CN106756807A - A kind of vapor deposition source, evaporation coating device and its evaporation coating method - Google Patents
A kind of vapor deposition source, evaporation coating device and its evaporation coating method Download PDFInfo
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- CN106756807A CN106756807A CN201710058896.2A CN201710058896A CN106756807A CN 106756807 A CN106756807 A CN 106756807A CN 201710058896 A CN201710058896 A CN 201710058896A CN 106756807 A CN106756807 A CN 106756807A
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- nozzle
- control structure
- vapor deposition
- deposition source
- crucible cover
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Embodiments of the invention provide a kind of vapor deposition source, evaporation coating device and its evaporation coating method, are related to display technology field, can improve the homogeneity of evaporation.The vapor deposition source, including crucible cover, nozzle are arranged on the crucible cover, and the nozzle is beyond the outer surface of the crucible cover；Also include the first control structure, first control structure drives the nozzle to be rotated relative to the crucible cover at the uniform velocity original place.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of vapor deposition source, evaporation coating device and its evaporation coating method.
Background technology
At present, OLED display device because with manufacture craft is simple, Color tunable, it is low in energy consumption many advantages, such as, in display
All it is the focus of exploitation and investment with lighting field.As the purposes of OLED display device is further extensive, its manufacture craft also day
Become ripe.Currently, the conventional preparation method of OLED display device includes that evaporation, inkjet printing, heat pass the various ways such as print.At this
In a little preparation methods, evaporation mode is a kind of method of comparative maturity, and has applied to volume production.
But when being deposited with using evaporation coating device of the prior art, after organic molecule sprays from vapor deposition source, in being in
Between the few states in many peripheries so that the homogeneity of evaporation is poor, so as to cause the brightness homogeneity of OLED display device poor.
The content of the invention
Embodiments of the invention provide a kind of vapor deposition source, evaporation coating device and its evaporation coating method, can improve the homogeneity of evaporation.
To reach above-mentioned purpose, embodiments of the invention are adopted the following technical scheme that：
First aspect, there is provided a kind of vapor deposition source, including crucible cover, nozzle are arranged on the crucible cover, and the nozzle
Beyond the outer surface of the crucible cover；Also include the first control structure, first control structure drives the nozzle with respect to institute
Crucible cover at the uniform velocity original place is stated to rotate.
Preferably, first control structure is corresponded with the nozzle.
Preferably, the vapor deposition source also includes the second control structure and is fixed on the dredging part of the nozzle interior；Institute
The second control structure is stated for driving the dredging part to be moved up and down in the nozzle.
It is further preferred that having hollow space between the inner and outer wall of the nozzle, the hollow space is around institute
State the circle of inwall one to set, second control structure is arranged on the hollow space.
It is further preferred that second control structure includes at least one electromagnet, the dredging part is included at least
One spring.
It is further preferred that the spring is multiple, multiple springs are arranged successively from top to bottom in the nozzle.
A kind of second aspect, there is provided evaporation coating device, including the vapor deposition source described in first aspect.
The third aspect, there is provided a kind of evaporation coating method of evaporation coating device as described in second aspect, methods described includes：Work as steaming
During plating, the first control structure drives nozzle with the relative crucible cover original place uniform rotation in the first direction of the first preset rotation speed；Wherein,
The first direction is clockwise or counterclockwise.
Preferably, methods described also includes：When nozzle is dredged, first control structure drives the nozzle with second
Preset rotation speed is rotated relative to the crucible cover original place in a second direction；The second direction is opposite to the first direction；Wherein,
Second preset rotation speed is more than or equal to first preset rotation speed.
Based on above-mentioned, it is preferred that methods described also includes：When nozzle is dredged, the second control structure drives dredging part
Moved up and down in the nozzle.
The embodiment of the present invention provides a kind of vapor deposition source, evaporation coating device and its evaporation coating method, by setting in vapor deposition source the
One control structure, when evaporation process is carried out, the first control structure drives nozzle to be rotated relative to crucible cover at the uniform velocity original place, and such one
Come, sprayed from nozzle again after the organic molecule for spraying is sufficiently mixed in nozzle so that the organic molecule of ejection is more uniform,
So as to improve the homogeneity of evaporation film-forming.On this basis, because nozzle rotates, cause under the action of the centrifugal force from nozzle spray
The scope of the organic molecule for going out is wider, so that the film forming that can increase vapor deposition source ensures area's area.
