CN106536119A - 使用非圆形激光光束来处理材料 - Google Patents
使用非圆形激光光束来处理材料 Download PDFInfo
- Publication number
- CN106536119A CN106536119A CN201580037272.1A CN201580037272A CN106536119A CN 106536119 A CN106536119 A CN 106536119A CN 201580037272 A CN201580037272 A CN 201580037272A CN 106536119 A CN106536119 A CN 106536119A
- Authority
- CN
- China
- Prior art keywords
- laser
- pulse
- laser pulse
- orientation
- specifically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic materials other than metals or composite materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic materials other than metals or composite materials
- B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP14176292.2A EP2965853B2 (en) | 2014-07-09 | 2014-07-09 | Processing of material using elongated laser beams |
| EP14176292.2 | 2014-07-09 | ||
| PCT/EP2015/065615 WO2016005455A1 (en) | 2014-07-09 | 2015-07-08 | Processing of material using non-circular laser beams |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106536119A true CN106536119A (zh) | 2017-03-22 |
Family
ID=51176164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580037272.1A Pending CN106536119A (zh) | 2014-07-09 | 2015-07-08 | 使用非圆形激光光束来处理材料 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10589384B2 (enExample) |
| EP (1) | EP2965853B2 (enExample) |
| JP (1) | JP2017528322A (enExample) |
| KR (1) | KR20170028888A (enExample) |
| CN (1) | CN106536119A (enExample) |
| LT (1) | LT2965853T (enExample) |
| WO (1) | WO2016005455A1 (enExample) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110253155A (zh) * | 2019-05-10 | 2019-09-20 | 武汉华工激光工程有限责任公司 | 一种微裂纹控制的激光加工装置 |
| CN110316949A (zh) * | 2018-03-28 | 2019-10-11 | 福州高意光学有限公司 | 一种飞秒激光器切割玻璃的方法 |
| CN110625275A (zh) * | 2018-06-20 | 2019-12-31 | 株式会社迪思科 | 激光加工装置 |
| CN112775539A (zh) * | 2019-11-07 | 2021-05-11 | 大族激光科技产业集团股份有限公司 | 激光加工方法及装置 |
| CN113169057A (zh) * | 2018-11-19 | 2021-07-23 | 株式会社东京精密 | 激光加工装置及其控制方法 |
| CN114178710A (zh) * | 2020-08-24 | 2022-03-15 | 奥特斯(中国)有限公司 | 部件承载件及其制造方法 |
| CN114430706A (zh) * | 2019-09-18 | 2022-05-03 | 浜松光子学株式会社 | 检查装置及检查方法 |
| CN114531857A (zh) * | 2019-09-18 | 2022-05-24 | 浜松光子学株式会社 | 检查装置及检查方法 |
| CN115609165A (zh) * | 2022-10-26 | 2023-01-17 | 中国科学院微电子研究所 | 碳化硅激光切割方法 |
| CN115697621A (zh) * | 2020-05-28 | 2023-02-03 | 通快机床欧洲股份公司 | 激光切割方法和激光切割设备 |
| CN117480133A (zh) * | 2021-06-16 | 2024-01-30 | Agc株式会社 | 板状构件的制造方法和板状构件 |
| CN118714898A (zh) * | 2024-08-28 | 2024-09-27 | 深圳御光新材料有限公司 | 钙钛矿薄膜电池的制作方法和钙钛矿薄膜电池 |
Families Citing this family (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
| US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
| US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| CN106687419A (zh) | 2014-07-08 | 2017-05-17 | 康宁股份有限公司 | 用于激光处理材料的方法和设备 |
| US11648623B2 (en) | 2014-07-14 | 2023-05-16 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
