CN102534529B - Magnetron sputtering source and magnetron sputtering equipment - Google Patents
Magnetron sputtering source and magnetron sputtering equipment Download PDFInfo
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- CN102534529B CN102534529B CN201010621854.3A CN201010621854A CN102534529B CN 102534529 B CN102534529 B CN 102534529B CN 201010621854 A CN201010621854 A CN 201010621854A CN 102534529 B CN102534529 B CN 102534529B
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Abstract
The invention provides a magnetron sputtering source and magnetron sputtering equipment. The magnetron sputtering source comprises a magnetron and a driving device which are connected, wherein the driving device is used for driving the magnetron to scan the whole target area in a spiral line track, so that when the magnetron sputtering source is applied to a magnetron sputtering process, areas of a target can be effectively sputtered, and a problem that some areas on the target cannot be fully utilized is avoided; and moreover, the retention period of the magnetron in the center and on the edge of the target is effectively adjusted by adjusting the running speed of the driving device, so that the consumption rates of the areas of the target tend to be consistent; and therefore, the utilization rate of the target is effectively improved. The magnetron sputtering equipment also can effectively improve the utilization rate of the target.
Description
Technical field
The present invention relates to microelectronic processing technique field, particularly, relate to a kind of controlled sputtering source and apply the magnetron sputtering equipment of this controlled sputtering source.
Background technology
In microelectronic product industry, magnetron sputtering technique, as one of important means of producing the products such as unicircuit, liquid-crystal display, thin-film solar cells and LED, is subject to the great attention of lots of manufacturers.
Referring to Fig. 1, is a kind of structure principle chart of typical magnetron sputtering equipment.This equipment mainly comprises: processing chamber 1, be arranged at processing chamber 1 lower inside position electrostatic chuck 3, be arranged at target 2 above processing chamber 1 and magnetron 4 and driven by magnetron motor 5.In addition, the lower end or sidewall of processing chamber 1 are also connected with air extractor 13.Its technological process is as follows: first, pass in processing chamber 1 for the formation of plasma body process gas (such as, argon gas etc.), under the acting in conjunction of the Electric and magnetic fields in chamber, the surface of the part ion bombardment target 2 in plasma body, the part of atoms on target 2 surface is come off, and deposits to substrate surface to be processed to form required rete.
In each assembly of aforesaid device, the project organization of target and magnetron has very important effect for the result of sputtering technology.Especially, when filling some dark/wide holes higher than (ratio of the finger-hole gap degree of depth and width) and groove, require in target as sputter process, keep higher metal ionization level.For obtaining higher ionization level, one of comparatively conventional method is the active area reducing magnetron, thus obtains higher power density in the unit surface of target.Meanwhile, all sputtered in order to ensure each region of target material surface, need to drive magnetron to carry out high-speed mobile scanning in target region by a kind of driving mechanism, to realize sputtering to target regional, to improve the utilization ratio of target.
Referring to Fig. 2, is a kind of structural representation of driven by magnetron mechanism.This institution staff process is as follows: motor drives transmission rod 74 to be rotated by transmission shaft 70; Moving gear 76 on transmission rod 74 circles around central shaft 72 with transmission rod 74; Fixed gear 62 does not rotate with transmission shaft 70, and under the engagement of this fixed gear 62, rotation occurs moving gear 76; Gear 78 engages with moving gear 76 and carries out rotation, and is driven magnetron 84 and counterweight 86 to carry out synchronous rotary with gear 78 by union lever 80; Thus drive magnetron 84 to scan target with certain movement locus within the scope of target.In addition, the other end of transmission rod 74 is also connected with the second counterweight 88, for the moment at center of equilibrium axle 72 two ends, the stability of increase rotation.
Referring to Fig. 3, is the running orbit schematic diagram of magnetron in driving mechanism shown in Fig. 2.As shown in the figure, the footprint that not only magnetron runs under the drive of above-mentioned driving mechanism cannot cover whole target region, and both made the density of the track while scan of magnetron in the region that covers at magnetron track also uneven, be embodied in, track near target center is closeer, and the track density near target rim is then less.For these reasons, certainly will will cause the difference of the wear rate of target, after target region is exhausted wear rate faster, namely whole target will cancel, and region target not being consumed and not being exhausted cannot be used by continuation, thus cause the serious waste of target.Because target price is very expensive, if higher target utilization can not be reached cause huge cost burden by enterprise.