Further, since nozzle is in rotation status during whole evaporation so that organic molecule cannot be big in a certain position
Amount accumulation, such that it is able to reduce evaporation during spray nozzle clogging probability.Further, if nozzle is blocked, the first control
Structure is reversely rotated by controlling nozzle, is made to be blocked in the organic material in nozzle and is loosened in the presence of reverse centrifugal force
Fall, so as to reach the effect of dredging nozzle.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is a kind of structural representation one of vapor deposition source provided in an embodiment of the present invention；
Fig. 2 is a kind of structural representation two of vapor deposition source provided in an embodiment of the present invention；
The schematic diagram of the evaporation effect of the vapor deposition source that Fig. 3 is provided for prior art；
Fig. 4 is the schematic diagram of the evaporation effect of vapor deposition source provided in an embodiment of the present invention；
Fig. 5 is a kind of structural representation one of nozzle provided in an embodiment of the present invention；
Fig. 6 is a kind of structural representation two of nozzle provided in an embodiment of the present invention；
Fig. 7 is a kind of structural representation three of nozzle provided in an embodiment of the present invention；
Fig. 8 is a kind of structural representation four of nozzle provided in an embodiment of the present invention.
Reference
10- crucible covers；20- nozzles；21- inwalls；22- outer walls；The control structures of 30- first；The control structures of 40- second；50-
Dredging part.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
The embodiment of the present invention provides a kind of vapor deposition source, and as depicted in figs. 1 and 2, including crucible cover 10, nozzle 20 is arranged on earthenware
On crucible lid 10, and nozzle 20 is beyond the outer surface of crucible cover 10；Also include the first control structure 30, the first control structure 30 drives
Nozzle 20 is rotated relative to the at the uniform velocity original place of crucible cover 10.
It should be noted that first, particular location of the embodiment of the present invention not to nozzle 20 on crucible cover 10 is limited
It is fixed, if for example, as shown in figure 1, vapor deposition source provided in an embodiment of the present invention is point source formula vapor deposition source, nozzle 20 can be arranged on
The center of crucible cover 10；As shown in Fig. 2 if vapor deposition source provided in an embodiment of the present invention is line source formula vapor deposition source, nozzle 20 can
Uniformly arranged with crucible cover 10.
Wherein, the concrete shape not to nozzle 20 is defined, and the shape of nozzle 20 is only to illustrate in Fig. 1 and Fig. 2.
Additionally, it will be understood by those skilled in the art that the first control structure 30 drives nozzle 20 with respect to the original place of crucible cover 10
During rotation, vapor deposition source inside should be kept in sealing state.
Second, nozzle 20 is beyond the outer surface of crucible cover 10, i.e. as depicted in figs. 1 and 2, the upper surface of nozzle 20 is higher by
The upper surface of crucible cover 10.
Wherein, it will be understood by those skilled in the art that material to be deposited will spray from nozzle 20, crucible cover 10 and nozzle 10
It is the hollow structure of both ends open that corresponding position should be provided with through hole, and nozzle 20, and nozzle 20 can be from crucible cover 10
Surface side is extended to beyond the outer surface of crucible cover 10 through through hole, it is also possible to be set directly at the outer surface of crucible cover 10,
The hollow space of nozzle 20 is corresponding with through hole, and other set-up modes are can also be certainly.
3rd, the embodiment of the present invention is not limited specifically the first control structure 30, and for example can be, but not limited to is electricity
Machine.
Wherein, the first control structure 30 and the on-link mode (OLM) of nozzle 20 are not defined, nozzle 20 can be driven to carry out
Rotate, for example, can be, but not limited to be directly to drive nozzle 20 to be rotated by the rotating shaft of motor.
Additionally, the specific set location to the first control structure 30 is not defined, as depicted in figs. 1 and 2, can with but not
It is limited to be arranged on crucible cover 10.
Furthermore, the first control structure 30 and the corresponding relation of nozzle 10 are not defined, with the first control structure in Fig. 2
30 are illustrated with the one-to-one corresponding of nozzle 10, it is of course also possible to be that a control structure 30 controls multiple nozzles 10 simultaneously.
4th, the first control structure 30 drives nozzle 20 to be rotated relative to the at the uniform velocity original place of crucible cover 10, and the original place of nozzle 20 rotates
Refer to that under the visual angle of the vapor deposition source shown in Fig. 1 and Fig. 2, nozzle 20 will not occur left and right and move when rotating with respect to crucible cover 10
It is dynamic or movable, can only be rotated clockwise or counterclockwise along the plane parallel to crucible cover 10.
