CN106661200B - 环氧树脂组合物、树脂片、预浸料及覆金属层叠板、印刷布线基板、半导体装置 - Google Patents
环氧树脂组合物、树脂片、预浸料及覆金属层叠板、印刷布线基板、半导体装置 Download PDFInfo
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- CN106661200B CN106661200B CN201580037762.1A CN201580037762A CN106661200B CN 106661200 B CN106661200 B CN 106661200B CN 201580037762 A CN201580037762 A CN 201580037762A CN 106661200 B CN106661200 B CN 106661200B
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- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
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- 235000006408 oxalic acid Nutrition 0.000 description 1
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- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
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- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
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- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
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- 239000012209 synthetic fiber Substances 0.000 description 1
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- 238000001721 transfer moulding Methods 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
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- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- 230000004584 weight gain Effects 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
- C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014157629A JP2016034996A (ja) | 2014-08-01 | 2014-08-01 | エポキシ樹脂組成物、プリプレグ及び金属張積層板、プリント配線基板 |
| JP2014-157629 | 2014-08-01 | ||
| PCT/JP2015/071632 WO2016017751A1 (ja) | 2014-08-01 | 2015-07-30 | エポキシ樹脂組成物、樹脂シート、プリプレグ及び金属張積層板、プリント配線基板、半導体装置 |
Publications (2)
| Publication Number | Publication Date |
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| CN106661200A CN106661200A (zh) | 2017-05-10 |
| CN106661200B true CN106661200B (zh) | 2019-12-24 |
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| Country | Link |
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| JP (1) | JP2016034996A (ko) |
| KR (1) | KR102316144B1 (ko) |
| CN (1) | CN106661200B (ko) |
| TW (1) | TWI664226B (ko) |
| WO (1) | WO2016017751A1 (ko) |
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| WO2018174447A1 (ko) * | 2017-03-22 | 2018-09-27 | 주식회사 엘지화학 | 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
| KR102049024B1 (ko) * | 2017-03-22 | 2019-11-26 | 주식회사 엘지화학 | 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
| WO2018174446A1 (ko) * | 2017-03-22 | 2018-09-27 | 주식회사 엘지화학 | 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
| KR102057255B1 (ko) | 2017-03-22 | 2019-12-18 | 주식회사 엘지화학 | 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
| JP7074278B2 (ja) | 2018-04-10 | 2022-05-24 | エルジー・ケム・リミテッド | 半導体パッケージ用熱硬化性樹脂組成物、プリプレグおよび金属箔積層板 |
| KR102246974B1 (ko) * | 2018-04-10 | 2021-04-30 | 주식회사 엘지화학 | 반도체 패키지용 열경화성 수지 조성물, 프리프레그 및 금속박 적층판 |
| KR102257926B1 (ko) | 2018-09-20 | 2021-05-28 | 주식회사 엘지화학 | 다층인쇄회로기판, 이의 제조방법 및 이를 이용한 반도체 장치 |
| JP6636599B2 (ja) * | 2018-11-30 | 2020-01-29 | 日本化薬株式会社 | エポキシ樹脂組成物、プリプレグ及び金属張積層板、プリント配線基板 |
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| CN103897143A (zh) * | 2012-12-28 | 2014-07-02 | 明和化成株式会社 | 环氧树脂、环氧树脂的制造方法及其使用 |
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| JPH05170874A (ja) * | 1991-12-19 | 1993-07-09 | Mitsui Toatsu Chem Inc | エポキシ樹脂組成物 |
| JP3476027B2 (ja) * | 1994-04-28 | 2003-12-10 | 日本化薬株式会社 | エポキシ樹脂の製造方法 |
| JP3525152B2 (ja) * | 1996-09-30 | 2004-05-10 | 独立行政法人 科学技術振興機構 | エポキシ樹脂硬化性組成物 |
| JP2004189811A (ja) * | 2002-12-10 | 2004-07-08 | Toho Tenax Co Ltd | 織物プリプレグ |
| JP5195582B2 (ja) * | 2009-03-30 | 2013-05-08 | 日立化成株式会社 | 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板 |
| SG184967A1 (en) * | 2010-04-21 | 2012-11-29 | Mitsubishi Gas Chemical Co | Heat curable composition |
| JP5754731B2 (ja) * | 2011-08-25 | 2015-07-29 | 明和化成株式会社 | エポキシ樹脂、エポキシ樹脂の製造方法、及びその使用 |
| KR101295688B1 (ko) | 2011-10-21 | 2013-08-14 | 부산대학교 산학협력단 | 유체의 회전을 이용한 액화천연가스 저장탱크의 슬로싱 저감장치 |
| JP6410405B2 (ja) * | 2012-08-01 | 2018-10-24 | 住友ベークライト株式会社 | 樹脂基板、プリプレグ、プリント配線基板、半導体装置 |
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| CN103897143A (zh) * | 2012-12-28 | 2014-07-02 | 明和化成株式会社 | 环氧树脂、环氧树脂的制造方法及其使用 |
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| Publication number | Publication date |
|---|---|
| KR20170037883A (ko) | 2017-04-05 |
| KR102316144B1 (ko) | 2021-10-22 |
| TWI664226B (zh) | 2019-07-01 |
| WO2016017751A1 (ja) | 2016-02-04 |
| CN106661200A (zh) | 2017-05-10 |
| TW201609946A (zh) | 2016-03-16 |
| JP2016034996A (ja) | 2016-03-17 |
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