| EP3169479B1 (en) | 2014-07-14 | 2019-10-02 | Corning Incorporated | Method of and system for arresting incident crack propagation in a transparent material |
| EP3169476A1 (en) | 2014-07-14 | 2017-05-24 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
| US10611667B2 (en) | 2014-07-14 | 2020-04-07 | Corning Incorporated | Method and system for forming perforations |
| DE102014116957A1 (de) | 2014-11-19 | 2016-05-19 | Trumpf Laser- Und Systemtechnik Gmbh | Optisches System zur Strahlformung |
| WO2016079275A1 (de) | 2014-11-19 | 2016-05-26 | Trumpf Laser- Und Systemtechnik Gmbh | System zur asymmetrischen optischen strahlformung |
| DE102014116958B9 (de) | 2014-11-19 | 2017-10-05 | Trumpf Laser- Und Systemtechnik Gmbh | Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung |
| WO2016115017A1 (en) | 2015-01-12 | 2016-07-21 | Corning Incorporated | Laser cutting of thermally tempered substrates using the multi photon absorption method |
| HUE055461T2 (hu) | 2015-03-24 | 2021-11-29 | Corning Inc | Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása |
| WO2016160391A1 (en) | 2015-03-27 | 2016-10-06 | Corning Incorporated | Gas permeable window and method of fabricating the same |
| EP3319911B1 (en) | 2015-07-10 | 2023-04-19 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
| EA201892522A1 (ru) * | 2016-05-05 | 2019-05-31 | Дзе Трастиз Оф Дзе Юниверсити Оф Пенсильвания | Днк-моноклональные антитела, нацеленные на молекулы контрольных точек |
| JP6938543B2 (ja) | 2016-05-06 | 2021-09-22 | コーニング インコーポレイテッド | 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し |
| JP6755707B2 (ja) * | 2016-05-12 | 2020-09-16 | 株式会社ディスコ | レーザー加工装置 |
| US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| FR3054151B1 (fr) * | 2016-07-25 | 2018-07-13 | Amplitude Systemes | Procede et appareil pour la decoupe de materiaux par multi-faisceaux laser femtoseconde |
| WO2018022476A1 (en) | 2016-07-29 | 2018-02-01 | Corning Incorporated | Apparatuses and methods for laser processing |
| KR102423775B1 (ko) | 2016-08-30 | 2022-07-22 | 코닝 인코포레이티드 | 투명 재료의 레이저 가공 |
| CN109803786B (zh) | 2016-09-30 | 2021-05-07 | 康宁股份有限公司 | 使用非轴对称束斑对透明工件进行激光加工的设备和方法 |
| US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
| US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
| US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
| US10830943B2 (en) * | 2017-10-31 | 2020-11-10 | Corning Incorporated | Optical fibers and optical systems comprising the same |
| US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
| JP6783401B2 (ja) * | 2018-01-31 | 2020-11-11 | Hoya株式会社 | 円盤形状のガラス素板の製造方法、及び磁気ディスク用ガラス基板の製造方法 |
| DE102018126381A1 (de) * | 2018-02-15 | 2019-08-22 | Schott Ag | Verfahren und Vorrichtung zum Einfügen einer Trennlinie in ein transparentes sprödbrüchiges Material, sowie verfahrensgemäß herstellbares, mit einer Trennlinie versehenes Element |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| US11897056B2 (en) | 2018-10-30 | 2024-02-13 | Hamamatsu Photonics K.K. | Laser processing device and laser processing method |