For solving the problem, technician takes the mode adjusting motor speed to obtaining uniform target wear rate.Specific practice is, the rotating speed of the motor that then slows down when magnetron operates in target rim region, to extend the residence time of magnetron in this region; Then accelerate the rotating speed of motor when magnetron operates in its central region, to shorten the residence time of magnetron in this region, thus the wear rate of target center and fringe region is reached unanimity.But because the magnetron in above-mentioned driving mechanism scans target to be similar to planetary movement locus, this magnetron carries out continuous shuttles motion between target rim and central zone.Therefore, want the method realizing above-mentioned electric machine speed regulation, motor will be made to run under the frequency of high acceleration/deceleration, not only have a strong impact on the work-ing life of motor, and due to too complicated to the control process of motor, cause the effect of practical application unsatisfactory.
Therefore, need a kind of running orbit of magnetron that can make at present badly and rationally cover whole target plane, effectively can improve again the technical scheme of target utilization.
Summary of the invention
For solving the problem, the invention provides a kind of controlled sputtering source, it effectively can improve target utilization.
For solving the problem, the present invention also provides a kind of magnetron sputtering equipment, and it effectively can improve target utilization equally.
For this reason, the invention provides a kind of controlled sputtering source, comprise magnetron and drive unit, described magnetron is connected with described drive unit, and described drive unit scans whole target region with spiral yarn shaped track for driving described magnetron.
Wherein, drive unit comprises central shaft, rotate in a circumferential direction portion and radial motion portion; Wherein, radial motion portion carries out straight reciprocating motion for driving the radial direction of magnetron centrally axle, and the portion that rotates in a circumferential direction is rotated around central shaft for driving radial rotary portion and magnetron; Magnetron for moving with spiral yarn shaped track under the acting in conjunction in the portion of rotating in a circumferential direction and radial motion portion.
Wherein, rotate in a circumferential direction between portion and radial motion portion and be provided with driving section, driving section is used for the radial motion of the rotary motion in the portion of rotating in a circumferential direction being transmitted as radial motion portion; Further, the radial motion in radial motion portion and the rotary motion in the portion of rotating in a circumferential direction synchronous.
Wherein, the portion of rotating in a circumferential direction comprises wheel casing, and wheel casing carries out around central shaft the motion that rotates in a circumferential direction; Radial motion portion comprises radial tooth bar, and radial tooth bar carries out radial translational motion relative to the portion of rotating in a circumferential direction; Driving section comprises at least one and is arranged at transmitting gear in wheel casing, and transmitting gear carries out rotation while carrying out rotating in a circumferential direction with wheel casing, and radial tooth bar and transmitting gear carry out radial translational motion under nibbling the driving effect being incorporated in transmitting gear.
Wherein, driving section also comprises turbine and worm screw, wherein, and scroll bar and central axis and do not rotate in a circumferential direction with wheel casing; Worm gear synchronously rotates in a circumferential direction with wheel casing, and is meshed with worm screw and rotation occurs; Transmitting gear is subject to the driving of turbine and rotation occurs, and drives radial tooth bar to carry out radial translational motion to make described transmitting gear.
Wherein, driving section also comprises at least one pair of twisted spur gear, and wherein, in a pair twisted spur gear one, for determine twisted spur gear, and not to rotate in a circumferential direction with described wheel casing with central axis; Another one in a pair twisted spur gear is dynamic twisted spur gear, and dynamic twisted spur gear synchronously rotates in a circumferential direction with wheel casing, and rotation occurs with determining twisted spur gear to be meshed; Transmitting gear is subject to dynamic helical gear driving and rotation occurs, and drives radial tooth bar to carry out radial translational motion to make described transmitting gear.
Wherein, driving section also comprises a fixed gear, wherein, and fixed gear and central axis and do not rotate in a circumferential direction with described wheel casing; Be meshed with fixed gear and rotation occurs while transmitting gear synchronously rotates in a circumferential direction with wheel casing, drive radial tooth bar to carry out radial translational motion to make described transmitting gear.
Wherein, drive unit also comprises rotating power source, rotates around central shaft for driving the portion that rotates in a circumferential direction.
Wherein, controlled sputtering source also comprises control unit, for when radial motion portion arrives the end of its rectilinear path, controls rotating power source reverse rotation.
Wherein, drive unit also comprises elastic holders; Control unit is used for when radial motion portion arrives the end of its rectilinear path, control rotating power source continue to rotate to an angle according to original sense of rotation after reverse rotation again; Elastic holders is used for continuing, in the process of rotation, to make the end in radial motion portion and transmitting gear keep Elastic Contact according to original sense of rotation in rotating power source.
