CN106537518A - 接着剂组成物、非等向性导电膜及使用其的半导体元件 - Google Patents
接着剂组成物、非等向性导电膜及使用其的半导体元件 Download PDFInfo
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- CN106537518A CN106537518A CN201580039422.2A CN201580039422A CN106537518A CN 106537518 A CN106537518 A CN 106537518A CN 201580039422 A CN201580039422 A CN 201580039422A CN 106537518 A CN106537518 A CN 106537518A
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- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical class C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- NXSDRAMLICHCOK-UHFFFAOYSA-N phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1.OC1=CC=CC=C1.OC1=CC=CC=C1 NXSDRAMLICHCOK-UHFFFAOYSA-N 0.000 description 1
- 150000003000 phloroglucinols Chemical class 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000013047 polymeric layer Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 238000000646 scanning calorimetry Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
Description
Claims (18)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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KR10-2014-0094673 | 2014-07-25 | ||
KR1020140094673A KR101721732B1 (ko) | 2014-07-25 | 2014-07-25 | 접착 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치 |
PCT/KR2015/005440 WO2016013758A1 (ko) | 2014-07-25 | 2015-05-29 | 접착 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치 |
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CN106537518A true CN106537518A (zh) | 2017-03-22 |
CN106537518B CN106537518B (zh) | 2018-06-12 |
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KR (1) | KR101721732B1 (zh) |
CN (1) | CN106537518B (zh) |
TW (1) | TWI582794B (zh) |
WO (1) | WO2016013758A1 (zh) |
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KR102438492B1 (ko) * | 2017-11-06 | 2022-08-30 | 에스케이온 주식회사 | 전극 구조체 및 이를 포함하는 이차 전지 |
Citations (5)
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CN103131367A (zh) * | 2011-11-23 | 2013-06-05 | 第一毛织株式会社 | 粘附组合物、粘附膜和电子元件 |
CN103160221A (zh) * | 2011-12-19 | 2013-06-19 | 第一毛织株式会社 | 各向异性导电膜和通过该膜结合的半导体装置 |
CN103160219A (zh) * | 2011-12-14 | 2013-06-19 | 第一毛织株式会社 | 各向异性导电膜组合物、各向异性导电膜和半导体装置 |
CN103748167A (zh) * | 2011-08-22 | 2014-04-23 | 迪睿合电子材料有限公司 | 热阳离子聚合性组合物、各向异性导电粘接膜、连接结构体及其制造方法 |
KR20140051085A (ko) * | 2012-10-22 | 2014-04-30 | 히타치가세이가부시끼가이샤 | 이방 도전성 접착제 조성물 |
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CN100380741C (zh) * | 2003-06-25 | 2008-04-09 | 日立化成工业株式会社 | 电路连接材料、电路构件的连接结构及其制造方法 |
KR101013260B1 (ko) * | 2004-06-09 | 2011-02-09 | 히다치 가세고교 가부시끼가이샤 | 회로접속재료 및 회로부재의 접속 구조 |
JP5201181B2 (ja) * | 2009-11-04 | 2013-06-05 | 日立化成株式会社 | 接着剤組成物、回路接続構造体及び半導体装置 |
JP5897871B2 (ja) | 2011-11-07 | 2016-04-06 | 三新化学工業株式会社 | スルホニウム化合物の製造方法 |
KR102259384B1 (ko) * | 2012-08-24 | 2021-06-02 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름의 제조 방법 및 이방성 도전 필름 |
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2014
- 2014-07-25 KR KR1020140094673A patent/KR101721732B1/ko active IP Right Grant
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2015
- 2015-05-29 CN CN201580039422.2A patent/CN106537518B/zh active Active
- 2015-05-29 WO PCT/KR2015/005440 patent/WO2016013758A1/ko active Application Filing
- 2015-07-23 TW TW104123798A patent/TWI582794B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103748167A (zh) * | 2011-08-22 | 2014-04-23 | 迪睿合电子材料有限公司 | 热阳离子聚合性组合物、各向异性导电粘接膜、连接结构体及其制造方法 |
CN103131367A (zh) * | 2011-11-23 | 2013-06-05 | 第一毛织株式会社 | 粘附组合物、粘附膜和电子元件 |
CN103160219A (zh) * | 2011-12-14 | 2013-06-19 | 第一毛织株式会社 | 各向异性导电膜组合物、各向异性导电膜和半导体装置 |
CN103160221A (zh) * | 2011-12-19 | 2013-06-19 | 第一毛织株式会社 | 各向异性导电膜和通过该膜结合的半导体装置 |
KR20140051085A (ko) * | 2012-10-22 | 2014-04-30 | 히타치가세이가부시끼가이샤 | 이방 도전성 접착제 조성물 |
Also Published As
Publication number | Publication date |
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KR20160012702A (ko) | 2016-02-03 |
KR101721732B1 (ko) | 2017-04-10 |
WO2016013758A1 (ko) | 2016-01-28 |
CN106537518B (zh) | 2018-06-12 |
TWI582794B (zh) | 2017-05-11 |
TW201606803A (zh) | 2016-02-16 |
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