| JP7285067B2 (ja) * | 2018-10-30 | 2023-06-01 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
| WO2020090905A1 (ja) * | 2018-10-30 | 2020-05-07 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
| JP7411566B2 (ja) * | 2018-10-30 | 2024-01-11 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
| DE102019116798A1 (de) * | 2019-06-21 | 2020-12-24 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Bearbeiten mindestens eines Werkstücks |
| US20210024411A1 (en) | 2019-07-26 | 2021-01-28 | Laser Engineering Applications | Method for structuring a transparent substrate with a laser in a burst mode |
| DE102019129036A1 (de) * | 2019-10-28 | 2021-04-29 | Schott Ag | Verfahren zur Herstellung von Glasscheiben und verfahrensgemäß hergestellte Glasscheibe sowie deren Verwendung |
| DE102019217021A1 (de) * | 2019-11-05 | 2021-05-06 | Photon Energy Gmbh | Laserschneidverfahren und zugehörige Laserschneidvorrichtung |
| JP2021088474A (ja) * | 2019-12-03 | 2021-06-10 | 日本電気硝子株式会社 | ガラス物品の製造方法、及びガラス物品 |
| DE102019219462A1 (de) * | 2019-12-12 | 2021-06-17 | Flabeg Deutschland Gmbh | Verfahren zum Schneiden eines Glaselements und Schneidsystem |
| ES2976069T3 (es) * | 2020-03-06 | 2024-07-22 | Schott Ag | Procedimiento para la preparación y/o realización de la separación de un elemento de sustrato y un elemento parcial de sustrato |
| JP2021163914A (ja) * | 2020-04-02 | 2021-10-11 | 浜松ホトニクス株式会社 | レーザ加工装置、レーザ加工方法及びウェハ |
| CN115697620A (zh) * | 2020-06-04 | 2023-02-03 | 康宁股份有限公司 | 使用改性脉冲串分布来激光加工透明工件的方法 |
| DE102020122598A1 (de) | 2020-08-28 | 2022-03-03 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Bearbeiten eines Materials |
| DE102020123786A1 (de) * | 2020-09-11 | 2022-03-17 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Trennen von Dünnstglas |
| DE102020213776A1 (de) * | 2020-11-03 | 2022-05-05 | Q.ant GmbH | Verfahren zum Spalten eines Kristalls |
| WO2022185096A1 (en) | 2021-03-03 | 2022-09-09 | Uab Altechna R&B | Laser beam transforming element |
| US11782276B2 (en) | 2021-03-17 | 2023-10-10 | Google Llc | Systems and methods to reduce bounce spacing and double-bounce in waveguides |
| DE102021109579B4 (de) | 2021-04-16 | 2023-03-23 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren und vorrichtung zum ausbilden von modifikationen mit einem laserstrahl in einem material mit einer gekrümmten oberfläche |
| US12270997B2 (en) | 2021-09-01 | 2025-04-08 | Google Llc | Systems and methods to minimize double-bounce in waveguides |
| WO2023099946A1 (en) | 2021-12-02 | 2023-06-08 | Uab Altechna R&D | Pulsed laser beam shaping device for laser processing of a material transparent for the laser beam |
| DE102022115711A1 (de) * | 2022-06-23 | 2023-12-28 | Schott Ag | Verfahren und Vorrichtung zum Bearbeiten von Werkstücken |