Wherein, elastic joint part comprises the spring and spring stop part that are arranged at wheel casing the same side, and spring is between wheel casing and spring stop part.
Wherein, drive unit also comprises the drive shaft being arranged at rotating power source and rotating in a circumferential direction between portion, and drive shaft and central axis and the portion of rotating in a circumferential direction described in can carrying out rotating driving relative to central shaft rotate.
In addition, the present invention also provides a kind of magnetron sputtering equipment, comprises processing chamber and target, is provided with the controlled sputtering source that the invention described above provides above target, for carrying out uniform magnetic field scanning to target material surface in magnetron sputtering technique.
The present invention has following beneficial effect:
Controlled sputtering source provided by the invention comprises magnetron and drive unit, and above-mentioned magnetron can scan whole target region with spiral yarn shaped track under the driving of drive unit.Therefore, the running orbit of above-mentioned magnetron effectively can cover all regions of target plane, thus the problem avoiding the target utilization that causes because target subregion cannot be covered by magnetron track low.And, in the process that magnetron scans target plane, can according to the wear rate of target regional in the radial direction, and the travelling speed of drive unit when regulating magnetron to move to this region, thus regulate magnetron in the residence time of target regional in the radial direction, and then the wear rate of respective regions on adjustment target, to reach unanimity, improve the utilization ratio of target to make the wear rate of regional on target.And, controlled sputtering source provided by the invention makes magnetron scan target with spiral yarn shaped track, in the scanning process to whole target, only need carry out Primary regulation when magnetron moves to the junction of target rim and central zone to motor speed to operate, thus disadvantageous effect can not be caused to the work-ing life of the rotating power source of motor etc.; Therefore, controlled sputtering source provided by the invention, while effectively regulating motor speed with the sputter rate effectively regulating target center and fringe region, effectively can avoid the impact on electrical machinery life.
Magnetron sputtering equipment provided by the invention comprises processing chamber and target, and the controlled sputtering source applied the invention described above and provide carries out magnetic field scanning to target.Therefore, magnetron sputtering equipment provided by the invention can make the wear rate of regional on target reach unanimity equally, thus effectively improves the utilization ratio of target.
Accompanying drawing explanation
Fig. 1 is a kind of structure principle chart of typical magnetron sputtering equipment;
Fig. 2 is a kind of structural representation of driven by magnetron mechanism;
Fig. 3 is the running orbit schematic diagram of magnetron in driving mechanism shown in Fig. 2;
Fig. 4 is the running orbit schematic diagram of magnetron in controlled sputtering source provided by the invention;
Fig. 5 is the structural representation of the first specific embodiment of controlled sputtering source provided by the invention;
Fig. 6 is in the structural representation of different operating state for controlled sputtering source shown in Fig. 5;
The running orbit schematic diagram that Fig. 7 is the magnetron of controlled sputtering source shown in Fig. 5;
Fig. 8 is the structural representation of controlled sputtering source the second specific embodiment provided by the invention; And
Fig. 9 is the structural representation of the third specific embodiment of controlled sputtering source provided by the invention.
Embodiment
For making those skilled in the art understand technical scheme of the present invention better, below in conjunction with accompanying drawing, controlled sputtering source provided by the invention and the magnetron sputtering equipment of applying this controlled sputtering source are described in detail.
Controlled sputtering source provided by the invention comprises magnetron and for driving the drive unit of magnetron.Wherein, magnetron can scan whole target region with spiral yarn shaped track under the driving of drive unit.
Concrete, above-mentioned drive unit can be set to comprise central shaft, the structure in rotate in a circumferential direction portion and radial motion portion; The radial direction of magnetron centrally axle is driven to carry out straight reciprocating motion by above-mentioned radial motion portion, and drive radial rotary portion and magnetron to be rotated around central shaft by the above-mentioned portion of rotating in a circumferential direction, thus make magnetron have spiral yarn shaped running orbit under the acting in conjunction in the portion of rotating in a circumferential direction and radial motion portion simultaneously.