The uniform rotation of nozzle 20 refers to that nozzle 20 is rotated with same speed when rotating in the same direction.That is, nozzle 20
During rotating clockwise, rotated with First Speed；During nozzle 20 is rotated counterclockwise, rotated with second speed.First speed
Degree can be with equal with second speed, it is also possible to unequal.The rotating speed of nozzle 20 is controlled by the first control structure 30.
5th, as shown in figure 3, when evaporation process is carried out, nozzle 20 does not rotate, the film forming being ejected on substrate ensures area
Area is substantially equal to the area of the hollow space of nozzle 20.As shown in figure 4, when evaporation process is carried out, the first control structure 30 is controlled
Nozzle processed 20 rotates, then under the action of the centrifugal force, the film forming being ejected on substrate ensures that the area in area can be significantly greater than nozzle 20
Hollow space area.
The embodiment of the present invention provides a kind of vapor deposition source, by setting the first control structure 30 in vapor deposition source, when evaporation work
When skill is carried out, the first control structure 30 drives nozzle 20 to be rotated relative to the at the uniform velocity original place of crucible cover 10, and so, to be sprayed has
Machine molecule sprays from nozzle 20 again after being sufficiently mixed in nozzle 20 so that the organic molecule of ejection is more uniform, so as to improve
The homogeneity of evaporation film-forming.On this basis, because nozzle 20 rotates, cause what is sprayed from nozzle 20 under the action of the centrifugal force
The scope of organic molecule is wider, so that the film forming that can increase vapor deposition source ensures area's area.
Further, since nozzle 20 is in rotation status during whole evaporation so that organic molecule cannot be in a certain position
A large amount of accumulation, such that it is able to reduce the probability that nozzle 20 during evaporation is blocked.Further, if nozzle 20 is blocked, the
One control structure 30 is reversely rotated by controlling nozzle 20, makes the organic material that is blocked in nozzle 20 in the work of reverse centrifugal force
Dropped with lower loosening, so as to reach the effect of dredging nozzle 20.
Preferably, as shown in Fig. 2 the first control structure 30 is corresponded with nozzle 20.
That is, one one nozzle 20 of control of the first control structure 30 is carried out clockwise or counterclockwise.
The embodiment of the present invention is corresponded by making the first control structure 30 and nozzle 20, is capable of achieving to each nozzle 20
Individually control, when evaporation process is carried out, all the first control structure 30 controls whole nozzles 20 to rotate, and in dredging nozzle rank
Section is, it is necessary to the first control structure 30 corresponding to the nozzle 20 of dredging starts, it is not necessary to corresponding to the nozzle 20 of dredging first
Control structure 30 then without starting, so, can both reduce power consumption, again can be with the control structure 30 of prolonging nozzle 20 and first
Service life.
Preferably, as shown in figure 5, the vapor deposition source also includes the second control structure 40 and is fixed on dredging inside nozzle 20
Logical part 50；Second control structure 40 is used to drive dredging part 50 to be moved up and down in nozzle 20.
It should be noted that first, specific set location of the embodiment of the present invention not to the second control structure 40 is limited
It is fixed, the outside of nozzle 20 can be for example arranged on as shown in Figure 3, it is also possible to be arranged on crucible cover 10, can also set certainly
In other positions.
Additionally, the number to the second control structure 40 is not defined, can be according to the structure of dredging part 50 and nozzle 20
Size reasonable set.
Second, concrete structure and fixed form nozzle 20 in of the embodiment of the present invention not to dredging part 50 are carried out
Limit, do not influence the ejection of material to be deposited as far as possible.For example, as shown in figure 3, dredging part 50 is the hollow of both ends open
Structure, its cross-sectional area is slightly less than the cross-sectional area of nozzle 20, and the second control structure 40 is dredged part 50 and existed by Magnetic Control
Moved up and down in nozzle 20.
Wherein, the material for dredging part 50 is not defined, meets high temperature resistant, good heat conductivity, is difficult deformation and not
Reacted with material to be deposited.The material of such as dredging part 50 can select the metals such as titanium, copper, aluminium, it is also possible to select
The materials such as quartz, ceramics.
