108365117A
- Authority
- CN
- China
- Prior art keywords
- layer
- encapsulated layer
- encapsulating structure
- encapsulated
- modified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
A kind of packaging method of present invention offer, encapsulating structure and encapsulating structure preparation facilities, the encapsulating structure include at least two layers of the encapsulated layer being stacked, and are provided between encapsulated layer with the modified layer for improving the two bond strength.Encapsulating structure provided by the invention is in such a way that setting has for improving the modified layer of the two bond strength between adjacent package layer, realize the purpose of the adhesion strength between the adjacent package layer for improving encapsulating structure, effectively prevent the appearance of encapsulating structure lamination, to effectively prevent influence of the lamination to its packaging effect of encapsulating structure, and then effectively increase the reliability of encapsulating structure.
Description
Technical field
The present invention relates to display technology fields, and in particular to a kind of packaging method, encapsulating structure and encapsulating structure prepare dress
It sets.
Background technology
In recent years, with the rapid development of electronic display technology, OLED (Organic Light-Emitting Diode)
Display device receives significant attention.But easily there is lamination in the encapsulating structure in existing OLED display, to straight
Connecing influences its packaging effect.
Invention content
In view of this, a kind of packaging method of present invention offer, encapsulating structure and encapsulating structure preparation facilities, existing to solve
Easily occurs lamination in encapsulating structure, the problem of to directly affect its packaging effect.
In a first aspect, the present invention provides a kind of encapsulating structure, which includes at least two layers encapsulation being stacked
Layer, and the modified layer for improving the two bond strength is provided between encapsulated layer.
In an embodiment of the present invention, the encapsulating structure include the first encapsulated layer and the second encapsulated layer, the second encapsulated layer with
Modified layer hydrophobicity having the same or hydrophily.
In an embodiment of the present invention, the first encapsulated layer is keyed with modified layer by chemistry.
In an embodiment of the present invention, the first encapsulated layer is inorganic material layer, and the second encapsulated layer is organic material layer.
In an embodiment of the present invention, the second encapsulated layer is Hydrophobic organic materials layer, contains hexamethyl two in modified layer
Silicon amine alkane.
In an embodiment of the present invention, the material of the first encapsulated layer includes one or more in silica, aluminium oxide,
The material of second encapsulated layer includes one or more in acrylic resin, epoxy resin.
Second aspect, one embodiment of the invention also provide a kind of packaging method, which includes providing a substrate；
The first encapsulated layer is formed on substrate；Surface modification treatment, which is carried out, in the first encapsulation layer surface at least partly region forms modified layer；
It is laminated to form the second encapsulated layer in modified layer corresponding position.
In an embodiment of the present invention, surface modification treatment formation is carried out in the first encapsulation layer surface at least partly region to change
The step of property layer, is included under air-proof condition, and heating and gasifying modifying agent makes the substrate of the modifying agent after gasification and preheated processing
First encapsulated layer on surface reacts to form modified layer, preferably by basal plate preheating to 60 DEG C -150 DEG C.
In an embodiment of the present invention, the second encapsulated layer is organic material layer, and the second encapsulated layer all has with modified layer
Hydrophobicity；Preferably, modifying agent is hexamethyldisilazane.
The third aspect, one embodiment of the invention also provide a kind of encapsulating structure preparation facilities, the encapsulating structure preparation facilities
Including the first package system, for preparing the first encapsulated layer for substrate；Modification system, for completing the first encapsulated layer system
The surface of standby substrate is modified processing to form modified layer；Second package system, for the second encapsulated layer to be stacked
Onto modified layer；Preferably, modification system includes the line style modifying agent evaporation source for being modified processing.
In an embodiment of the present invention, which further comprises process control system, for controlling
The encapsulating structure of substrate prepares process.
In an embodiment of the present invention, modification system includes being evaporated for being modified the line style modifying agent of processing
Source；First package system and/or the second package system include the line style encapsulated layer evaporation source for being packaged layer preparation.
Fourth aspect, one embodiment of the invention also provide a kind of encapsulating structure preparation facilities, the encapsulating structure preparation facilities
Including：Chamber vacuum system, including vacuum cavity, for providing space environment for the preparation of encapsulating structure；Transmission system, setting
In the substrate to be prepared in vacuum cavity, being used for transmission and after bearing stack the first encapsulated layer of setting；Modification system, including
The modifying agent evaporation source being set in vacuum cavity, the first encapsulated layer for the substrate to being set in Transmission system wait being laminated
The surface of second encapsulated layer is modified processing to form modified layer；Flash system, including the encapsulation that is set in vacuum cavity
Layer evaporation source, for the second encapsulated layer to be stacked modified layer.
In an embodiment of the present invention, which further comprises mask system, including is set to true
Mask plate in cavity body, for carrying out zonal encapsulating structure preparation manipulation to substrate to be prepared.