Referring to Fig. 4, is the schematic diagram of the magnetron running orbit of controlled sputtering source provided by the invention.From figure shown in figure, apply controlled sputtering source provided by the invention and magnetron can be made to be scanned up to target center position along certain spiral yarn shaped track gradually by target rim, or, the marginal position of target is scanned up to gradually by target center; And magnetron track not in background technology is as shown in Figure 3 such, shuttle back and forth at target rim and central zone and scan, therefore, apply controlled sputtering source provided by the invention and can accelerate its travelling speed when magnetron moves to its central region, to shorten the residence time of magnetron in its central region, thus correspondingly reduce the wear rate of its central region; And its travelling speed that slows down when magnetron moves to target rim region, to extend the residence time of magnetron in target rim region, thus correspondingly improve the wear rate in target rim region; By target rim can be made after above-mentioned adjustment consistent with the wear rate region of central zone, thus when avoiding that on target, a certain region is used up and the problem that other region is not fully utilized, to improve the utilization ratio of target.And, because controlled sputtering source provided by the invention makes magnetron scan target with spiral yarn shaped track; Therefore, complete once to the scanning of whole target, only need carry out Primary regulation when magnetron moves to the junction of target rim and central zone to motor speed and operate; And the magnetron running orbit in background technology is planetary track, complete once to the scanning of whole target, need even to convert motor speed for tens times several times continuously; As can be seen here, controlled sputtering source provided by the invention, while effectively regulating motor speed with the sputter rate effectively regulating target center and fringe region, effectively can avoid the impact on electrical machinery life.
In actual applications, usually driving section can be set above-mentioned rotating in a circumferential direction between portion and radial motion portion, by the radial motion that the rotary motion in the portion of rotating in a circumferential direction transmission is radial motion portion by this driving section; Meanwhile, make the radial motion in radial motion portion synchronous with the rotary motion in the portion of rotating in a circumferential direction, that is the two is continuous action relation, only has when the portion of rotating in a circumferential direction rotates, and radial motion portion just can be driven synchronously to carry out with it radial translational motion.The advantage of such setting is, only needs can realize the synchronous driving of the portion of rotating in a circumferential direction with radial motion portion for the portion of rotating in a circumferential direction arranges a rotating power source, thus can effective simplified apparatus mechanism, and saves the manufacturing cost of equipment.Certainly, technician also can arrange propulsion source for the portion of rotating in a circumferential direction and radial motion portion respectively, thus can carry out independent control to the running status in the portion of rotating in a circumferential direction and radial motion portion, to obtain more flexile magnetron running orbit.But, in order to obtain good repeatability, preferably, above-mentioned portion and the radial motion portion of rotating in a circumferential direction is synchronized with the movement, and the technical scheme described in each embodiment following is the scheme be synchronized with the movement.
See also Fig. 5 and Fig. 6, wherein, Fig. 5 is the structural representation of controlled sputtering source provided by the invention first specific embodiment; Fig. 6 is in the structural representation of different operating state for controlled sputtering source shown in Fig. 5.
In the present embodiment, the drive shaft 23 that the portion of rotating in a circumferential direction of drive unit comprises wheel casing 17, is fixedly connected with wheel casing 17; This drive shaft 23 is hollow structure, and it is sleeved on the outside of central shaft 22 and carries out around central shaft 22 motion that rotates in a circumferential direction, thus drives said gear case 17 to carry out the rotary motion of circumference together.In practical application, this drive shaft 23 can be connected to the rotating power source (not shown) of a such as electric motor etc., with the driving realized the portion of rotating in a circumferential direction by this rotating power source.
The radial motion portion of drive unit comprises radial tooth bar 29, and this radial tooth bar 29 is connected with magnetron 100 by the union lever 31 running through wheel casing 17, and drives the radial direction of magnetron 100 centrally axle 22 to carry out straight reciprocating motion.
Driving section in the present embodiment comprises a pair turbine 18 and scroll bar 20, driving gear 25 and transmitting gear 27.Particularly, worm screw 20 arranges with central shaft 22 is coaxial and can not rotates in a circumferential direction with wheel casing 17 by being fixed with the structure of such as fixed support etc., and turbine 18 to be arranged in wheel casing and to carry out synchronous rotating in a circumferential direction with wheel casing 17; Turbine 18 is subject to the engagement of worm screw 20 and rotation occurs while rotating in a circumferential direction, because coaxial and the two the relative position of driving gear 25 and worm gear 18 is fixed, thus above-mentioned driving gear 25 can carry out rotation with worm gear 18, and then drive above-mentioned transmitting gear 27 to rotate, eventually through the rotating in a circumferential direction wheel casing 17 to move and be converted to the translational motion of radial tooth bar 29 of the meshing relation between this transmitting gear 27 and radial tooth bar 29; The magnetron 100 being positioned at radial tooth bar 29 end is subject to the common driving of the two and finally forms spiral yarn shaped running orbit.
