CN106604878B - 电子部件包装用盖带、电子部件包装用包材和电子部件包装体 - Google Patents

电子部件包装用盖带、电子部件包装用包材和电子部件包装体 Download PDF

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Publication number
CN106604878B
CN106604878B CN201580045612.5A CN201580045612A CN106604878B CN 106604878 B CN106604878 B CN 106604878B CN 201580045612 A CN201580045612 A CN 201580045612A CN 106604878 B CN106604878 B CN 106604878B
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CN
China
Prior art keywords
cover strip
heat sealing
sealing layer
electronic
carrier band
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580045612.5A
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English (en)
Chinese (zh)
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CN106604878A (zh
Inventor
山口亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of CN106604878A publication Critical patent/CN106604878A/zh
Application granted granted Critical
Publication of CN106604878B publication Critical patent/CN106604878B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2553/00—Packaging equipment or accessories not otherwise provided for
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Laminated Bodies (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN201580045612.5A 2014-11-12 2015-11-10 电子部件包装用盖带、电子部件包装用包材和电子部件包装体 Active CN106604878B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2014-230222 2014-11-12
JP2014230222 2014-11-12
JP2015-113711 2015-06-04
JP2015113711 2015-06-04
PCT/JP2015/081653 WO2016076331A1 (ja) 2014-11-12 2015-11-10 電子部品包装用カバーテープ、電子部品包装用包材、および電子部品包装体

Publications (2)

Publication Number Publication Date
CN106604878A CN106604878A (zh) 2017-04-26
CN106604878B true CN106604878B (zh) 2018-03-20

Family

ID=55954414

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580045612.5A Active CN106604878B (zh) 2014-11-12 2015-11-10 电子部件包装用盖带、电子部件包装用包材和电子部件包装体

Country Status (5)

Country Link
JP (1) JP5983902B1 (ko)
KR (1) KR101756623B1 (ko)
CN (1) CN106604878B (ko)
TW (1) TWI647297B (ko)
WO (1) WO2016076331A1 (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6772761B2 (ja) * 2016-10-27 2020-10-21 日亜化学工業株式会社 テープフィーダ及びｌｅｄの取出し方法
JP6865647B2 (ja) * 2017-07-03 2021-04-28 デンカ株式会社 積層シート
KR20200070251A (ko) 2017-10-31 2020-06-17 덴카 주식회사 커버 필름
JP7040007B2 (ja) * 2017-12-27 2022-03-23 凸版印刷株式会社 包装材用シーラントフィルム、包装材、及び包装体
JP2019127286A (ja) * 2018-01-24 2019-08-01 信越ポリマー株式会社 カバーテープ及び包装体
JP6638751B2 (ja) * 2018-03-07 2020-01-29 住友ベークライト株式会社 カバーテープおよび電子部品包装体
JP2019204933A (ja) * 2018-05-25 2019-11-28 デクセリアルズ株式会社 電子部品供給体、電子部品供給リール
US10679877B2 (en) 2018-06-28 2020-06-09 Taiwan Semiconductor Manufacturing Co., Ltd. Carrier tape system and methods of using carrier tape system
CN110654714B (zh) * 2018-06-28 2021-09-17 台湾积体电路制造股份有限公司 半导体元件的载带系统与从载带的口袋搬移半导体元件的方法
JP6806753B2 (ja) * 2018-09-28 2021-01-06 住友ベークライト株式会社 カバーテープおよび電子部品用包装体
WO2020196031A1 (ja) * 2019-03-27 2020-10-01 三井・ダウポリケミカル株式会社 紙キャリアテープ用カバーテープ、電子部品搬送用包装体および電子部品包装体
WO2020204138A1 (ja) * 2019-04-03 2020-10-08 大日本印刷株式会社 電子部品包装用カバーテープおよび包装体
JP7156236B2 (ja) * 2019-10-11 2022-10-19 株式会社村田製作所 電子部品包装体、電子部品連および電子部品連形成装置
JP7177265B2 (ja) * 2019-10-11 2022-11-22 大日本印刷株式会社 電子部品包装用カバーテープ、包装体、および包装体用セット
JP7003099B2 (ja) 2019-12-10 2022-01-20 住友ベークライト株式会社 カバーテープおよび電子部品包装体
JP6950774B1 (ja) * 2020-03-17 2021-10-13 大日本印刷株式会社 電子部品包装用カバーテープおよび包装体
JP6950773B1 (ja) * 2020-03-17 2021-10-13 大日本印刷株式会社 電子部品包装用カバーテープおよび包装体
CN111757663B (zh) * 2020-06-29 2022-03-08 西安微电子技术研究所 一种贴片机减振散料贴装工具及其应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08192886A (ja) * 1995-01-11 1996-07-30 Sumitomo Bakelite Co Ltd 電子部品包装用カバーテープ
JPH08324676A (ja) * 1995-05-30 1996-12-10 Sumitomo Bakelite Co Ltd 電子部品包装用カバーテープ
JP2002283512A (ja) * 2001-03-23 2002-10-03 Dainippon Printing Co Ltd ヒートシール積層体およびキャリアテープ包装体
JP2006219137A (ja) * 2005-02-08 2006-08-24 Sumitomo Bakelite Co Ltd 電子部品包装用カバーテープ
CN101273677A (zh) * 2005-09-16 2008-09-24 3M创新有限公司 盖带及其制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3751414B2 (ja) 1997-06-03 2006-03-01 株式会社 東京ウエルズ キャリアテープ、その製造方法、その製造装置およびキャリアテープ体
JPH10218281A (ja) 1998-03-19 1998-08-18 Taiyo Yuden Co Ltd チップ部品用紙製キャリアテープ
CN1277275C (zh) * 2000-04-03 2006-09-27 大日本印刷株式会社 载体胶带盖
JP5417250B2 (ja) 2010-04-21 2014-02-12 信越ポリマー株式会社 エンボスキャリアテープ及びその製造方法ならびに包装部品巻回体
KR101685749B1 (ko) 2010-06-15 2016-12-12 덴카 주식회사 커버 테이프

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08192886A (ja) * 1995-01-11 1996-07-30 Sumitomo Bakelite Co Ltd 電子部品包装用カバーテープ
JPH08324676A (ja) * 1995-05-30 1996-12-10 Sumitomo Bakelite Co Ltd 電子部品包装用カバーテープ
JP2002283512A (ja) * 2001-03-23 2002-10-03 Dainippon Printing Co Ltd ヒートシール積層体およびキャリアテープ包装体
JP2006219137A (ja) * 2005-02-08 2006-08-24 Sumitomo Bakelite Co Ltd 電子部品包装用カバーテープ
CN101273677A (zh) * 2005-09-16 2008-09-24 3M创新有限公司 盖带及其制造方法

Also Published As

Publication number Publication date
WO2016076331A1 (ja) 2016-05-19
JP5983902B1 (ja) 2016-09-06
JPWO2016076331A1 (ja) 2017-04-27
CN106604878A (zh) 2017-04-26
TW201629172A (zh) 2016-08-16
KR20170024126A (ko) 2017-03-06
KR101756623B1 (ko) 2017-07-10
TWI647297B (zh) 2019-01-11

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