In an embodiment of the present invention, chamber vacuum system further comprises the Process flowchart system for being connected to vacuum cavity
System, for control encapsulating structure prepare environment and/or prepare process.
In an embodiment of the present invention, modifying agent evaporation source and/or encapsulated layer evaporation source are line evaporation source.
Encapsulating structure provided in an embodiment of the present invention has by being arranged between adjacent package layer for improving the two knot
The mode for closing the modified layer of intensity realizes the purpose of the adhesion strength between the adjacent package layer for improving encapsulating structure, effectively anti-
The appearance for having stopped encapsulating structure lamination, to effectively prevent shadow of the lamination to its packaging effect of encapsulating structure
It rings, and then effectively increases the reliability of encapsulating structure.
Description of the drawings
Fig. 1 show the structural schematic diagram of the encapsulating structure of first embodiment of the invention offer.
Fig. 2 a to Fig. 2 c show the primary structure shape of the preparation process of the encapsulating structure of first embodiment of the invention offer
State schematic diagram.
Fig. 3 show the flow diagram of the packaging method of second embodiment of the invention offer.
Fig. 4 show the structural schematic diagram of the encapsulating structure preparation facilities of third embodiment of the invention offer.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Based on this
Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts
Example is applied, shall fall within the protection scope of the present invention.
Fig. 1 show the structural schematic diagram of the encapsulating structure of first embodiment of the invention offer.As shown in Figure 1, of the invention
The encapsulating structure that first embodiment provides includes the first encapsulated layer 2 and the second encapsulated layer 4, Yi Jishe for being stacked substrate 1
The modified layer 3 having for improving the two bond strength being placed between the first encapsulated layer 2 and the second encapsulated layer 4.
In an embodiment of the present invention, it is attached by chemical bond between the first encapsulated layer 2 and modified layer 3, to realize
Improve the purpose of the bond strength between the first encapsulated layer 2 and modified layer 3.
It should be appreciated that the setting of modified layer 3 can voluntarily be set to the specific region on the surface of the first encapsulated layer 2 according to actual conditions
It is fixed, fully to improve the adaptability and widespread popularity of encapsulating structure provided in an embodiment of the present invention, the embodiment of the present invention pair
This is limited without unified.For example, only modified layer 3 is arranged to 2 upper surface of the first encapsulated layer (the first of orientation as shown in Figure 2
The upper surface of encapsulated layer 2) edge.
Fig. 2 a to Fig. 2 c show the primary structure shape of the preparation process of the encapsulating structure of first embodiment of the invention offer
State schematic diagram.In the preparation process for the encapsulating structure that first embodiment of the invention provides, the first main knot of preparation process
Structure state is as shown in Figure 2 a, including the substrate 1 and the first encapsulated layer 2 being stacked, i.e., selected first substrate 1, then by first
Encapsulated layer 2 is stacked the surface to be packaged of substrate 1；Second primary structure state of its preparation process is as shown in Figure 2 b, with
First primary structure state is compared, and the second primary structure state further comprises that setting waits being stacked it to the first encapsulated layer 2
Modifying agent is waited the surface for being stacked other encapsulated layers by the modified layer 3 on the surface of his encapsulated layer to the first encapsulated layer 2
To form modified layer 3；The third primary structure state of its preparation process is as shown in Figure 2 c, compared with the second primary structure state,
Third primary structure state further comprises the second encapsulated layer 4 for being stacked modified layer 3, i.e., the second encapsulated layer 4 is laminated
It is arranged to the surface after the coating modifying agent of the first encapsulated layer 2.
The encapsulating structure that first embodiment of the invention provides has by being arranged between adjacent package layer for improving two
The mode of the modified layer of person's bond strength realizes the purpose of the adhesion strength between the adjacent package layer for improving encapsulating structure, has
Effect prevents the appearance of encapsulating structure lamination, to effectively prevent the lamination of encapsulating structure to its packaging effect
It influences.
It should be appreciated that the specific number of plies of encapsulated layer can be according to actual conditions sets itself, including but not limited in the present invention
State two encapsulated layers mentioned by embodiment.
In an embodiment of the present invention, encapsulating structure further comprise and be stacked the first encapsulated layer, modified layer and
The adjacent stacking periods structure of second encapsulated layer, stacking periods be stacked and between include modified layer the first encapsulated layer and
Second encapsulated layer, the embodiment of the present invention are adjacent with the first encapsulated layer, modified layer and the second encapsulated layer being stacked by being arranged
Stacking periods structure mode, adaptability and the application for further improving encapsulating structure provided in an embodiment of the present invention be wide
General property.
In an alternative embodiment of the invention, the first encapsulated layer 2 is inorganic layer, and the second encapsulated layer 4 is organic layer, i.e. the first envelope
It is different with the hydrophilic and hydrophobic of the second encapsulated layer 4 to fill layer 2.