When transmitting gear 27 arrives the end of the rectilinear path of radial tooth bar 29 with the position of engagement of radial tooth bar 29, rotating power source is then made to carry out reverse rotation, to drive the portion of rotating in a circumferential direction to carry out reverse rotation, drive radial tooth bar 29 to carry out reverse translational motion by above-mentioned a series of drive connection simultaneously.Fig. 5 and Fig. 6 respectively illustrates transmitting gear 27 when arriving the end positions of radial tooth bar 29, radial tooth bar 29 and the location diagram of magnetron 100 be attached thereto.In actual applications, the Reverse Turning Control that such as can realize above-mentioned rotating power source by arranging a kind of control unit for drive unit, this control unit such as can adopt micro-chip, PC etc. have the device of controlling functions and realize.In some preferred implementations, the proofing unit of sensor can also be set, accurately to detect the relative position of transmitting gear 27 with radial tooth bar 29 at above-mentioned two ends of carrying out tooth bar 29.
In addition, in order to obtain more uniform target as sputter result, the spiral trajectory of magnetron 100 each run can be made mutually to stagger certain angle, thus enable the magnetron running orbit after Multiple-Scan cover whole target region completely.Specific practice is, when transmitting gear 27 drives the radial tooth bar 29 be engaged with to the motion of wheel casing 17 lateral direction until after transmitting gear 27 and radial tooth bar 29 are separated away from the end of magnetron 100, reverse rotation again after making rotating power source continue to rotate to an angle according to original sense of rotation, thus the magnetron track oppositely and previous track are staggered some angles mutually.What need only explanation is, the above-mentioned angle making mutually to stagger between magnetron running orbit can set flexibly according to actual needs such as the spacing of the size of actual magnetic keyholed back plate, running orbit and target size, in the present embodiment, the setting that can be realized above-mentioned angle by the departing from speed of rotation after transmitting gear 27 and time length at radial tooth bar 29 of setting rotating power source.And in order to ensure when transmitting gear 27 can be made after rotating power source reverse rotation effectively to engage with radial tooth bar 29, an elastic holders can be set for drive unit, thus continue, in the process rotated according to original sense of rotation, to make the end in radial motion portion keep Elastic Contact with transmitting gear 27 all the time by this elastic holders when transmitting gear 27 arrives rotating power source behind the end of radial tooth bar 29.In the present embodiment, above-mentioned elastic holders is specially and is sleeved on union lever 31 and between wheel casing 17 and radial tooth bar 29 spring 40, and it is inner that this spring 40 is arranged at wheel casing 17; Preferably, spring stop part 41 is provided with, to be limited between wheel casing 17 and this spring stop part 41 by spring 40 at driving rack 29 and the junction of union lever 31.In actual applications, can above-mentioned spring 40 be fixed on the sidewall of wheel casing 17, also can make the union lever 31 of spring 40 between wheel casing 17 and spring stop part 41 is free to slide.Structure shown in Fig. 5 is schematic diagram when above-mentioned spring 40 and spring stop part 41 are in interacting state.
Referring to Fig. 7, is the running orbit schematic diagram of the magnetron of controlled sputtering source shown in Fig. 5.For the ease of observing, in Fig. 7, illustrate only the spiral yarn shaped track of four certain angles that mutually stagger.As shown in the figure, stagger between adjacent magnetron running orbit certain angle, and form certain interval.It is easily understood that, when the number of times that the equal and magnetron of the angle that the running orbit of each magnetron staggers scans target is abundant, uniform fold can be carried out in all regions of target, thus avoid some region of target cannot obtain the problem of effectively sputtering, to improve the utilization ratio of target.And, the running orbit of every bar magnetron is and is covered in the spiral curve of target center to fringe region layer by layer, because the line segment of the corresponding target rim of this spiral-line or central zone is continuous print line segment, therefore, can effectively regulate magnetron in the residence time of target center or fringe region by adjustment magnetron in the speed moving to different positions in this curve, thus the wear rate of adjustable target regional reaches unanimity to make the wear rate of target regional, and then improve target utilization.Further, in some preferred embodiments, by the transmission of each transmitting gear of adjustment when drive connection and the helix pitch that adjusts between the hand of spiral of magnetron track and adjacent track, thus can also be conducive to obtaining more uniform target track while scan.