| CN114985990B (zh) * | 2022-07-14 | 2024-10-22 | 中国科学院半导体研究所 | 双激光裂片方法和装置 |
| DE102024118609A1 (de) * | 2024-07-01 | 2026-01-08 | Schott Ag | Verfahren zur Herstellung von ultradünnen Elementen aus glasbasiertem Material, ultradünnes Element aus glasbasiertem Material sowie dessen Verwendung |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1276495C (zh) * | 2000-01-10 | 2006-09-20 | 电子科学工业公司 | 以具超短脉冲宽度的激光脉冲的脉冲串处理存储器链路的激光器系统及方法 |
| CN100589915C (zh) * | 2003-07-02 | 2010-02-17 | 詹诺普蒂克自动化技术有限公司 | 利用算出的射束光点长度分离扁平的陶瓷工件的方法 |
| CN102233485A (zh) * | 2010-04-30 | 2011-11-09 | Qmc株式会社 | 目标对象处理方法和目标对象处理装置 |
| DE102012110971A1 (de) * | 2012-11-14 | 2014-05-15 | Schott Ag | Trennen von transparenten Werkstücken |
| CN104339084A (zh) * | 2013-07-29 | 2015-02-11 | Ap系统股份有限公司 | 使用非球面多焦点透镜加工脆性基底的设备 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4659300B2 (ja) | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
| JP3867109B2 (ja) * | 2000-09-13 | 2007-01-10 | 浜松ホトニクス株式会社 | レーザ加工方法 |
| US8624157B2 (en) * | 2006-05-25 | 2014-01-07 | Electro Scientific Industries, Inc. | Ultrashort laser pulse wafer scribing |
| CN101755226A (zh) * | 2007-07-06 | 2010-06-23 | 日东电工株式会社 | 偏振光板 |
| JP5446631B2 (ja) | 2009-09-10 | 2014-03-19 | アイシン精機株式会社 | レーザ加工方法及びレーザ加工装置 |
| JP6121901B2 (ja) | 2010-07-12 | 2017-04-26 | ロフィン−シナー テクノロジーズ インコーポレーテッド | レーザーフィラメント形成による材料加工方法 |
| JP5860228B2 (ja) | 2011-06-13 | 2016-02-16 | 株式会社ディスコ | レーザー加工装置 |
| US9029242B2 (en) * | 2011-06-15 | 2015-05-12 | Applied Materials, Inc. | Damage isolation by shaped beam delivery in laser scribing process |
| JP2013082589A (ja) | 2011-10-11 | 2013-05-09 | V Technology Co Ltd | ガラス基板のレーザ加工装置 |
| JP2014104484A (ja) | 2012-11-27 | 2014-06-09 | Disco Abrasive Syst Ltd | レーザー加工装置 |
-
2014
- 2014-07-09 LT LTEP14176292.2T patent/LT2965853T/lt unknown
- 2014-07-09 EP EP14176292.2A patent/EP2965853B2/en active Active
-
2015
- 2015-07-08 JP JP2017500887A patent/JP2017528322A/ja active Pending
- 2015-07-08 US US15/317,220 patent/US10589384B2/en active Active
- 2015-07-08 KR KR1020167035653A patent/KR20170028888A/ko not_active Withdrawn
- 2015-07-08 CN CN201580037272.1A patent/CN106536119A/zh active Pending
- 2015-07-08 WO PCT/EP2015/065615 patent/WO2016005455A1/en not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1276495C (zh) * | 2000-01-10 | 2006-09-20 | 电子科学工业公司 | 以具超短脉冲宽度的激光脉冲的脉冲串处理存储器链路的激光器系统及方法 |
| CN100589915C (zh) * | 2003-07-02 | 2010-02-17 | 詹诺普蒂克自动化技术有限公司 | 利用算出的射束光点长度分离扁平的陶瓷工件的方法 |
| CN102233485A (zh) * | 2010-04-30 | 2011-11-09 | Qmc株式会社 | 目标对象处理方法和目标对象处理装置 |
| DE102012110971A1 (de) * | 2012-11-14 | 2014-05-15 | Schott Ag | Trennen von transparenten Werkstücken |
| CN104339084A (zh) * | 2013-07-29 | 2015-02-11 | Ap系统股份有限公司 | 使用非球面多焦点透镜加工脆性基底的设备 |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110316949A (zh) * | 2018-03-28 | 2019-10-11 | 福州高意光学有限公司 | 一种飞秒激光器切割玻璃的方法 |