It should be appreciated that when the first encapsulated layer is inorganic layer, the material of the first encapsulated layer includes in silica, aluminium oxide
It is one or more, when the second encapsulated layer be organic layer when, the material of the second encapsulated layer includes acrylic resin, epoxy resin
In it is one or more, fully to improve encapsulating structure adaptability and widespread popularity provided in an embodiment of the present invention, this hair
Bright embodiment limits this without unified.
It should be appreciated that when the first adjacent encapsulated layer 2 is identical with the hydrophilic and hydrophobic of the second encapsulated layer 4, two encapsulated layers it
Between adhesion strength can enhance, go out in the process of bending to reduce the encapsulating structure comprising the first encapsulated layer 2 and the second encapsulated layer 4
The probability of existing lamination.
In addition, it should be understood that the first encapsulated layer 2 and the second encapsulated layer 4 not shall be limited only to the extent mentioned by the embodiment of the present invention
The different situation of hydrophilic and hydrophobic, as long as easily there is lamination between the first encapsulated layer 2 and the second encapsulated layer 4, and lead to
Adjacent package layer can be improved by crossing the mode of modified layer 3 of the setting with stickiness between the first encapsulated layer 2 and the second encapsulated layer 4
Between lamination encapsulating structure, belong to the range for the encapsulating structure that first embodiment of the invention is provided, the present invention
This is not described in detail in embodiment.
Fig. 3 show the flow diagram of the packaging method of second embodiment of the invention offer.Second embodiment of the invention
The packaging method of offer is applied to the encapsulating structure of the first encapsulated layer and the second encapsulated layer including being stacked, wherein first
The hydrophilic and hydrophobic of encapsulated layer and the second encapsulated layer is different.
It should be appreciated that hydrophilic and hydrophobic difference refer to be the first encapsulated layer and the second encapsulated layer material molecule hydrophilic and hydrophobic
Difference, for example, the material of the first encapsulated layer is hydrophilic molecule, the material of the second encapsulated layer is hydrophobic molecule.
As shown in figure 3, the packaging method that second embodiment of the invention provides includes：
Step S1：One substrate is provided.
Step S2：The first encapsulated layer is formed on substrate.
In an embodiment of the present invention, substrate is the flexible display substrates in flexible display apparatus.
Step S3：Surface modification treatment, which is carried out, in the first encapsulation layer surface at least partly region forms modified layer.
It should be appreciated that the modification mentioned in step S2 includes but not limited to for modifications sides such as coating modifying agent
Formula, no longer narration in detail one by one to this of the embodiment of the present invention.
Step S4：It is laminated to form the second encapsulated layer in modified layer corresponding position.
Also, it is to be understood that when the hydrophilic and hydrophobic of adjacent the first encapsulated layer and the second encapsulated layer is identical, two encapsulated layers
Between adhesion strength can enhance, go out in the process of bending to reduce the encapsulating structure comprising the first encapsulated layer and the second encapsulated layer
The probability of existing lamination.
In actual application, the first encapsulated layer is stacked on substrate first, then the first encapsulated layer is waited being laminated
The surface of second encapsulated layer is modified processing to be formed and the second encapsulated layer to be laminated parent on the surface of the first encapsulated layer
The consistent modified layer of hydrophobicity, to make the adjacent surface of the first encapsulated layer and the second encapsulated layer have identical hydrophilic and hydrophobic, most
The surface of modified layer is formed after the second encapsulated layer is stacked to the first encapsulated layer modification afterwards.
The packaging method that second embodiment of the invention provides passes through to adjacent but different hydrophilic and hydrophobic two encapsulated layers progress
Modification improves the adherency between adjacent package layer in a manner of keeping the hydrophilic and hydrophobic of the adjacent surface of two encapsulated layers identical
There is the case where lamination in the process of bending to effectively prevent encapsulating structure in power, and then effectively increases encapsulation knot
The reliability of structure.
In an embodiment of the present invention, surface modification treatment formation is carried out in the first encapsulation layer surface at least partly region to change
The step of property layer include：Under air-proof condition, heating and gasifying modifying agent makes the substrate of the modifying agent after gasification and preheated processing
First encapsulated layer on surface reacts to form modified layer, and preferably by basal plate preheating to 60 DEG C -150 DEG C.
It is filled it should be appreciated that the modifying agent that basal plate preheating can either ensure to 60 DEG C -150 DEG C after gasification is reacted with encapsulated layer
Point, and can fully ensure that reaction rate and hair answer completeness.
Preferably, in an embodiment of the present invention, the first encapsulated layer is to have hydrophilic inorganic layer (such as silica
Layer), the second encapsulated layer is to have hydrophobic organic layer, and modifying agent is hexamethyldisilazane (Hexamethyl
Disilazane, HMDS) modifying agent.