In the embodiment shown in fig. 5, due to only when radial tooth bar 29 is meshed with transmitting gear 27 away from the end of magnetron (now, magnetron is positioned at the marginal position of target), radial tooth bar 29 just can be subject to the elastic contribution of spring 40 and keep Elastic Contact with transmitting gear 27, so the drive unit in the embodiment shown in Fig. 5 can only make magnetron 100 just can carry out above-mentioned dislocation operation after moving to target rim position; And when the one end near magnetron on radial tooth bar 29 is meshed with transmitting gear 27 (now, magnetron is positioned at the central position of target), above-mentioned spring 40 cannot play a role, and now rotating power source must reverse rotation immediately, otherwise transmitting gear 27 and spring stop part 41 can be made to collide.Therefore, the magnetron running orbit of each shown in Fig. 7 is magnetron and is scanned up to target center by target rim and the reciprocating path returned by former road by target center.And in order to obtain magnetron running orbit more uniformly and effectively, in another embodiment provided by the invention, the elastic holders in above-mentioned drive unit having been carried out some and has improved.
Referring to Fig. 8, is the structural representation of controlled sputtering source provided by the invention second specific embodiment.In the present embodiment, the first spring stop part 411 and the second spring stop part 412 is respectively arranged with at the two ends of union lever 31, it is inside and outside that this first spring stop part 411 and the second spring stop part 412 lay respectively at wheel casing 17, that is, be positioned at the both sides of same sidewall on wheel casing 17; And, the first spring 401 is provided with between wheel casing 17 and the first spring stop part 411, between wheel casing 17 and the second spring stop part 412, be provided with the second spring 402, correspondingly, above-mentioned first spring 401 and the second spring 402 also lay respectively at the inside and outside of wheel casing 17; Above-mentioned first spring 401, second spring 402, first spring stop part 411 and the second spring stop part 412 form the elastic holders in the present embodiment jointly.Be specially, above-mentioned first spring 401 and the first spring stop part 411 are for when radial tooth bar 29 becomes from the state be meshed with transmitting gear 27 state be separated with transmitting gear 27 away from one end of magnetron 100, make the two keep Elastic Contact, thus carry out dislocation operation when enabling magnetron 100 arrive target rim position; And the second spring 402 and the second spring stop part 412 are for when radial tooth bar 29 becomes from the state be meshed with transmitting gear 27 state be separated with transmitting gear 27 near one end of magnetron 100, make the two keep Elastic Contact, thus can dislocation operation be carried out equally when making magnetron 100 arrive target center position; In addition, between above-mentioned first spring stop part 411 and radial tooth bar 29, leave certain intervals distance, collide for avoiding transmitting gear 27 and the first spring stop part 411 and damage.
In addition, the first specific embodiment shown in the present embodiment and above-mentioned Fig. 5 and Fig. 6 is distinguished and is also, the drive shaft 23 in the present embodiment is solid construction, and this drive shaft 23 is fixedly connected with the bottom of wheel casing 17; And central shaft 22 and worm screw 20 are hollow structure, the two is all sleeved on the outside of drive shaft 23; Central shaft 22 runs through this wheel casing by the through hole 58 on wheel casing 17, its upper end and the structure of such as fixed support 16 grade be fixed be connected and not with drive shaft 23 synchronous rotary, the lower end of central shaft 22 is fixedly connected with worm screw 20.It is easily understood that the type of drive that realizes of the drive mechanism of above-mentioned drive unit and the first embodiment shown in magnetron running orbit and above-mentioned Fig. 5 and Fig. 6 have same or similar feature, thus repeat no more.
Referring to Fig. 9, is the structural representation of controlled sputtering source provided by the invention 3rd specific embodiment.In the present embodiment, the turbine in the transmission mechanism in the first specific embodiment shown in above-mentioned Fig. 5 and Fig. 6 and worm transmission structure are replaced with a pair helical gear structure.One in above-mentioned a pair twisted spur gear for determine twisted spur gear 26, its coaxial with central shaft 22 and the two be fixedly connected with; Wherein, same being fixed with the structure of such as fixed support etc. of central shaft 22 is connected; Further, drive shaft 23 structure in the present embodiment is identical or similar with the first specific embodiment above-mentioned.Another one in above-mentioned twisted spur gear is dynamic twisted spur gear 16, and this dynamic twisted spur gear 16 carries out synchronous rotating in a circumferential direction with wheel casing 17, and rotation occurs with determining twisted spur gear 26 to be meshed, thus drives the driving gear 25 coaxial with dynamic twisted spur gear 16 to rotate; This driving gear 25 and then driving transmitting gear 27 rotate, and the final translational motion driving radial tooth bar 29 to carry out radial direction.In addition, in the present embodiment, have employed and same or similar elastic holders's structure in embodiment shown in above-mentioned Fig. 8, thus repeat no more.