The embodiment of the present invention by setting dredging part 50 inside nozzle 20, when nozzle 20 is blocked, tie by the second control
The control dredging part 50 of structure 40 is moved up and down in nozzle 20, can further improve the dredging effect of nozzle 20.
It is further preferred that as shown in fig. 6, between the inwall 21 and outer wall 22 of nozzle 20 have hollow space, it is described in
Empty part is enclosed around inwall 21 1 and is set, and the second control structure 40 is arranged on the hollow space.
Wherein, it will be understood by those skilled in the art that having hollow space between inwall 21 and outer wall 22, and the He of inwall 21
Outer wall 22 necessarily has coupling part to couple together inwall 21 and outer wall 22 between the two as the wall of nozzle 20.In order to avoid
Material to be deposited enters hollow space and produces influence to the second control structure 40, and the embodiment of the present invention is preferred, inwall 21 and outer
Wall 22 is all connected with the top end and bottom end of nozzle 20.
Additionally, the second control structure 50 can be fixed on inwall 21 as shown in Figure 7, it is also possible to be fixed on outer wall 22.
The embodiment of the present invention is arranged on what is surrounded by the inwall 21 and outer wall 22 of nozzle 20 by by the second control structure 40
In hollow space, on the basis of realizing that control dredging part 50 is moved up and down, material to be deposited can have both been avoided to be controlled to second
Structure processed 40 is caused damage, and the ejection that the second control structure 40 can be avoided to treat deposition material again is impacted.
It is further preferred that as shown in Figure 7 and Figure 8, the second control structure 40 includes at least one electromagnet, dredges part
50 include at least one spring.
I.e., it is possible to be that one spring of multiple magnet controls carries out elastic shrinkage, or multiple magnet controls are more
Individual spring carries out elastic shrinkage, can also be that a magnet control multiple spring carries out elastic shrinkage certainly.
Wherein, electromagnet can be galvanization after producing the device of magnetic force, electromagnet to be powered, can produce electromagnetic field, such as
Shown in Fig. 7, spring shrinks in the presence of the magnetic force that electromagnet is produced；After changing the sense of current or closing energization, electromagnetism
Iron produces reverse magnetic force or magnetic force to disappear, now, as shown in figure 8, spring stretches naturally.For electromagnet and the number of spring,
Can rationally set as the case may be, it is ensured that spring is arranged in the range of the magnetic force of electromagnet generation.
Additionally, in order to reduce the influence that spring treats the ejection of deposition material, spring should try one's best the inwall of nozzle 20
21 are set.
Furthermore, can when inwall 21 sets tiny projection or groove or otherwise prevents electromagnet from powering off,
Spring is fallen to inside crucible body.
The embodiment of the present invention is dredged by way of using magnet control spring to nozzle 20, that is, save dredging
The installation space of the control structure 40 of part 50 and second, reduces the influence of the ejection for treating deposition material again.
It is further preferred that set multiple springs in nozzle 20, multiple springs in nozzle 20 from top to bottom successively
Arrangement.
That is, multiple springs should arrange successively, not overlapped between spring.
The embodiment of the present invention is set to multiple by by spring, can both reduce the requirement of the magnetic force produced to electromagnet,
The dredging effect of nozzle 20 can be lifted again.
The embodiment of the present invention also provides a kind of evaporation coating device, including above-mentioned vapor deposition source.
Evaporation coating device provided in an embodiment of the present invention includes above-mentioned vapor deposition source, the beneficial effect of beneficial effect and above-mentioned vapor deposition source
Really identical, here is omitted.
The embodiment of the present invention also provides a kind of evaporation coating method of above-mentioned evaporation coating device, and methods described includes：
When evaporation, the first control structure 30 drives nozzle 20 with the first preset rotation speed in the first direction with respect to crucible cover 10
Original place uniform rotation；Wherein, the first direction is clockwise or counterclockwise.
Herein, the size not to the first preset rotation speed is defined, and can be configured according to specific applicable cases.
The embodiment of the present invention provides a kind of evaporation coating method of evaporation coating device, when evaporation process is carried out, by the first control
Structure 30 drives nozzle 20 to be rotated relative to the at the uniform velocity original place of crucible cover 10, and so, organic molecule to be sprayed is in nozzle 20
Sprayed from nozzle 20 again after being sufficiently mixed so that the organic molecule of ejection is more uniform, so as to improve the homogeneous of evaporation film-forming
Property.On this basis, because nozzle 20 rotates, under the action of the centrifugal force cause from nozzle 20 spray organic molecule scope more
Extensively, so that the film forming that can increase vapor deposition source ensures area's area.
