CN106751517A - 用于电层合体的存储稳定的环氧树脂组合物 - Google Patents

用于电层合体的存储稳定的环氧树脂组合物 Download PDF

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Publication number
CN106751517A
CN106751517A CN201611176356.6A CN201611176356A CN106751517A CN 106751517 A CN106751517 A CN 106751517A CN 201611176356 A CN201611176356 A CN 201611176356A CN 106751517 A CN106751517 A CN 106751517A
Authority
CN
China
Prior art keywords
composition
epoxy resin
solvent blend
solids content
storage stability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201611176356.6A
Other languages
English (en)
Chinese (zh)
Inventor
R·L·赫恩
W·E·默瑟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blue Cube Intellectual Property Co Ltd
Dow Global Technologies LLC
Original Assignee
Blue Cube Intellectual Property Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blue Cube Intellectual Property Co Ltd filed Critical Blue Cube Intellectual Property Co Ltd
Publication of CN106751517A publication Critical patent/CN106751517A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/22—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
    • C08G65/223—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring containing halogens
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201611176356.6A 2009-11-06 2010-10-08 用于电层合体的存储稳定的环氧树脂组合物 Pending CN106751517A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US25885809P 2009-11-06 2009-11-06
US61/258,858 2009-11-06
CN2010800604266A CN102695744A (zh) 2009-11-06 2010-10-08 用于电层合体的存储稳定的环氧树脂组合物

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2010800604266A Division CN102695744A (zh) 2009-11-06 2010-10-08 用于电层合体的存储稳定的环氧树脂组合物

Publications (1)

Publication Number Publication Date
CN106751517A true CN106751517A (zh) 2017-05-31

Family

ID=43707754

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201611176356.6A Pending CN106751517A (zh) 2009-11-06 2010-10-08 用于电层合体的存储稳定的环氧树脂组合物
CN2010800604266A Pending CN102695744A (zh) 2009-11-06 2010-10-08 用于电层合体的存储稳定的环氧树脂组合物

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2010800604266A Pending CN102695744A (zh) 2009-11-06 2010-10-08 用于电层合体的存储稳定的环氧树脂组合物

Country Status (7)

Country Link
US (1) US8980376B2 (https=)
EP (1) EP2496632B1 (https=)
JP (1) JP5798566B2 (https=)
KR (1) KR20120115247A (https=)
CN (2) CN106751517A (https=)
TW (1) TWI496834B (https=)
WO (1) WO2011056352A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR112012029002A2 (pt) * 2010-05-13 2015-09-08 Agrigenetics Inc uso de silagem de milho brown midrib em carne de vaca para substituir o milho
CN103045043A (zh) * 2012-12-11 2013-04-17 金继典 一种酒瓶透明光亮面油及其制备工艺
JP6447557B2 (ja) * 2016-03-24 2019-01-09 日亜化学工業株式会社 発光装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1315974A (zh) * 1998-08-14 2001-10-03 陶氏化学公司 热固性树脂组合物的粘度改性剂
CN1423678A (zh) * 1999-12-13 2003-06-11 陶氏环球技术公司 含磷元素阻燃剂环氧树脂组合物
US20090081379A1 (en) * 2007-09-21 2009-03-26 Nawrocki Daniel J Compositions and processes for manufacturing printed electronics

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
JPS6038421A (ja) 1983-08-11 1985-02-28 Mitsubishi Petrochem Co Ltd エポキシ樹脂組成物
US4550128A (en) 1984-04-16 1985-10-29 International Business Machines Corporation Epoxy composition
MY131084A (en) 1991-04-03 2007-07-31 Dow Chemical Co Epoxy resin compositions for use in electrical laminates.
US5670250A (en) 1995-02-24 1997-09-23 Polyclad Laminates, Inc. Circuit board prepreg with reduced dielectric constant
JPH10168287A (ja) 1996-12-06 1998-06-23 Dainippon Ink & Chem Inc エポキシ樹脂組成物
EP0954553B2 (en) * 1997-01-21 2008-12-10 Dow Global Technologies Inc. Latent catalysts for epoxy curing systems
WO2000076764A1 (en) * 1999-06-10 2000-12-21 Isola Laminate Systems Corp. Epoxy resin, styrene-maleic anhydride copolymer and flexibilizer
US6245696B1 (en) * 1999-06-25 2001-06-12 Honeywell International Inc. Lasable bond-ply materials for high density printed wiring boards
US6361923B1 (en) * 1999-08-17 2002-03-26 International Business Machines Corporation Laser ablatable material and its use
DE50201326D1 (de) * 2002-10-19 2004-11-18 Leuna Harze Gmbh Härtbare Epoxidharzzusammensetzung
US6855738B2 (en) 2003-06-06 2005-02-15 Dow Global Technologies Inc. Nanoporous laminates
TWI290945B (en) * 2005-11-09 2007-12-11 Taiwan Union Technology Corp Application of electrical material in high frequency and manufacturing method of the same
BRPI0621083A2 (pt) 2005-12-22 2011-11-29 Dow Global Technologies Inc composição de resina epóxi curável contendo halogênio, artigo compósito reforçado com fibra, componente de circuito elétrico, processo para produzir um artigo revestido, pré- impregnado, laminado, placa de circuito impresso (pcb), processo para preparar um artigo revestido com resina, e artigo revestido com resina
BRPI0715994A2 (pt) * 2006-10-19 2013-08-06 Dow Global Technologies Inc composiÇço termofxÁvel tendo aderÊncia melhorada a subtratos metÁlicos quando curada, processo para confeccionar um artigo revestido, processo para confeccionar um artigo compàsito reforÇado com fibra, processo para confeccionar um laminado e artigo
JP5235155B2 (ja) * 2009-04-08 2013-07-10 パナソニック株式会社 微細樹脂構造体及び光電回路基板の製造方法、微細樹脂構造体及び光電回路基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1315974A (zh) * 1998-08-14 2001-10-03 陶氏化学公司 热固性树脂组合物的粘度改性剂
CN1423678A (zh) * 1999-12-13 2003-06-11 陶氏环球技术公司 含磷元素阻燃剂环氧树脂组合物
US20090081379A1 (en) * 2007-09-21 2009-03-26 Nawrocki Daniel J Compositions and processes for manufacturing printed electronics

Also Published As

Publication number Publication date
KR20120115247A (ko) 2012-10-17
EP2496632B1 (en) 2015-04-29
TW201116576A (en) 2011-05-16
US20120225212A1 (en) 2012-09-06
US8980376B2 (en) 2015-03-17
JP5798566B2 (ja) 2015-10-21
WO2011056352A1 (en) 2011-05-12
CN102695744A (zh) 2012-09-26
EP2496632A1 (en) 2012-09-12
JP2013510224A (ja) 2013-03-21
TWI496834B (zh) 2015-08-21

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SE01 Entry into force of request for substantive examination
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Application publication date: 20170531