In actual application, when inorganic layer is silicon dioxide layer, HMDS modifying agent is coated to dioxy by gas phase
The HMDS of volatilization is brought into airtight cavity by the surface of SiClx layer (i.e. inorganic layer) organic layer to be stacked by carrier gas, and
The substrate placed in airtight cavity is heated, the gas of HMDS is carried and substrate surface contacts to finally make coated
It is (i.e. modified to generate silicon ether layer in silicon chip surface for the hydroxyl reaction of HMDS modifying agent and silicon dioxide layer (i.e. inorganic layer) surface
Layer), to make the polarity on silicon dioxide layer (i.e. inorganic layer) surface be changed to hydrophobicity by hydrophily, finally organic layer stackup is set
The surface that modified layer is formed after modification for setting inorganic layer, to finally realize, raising is modified to have hydrophobicity
Silicon dioxide layer (i.e. inorganic layer) and the adhesion strength being likewise supplied between hydrophobic organic layer purpose.
It should be appreciated that modifying agent includes but not limited to for coupling agent, surfactant, organic polymer inorganic agent, inorganic
The modifying agent such as inorganic agent, fully to improve the adaptability and widespread popularity of packaging method provided in an embodiment of the present invention, this
Inventive embodiments do not limit this uniformly.
In addition, it should be understood that the packaging method mentioned by the above embodiment of the present invention not shall be limited only to the extent and prepare above-mentioned reality
The encapsulating structure that adjacent package layer mentioned by example is the different encapsulated layer of hydrophilic and hydrophobic is applied, as long as but the first encapsulated layer and the
Easily occur lamination between two encapsulated layers, and there is stickiness by being arranged between the first encapsulated layer and the second encapsulated layer
The mode of modified layer can improve the encapsulating structure of the lamination between adjacent package layer, belong to provided by the present invention
This is no longer described in detail in the scope of application of packaging method, the embodiment of the present invention one by one.
In an embodiment of the present invention, a kind of encapsulating structure preparation facilities is also provided, which is used for
Prepare the encapsulating structure mentioned by the above embodiment of the present invention.Specifically, which includes that the first encapsulation is
System, for preparing the first encapsulated layer 2 for substrate 1；Modification system, for the substrate 1 to completing the preparation of the first encapsulated layer 2
Surface is modified processing to form modified layer 3；Second package system, for the second encapsulated layer 4 to be stacked modified layer 3
On.
Fig. 4 show the structural schematic diagram of the encapsulating structure preparation facilities of third embodiment of the invention offer.Such as Fig. 4 institutes
Show, the encapsulating structure preparation facilities that third embodiment of the invention provides includes chamber vacuum system, Transmission system, modification system
System, flash system and mask system.
Specifically, chamber vacuum system includes vacuum cavity 51 and is connected respectively to the air source control of vacuum cavity 51
Device 52 and air pump 53, wherein vacuum cavity 51 is used to provide necessary space environment for the preparation of encapsulating structure；Air source controller
52 and air pump 53 be used as process control system, enter the speed that in vacuum cavity 51 and gas enters for controlling required gas
Degree, to control encapsulating structure prepare environment and/or prepare process.
Transmission system includes the transmission carrier 61 for the opposite inner face for being set to vacuum cavity 51, wherein transmission is held
Carrier 61 can move in vacuum cavity 51, be used for transmission and waited for after bearing stack the first encapsulated layer (not shown) of setting
Prepare substrate 1.
Modification system includes sequentially connected modifier source 71, modifying agent vapo(u)rization system 72 and modifying agent evaporation source
73, wherein modifying agent evaporation source 73 is set in vacuum cavity 51, and the first encapsulated layer in substrate 1 to be prepared is (in figure not
Show) modifying agent to be coated surface side, for being set to the substrate 1 in Transmission system the first encapsulated layer (figure
In be not shown) wait for stacking the second encapsulated layer surface be modified processing to form modified layer (not shown).
Flash system include sequentially connected organic material resource 81, organic matter vapo(u)rization system 82 and organic evaporation source 83 (i.e.
Encapsulated layer evaporation source), wherein organic evaporation source 83 is also set in vacuum cavity 51, and organic evaporation source 83 and modification
The modifying agent evaporation source 73 of processing system is in the same side of substrate 1 to be prepared, is used for the second encapsulated layer (not shown)
It is stacked to the surface after the first encapsulated layer (not shown) modification.
It should be appreciated that the second encapsulated layer that the flash system of the embodiment of the present invention is applied to encapsulating structure to be prepared is to have
The case where machine layer.When the second encapsulated layer is the film layer of other materials, organic material resource 81 in flash system, organic matter can be steamed
Hair system 82 and the correspondence of organic evaporation source 83 replace with flash distillation plant corresponding with the material of the second encapsulated layer.