| CN110625275A (zh) * | 2018-06-20 | 2019-12-31 | 株式会社迪思科 | 激光加工装置 |
| CN113169057B (zh) * | 2018-11-19 | 2022-05-27 | 株式会社东京精密 | 激光加工装置及其控制方法 |
| CN113169057A (zh) * | 2018-11-19 | 2021-07-23 | 株式会社东京精密 | 激光加工装置及其控制方法 |
| US11260470B2 (en) | 2018-11-19 | 2022-03-01 | Tokyo Seimitsu Co., Ltd. | Laser machining device and control method therefor |
| CN110253155A (zh) * | 2019-05-10 | 2019-09-20 | 武汉华工激光工程有限责任公司 | 一种微裂纹控制的激光加工装置 |
| CN114531857A (zh) * | 2019-09-18 | 2022-05-24 | 浜松光子学株式会社 | 检查装置及检查方法 |
| CN114430706A (zh) * | 2019-09-18 | 2022-05-03 | 浜松光子学株式会社 | 检查装置及检查方法 |
| US12023761B2 (en) | 2019-09-18 | 2024-07-02 | Hamamatsu Photonics K.K. | Inspection device and inspection method |
| CN112775539A (zh) * | 2019-11-07 | 2021-05-11 | 大族激光科技产业集团股份有限公司 | 激光加工方法及装置 |
| CN115697621A (zh) * | 2020-05-28 | 2023-02-03 | 通快机床欧洲股份公司 | 激光切割方法和激光切割设备 |
| CN114178710A (zh) * | 2020-08-24 | 2022-03-15 | 奥特斯(中国)有限公司 | 部件承载件及其制造方法 |
| US12048101B2 (en) | 2020-08-24 | 2024-07-23 | AT&S(China) Co. Ltd. | Component carrier with well-defined outline sidewall cut by short laser pulse and/or green laser |
| CN114178710B (zh) * | 2020-08-24 | 2024-11-26 | 奥特斯(中国)有限公司 | 部件承载件及其制造方法 |
| CN117480133A (zh) * | 2021-06-16 | 2024-01-30 | Agc株式会社 | 板状构件的制造方法和板状构件 |
| CN115609165A (zh) * | 2022-10-26 | 2023-01-17 | 中国科学院微电子研究所 | 碳化硅激光切割方法 |
| CN118714898A (zh) * | 2024-08-28 | 2024-09-27 | 深圳御光新材料有限公司 | 钙钛矿薄膜电池的制作方法和钙钛矿薄膜电池 |
| CN118714898B (zh) * | 2024-08-28 | 2024-12-27 | 深圳御光新材料有限公司 | 钙钛矿薄膜电池的制作方法和钙钛矿薄膜电池 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20170120374A1 (en) | 2017-05-04 |
| EP2965853B1 (en) | 2016-09-21 |
| EP2965853A1 (en) | 2016-01-13 |
| JP2017528322A (ja) | 2017-09-28 |
| KR20170028888A (ko) | 2017-03-14 |
| EP2965853B2 (en) | 2020-03-25 |
| US10589384B2 (en) | 2020-03-17 |
| LT2965853T (lt) | 2016-11-25 |
| WO2016005455A1 (en) | 2016-01-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106536119A (zh) | 使用非圆形激光光束来处理材料 | |
| US10137527B2 (en) | Laser-based modification of transparent materials | |
| KR102287201B1 (ko) | 이온-교환가능한 유리 기판의 레이저 절단 | |
| US10626039B2 (en) | Separation of transparent workpieces | |
| KR101904130B1 (ko) | 버스트 초고속 레이저 펄스를 사용하는 취성 재료를 위한 폐형 릴리즈 방법 | |
| US10597321B2 (en) | Edge chamfering methods | |
| US10010971B1 (en) | Method and apparatus for performing laser curved filamentation within transparent materials | |
| TWI639479B (zh) | 用於片狀基板之雷射加工的方法與系統以及玻璃製品 | |
| EP4003633B1 (en) | Method of laser beam machining of a transparent brittle material | |
| Mishchik et al. | Laser glass cutting by spatio-temporal control of energy deposition using bursts of femtosecond pulses | |
| Mackevičiūtė | Efficient and fast glass cutting using laser bursts | |
| Mishchik et al. | Glass cutting with femtosecond pulses: Industrial approach with beam engineering |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170322 |