Further, since nozzle 20 is in rotation status during whole evaporation so that organic molecule cannot be in a certain position
A large amount of accumulation, such that it is able to reduce the probability that nozzle 20 during evaporation is blocked.
Preferably, methods described also includes：
When nozzle 20 is dredged, the first control structure 30 drives nozzle 20 with the second preset rotation speed in a second direction with respect to earthenware
Crucible lid 10 is rotated；The second direction is opposite to the first direction.
Herein, the first control structure 30 drives nozzle 20 to be rotated relative to crucible cover 10 in a second direction with the second preset rotation speed
When, can be uniform rotation, or speed change is rotated.
Additionally, second direction is opposite with first direction, i.e. when first direction is clockwise direction, second direction is then inverse
Clockwise；Accordingly, when first direction is counter clockwise direction, second direction is then for clockwise.
Preferably, second preset rotation speed is more than or equal to first preset rotation speed.
The evaporation coating method of evaporation coating device provided in an embodiment of the present invention, when dredging nozzle is needed, the first control structure 30
Drive nozzle 20 to reversely rotate, the solid-state material falls back to be deposited being bonded on nozzle 20 can be made in the presence of reverse centrifugal force,
So as to reach the purpose of dredging nozzle 20, on this basis, by making the second preset rotation speed more than the first preset rotation speed, Ke Yijin
One step improves the dredging effect of nozzle 20, shortens the dredging time of nozzle 20.
In order to further improve the dredging effect to nozzle 20, the embodiment of the present invention is preferred, and methods described also includes：
When nozzle 20 is dredged, the second control structure 40 drives dredging part 50 to be moved up and down in nozzle 20.
The above, specific embodiment only of the invention, but protection scope of the present invention is not limited thereto, and it is any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all contain
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (10)
1. a kind of vapor deposition source, including crucible cover, nozzle is arranged on the crucible cover, and the nozzle is beyond the crucible cover
Outer surface；Characterized in that, also including the first control structure, first control structure drives the relatively described crucible of nozzle
Lid at the uniform velocity original place rotates.
2. vapor deposition source according to claim 1, it is characterised in that a pair of first control structure and the nozzle 1
Should.
3. vapor deposition source according to claim 1, it is characterised in that also including the second control structure and be fixed on the nozzle
Internal dredging part；Second control structure is used to drive the dredging part to be moved up and down in the nozzle.
4. vapor deposition source according to claim 3, it is characterised in that there is hollow bulb between the inner and outer wall of the nozzle
Point, the hollow space is enclosed around the inwall one and set, and second control structure is arranged on the hollow space.
5. vapor deposition source according to claim 4, it is characterised in that second control structure includes at least one electromagnetism
Iron, the dredging part includes at least one spring.
6. vapor deposition source according to claim 5, it is characterised in that the spring is multiple, and multiple springs are described
Arranged successively from top to bottom in nozzle.
7. a kind of evaporation coating device, it is characterised in that including the vapor deposition source described in claim any one of 1-6.
8. a kind of evaporation coating method of evaporation coating device as claimed in claim 7, it is characterised in that methods described includes：
When evaporation, the first control structure drives nozzle, and with the first preset rotation speed, relative crucible cover original place at the uniform velocity turns in the first direction
It is dynamic；
Wherein, the first direction is clockwise or counterclockwise.
9. method according to claim 8, it is characterised in that methods described also includes：
When nozzle is dredged, first control structure drives the nozzle relatively described in a second direction with the second preset rotation speed
Crucible cover original place rotates；
The second direction is opposite to the first direction；
Wherein, second preset rotation speed is more than or equal to first preset rotation speed.
10. method according to claim 8 or claim 9, it is characterised in that methods described also includes：
When nozzle is dredged, the second control structure drives dredging part to be moved up and down in the nozzle.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110195210A (en) * | 2019-07-03 | 2019-09-03 | 京东方科技集团股份有限公司 | Crucible, evaporation source and evaporated device |
| CN111424240A (en) * | 2020-05-29 | 2020-07-17 | 云谷（固安）科技有限公司 | Evaporation crucible |
| CN112680698A (en) * | 2021-03-15 | 2021-04-20 | 苏州盟萤电子科技有限公司 | Heating crucible for vacuum evaporation and vacuum evaporation device |
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