Mask system include be set in vacuum cavity 51 and with the first encapsulated layer (not shown) of substrate 1 to be prepared
The adjacent mask plate 91 in the surface of the second encapsulated layer of stacking is waited for, for carrying out zonal encapsulating structure system to substrate 1 to be prepared
Standby operation.
It, then will stacking first with the preparation of the first encapsulated layer of other equipment completing substrate 1 in actual fabrication process
The vacuum chamber that substrate to be prepared 1 after first encapsulated layer is sent to the encapsulating structure preparation facilities that the embodiment of the present invention refers to is set
On transmission carrier 61 in body 51, and the surface for being provided with the first encapsulated layer of substrate 1 to be prepared is adjacent with mask plate 91
And the alignment operation of substrate 1 and mask plate 91 to be prepared is carried out based on transmission carrier 61, finally utilize modification system pair
First encapsulated layer of substrate 1 to be prepared waits for that the surface of the second encapsulated layer of stacking is modified processing, and utilizes flash system pair
The surface of the first encapsulated layer after modification carries out organic thin film deposition operation (preparation for carrying out the second encapsulated layer).
Wherein, using modification system to the table for waiting for the second encapsulated layer of stacking of the first encapsulated layer of substrate 1 to be prepared
Face is modified processing and specifically includes：Changing in modifier source 71 is controlled using the modifying agent vapo(u)rization system 72 of modification system
Property agent be input to modifying agent evaporation source 73, to drive substrate 1 and mask plate 91 by the transmission carrier 61 of Transmission system
It moves to receive the modifying agent of the output of modifying agent evaporation source 73, to finally realize the coating of modifying agent and the life of modified layer
At；Similarly, specific to the surface progress organic thin film deposition operation of the first encapsulated layer after modification using flash system
Including：The organic matter in organic material resource 81 is controlled using organic matter vapo(u)rization system 82 and is input to organic evaporation source 83, to logical
The transmission carrier 61 for crossing Transmission system drives the movement of substrate 1 and mask plate 91 to receive having for the output of organic evaporation source 83
Machine object, to finally realize the deposition of organic layer (i.e. the second encapsulated layer).
It should be appreciated that in actual preparation process, process control system (i.e. air source controller 52 and air pump can be passed through
53) gas of control vacuum cavity 51 into situation and the progression rate of modified operation and flashing operation.
In addition, it should be understood that in actual preparation process, can be realized by mask system to the first encapsulation layer surface
Specific region is modified processing and organic matter flashing operation, is prepared with fully improving encapsulating structure provided in an embodiment of the present invention
The adaptability and widespread popularity of device.
Third embodiment of the invention provide encapsulating structure preparation facilities by by chamber vacuum system, Transmission system,
Mutual cooperation linkage between modification system, flash system and mask system, it is included not to realize to encapsulating structure
With the modification of the adjacent package layer of hydrophilic and hydrophobic, the adherency between adjacent package layer to improve different hydrophilic and hydrophobics
Power effectively prevents encapsulating structure and occurs the case where lamination in the process of bending, to effectively increase encapsulating structure
Reliability.
It should be appreciated that the encapsulating structure preparation facilities that third embodiment of the invention provides not only is defined in the preparation present invention
The different encapsulating structure of the hydrophilic and hydrophobic of adjacent package layer mentioned by above-described embodiment, as long as the adjacent package layer of encapsulating structure
Between easily there is lamination, and can be changed by way of modified layer of the setting with stickiness between adjacent package layer
The case where lamination being apt between adjacent package layer, belongs to the encapsulating structure that third embodiment of the invention is provided and prepares dress
This is no longer described in detail in the preparation range set, the embodiment of the present invention one by one.
In an embodiment of the present invention, modifying agent evaporation source 73 and/or organic evaporation source 83 are line evaporation source, to keep away
Exempt from the case where two evaporation sources installation phase mutually stops.In addition, in actual fabrication process, by modifying agent evaporation source 73 and/
Or organic evaporation source 83 the occurrence of being set as line evaporation source also and effectivelying prevent the interference and blocking between two evaporation sources.
Preferably, modifying agent evaporation source 73 and organic evaporation source 83 are line evaporation source.
In an embodiment of the present invention, encapsulating structure preparation facilities does not include mask system, i.e., in actual fabrication process
It need not carry out the alignment operation of substrate 1 and mask plate 91 to be prepared.
In an alternative embodiment of the invention, chamber vacuum system does not include process control system (i.e. 52 He of air source controller
Air pump 53), i.e., chamber vacuum system only includes vacuum cavity 51.
In an embodiment of the present invention, a kind of flexible display apparatus is also provided, which includes any of the above-described
Encapsulating structure described in embodiment.The flexible display apparatus may be used on the various electronics such as mobile phone, tablet computer, display and set
It is standby.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
Within god and principle, made by any modification, equivalent replacement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of encapsulating structure, which is characterized in that the encapsulating structure includes at least two layers of the encapsulated layer being stacked, and described
The modified layer for improving the two bond strength is provided between encapsulated layer.
2. encapsulating structure as described in claim 1, which is characterized in that the encapsulating structure includes the first encapsulated layer and the second envelope
Fill layer, second encapsulated layer and modified layer hydrophobicity having the same or hydrophily.
3. encapsulating structure as claimed in claim 2, which is characterized in that first encapsulated layer passes through chemistry with the modified layer
Key connection.
4. encapsulating structure as claimed in claim 2 or claim 3, which is characterized in that first encapsulated layer is inorganic material layer, described
Second encapsulated layer is organic material layer.
5. encapsulating structure as claimed in claim 2 or claim 3, which is characterized in that second encapsulated layer is Hydrophobic organic materials
Layer, contain hexamethyldisilazane in the modified layer.
6. encapsulating structure as claimed in claim 5, which is characterized in that the material of first encapsulated layer includes silica
And/or aluminium oxide, the material of second encapsulated layer includes acrylic resin and/or epoxy resin.
7. a kind of packaging method, which is characterized in that including：
One substrate is provided；
The first encapsulated layer is formed on the substrate；
Surface modification treatment, which is carried out, in the first encapsulation layer surface at least partly region forms modified layer；
It is laminated to form the second encapsulated layer in the modified layer corresponding position.
8. packaging method as claimed in claim 7, which is characterized in that it is described first encapsulation layer surface at least partly region into
Row surface modification treatment formed modified layer the step of include：
Under air-proof condition, heating and gasifying modifying agent makes the described of the modifying agent after gasification and the substrate surface of preheated processing
First encapsulated layer reacts to form the modified layer, preferably by the basal plate preheating to 60 DEG C -150 DEG C.
9. packaging method as claimed in claim 7, which is characterized in that second encapsulated layer is organic material layer, and described
Second encapsulated layer all has hydrophobicity with the modified layer；Preferably, the modifying agent is hexamethyldisilazane.
10. a kind of encapsulating structure preparation facilities, which is characterized in that including：
First package system, for preparing the first encapsulated layer for substrate；
Modification system, for being modified processing to the surface for completing the substrate prepared by first encapsulated layer with shape
At modified layer；
Second package system, for the second encapsulated layer to be stacked the modified layer；
Preferably, the modification system includes the line style modifying agent evaporation source for being modified processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810099465.5A CN108365117A (en) | 2018-01-31 | 2018-01-31 | Encapsulating structure and encapsulating method and structure preparation facilities |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810099465.5A CN108365117A (en) | 2018-01-31 | 2018-01-31 | Encapsulating structure and encapsulating method and structure preparation facilities |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108365117A true CN108365117A (en) | 2018-08-03 |
Family
ID=63007753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810099465.5A Pending CN108365117A (en) | 2018-01-31 | 2018-01-31 | Encapsulating structure and encapsulating method and structure preparation facilities |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108365117A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110518145A (en) * | 2019-08-28 | 2019-11-29 | 云谷（固安）科技有限公司 | Thin-film packing structure and preparation method thereof, display panel |
| CN111211209A (en) * | 2020-01-16 | 2020-05-29 | 江西新正耀光学研究院有限公司 | Ultraviolet light-emitting diode and manufacturing method thereof |
| CN111446381A (en) * | 2020-04-13 | 2020-07-24 | 武汉华星光电半导体显示技术有限公司 | Display panel and display terminal |
| CN113013369A (en) * | 2021-02-22 | 2021-06-22 | 昆山工研院新型平板显示技术中心有限公司 | Thin film packaging method and display panel |
Citations (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020013218A1 (en) * | 2000-06-14 | 2002-01-31 | Meverden Craig C. | Process for producing improved premixed supported boraaryl catalysts |
| CN101182627A (en) * | 2006-11-16 | 2008-05-21 | 财团法人山形县产业技术振兴机构 | Evaporation source and vacuum evaporator using the same |
| CN101242688A (en) * | 2008-02-29 | 2008-08-13 | 东莞宏威数码机械有限公司 | A making system for line organic luminescent display |
| CN101393969A (en) * | 2007-09-19 | 2009-03-25 | 富士胶片株式会社 | Light-emitting device or display device, and method for producing them |
| CN101412300A (en) * | 2007-10-16 | 2009-04-22 | 富士胶片株式会社 | Barrier laminate, barrier film substrate, device, and method for producing barrier laminate |
| CN103305794A (en) * | 2013-06-09 | 2013-09-18 | 京东方科技集团股份有限公司 | Organic film coating device and method |
| CN203312371U (en) * | 2012-03-05 | 2013-11-27 | 三星显示有限公司 | Substrate used for conversion of inorganic layer and organic light-emitting device |
| CN103523790A (en) * | 2013-10-16 | 2014-01-22 | 同济大学 | Gas phase chemical surface modification method for producing hydrophobic aerogel with low cost and on large scale |
| CN103996799A (en) * | 2013-02-14 | 2014-08-20 | 三星显示有限公司 | Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same |
| CN104120399A (en) * | 2014-08-04 | 2014-10-29 | 熊丹 | Vacuum coating device and vacuum coating method |
| CN104294220A (en) * | 2014-09-16 | 2015-01-21 | 京东方科技集团股份有限公司 | Evaporation device and evaporation method |
| CN104294217A (en) * | 2013-07-18 | 2015-01-21 | 上海和辉光电有限公司 | Evaporation source device |
| CN104328377A (en) * | 2014-11-20 | 2015-02-04 | 京东方科技集团股份有限公司 | Evaporation source, film-forming facility and film-forming method thereof |
| CN104347822A (en) * | 2013-08-08 | 2015-02-11 | 三星显示有限公司 | Display apparatus including encapsulation film and method of inspecting the encapsulation film |
| CN104561905A (en) * | 2014-12-29 | 2015-04-29 | 昆山国显光电有限公司 | Linear evaporation source |
| CN104750285A (en) * | 2013-12-27 | 2015-07-01 | 昆山工研院新型平板显示技术中心有限公司 | Touch display device and preparation method thereof |
| CN105695939A (en) * | 2016-04-26 | 2016-06-22 | 京东方科技集团股份有限公司 | Linear evaporation source and vacuum evaporation device and method |
| CN105789257A (en) * | 2016-03-23 | 2016-07-20 | 京东方科技集团股份有限公司 | Thin-film packaging structure and display device |
| CN105908129A (en) * | 2016-06-27 | 2016-08-31 | 京东方科技集团股份有限公司 | Organic material evaporation equipment and method |
| CN106328671A (en) * | 2015-06-30 | 2017-01-11 | 乐金显示有限公司 | Flexible organic light emitting diode display device and method of fabricating the same |
| CN106531904A (en) * | 2016-11-22 | 2017-03-22 | 武汉船舶通信研究所 | OLED display device package and packaging method |
| CN106601927A (en) * | 2016-12-01 | 2017-04-26 | Tcl集团股份有限公司 | Thin film encapsulation structure of display panel and preparation method |
| CN106711345A (en) * | 2015-11-12 | 2017-05-24 | 宁波长阳科技股份有限公司 | Flexible transparent barrier film and preparation method thereof |
| CN106784398A (en) * | 2016-12-15 | 2017-05-31 | 武汉华星光电技术有限公司 | OLED encapsulation method and OLED encapsulating structures |
-
2018
- 2018-01-31 CN CN201810099465.5A patent/CN108365117A/en active Pending
Patent Citations (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020013218A1 (en) * | 2000-06-14 | 2002-01-31 | Meverden Craig C. | Process for producing improved premixed supported boraaryl catalysts |
| CN101182627A (en) * | 2006-11-16 | 2008-05-21 | 财团法人山形县产业技术振兴机构 | Evaporation source and vacuum evaporator using the same |
| CN101393969A (en) * | 2007-09-19 | 2009-03-25 | 富士胶片株式会社 | Light-emitting device or display device, and method for producing them |
| CN101412300A (en) * | 2007-10-16 | 2009-04-22 | 富士胶片株式会社 | Barrier laminate, barrier film substrate, device, and method for producing barrier laminate |
| CN101242688A (en) * | 2008-02-29 | 2008-08-13 | 东莞宏威数码机械有限公司 | A making system for line organic luminescent display |
| CN203312371U (en) * | 2012-03-05 | 2013-11-27 | 三星显示有限公司 | Substrate used for conversion of inorganic layer and organic light-emitting device |
| CN103996799A (en) * | 2013-02-14 | 2014-08-20 | 三星显示有限公司 | Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same |
| CN103305794A (en) * | 2013-06-09 | 2013-09-18 | 京东方科技集团股份有限公司 | Organic film coating device and method |
| CN104294217A (en) * | 2013-07-18 | 2015-01-21 | 上海和辉光电有限公司 | Evaporation source device |
| CN104347822A (en) * | 2013-08-08 | 2015-02-11 | 三星显示有限公司 | Display apparatus including encapsulation film and method of inspecting the encapsulation film |
| CN103523790A (en) * | 2013-10-16 | 2014-01-22 | 同济大学 | Gas phase chemical surface modification method for producing hydrophobic aerogel with low cost and on large scale |
| CN104750285A (en) * | 2013-12-27 | 2015-07-01 | 昆山工研院新型平板显示技术中心有限公司 | Touch display device and preparation method thereof |
| CN104120399A (en) * | 2014-08-04 | 2014-10-29 | 熊丹 | Vacuum coating device and vacuum coating method |
| CN104294220A (en) * | 2014-09-16 | 2015-01-21 | 京东方科技集团股份有限公司 | Evaporation device and evaporation method |
| CN104328377A (en) * | 2014-11-20 | 2015-02-04 | 京东方科技集团股份有限公司 | Evaporation source, film-forming facility and film-forming method thereof |
| CN104561905A (en) * | 2014-12-29 | 2015-04-29 | 昆山国显光电有限公司 | Linear evaporation source |
| CN106328671A (en) * | 2015-06-30 | 2017-01-11 | 乐金显示有限公司 | Flexible organic light emitting diode display device and method of fabricating the same |
| CN106711345A (en) * | 2015-11-12 | 2017-05-24 | 宁波长阳科技股份有限公司 | Flexible transparent barrier film and preparation method thereof |
| CN105789257A (en) * | 2016-03-23 | 2016-07-20 | 京东方科技集团股份有限公司 | Thin-film packaging structure and display device |
| CN105695939A (en) * | 2016-04-26 | 2016-06-22 | 京东方科技集团股份有限公司 | Linear evaporation source and vacuum evaporation device and method |
| CN105908129A (en) * | 2016-06-27 | 2016-08-31 | 京东方科技集团股份有限公司 | Organic material evaporation equipment and method |
| CN106531904A (en) * | 2016-11-22 | 2017-03-22 | 武汉船舶通信研究所 | OLED display device package and packaging method |
| CN106601927A (en) * | 2016-12-01 | 2017-04-26 | Tcl集团股份有限公司 | Thin film encapsulation structure of display panel and preparation method |
| CN106784398A (en) * | 2016-12-15 | 2017-05-31 | 武汉华星光电技术有限公司 | OLED encapsulation method and OLED encapsulating structures |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110518145A (en) * | 2019-08-28 | 2019-11-29 | 云谷（固安）科技有限公司 | Thin-film packing structure and preparation method thereof, display panel |
| CN111211209A (en) * | 2020-01-16 | 2020-05-29 | 江西新正耀光学研究院有限公司 | Ultraviolet light-emitting diode and manufacturing method thereof |
| CN111446381A (en) * | 2020-04-13 | 2020-07-24 | 武汉华星光电半导体显示技术有限公司 | Display panel and display terminal |
| CN113013369A (en) * | 2021-02-22 | 2021-06-22 | 昆山工研院新型平板显示技术中心有限公司 | Thin film packaging method and display panel |
| CN113013369B (en) * | 2021-02-22 | 2022-08-02 | 昆山工研院新型平板显示技术中心有限公司 | Thin film packaging method and display panel |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108365117A (en) | Encapsulating structure and encapsulating method and structure preparation facilities | |
| CN103930501B (en) | Bonding film | |
| CN107170902B (en) | The packaging method of packaging film and preparation method thereof and oled panel | |
| US11267996B2 (en) | Adhesive composition | |
| TWI582202B (en) | Photocurable pressure-sensitive adhesive film for encapsulating organic electronic device, organic electronic device and method for encapsulating the same | |
| CN105098088B (en) | A kind of flexible display and its film encapsulation method | |
| US10153329B2 (en) | Method of manufacturing display panel | |
| CN106784311A (en) | Flexible panel and preparation method thereof | |
| CN103946998A (en) | Photocurable adhesive film for organic electronic device seal, organic electronic device, and method for sealing same | |
| WO2017020372A1 (en) | Flexible glass substrate, flexible display screen and manufacturing method for flexible display screen | |
| CN105098097B (en) | The encapsulating structure and method for packing of a kind of flexible OLED devices | |
| KR101518125B1 (en) | Adhesive Film and Encapsulation Product of Organic Electronic Device Using the Same | |
| CN105024018A (en) | Flexible display and manufacturing method thereof | |
| KR20140018816A (en) | Adhesive film and encapsulation method of organic electronic device using the same | |
| CN108190832B (en) | OLED panel and manufacturing method thereof | |
| TWM426870U (en) | Transparent multilayer board laminating apparatus | |
| CN110518145A (en) | Thin-film packing structure and preparation method thereof, display panel | |
| JP2020059169A (en) | Laminate and method for manufacturing laminate | |
| CN110611039A (en) | Manufacturing method of flexible OLED display device and flexible OLED display device | |
| JP2013157228A (en) | Organic el device, and manufacturing method therefor | |
| WO2018072297A1 (en) | Oled display panel manufacturing method | |
| CN107331759A (en) | Exempt from the wafer-level packaging method and LED flip chip packaging body of organic gel | |
| TWI575793B (en) | Adhesive film | |
| WO2016177267A1 (en) | Packaging adhesive, packaging method, display panel and display device | |
| WO2020133819A1 (en) | Manufacture method for stretchable display device and stretchable display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180803 |
|
| RJ01 | Rejection of invention patent application after publication |