It is easily understood that in the drive unit of controlled sputtering source provided by the invention, driving section can also be set to multiple to gear-driven structure, make one of them straight tooth gear be fixed gear, and this fixed gear and central axis are arranged; Then be meshed with fixed gear and rotation occurs while making other transmitting gear synchronously rotate in a circumferential direction with wheel casing, and then drive radial tooth bar to carry out radial translational motion.The drive unit of this structure can realize the magnetron running orbit in the various embodiments described above equally.
It is pointed out that in the drive unit of controlled sputtering source provided by the invention, be not limited to actuation types and the gear quantity of the transmitting gear in each embodiment above-mentioned.Such as; turbine and worm drive and helical gear structure can also be applied in same drive unit simultaneously; and multiple turbine and scroll bar or twisted spur gear can be applied simultaneously; and various deformation on this basis and improvement, and every based on the distortion done by spirit of the present invention and essence with improve and also all should be considered as protection scope of the present invention.
In sum, controlled sputtering source provided by the invention can make magnetron carry out covering to whole target region scope in the mode of many spiral-line running orbits comprehensively and uniformly, and magnetron can be regulated in the residence time in each region of target by the rotating speed of this drive unit of adjustment, thus the wear rate in the adjustment each region of target; Therefore, apply controlled sputtering source provided by the invention when carrying out magnetron sputtering technique, target regional can be made all to be used effectively, and the wear rate in each region of target is reached unanimity, thus effectively improve homogeneity and the utilization ratio of target as sputter.Further, in each embodiment above-mentioned of controlled sputtering source provided by the invention, rotating power source is only used can to realize driving while the portion of rotating in a circumferential direction and radial motion portion, thus to a certain extent can simplified apparatus structure save equipment cost.
As another kind of technical scheme, the present invention also provides a kind of magnetron sputtering equipment, it at least comprises processing chamber and target, is provided with the controlled sputtering source that the invention described above provides above target, for carrying out uniform magnetic field scanning to target material surface in magnetron sputtering technique.
Based on same reason, magnetron sputtering equipment provided by the invention is when carrying out magnetron sputtering technique, target regional can be made all to be used effectively, and the wear rate in each region of target is reached unanimity, thus effectively improve homogeneity and the utilization ratio of target as sputter.
Be understandable that, the illustrative embodiments that above embodiment is only used to principle of the present invention is described and adopts, but the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (12)
1. a controlled sputtering source, is characterized in that, comprises magnetron and drive unit, and described magnetron is connected with described drive unit, and described drive unit scans whole target region with spiral yarn shaped track for driving described magnetron;
Described drive unit comprises central shaft, rotate in a circumferential direction portion and radial motion portion; Wherein,
Described radial motion portion carries out straight reciprocating motion for driving described magnetron along the radial direction of described central shaft, and described in the portion that rotates in a circumferential direction be rotated around described central shaft for driving described radial rotary portion and described magnetron;
And described magnetron is used for moving with spiral yarn shaped track under the acting in conjunction in described rotate in a circumferential direction portion and radial motion portion.
2. controlled sputtering source according to claim 1, it is characterized in that, described rotating in a circumferential direction between portion and described radial motion portion is provided with driving section, and described driving section is used for the radial motion of the rotary motion in the described portion that rotates in a circumferential direction being transmitted as described radial motion portion; Further, the radial motion in described radial motion portion is synchronous with the rotary motion in the described portion that rotates in a circumferential direction.
3. controlled sputtering source according to claim 2, is characterized in that,
The described portion of rotating in a circumferential direction comprises wheel casing, and described wheel casing carries out around described central shaft the motion that rotates in a circumferential direction;
Described radial motion portion comprises radial tooth bar, and described radial tooth bar carries out radial translational motion relative to the described portion of rotating in a circumferential direction;
Described driving section comprises at least one and is arranged at transmitting gear in described wheel casing, described transmitting gear carries out rotation while carrying out rotating in a circumferential direction with described wheel casing, and described radial tooth bar and described transmitting gear carry out radial translational motion under nibbling the driving effect being incorporated in described transmitting gear.
4. controlled sputtering source according to claim 3, is characterized in that, described driving section also comprises turbine and worm screw, wherein,
Described scroll bar and described central axis and do not rotate in a circumferential direction with described wheel casing;
Described worm gear synchronously rotates in a circumferential direction with described wheel casing, and is meshed with described worm screw and rotation occurs;
Described transmitting gear is subject to the driving of described turbine and rotation occurs, and drives described radial tooth bar to carry out radial translational motion to make described transmitting gear.
5. controlled sputtering source according to claim 3, is characterized in that, described driving section also comprises at least one pair of twisted spur gear, wherein,
In described a pair twisted spur gear one, for determine twisted spur gear, and not to rotate in a circumferential direction with described wheel casing with described central axis;
Another one in described a pair twisted spur gear is dynamic twisted spur gear, and described dynamic twisted spur gear synchronously rotates in a circumferential direction with described wheel casing, and determines twisted spur gear and be meshed with described and rotation occurs;
Described transmitting gear is subject to described dynamic helical gear driving and rotation occurs, and drives described radial tooth bar to carry out radial translational motion to make described transmitting gear.
6. controlled sputtering source according to claim 3, is characterized in that, described driving section also comprises a fixed gear, wherein,
Described fixed gear and described central axis and do not rotate in a circumferential direction with described wheel casing;
Be meshed with described fixed gear and rotation occurs while described transmitting gear synchronously rotates in a circumferential direction with described wheel casing, drive described radial tooth bar to carry out radial translational motion to make described transmitting gear.
7. according to the controlled sputtering source in claim 3 to 6 described in any one, it is characterized in that, described drive unit also comprises rotating power source, rotates around described central shaft for the portion that rotates in a circumferential direction described in driving.
8. controlled sputtering source according to claim 7, is characterized in that, described controlled sputtering source also comprises control unit, for when described radial motion portion arrives the end of its rectilinear path, controls described rotating power source reverse rotation.
9. controlled sputtering source according to claim 8, is characterized in that, described drive unit also comprises elastic holders;
Described control unit is used for when described radial motion portion arrives the end of its rectilinear path, control described rotating power source continue to rotate to an angle according to original sense of rotation after reverse rotation again;
Described elastic holders is used for continuing, in the process of rotation, to make the end in described radial motion portion and described transmitting gear keep Elastic Contact according to original sense of rotation in described rotating power source.
10. controlled sputtering source according to claim 9, is characterized in that, described elastic joint part comprises the spring and spring stop part that are arranged at described wheel casing the same side, and described spring is between described wheel casing and described spring stop part.
11. controlled sputtering sources according to claim 7, it is characterized in that, described drive unit also comprises and is arranged at described rotating power source and the described drive shaft rotated in a circumferential direction between portion, and described drive shaft and described central axis and the portion of rotating in a circumferential direction described in can carrying out rotating driving relative to described central shaft rotate.
12. 1 kinds of magnetron sputtering equipment, comprise processing chamber and target, it is characterized in that, are provided with the controlled sputtering source in claim 1-11 described in any one above described target, for carrying out uniform magnetic field scanning to target material surface in magnetron sputtering technique.
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| CN102888590A (en) * | 2012-10-23 | 2013-01-23 | 东莞宏威数码机械有限公司 | Scanning type magnetron sputtering cathode and scanning type magnetron sputtering device |
| KR102136787B1 (en) * | 2013-03-14 | 2020-07-23 | 삼성디스플레이 주식회사 | Vacuum evaporating appartus |
| CN104120390A (en) * | 2013-04-24 | 2014-10-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Driving mechanism used for driving magnetron, and magnetron sputtering processing apparatus |
| CN104746027A (en) * | 2013-12-29 | 2015-07-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Magnetron component and magnetron sputtering device |
| CN106086783B (en) * | 2016-06-30 | 2019-01-22 | 京东方科技集团股份有限公司 | A kind of radical occlusion device and its occlusion method and deposition system |
| CN109887879B (en) * | 2017-12-06 | 2021-12-17 | 北京北方华创微电子装备有限公司 | Method for covering film in hole and semiconductor processing equipment |
| CN108651015A (en) * | 2018-04-23 | 2018-10-16 | 中山市精镀机电设备有限公司 | A kind of thresing machine |
| CN110643962A (en) * | 2019-09-20 | 2020-01-03 | 深圳市晶相技术有限公司 | Semiconductor device |
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| US4995958A (en) * | 1989-05-22 | 1991-02-26 | Varian Associates, Inc. | Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile |
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Address after: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Patentee after: Beijing North China microelectronics equipment Co Ltd Address before: 100015, M5 building, No. 1 Jiuxianqiao East Road, Beijing, Chaoyang District, two South Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |